Heat dissipation device and computer

Abstract

The utility model provides a heat dissipation device and a computer. The heat dissipation device comprises a main heat dissipation sheet, an auxiliary heat dissipation sheet and a heat conduction pipe. The main cooling fin is provided with a first surface, and the first surface is used for being connected to the top of the processor. The auxiliary cooling fins are arranged on the main cooling fins, and the auxiliary cooling fins are spaced from the first surface in the first direction. The heat conduction pipe penetrates through the main cooling fins and the auxiliary cooling fins. The heat dissipation device provides a containing space for other parts except the processor, is suitable for compact design of the position of the computer processor, and is good in heat dissipation performance.

Description

Technical Field

[0001] The utility model generally relates to the technical field of radiators, and more specifically to a heat dissipation device and a computer. Background Art

[0002] At present, with the development of servers, the requirements for miniaturization of servers are receiving more and more attention. As server performance becomes more and more powerful, server components become more and more dense, and the heat dissipation space left for components becomes smaller and smaller, making the space in front of the CPU that could be used for heat dissipation easily occupied by other components. However, the power of the CPU is getting bigger and bigger, which brings greater challenges to the heat dissipation of the server. Utility Model Content

[0003] A series of simplified concepts are introduced in the utility model content section, which will be further described in detail in the detailed implementation section. The utility model content section of the utility model does not mean to attempt to define the key features and essential technical features of the technical solution claimed for protection, nor does it mean to attempt to determine the scope of protection of the technical solution claimed for protection.

[0004] In order to at least partially solve the above problems, the first aspect of the present invention provides a heat dissipation device, the heat dissipation device comprising:

[0005] A main heat sink, the main heat sink being provided with a first surface, the first surface being used for connecting to the top of the processor;

[0006] A secondary heat sink, the secondary heat sink being disposed on the main heat sink, the secondary heat sink being spaced apart from the first surface along a first direction; and

[0007] A heat conducting pipe is provided to penetrate the main heat sink and the auxiliary heat sink.

[0008] According to the heat dissipation device of the first aspect of the utility model, the main heat sink is connected to the processor, so that the auxiliary heat sink and the main heat sink can dissipate heat for the processor, and the auxiliary heat sink is separated from the first surface of the main heat sink, thereby providing accommodation space for other components, which is suitable for the compact design of the computer processor position. In addition, the provision of the heat pipe strengthens the heat conduction between the main heat sink and the auxiliary heat sink, so that the heat conducted from the processor to the main heat sink is diffused through the auxiliary heat sink, thereby improving the overall heat dissipation performance of the heat dissipation device.

[0009] Optionally, the heat dissipation device also includes a mounting plate, which is connected to the first surface and is used to be mounted on the processor; the first end of the heat pipe is passed through the main heat sink and the auxiliary heat sink along the second direction, and the second end of the heat pipe is passed between the mounting plate and the first surface.

[0010] Optionally, a receiving groove is provided on a side of the main heat sink close to the auxiliary heat sink, and the heat pipe is at least partially located in the receiving groove.

[0011] Optionally, the main heat sink comprises a plurality of first fins, and the plurality of first fins are arranged at intervals along the second direction; and / or

[0012] The auxiliary heat sink includes a plurality of second fins, and the plurality of second fins are arranged at intervals along the second direction.

[0013] Optionally, the mounting plate is provided with a first half groove, and the first surface is provided with a second half groove, and the first half groove and the second half groove are arranged correspondingly and constitute a heat-conducting groove for passing the heat-conducting pipe.

[0014] Optionally, the heat dissipation device further includes a heat conducting layer, which is disposed on the mounting plate and is used to contact the processor.

[0015] Optionally, the heat dissipation device includes two auxiliary heat sinks, and along a second direction perpendicular to the first direction, the two auxiliary heat sinks are respectively located on both sides of the main heat sink.

[0016] Optionally, the main heat sink is further provided with a second surface, the second surface is spaced apart from the first surface along the first direction, and the auxiliary heat sink is aligned with the second surface.

[0017] Optionally, the heat dissipation device further includes a reinforcing plate, wherein the reinforcing plate is attached to the second surface and the auxiliary heat sink, and the reinforcing plate is provided with a bending edge, and the bending edge is located on the side of the main heat sink and the auxiliary heat sink.

[0018] A second aspect of the present invention provides a computer, comprising:

[0019] processor;

[0020] Electronic devices; and

[0021] According to the above heat dissipation device, the first surface is connected to the top of the processor.

