Inductive load test tool for multifunctional key machine

Abstract

The utility model discloses a multifunctional key machine inductive load test tool, relates to the field of load test, and solves the problem that inductive loads with different voltage requirements cannot be tested simultaneously in the prior art. Comprising a voltage conversion and power supply module, an MCU driving chip, a buzzer, a voice module, a strong current driving load module, a weak current driving load module and a switch control circuit module. Voltage of different intensities is obtained through layer-by-layer voltage conversion of the voltage conversion and power supply module, the voltage requirements of strong current and weak current loads are met, meanwhile, power is supplied to the MCU driving chip, the MCU driving chip achieves on-off control of different weak current loads through the on-off control circuit module, simultaneous testing of multiple weak current loads is achieved, and the testing efficiency is improved. Meanwhile, the MCU driving chip is connected with the strong current driving load module, so that isolation control over the strong current load is achieved, the strong current load can be tested while various weak current loads are tested, and inductive loads with different voltage requirements are tested at the same time.

Description

Technical Field

[0001] The utility model relates to the field of load testing, in particular to a multifunctional bonding machine inductive load testing tool. Background Art

[0002] A bonding machine is a device used in semiconductor chip manufacturing. Its working principle is to weld metal wires (usually aluminum or gold) to metal pins on the surface of the chip. These metal wires are used to connect different parts on the chip to form a circuit. Inductive load refers to a load with inductance parameters, which contains coils, such as various motors, motors, pumps, etc. In order to control the distance and force, solenoids, voice coil motors, etc. are used on the bonding machine. DC motors are used to drive the structure. A series of fans are installed for heat dissipation. These are all inductive loads, and the reliability of inductive loads needs to be tested and verified before they can be used in the equipment. The relevant equipment used for testing is the test tooling. In related technologies, the voltage is usually provided by a switching power supply, and the test tooling is made into a unified test after power-on. However, in the existing technical solutions, the output voltage is fixed. If there are several inductive loads with different voltage requirements, they cannot be tested at the same time; at the same time, the power on and off during the test requires manual timing, manual closing and opening, which cannot be achieved manually in situations where repeated on-off tests are required or high accuracy of the power-on time is required. In addition, it is difficult for existing test tools to test a large number of loads at the same time. There are not enough different voltage interfaces and lack of human-computer interaction. It is difficult to count the specific test time and the number of cycle tests. There is no voice or sound and light prompt when operating the tooling. Utility Model Content

[0003] The technical problem to be solved by the utility model is that the existing testing tooling technology cannot simultaneously test inductive loads with different voltage requirements.

[0004] The utility model solves the above technical problems through the following technical solutions:

[0005] A multifunctional bonding machine inductive load test tool comprises a voltage conversion and power supply module, an MCU driving chip, a buzzer, a voice module, a strong-electric drive load module, a weak-electric drive load module, and a switch control circuit module; the output end of the voltage conversion and power supply module is respectively connected to the MCU driving chip power supply end, the weak-electric drive load module power supply end, the strong-electric drive load module power supply end, the buzzer power supply end, and the voice module power supply end; the MCU driving chip output end is respectively connected to the strong-electric drive load module input end, the buzzer input end, the voice module input end, and the switch control circuit module input end; and the control feedback end of the switch control circuit module is connected to the control feedback end of the weak-electric drive load module.

[0006] The utility model obtains voltages of different strengths through layer-by-layer voltage conversion and power supply modules, thereby meeting the power supply requirements of strong current loads and weak current loads with multiple different weak current requirements, and also provides power for MCU driver chips, buzzers, and voice modules. The MCU driver chip realizes switch control of different weak current loads through the switch control circuit module, thereby realizing simultaneous testing of multiple weak current loads. At the same time, the MCU driver chip realizes isolation control of strong current loads by connecting to the strong current drive load module, and can test strong current loads while testing multiple weak current loads, thereby finally realizing simultaneous testing of inductive loads with different voltage requirements. In addition, the voice module and buzzer of the present application can also provide sound and light prompts, thereby further improving human-computer interaction.

