Magnetic control type rotating target material

Abstract

The utility model discloses a magnetic control type rotary target material, which comprises a hollow backing tube, a hollow columnar silicon target material and two reinforcing rings, the silicon target material is sleeved on the outer surface of the backing tube, and the two reinforcing rings are sleeved on the outer surface of the backing tube and are respectively positioned at two end parts of the silicon target material. And each reinforcing ring is tightly connected with the corresponding end part of the silicon target material. The reinforcing rings are connected to the two ends of the silicon target material, so that the condition of discharge voltage fluctuation caused by cracking of the end part after long-time use can be avoided, and the stability is higher.

Description

Technical Field

[0001] The utility model belongs to the field of sputtering coating, and in particular relates to a target material capable of preventing cracking. Background Art

[0002] Target coating is a sputtering source that forms various functional thin films on substrates through magnetron sputtering, multi-arc ion plating or other types of coating systems under appropriate process conditions (high-speed energetic particle bombardment). When lasers with different power densities, different output waveforms, and different wavelengths interact with different target materials, different killing and destructive effects will be produced. Replacing different target materials (such as aluminum, copper, stainless steel, titanium, nickel targets, etc.) can also obtain different film systems (such as super-hard, wear-resistant, and corrosion-resistant alloy films, etc.). Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, optical discs, flat-panel displays, and surface coatings of workpieces.

[0003] Coating usually uses a rotating target, which can rotate at different speeds and directions, making the distribution of the material on the target more uniform. Compared with a flat target, a rotating target has a more flexible usage and higher plasticity.

[0004] As an important functional thin film material, silicon target has good hardness, optics, dielectric properties, wear resistance and corrosion resistance. Therefore, silicon target has broad application prospects in the fields of optics and microelectronics. At present, it is mainly used in transparent conductive glass, architectural glass and microelectronics industries. However, after long-term discharge, silicon target is prone to cracks at both ends, resulting in fluctuations in the discharge voltage of the target and abnormal uniformity.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a silicon target material that can prevent cracking.

[0006] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0007] The utility model aims to provide a magnetically controlled rotating target material for solving the problem of end cracking.

[0008] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0009] The utility model provides a magnetron type rotating target material, comprising a hollow backing tube, a hollow columnar silicon target material and two reinforcement rings, wherein the silicon target material is sleeved on the outer surface of the backing tube, and the two reinforcement rings are sleeved on the outer surface of the backing tube and are respectively located at the two ends of the silicon target material, and each reinforcement ring is tightly connected to the corresponding end of the silicon target material.

[0010] In one or more embodiments of the present invention, the reinforcement ring is a titanium ring.

[0011] In one or more embodiments of the present invention, the titanium ring and the silicon target are sintered together by soldering.

[0012] In one or more embodiments of the present invention, the thickness of the reinforcement ring is smaller than the thickness of the silicon target.

[0013] In one or more embodiments of the present invention, the two reinforcement rings are equal in length and thickness and are symmetrically arranged at two ends of the silicon target.

[0014] In one or more embodiments of the present invention, the length of the titanium ring is 70 mm, and / or the length of the silicon target is 1760 mm.

[0015] In one or more embodiments of the present invention, the thickness of the titanium ring is 4 mm.

[0016] In one or more embodiments of the present invention, the silicon target is fixed to the backing tube by solder sintering.

[0017] In one or more embodiments of the present invention, at least one end portion of the backing tube is formed with a thread for fixing to a flange.

[0018] In one or more embodiments of the present invention, the threads are formed on the outer surface of the backing tube.

[0019] Compared with the prior art, the target material in the utility model is connected with reinforcement rings at both ends, which can prevent the target material from cracking at both ends after long-term use, thereby solving the problem of end cracking after long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1It is a cross-sectional view of a magnetron type rotating target in one embodiment of the utility model.