[0022] The computer according to the second aspect of the utility model has a compact structure and high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following drawings of the embodiments of the present invention are used as part of the present invention for understanding the present invention. The drawings show the embodiments of the present invention and their descriptions, and are used to explain the principles of the present invention. In the drawings,

[0024] Figure 1A three-dimensional schematic diagram of a heat dissipation device according to a preferred embodiment of the utility model;

[0025] Figure 2 for Figure 1 An exploded schematic diagram of the heat sink in FIG.

[0026] Figure 3 is a three-dimensional schematic diagram of a main heat sink;

[0027] Figure 4 is a three-dimensional schematic diagram of an auxiliary heat sink; and

[0028] Figure 5 for Figure 1 Side view of the heat sink in FIG.

[0029] Description of Reference Numerals

[0030] 100: Mounting plate 101: First half slot

[0031] 110: Fastener 120: Main heat sink

[0032] 121: first fin 122: first surface

[0033] 123: second surface 124: first heat conducting hole

[0034] 125: second half slot 126: receiving slot

[0035] 130: auxiliary heat sink 131: second fin

[0036] 132: Second heat conducting hole 140: Heat conducting pipe

[0037] 141: first heat pipe 142: second heat pipe

[0038] 150: Reinforcement plate 151: Bend edge

[0039] 160: Heat conducting layer 170: Heat conducting groove

[0040] D1: First direction D2: Second direction

[0041] D3: Third direction DETAILED DESCRIPTION

[0042] In the following description, a large number of specific details are given to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.

[0043] In this document, ordinal numbers such as "first" and "second" cited in the present invention are merely identifiers and do not have any other meanings, such as a specific order, etc. Moreover, for example, the term "first component" itself does not imply the existence of the "second component", and the term "second component" itself does not imply the existence of the "first component".

[0044] In this document, “upper”, “lower”, “front”, “back”, “left”, “right”, etc. are only used to indicate the relative position relationship between related parts, rather than to limit the absolute positions of these related parts.

[0045] In this document, “equal”, “same”, etc. are not strictly limited in a mathematical and / or geometric sense, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use.

[0046] Unless otherwise stated, the numerical ranges herein include not only the entire range within its two endpoints but also include several sub-ranges contained therein.

[0047] Figures 1 to 5 A heat dissipation device according to the present invention is shown, and the heat dissipation device includes a main heat sink 120, an auxiliary heat sink 130, and a heat pipe 140. The main heat sink 120 is provided with a first surface 122, and the first surface 122 is used to connect to the top of the processor. The auxiliary heat sink 130 is provided on the main heat sink 120, and the auxiliary heat sink 130 is spaced from the first surface 122 along the first direction D1. The heat pipe 140 is penetrated to the main heat sink 120 and the auxiliary heat sink 130.

[0048] According to the heat dissipation device of the present invention, the main heat sink 120 is connected to the processor, so that the auxiliary heat sink 130 and the main heat sink 120 can dissipate heat for the processor, and the auxiliary heat sink 130 is spaced apart from the first surface 122 of the main heat sink 120, thereby providing accommodation space for other components, which is suitable for the compact design of the computer processor position. In addition, the provision of the heat pipe 140 strengthens the heat conduction between the main heat sink 120 and the auxiliary heat sink 130, so that the heat conducted from the processor to the main heat sink 120 is diffused through the auxiliary heat sink 130, thereby improving the overall heat dissipation performance of the heat dissipation device.

[0049] Reference Figure 1 Along the second direction D2, the auxiliary heat sink 130 is disposed on the side of the main heat sink 120, so that the auxiliary heat sink 130 and the main heat sink 120 form an accommodating space for accommodating other electronic components on the side of the processor.

[0050] Reference Figure 3The main heat sink 120 is also provided with a second surface 123, the first surface 122 is the bottom surface of the main heat sink 120, the second surface 123 is the top surface of the main heat sink 120, and along the first direction D1, the first surface 122 and the second surface 123 are spaced apart. The heat dissipation device includes two auxiliary heat sinks 130, which are arranged along the second direction D2 and are respectively located on both sides of the main heat sink 120. The top surface of the auxiliary heat sink 130 is flush with the second surface 123 of the main heat sink 120, so that the heat dissipation device is T-shaped as a whole. The heat dissipation device is installed on the top of the processor, so that both sides of the main heat sink 120 form a storage space for accommodating other electronic devices such as memory, which makes the arrangement of the processor and other electronic devices in the computer more compact on the basis of ensuring the heat dissipation effect of the processor.

[0051] In addition, the main heat sink 120 and the auxiliary heat sink 130 are welded together, so the structure is stable and conducive to heat conduction.