[0007] Preferably, the voltage conversion and power supply module includes 220V strong electricity, 24V weak electricity, 12V weak electricity, 5V weak electricity, and 3.3V weak electricity. The 220V strong electricity provides power to the power supply end of the strong-electric drive load module, the 220V strong electricity is stepped down and converted into 24V weak electricity, the 24V weak electricity provides power to the power supply end of the weak-electric drive load module, the 24V weak electricity is stepped down and converted into 12V weak electricity, the 12V weak electricity provides power to the power supply end of the weak-electric drive load module, the 12V weak electricity is stepped down and converted into 5V weak electricity and 3.3V weak electricity, the 5V weak electricity provides power to the power supply end of the weak-electric drive load module, the 3.3V weak electricity provides power to the power supply end of the weak-electric drive load module, and the 3.3V weak electricity provides power to the power supply end of the MCU driver chip.

[0008] The 220V strong electricity is converted into 24V weak electricity through a switching power supply, the 24V weak electricity is converted into 12V weak electricity through a 12V voltage conversion chip, the 12V weak electricity is converted into 5V weak electricity through a 5V voltage conversion chip, and the 12V weak electricity is converted into 3.3V weak electricity through a 3.3V voltage conversion chip.

[0009] The specific model of the 12V voltage conversion chip is LR7812; the specific model of the 5V voltage conversion chip is LM7805; the specific model of the 3.3V voltage conversion chip is AMS1117-3.3.

[0010] Preferably, the weak current drive load module includes a 24V weak current drive load group, a 12V weak current drive load group, a 5V weak current drive load group, and a 3.3V weak current drive load group; the 24V weak current drive load group, the 12V weak current drive load group, the 5V weak current drive load group, and the 3.3V weak current drive load group all include a number of load plug-in circuits; wherein the power supply end of each load plug-in circuit in the 24V weak current drive load group is connected to the 24V weak current, and the control feedback end of each load plug-in circuit in the 24V weak current drive load group is connected to the control feedback end of the switch control circuit module; wherein each load in the 12V weak current drive load group The power supply end of the plug-in circuit is connected to 12V weak electricity, and the control feedback end of each load plug-in circuit in the 12V weak electricity driven load group is connected to the control feedback end of the switch control circuit module; wherein the power supply end of each load plug-in circuit in the 5V weak electricity driven load group is connected to 5V weak electricity, and the control feedback end of each load plug-in circuit in the 5V weak electricity driven load group is connected to the control feedback end of the switch control circuit module; wherein the power supply end of each load plug-in circuit in the 3.3V weak electricity driven load group is connected to 3.3V weak electricity, and the control feedback end of each load plug-in circuit in the 3.3V weak electricity driven load group is connected to the control feedback end of the switch control circuit module.

[0011] Preferably, the switch control circuit module includes a plurality of switch control circuits, the input end of each switch control circuit is connected to the output end of the MCU driver chip, and the output end of each switch control circuit is connected to the input end of a load plug-in circuit.

[0012] The input ends of the two switch control circuits are connected together and connected to the output end of the MCU.

[0013] The strong electric drive load module includes a photoelectric coupler U901, a bidirectional thyristor TR1, a capacitor C901, a capacitor C902, a resistor R901, a resistor R902, a resistor R903, a resistor R904, and a fuse FUSE1. The first pin of the photoelectric coupler U901 is connected to the output end of the MCU driver chip, the second pin of the photoelectric coupler U901 is connected to one end of the resistor R901, one end of the capacitor C901 is connected in parallel to the first pin of the photoelectric coupler U901, the other end of the capacitor C901 is connected to the other end of the resistor R901 and is grounded, the fourth pin of the photoelectric coupler U901 is respectively connected to the gate of the bidirectional thyristor TR1 and one end of the resistor R902, the other end of the resistor R902 is connected to one end of the 220V load to be tested, and the photoelectric coupler U901 is connected to the gate of the bidirectional thyristor TR1 and one end of the resistor R902. The 6th pin of coupler U901 is connected to one end of resistor R903, the other end of resistor R903 is connected to one end of fuse FUSE1, the other end of fuse FUSE1 is connected to the other end of the 220V load to be tested, the two main terminals of bidirectional thyristor TR1 are respectively connected in parallel to the other end of resistor R903 and one end of fuse FUSE1, which are connected close to the line where the other end of resistor R903 and the line where the other end of resistor R902 are located, one end of capacitor C902 is connected to the other end of resistor R903 and one end of fuse FUSE1, which are connected close to the line where one end of fuse FUSE1 is located, the other end of capacitor C902 is connected to one end of resistor R904, and the other end of resistor R904 is connected to the line where the other end of resistor R902 is located.