[0022] Description of main reference numerals:

[0023] 100-magnetron rotating target, 10-silicon target, 20-reinforcement ring, 30-backing tube, 31-thread. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0025] like Figure 1 As shown, the magnetron type rotating target 100 in one embodiment of the utility model comprises a silicon target 10, a reinforcement ring 20 and a hollow backing tube 30. The backing tube 30 is a hollow structure, and the interior thereof is used to place a magnet. The silicon target 10 is a hollow columnar structure, which is sleeved on the outer surface of the backing tube 30. The reinforcement ring 20 is sleeved on the outer surface of the backing tube 30 and is respectively located at both ends of the silicon target 10, and the reinforcement ring 20 is tightly connected to the corresponding ends of the silicon target 10.

[0026] In the above embodiment, by providing reinforcement rings 20 at both ends of the silicon target 10, the tendency of cracking at both ends of the silicon target 20 after long-term use can be prevented, so as to solve the problem of cracking at the end after long-term use, so that the silicon target 10 can still maintain a stable voltage after long-term use, and prevent voltage fluctuations from occurring, which may lead to abnormal uniformity of the film.

[0027] Specifically, the reinforcement ring 20 is a titanium ring. When titanium is used as the reinforcement material, the reaction produced during particle bombardment is relatively light and the impact is relatively small. Of course, other materials with better stability can also be used, and this embodiment is not limited thereto.

[0028] In one embodiment, the titanium ring and the silicon target 10 are connected and fixed by solder sintering. Further, the silicon target 10 and the titanium ring are also fixed to the substrate 30 by solder sintering.

[0029] Furthermore, the length and thickness of the titanium rings at both ends are the same, so the two are symmetrically arranged at the two ends of the silicon target 10 .

[0030] In one embodiment, the length of the titanium rings at both ends is 70 mm, the length of the silicon target 10 in the middle is 1760 mm, the total length is 1900 mm, and the thickness of the titanium ring is 4 mm, which is less than the thickness of the silicon target 10 in the middle.

[0031] It can be imagined that the inner diameters of the titanium rings at both ends and the middle silicon target 10 are the same, so both can be fixed on the stainless steel substrate 30 by solder sintering at the same time, with high stability.

[0032] In one embodiment, a thread 31 is formed on at least one end of the backing tube 30 for connecting with a flange or other fixing or rotating device. When both ends need to be connected with other parts of the equipment at the same time, threads 31 can be provided on both ends of the backing tube 30 to connect and fix from both ends at the same time to improve stability during rotation.

[0033] Further, the threads 31 are formed on the outer surface of the backing tube 30. Of course, in other embodiments, the threads 31 may also be formed on the inner surface of the backing tube 30, or the threads 31 may be provided on both the inner and outer surfaces to improve the flexibility during specific operations.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0035] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A magnetron type rotating target, characterized in that: include: A hollow backing tube; A hollow cylindrical silicon target material is sleeved on the outer surface of the backing tube; Two reinforcement rings are sleeved on the outer surface of the backing tube and are respectively located at the two ends of the silicon target material, and each reinforcement ring is tightly connected to the corresponding end of the silicon target material.

2. The magnetron type rotating target according to claim 1, characterized in that: The reinforcement ring is a titanium ring.

3. The magnetron type rotating target according to claim 2, characterized in that: The titanium ring and the silicon target are sintered together by soldering.

4. The magnetron type rotating target according to claim 1, characterized in that: The thickness of the reinforcement ring is smaller than the thickness of the silicon target.

5. The magnetron type rotating target according to claim 1, characterized in that: The two reinforcement rings are equal in length and thickness and are symmetrically arranged at two ends of the silicon target.

6. The magnetron type rotating target according to claim 2, characterized in that: The titanium ring is 70 mm long, and / or the silicon target is 1760 mm long.

7. The magnetron type rotating target according to claim 2, characterized in that: The thickness of the titanium ring is 4 mm.

8. The magnetron type rotating target according to claim 1, characterized in that: The silicon target is fixed to the backing tube by solder sintering.

9. The magnetron type rotating target according to claim 1, characterized in that: At least one end of the backing tube is formed with a thread for fixing with a flange.

10. The magnetron type rotating target according to claim 9, characterized in that: The threads are formed on the outer surface and / or the inner surface of the backing tube.

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