[0052] Reference Figure 3 and Figure 4 The main heat sink 120 includes a plurality of first fins 121, which are arranged at intervals along the second direction D2, so that the heat conducted to the main heat sink 120 is diffused into the air from the surface of each first fin 121. The auxiliary heat sink 130 includes a plurality of second fins 131, which are arranged at intervals along the second direction D2, so that the heat transmitted to the auxiliary heat sink 130 is diffused into the air from the surface of each second fin 131. The structural arrangement of the main heat sink 120 and the auxiliary heat sink 130 has good heat dissipation performance and a compact structure.

[0053] Reference Figure 3 , the main heat sink 120 is provided with six first heat conduction holes 124 and six receiving grooves 126, the first heat conduction holes 124 penetrate the main heat sink 120 along the second direction D2, and the six first heat conduction holes 124 are arranged along the third direction D3. The six receiving grooves 126 are divided into two groups, and the two groups of receiving grooves 126 are arranged on both sides of the main heat sink 120. Each group of receiving grooves 126 includes three receiving grooves 126, and the three receiving grooves 126 in one group are respectively connected to the three first heat conduction holes 124. The two auxiliary heat sinks 130 are provided with second heat conduction holes 132, and the second heat conduction holes 132 penetrate the auxiliary heat sink 130 along the second direction D2. Each auxiliary heat sink 130 is provided with three second heat conduction holes 132, and the second heat conduction holes 132 of the two auxiliary heat sinks 130 (a total of six second heat conduction holes 132) are arranged one by one with the six first heat conduction holes 124.

[0054] Combination Figure 1 and Figure 2As shown, the heat pipe 140 includes three first heat pipes 141 and three second heat pipes 142, and the three first heat pipes 141 are correspondingly arranged in three receiving grooves 126 located on one side of the main heat sink 120. The first end of the first heat pipe 141 passes through the first heat conduction hole 124 and the second heat conduction hole 132 in sequence, so that the main heat sink 120 and the auxiliary heat sink 130 are inserted together through the heat pipe 140, and the second end of the first heat pipe 141 extends to the first surface 122 of the main heat sink 120. Similarly, the three second heat pipes 142 are correspondingly arranged in the three receiving grooves 126 located on the other side of the main heat sink 120. The first end of the second heat pipe 142 passes through the first heat conduction hole 124 and the second heat conduction hole 132 in sequence, and the second end of the second heat pipe 142 extends to the first surface 122 of the main heat sink 120. Through the first heat pipe 141 and the second heat pipe 142, the two auxiliary heat sinks 130 are connected to the main heat sink 120 through the heat pipe 140, which not only strengthens the connection strength between the two auxiliary heat sinks 130 and the main heat sink 120, but also helps to strengthen the conduction of heat in the main heat sink 120 toward the two auxiliary heat sinks 130, thereby improving the overall stability and heat dissipation performance of the heat sink. In addition, the arrangement of the receiving groove 126 prevents the heat pipe 140 from interfering with the auxiliary heat sink 130, making the structure of the heat sink more compact.

[0055] Further, combined with Figure 5 As shown, the heat sink further includes a mounting plate 100, the top surface of the mounting plate 100 is welded to the first surface 122 of the main heat sink 120, and fasteners 110 (such as mounting nuts or screws, etc.) are provided at the four corners of the mounting plate 100, so that the mounting plate 100 can be connected to the processor. The arrangement of the mounting plate 100 facilitates the installation of the heat sink to the processor and facilitates assembly and disassembly. In detail, the mounting plate 100 is provided with six first half slots 101, the six first half slots 101 are arranged along the third direction D3, and the six first half slots 101 all extend along the second direction D2. The first surface 122 of the main heat sink 120 is provided with six second half grooves 125, and the six first half grooves 101 are respectively provided corresponding to the six second half grooves 125, and the six first half grooves 101 and the six second half grooves 125 constitute six heat conduction grooves 170, and the six heat conduction grooves 170 are respectively used to penetrate the second ends of six heat pipes 140 (three first heat pipes 141 and three second heat pipes 142). Through the arrangement of the mounting plate 100, the heat pipes 140 and the main heat sink 120, the heat pipes 140 are respectively in full contact with the bottom of the main heat sink 120 and the top of the mounting plate 100, so that the heat transferred from the processor to the mounting plate 100 can be transferred to the top of the main heat sink 120 and the auxiliary heat sink 130 through the heat pipes 140, which has the effect of accelerating the heat dissipation performance of the heat sink.