[0014] Preferably, the voice module includes a voice chip Music1 and a speaker, the voice chip Music1 model is JQ8900, the 9th to 15th pins of the voice chip Music1 are connected to the output end of the MCU driver chip, the 7th pin of the voice chip Music1 is connected to the 2nd pin of the speaker, and the 8th pin of the voice chip Music1 is connected to the 1st pin of the speaker.

[0015] Preferably, the model of the MCU driver chip is MSP430F149.

[0016] The advantages of the utility model are:

[0017] The utility model obtains voltages of different strengths through layer-by-layer voltage conversion and power supply modules, thereby meeting the power supply requirements of strong current loads and weak current loads with multiple different weak current requirements, and also provides power for MCU driver chips, buzzers, and voice modules. The MCU driver chip realizes switch control of different weak current loads through the switch control circuit module, thereby realizing simultaneous testing of multiple weak current loads. At the same time, the MCU driver chip realizes isolation control of strong current loads by connecting to the strong current drive load module, and can test strong current loads while testing multiple weak current loads, thereby finally realizing simultaneous testing of inductive loads with different voltage requirements. In addition, the voice module and buzzer of the present application can also provide sound and light prompts, thereby further improving human-computer interaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a flowchart of a multifunctional bonding machine inductive load testing tooling according to an embodiment of the utility model;

[0019] Figure 2 This is a diagram of a partial load plug-in circuit of a 24V weak current drive load group of a multifunctional bonding machine inductive load test tooling in an embodiment of the utility model;

[0020] Figure 3 This is a switch control circuit diagram of a multifunctional bonding machine inductive load test tooling in an embodiment of the utility model;

[0021] Figure 4 This is a circuit diagram of a strong electric drive load module of a multifunctional bonding machine inductive load test tooling in an embodiment of the utility model;

[0022] Figure 5 This is a circuit diagram of a voice module of a multifunctional bonding machine inductive load test tooling in an embodiment of the utility model;

[0023] Figure 6 The present invention is a pin diagram of an MCU driver chip of a multifunctional bonding machine inductive load test tool. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model will be clearly and completely described below in combination with the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The technical solution of the utility model is further described below in conjunction with the accompanying drawings and specific embodiments of the specification:

[0026] like Figure 1 As shown, it is a flow chart of a multifunctional bonding machine inductive load test tooling according to an embodiment of the utility model, including a voltage conversion and power supply module, an MCU driver chip, a buzzer, a voice module, a strong-electric drive load module, a weak-electric drive load module, and a switch control circuit module; the output end of the voltage conversion and power supply module is respectively connected to the MCU driver chip power supply end, the weak-electric drive load module power supply end, the strong-electric drive load module power supply end, the buzzer power supply end, and the voice module power supply end, the MCU driver chip output end is respectively connected to the strong-electric drive load module input end, the buzzer input end, the voice module input end, and the switch control circuit module input end, and the control feedback end of the switch control circuit module is connected to the control feedback end of the weak-electric drive load module.