[0056] Optionally, the heat sink further includes a heat conducting layer 160, which is disposed on the bottom surface of the mounting plate 100. When the mounting plate 100 is connected to the processor, the heat conducting layer 160 contacts the top surface of the processor. The heat conducting layer 160 may be made of silicone material, which can enhance the heat conduction speed between the processor and the heat sink, and is also conducive to enhancing the insulation between the processor and the heat sink.

[0057] Reference Figure 1 and Figure 2 The heat dissipation device further includes a reinforcing plate 150, which is attached to the second surface 123 and the top surface of the auxiliary heat sink 130. The reinforcing plate 150 is welded and fixed to the main heat sink 120 and the auxiliary heat sink 130, thereby strengthening the connection strength between the main heat sink 120 and the auxiliary heat sink 130. The reinforcing plate 150 is provided with bending edges 151 on both sides along the third direction D3. The two bending edges 151 are located on both sides of the main heat sink 120 and the auxiliary heat sink 130, so that the main heat sink 120 and the auxiliary heat sink 130 can be limited along the third direction D3, further strengthening the connection strength between the main heat sink 120 and the auxiliary heat sink 130, and also contributing to the overall stability of the heat dissipation device.

[0058] The utility model also provides a computer, comprising a processor, an electronic device and the heat dissipation device according to the above. The first surface 122 of the main heat sink 120 is connected to the top of the processor. The accommodation space is used to accommodate the electronic device. The computer according to the utility model has a compact structure and high heat dissipation efficiency.

[0059] Optionally, the computer includes products such as servers, computers, and mobile phones, and the processor includes a central processing unit (CPU) or a microprocessor, etc. The electronic device is generally a memory device, and can also be other devices of the computer, depending on the actual structure of the computer.

[0060] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art in the technical field of the present invention. The terms used herein are only for describing specific implementation purposes and are not intended to limit the present invention. Terms such as "setting" appearing in this article may indicate that one component is directly attached to another component, or that one component is attached to another component through an intermediate. Features described in this article in one embodiment may be applied to another embodiment alone or in combination with other features, unless the feature is not applicable in the other embodiment or otherwise specified.

[0061] The utility model has been described through the above embodiments, but it should be understood that the above embodiments are only for the purpose of example and description, and are not intended to limit the utility model to the described embodiments. It can be understood by those skilled in the art that more variations and modifications can be made according to the teachings of the utility model, and these variations and modifications all fall within the scope of the protection claimed by the utility model.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device comprises: A main heat sink, the main heat sink being provided with a first surface, the first surface being used for connecting to the top of the processor; A secondary heat sink, the secondary heat sink being disposed on the main heat sink, the secondary heat sink being spaced apart from the first surface along a first direction; and A heat conducting pipe is provided to penetrate the main heat sink and the auxiliary heat sink.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a mounting plate, which is connected to the first surface and is used to be mounted on the processor; the first end of the heat pipe is passed through the main heat sink and the auxiliary heat sink along the second direction, and the second end of the heat pipe is passed between the mounting plate and the first surface.

3. The heat dissipation device according to claim 2, characterized in that: A receiving groove is provided on the side of the main heat sink close to the auxiliary heat sink, and the heat pipe is at least partially located in the receiving groove.

4. The heat dissipation device according to claim 2, characterized in that: The main heat sink comprises a plurality of first fins, and the plurality of first fins are arranged at intervals along the second direction; and / or The auxiliary heat sink includes a plurality of second fins, and the plurality of second fins are arranged at intervals along the second direction.

5. The heat dissipation device according to claim 2, characterized in that: The mounting plate is provided with a first half groove, and the first surface is provided with a second half groove. The first half groove and the second half groove are arranged correspondingly and constitute a heat-conducting groove for passing the heat-conducting pipe.

6. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device further comprises a heat conducting layer, which is arranged on the mounting plate and is used for contacting the processor.

7. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device comprises two auxiliary heat sinks, and along a second direction perpendicular to the first direction, the two auxiliary heat sinks are respectively located on both sides of the main heat sink.

8. The heat dissipation device according to claim 1, characterized in that: The main heat sink is further provided with a second surface, the second surface is spaced apart from the first surface along the first direction, and the auxiliary heat sink is aligned with the second surface.

9. The heat dissipation device according to claim 8, characterized in that: The heat dissipation device further comprises a reinforcing plate, the reinforcing plate is attached to the second surface and the auxiliary heat sink, the reinforcing plate is provided with a bending edge, and the bending edge is located at the side of the main heat sink and the auxiliary heat sink.

10. A computer, characterized in that: include: processor; Electronic devices; as well as According to any one of claims 1 to 9, the first surface is connected to the top of the processor.

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