[0027] The voltage conversion and power supply module described in this embodiment is powered by 220V strong electricity, which is converted into 24V weak electricity through a switching power supply, and the 24V weak electricity is converted into 12V weak electricity through an LR7812 voltage conversion chip, and the 12V weak electricity is converted into 5V weak electricity through an LM7805 voltage conversion chip. The 12V weak electricity can also be converted into 3.3V weak electricity through an AMS1117-3.3 voltage conversion chip; the 220V strong electricity provides power to the strong-electricity driven load module test load, the 24V weak electricity provides power to the load plug-in circuit of the 24V weak-electricity driven load group, the 12V weak electricity provides power to the load plug-in circuit of the 12V weak-electricity driven load group, the 5V weak electricity provides power to the load plug-in circuit of the 5V weak-electricity driven load group, and the 3.3V weak electricity provides power to the load plug-in circuit of the 3.3V weak-electricity driven load group. At the same time, the 3.3V weak electricity also provides power to the MCU driver chip power supply end, the buzzer power supply end, and the voice module power supply end. The voltage conversion and power supply module can be powered by 220V strong electricity, and can also be directly powered by 24V weak electricity if there is no 220V load test requirement.

[0028] The weak current drive load module of this embodiment includes a 24V weak current drive load group, a 12V weak current drive load group, a 5V weak current drive load group, and a 3.3V weak current drive load group; the 24V weak current drive load group, the 12V weak current drive load group, the 5V weak current drive load group, and the 3.3V weak current drive load group all include a number of load plug-in circuits; taking the 24V weak current drive load group as an example, see Figure 2, is a partial load plug-in circuit diagram of a 24V weak-current drive load group of a multifunctional bonding machine inductive load test tooling of the present embodiment, taking the CN25 load plug-in circuit shown therein as an example, including a capacitor C801, a freewheeling diode D801, and a load plug-in interface CN25 to be tested, wherein the first pin of the load plug-in interface CN25 to be tested is connected to the 24V weak current, and the second pin of the load plug-in interface CN25 to be tested is connected to the control feedback end of the switch control circuit as the control feedback end, one end of the capacitor C801 is connected in parallel to the line where the first pin of the load plug-in interface CN25 to be tested is located, and the other end of the capacitor C801 is connected in parallel to the line where the second pin of the load plug-in interface CN25 to be tested is located, the cathode of the freewheeling diode D801 is connected to the line where the first pin of the load plug-in interface CN25 to be tested is located, and the anode of the freewheeling diode D801 is connected On the line where pin 2 of the load plug-in interface CN25 to be tested is located; the connection relationship of other load plug-in circuits of the 24V low-current drive load group is the same as the above-mentioned CN25 load plug-in circuit, and each load plug-in circuit includes a filter capacitor, a freewheeling diode and a load plug-in interface to be tested; the load plug-in circuit group of the 12V low-current drive load group, the 5V low-current drive load group, and the 3.3V low-current drive load group is also configured the same as the load plug-in circuit group of the above-mentioned 24V low-current drive load group, and each load plug-in circuit also includes a filter capacitor, a freewheeling diode and a load plug-in interface to be tested, but the specific filter capacitor, freewheeling diode and load plug-in interface to be tested are reasonably configured according to the different driving voltages of the test loads. The relevant configuration methods are commonly used technical means in this field, and the utility model will not go into details here.

[0029] The switch control circuit module of this embodiment includes a number of switch control circuits corresponding to a number of load plug-in circuits included in the 24V weak current drive load group, the 12V weak current drive load group, the 5V weak current drive load group, and the 3.3V weak current drive load group; see Figure 3The present invention is a switch control circuit diagram of a multifunctional bonding machine inductive load test tooling according to an embodiment, which includes two switch control circuits connected to different load plug-in circuits. Taking the switch control circuit connected to load 1 as an example, the switch control circuit includes a diode D501, a resistor R501, a resistor R502, and a Darlington tube Q501. The base of the Darlington tube Q501 is connected to one end of the resistor R501, and the other end of the resistor R501 is connected to the negative electrode of the diode D501. The anode of the diode D501 is connected to the output end of the MCU driver chip as an input end, and the collector of the Darlington tube Q501 is connected to the control feedback end of the load plug-in circuit as a control feedback end. The emitter of the Darlington tube Q501 is grounded, and the resistor R502 is connected in parallel between the base and the emitter of the Darlington tube Q501. The switch control circuit connected to load 2 has the same configuration as the switch control circuit connected to load 1. At the same time, the input ends of the two different switch control circuits can be connected together to connect to the output end of the MCU driver chip.

[0030] See also Figure 4 , is a circuit diagram of a strong electric drive load module of a multifunctional bonding machine inductive load test tooling of this embodiment, including a photoelectric coupler U901, a bidirectional thyristor TR1, a capacitor C901, a capacitor C902, a resistor R901, a resistor R902, a resistor R903, a resistor R904, and a fuse FUSE1, wherein the first pin of the photoelectric coupler U901 is connected to the output end of the MCU driver chip, the second pin of the photoelectric coupler U901 is connected to one end of the resistor R901, one end of the capacitor C901 is connected in parallel to the first pin of the photoelectric coupler U901, the other end of the capacitor C901 is connected to the other end of the resistor R901 and is grounded, the fourth pin of the photoelectric coupler U901 is respectively connected to the gate of the bidirectional thyristor TR1 and one end of the resistor R902, the other end of the resistor R902 is connected to the other end of the 220V load to be tested as the OUT-2 output port, and the photoelectric coupler U901 is connected to the output end of the MCU driver chip, the second pin of the photoelectric coupler U901 is connected to one end of the resistor R901, the capacitor C901 is connected to the output end of the MCU driver chip ... The 6th pin of the electric coupler U901 is connected to one end of the resistor R903, the other end of the resistor R903 is connected to one end of the fuse FUSE1, the other end of the fuse FUSE1 is connected to one end of the 220V load to be tested as the OUT-1 output port, the two main terminals of the bidirectional thyristor TR1 are respectively connected in parallel to the other end of the resistor R903 and one end of the fuse FUSE1, which are connected close to the line where the other end of the resistor R903 and the line where the other end of the resistor R902 are located, one end of the capacitor C902 is connected to the other end of the resistor R903 and one end of the fuse FUSE1, which are connected close to the line where one end of the fuse FUSE1 is located, the other end of the capacitor C902 is connected to one end of the resistor R904, the other end of the resistor R904 is connected to the line where the other end of the resistor R902 is located, and the power supply end of the 220V load to be tested is powered by 220V strong electricity.

[0031] See also Figure 5, is a voice module circuit diagram of a multifunctional bonding machine inductive load test tooling of this embodiment, including a voice chip Music1, a speaker, a transistor Q4, a resistor RM3, a resistor RM2, a resistor RM1, and a capacitor CM1. The first pin of the voice chip Music1 and the 3.3V power supply are connected to the collector of the transistor Q4, the base of the transistor Q4 is connected to one end of the resistor RM3, the other end of the resistor RM3 is connected to the output end of the MCU driver chip, the emitter of the transistor Q4 is connected to one end of the resistor RM2, and the other end of the resistor RM2 is grounded. The voice chip M The 5th pin of usic1 is grounded, the 6th pin of the voice chip Music1 is connected to the 3.3V power supply, and the 6th pin of the voice chip Music1 is connected to the 3.3V power supply line. A common point is also provided to connect one end of the capacitor CM1, the other end of the capacitor CM1 is connected to one end of the resistor RM1 and grounded, the other end of the resistor RM1 is grounded, the 7th pin of the voice chip Music1 is connected to the 2nd pin of the speaker, the 8th pin of the voice chip Music1 is connected to the 1st pin of the speaker, and the 9th to 15th pins of the voice chip Music1 are respectively connected to the output end of the MCU driver chip.

[0032] See also Figure 6 , is a pin diagram of the MCU driver chip of a multifunctional bonding machine inductive load test tooling of this embodiment. The MCU driver chip model used in the utility model is MSP430F149. The single-chip microcomputer of this model has the largest number of output interfaces in the 16-bit single-chip microcomputer, which is 48PIN. Under this premise, combined with the power supply provided by the voltage conversion and power supply module of this embodiment, the weak-current drive load module can provide simultaneous testing for multiple weak-current loads. At the same time, the electric drive load module can provide testing for strong-current loads. Under the premise that many output interfaces are used as the output ends of the MCU driver chip, 220V high voltage can test 3 loads at the same time, and 24V / 12V / 5V weak-current loads each have 10 interfaces, with a total of 30 weak-current test interfaces; at the same time, the software is directly programmed in the MCU driver chip to control the load to be regularly turned on or off, and different working modes, automatic cycle test times, voice module prompts, buzzer beeping prompts, etc. are set to achieve precise control of test accuracy. The relevant programming content is the prior art. Relevant technicians in this field write applications according to actual test conditions, and the utility model will not be described in detail here.

[0033] When the utility model is working, 220V strong electricity supplies power to the strong power load to be tested, and is converted into weak voltage through the switch module and various voltage conversion chips to supply power to various different weak power drive load groups and MCU drive chip, buzzer, and voice module; at the same time, the high and low levels output by the output interface are controlled by the software program set in the MCU drive chip, so as to further control the switch control circuit, that is, when the output interface outputs a high level to the input end of the switch control circuit, the Darlington tube of the switch control circuit is turned on, and the load plug-in circuit is turned on for detection; when the output interface outputs a low level to the input end of the switch control circuit When the MCU driver chip output interface outputs a high level to the input end of the strong electric drive load module, the optocoupler U901 is turned on, making the bidirectional thyristor TR1 turned on, so that OUT-1 and OUT-2 are turned on, and the load can work; when the MCU driver chip output interface outputs a low level to the input end of the strong electric drive load module, the optocoupler is turned off, the bidirectional thyristor is turned off, and the load stops working; at the same time, the buzzer and voice module respond according to the control of the MCU driver chip, and emit sound and light to prompt the tester.

[0034] The utility model converts the voltage layer by layer through the voltage conversion and power supply module, and provides power to the load to be tested with different power supply requirements, as well as the MCU driver chip, buzzer, voice module and other modules at the same time, so as to meet the test requirements of various inductive loads on the bonding machine. At the same time, since there are more conversion voltages and the voltage itself has a certain fine-tuning amplitude, the utility model also has the function of overvoltage and undervoltage testing. The circuit can use 220V AC power supply or 24V DC power supply according to actual conditions; further, the weak-current drive load module of the utility model is composed of various weak-current drive load groups composed of load plug-in circuits with different power supply requirements, and the switch control circuit module is provided with a switch control circuit corresponding to each load plug-in circuit, and each load plug-in circuit is divided into 24V, 12V, 5V and 3.3V according to the different voltage requirements of the weak-current load to be tested. Under the control of the switch control circuit, the detection of weak-current loads with different voltage requirements can be realized. At the same time, the switch control circuit can choose to connect the input ends of the two switch control circuits together and connect them to the same MCU driver chip output interface according to actual needs, which greatly increases the number of loads that can be detected simultaneously; and the utility model is also provided with a strong-current drive load module, which can isolate, control and detect the strong-current load; based on the above-mentioned large number of output interface requirements, the utility model adopts the MSP430F149 single-chip microcomputer chip with many output interfaces and outstanding performance, with 48PIN, which can simultaneously meet the output interface output of 3 strong-current drive load modules and 30 weak-current output interface outputs, and realize the demand for simultaneous testing of a large number of loads with different voltage requirements; at the same time, sound and light prompts are given through the voice module and the buzzer to enhance human-computer interaction.

[0035] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multifunctional bonding machine inductive load test tool, characterized in that: It includes a voltage conversion and power supply module, an MCU driver chip, a buzzer, a voice module, a strong-current drive load module, a weak-current drive load module, and a switch control circuit module; the output end of the voltage conversion and power supply module is respectively connected to the MCU driver chip power supply end, the weak-current drive load module power supply end, the strong-current drive load module power supply end, the buzzer power supply end, and the voice module power supply end; the MCU driver chip output end is respectively connected to the strong-current drive load module input end, the buzzer input end, the voice module input end, and the switch control circuit module input end; the control feedback end of the switch control circuit module is connected to the control feedback end of the weak-current drive load module.

2. The multifunctional bonding machine inductive load testing tool according to claim 1, characterized in that: The voltage conversion and power supply module includes 220V strong electricity, 24V weak electricity, 12V weak electricity, 5V weak electricity, and 3.3V weak electricity. The 220V strong electricity provides power to the power supply end of the strong-electric drive load module, the 220V strong electricity is stepped down and converted into 24V weak electricity, the 24V weak electricity provides power to the power supply end of the weak-electric drive load module, the 24V weak electricity is stepped down and converted into 12V weak electricity, the 12V weak electricity provides power to the power supply end of the weak-electric drive load module, the 12V weak electricity is stepped down and converted into 5V weak electricity and 3.3V weak electricity, the 5V weak electricity provides power to the power supply end of the weak-electric drive load module, the 3.3V weak electricity provides power to the power supply end of the weak-electric drive load module, and the 3.3V weak electricity provides power to the power supply end of the MCU driver chip.

3. The multifunctional bonding machine inductive load testing tool according to claim 2, characterized in that: The 220V strong electricity is converted into 24V weak electricity through a switching power supply, the 24V weak electricity is converted into 12V weak electricity through a 12V voltage conversion chip, the 12V weak electricity is converted into 5V weak electricity through a 5V voltage conversion chip, and the 12V weak electricity is converted into 3.3V weak electricity through a 3.3V voltage conversion chip.

4. The multifunctional bonding machine inductive load testing tool according to claim 3, characterized in that: The specific model of the 12V voltage conversion chip is LR7812; the specific model of the 5V voltage conversion chip is LM7805; the specific model of the 3.3V voltage conversion chip is AMS1117-3.

3.

5. The multifunctional bonding machine inductive load testing tool according to claim 1, characterized in that: The weak current drive load module includes a 24V weak current drive load group, a 12V weak current drive load group, a 5V weak current drive load group, and a 3.3V weak current drive load group; the 24V weak current drive load group, the 12V weak current drive load group, the 5V weak current drive load group, and the 3.3V weak current drive load group all include a number of load plug-in circuits; wherein the power supply end of each load plug-in circuit in the 24V weak current drive load group is connected to the 24V weak current, and the control feedback end of each load plug-in circuit in the 24V weak current drive load group is connected to the control feedback end of the switch control circuit module; wherein each load plug-in circuit in the 12V weak current drive load group The power supply end of the circuit is connected to 12V weak current, and the control feedback end of each load plug-in circuit in the 12V weak current drive load group is connected to the control feedback end of the switch control circuit module; wherein the power supply end of each load plug-in circuit in the 5V weak current drive load group is connected to 5V weak current, and the control feedback end of each load plug-in circuit in the 5V weak current drive load group is connected to the control feedback end of the switch control circuit module; wherein the power supply end of each load plug-in circuit in the 3.3V weak current drive load group is connected to 3.3V weak current, and the control feedback end of each load plug-in circuit in the 3.3V weak current drive load group is connected to the control feedback end of the switch control circuit module.

6. The multifunctional bonding machine inductive load testing tool according to claim 1, characterized in that: The switch control circuit module includes multiple groups of switch control circuits, the input end of each switch control circuit is connected to the output end of the MCU driver chip, and the output end of each switch control circuit is connected to the input end of a load plug-in circuit.

7. The multifunctional bonding machine inductive load testing tool according to claim 6, characterized in that: The input ends of the two switch control circuits are connected together and connected to the output end of the MCU.

8. The multifunctional bonding machine inductive load testing tool according to claim 1, characterized in that: The voice module includes a voice chip Music1 and a speaker. The model of the voice chip Music1 is JQ8900. The 9th to 15th pins of the voice chip Music1 are connected to the output end of the MCU driver chip, the 7th pin of the voice chip Music1 is connected to the 2nd pin of the speaker, and the 8th pin of the voice chip Music1 is connected to the 1st pin of the speaker.

9. The multifunctional bonding machine inductive load testing tool according to claim 1, characterized in that: The model of the MCU driver chip is MSP430F149.

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