Structure for improving antistatic capability of FPC

Abstract

The structure for improving the antistatic capability of the FPC comprises the FPC and a mainboard, an electronic element is arranged on the front face of the FPC, a reinforcing plate is arranged at the position, close to the bottom, of the center of the right side of the front face of the FPC, a copper leaking area is arranged at the bottom of the front face of the FPC, and a conductive device is arranged on the front face of the copper leaking area; and the conductive device and the main board are connected with each other. According to the structure for improving the antistatic capability of the FPC, the areas, where the wires are not arranged, on the FPC are all arranged to be the copper leakage areas, and the conductive devices (conductive cloth or conductive double-sided adhesive tapes) are arranged on the surfaces of the copper leakage areas, so that static electricity on the copper leakage areas can be guided into the conductive devices, and the conductive devices are connected with the ground wire of the mainboard, so that the static electricity on the copper leakage areas can be guided into the conductive devices. Therefore, static electricity on the FPC can be transmitted to the ground wire on the mainboard, the ground wire is connected with a shell of a product, finally the static electricity can be released from the shell, and the problem that the static electricity is accumulated on a display screen and the FPC end and cannot be released is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC, in particular to a structure for improving the antistatic ability of FPC. Background Art

[0002] At present, there are more and more intelligent things. With the development of science and technology, intelligence can be seen everywhere in people's lives. Smart wearable products have been sought after by people in recent years. Among them, smart watches and bracelets are of various styles. They are not only used as watches and sports equipment, but also have certain accessories. The static electricity problem of all wearable electronic products has always existed. At present, wearable electronic products with display screens will be affected by their own or external static electricity during use. Static electricity accumulates on the display screen and FPC end and cannot be released, which eventually leads to display abnormalities and other adverse phenomena. In severe cases, the product will be unusable. In mild cases, it will affect the product during use and reduce the buyer's experience. Utility Model Content

[0003] The utility model aims to overcome the shortcomings of the prior art and provide a structure for improving the antistatic ability of FPC.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A structure for improving the antistatic ability of an FPC comprises: an FPC and a main board, wherein an electronic component is arranged on the front of the FPC, a reinforcing plate is arranged at a position near the bottom of the right center of the front of the FPC, a copper leakage area is arranged at the bottom of the front of the FPC, and a conductive device is arranged on the front of the copper leakage area; the conductive device and the main board are connected to each other.

[0006] In one of the embodiments, an EMI circuit is disposed at the center of the front side of the FPC. The EMI circuit covers the central area of ​​the FPC, and the area occupied by the EMI circuit is 70% of the central area of ​​the FPC.

[0007] In one of the embodiments, the electronic component is arranged on the right side of the top of the front side of the FPC, and insulating paper is arranged on the surface of the electronic component.

[0008] In one of the embodiments, a layer of foam is disposed on the front side of the reinforcing plate, and an FPC binding area is disposed at a corresponding position on the back side of the reinforcing plate.

[0009] In one of the embodiments, a SUS reinforcing plate is provided on the right side of the front side of the FPC and at the back side of the electronic component, and the area of ​​the front side of the SUS reinforcing plate is the same as the area of ​​the front side of the electronic component.

[0010] In one embodiment, the conductive device is conductive cloth or conductive double-sided adhesive.

[0011] In one of the embodiments, a plurality of heat dissipation elements are disposed on the back of the FPC near the electronic components.

[0012] In one of the embodiments, the copper leakage area is arranged at the lower left corner of the bottom of the front surface of the FPC, and the conductive device covers the top of the copper leakage area and is adhered to each other.

[0013] In one embodiment, the ground wire of the mainboard is connected to the housing of the product, and the ground wire of the mainboard is connected to the conductive device.

[0014] In one embodiment, the area of ​​the front side of the insulating paper is larger than the area of ​​the front side of the electronic component, and the insulating paper covers the entire electronic component.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The utility model discloses a structure for improving the anti-static ability of FPC, by setting all the areas on FPC without wiring as copper leakage areas, and by setting a conductive device (conductive cloth or conductive double-sided adhesive) on the surface of the copper leakage area, so that the static electricity on the copper leakage area can be introduced into the conductive device, and the conductive device is connected with the ground wire of the mainboard, so that the static electricity on the FPC can be transmitted to the ground wire on the mainboard, and the ground wire is connected with the shell of the product, and finally the static electricity can be released from the shell, so as to solve the problem that the static electricity accumulates on the display screen and the FPC end and cannot be released. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a front overall schematic diagram of the structure for improving the antistatic ability of FPC according to the utility model.

[0019] In the figure: 1. FPC; 11. EMI circuit; 12. Conductive device; 13. Insulation paper; 14. Electronic components; 15. Reinforcement board; 16. Copper leakage area; 2. Main board. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0021] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] Unless otherwise clearly stipulated and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] like Figure 1 As shown, a structure for improving the antistatic ability of FPC includes: FPC1 and main board 2, an electronic component 14 is arranged on the front of FPC1, a reinforcing plate 15 is arranged at the center of the right side of the front of FPC1 near the bottom, a copper leakage area 16 is arranged at the bottom of the front of FPC1, and a conductive device 12 is arranged on the front of the copper leakage area 16; the conductive device 12 and the main board 2 are connected to each other. It should be noted that the design idea of ​​the technical solution is to use the conductive device 12 (conductive cloth or conductive double-sided adhesive) to conduct the static electricity accumulated on FPC1 to the ground wire of the main board 2, and the ground wire of the main board 2 is connected to the shell of the display module, so that the static electricity on FPC1 and the main board 2 can be released from the shell.

[0025] like Figure 1As shown, in one embodiment, an EMI circuit 11 is arranged in the center of the front of FPC1, and the EMI circuit 11 covers the central area of ​​FPC1, and the area occupied by the EMI circuit 11 is 70% of the central area of ​​FPC1. It should be noted that the EMI circuit 11 has the function of protecting FPC1 and preventing external signals from affecting the signals of the electronic components 14 inside FPC1.

[0026] like Figure 1 As shown, in one embodiment, the electronic component 14 is arranged on the right side of the top of the front of the FPC1, and the surface of the electronic component 14 is provided with an insulating paper 13. The area of ​​the front of the insulating paper 13 is larger than the area of ​​the front of the electronic component 14, and the insulating paper 13 covers the entire electronic component 14. It should be noted that this design can protect the electronic component 14 from leakage.

[0027] like Figure 1 As shown, in one embodiment, a layer of foam is provided on the front of the reinforcing plate 15, and an FPC binding area is provided at a corresponding position of the back of the FPC1. It should be noted that the reinforcing plate 15 can enhance the hardness of the FPC binding area, thereby facilitating the external binding of the FPC binding area.

[0028] like Figure 1 As shown, in one embodiment, a SUS reinforcing plate is provided on the right side of the front of the FPC 1 and at the back of the electronic component 14, and the area of ​​the front of the SUS reinforcing plate is the same as the area of ​​the front of the electronic component 14. It should be noted that this design can enhance the hardness of the electronic component 14 area and can protect the electronic component 14.

[0029] like Figure 1 As shown, in one embodiment, the conductive device 12 is a conductive cloth or a conductive double-sided adhesive. It should be noted that the staff can choose to use a conductive cloth or a conductive double-sided adhesive according to their needs.

[0030] like Figure 1 As shown, in one embodiment, a plurality of heat dissipation elements are arranged at the back of the FPC 1 near the electronic element 14. It should be noted that this design can enhance the heat dissipation capability of the FPC 1.

[0031] like Figure 1 As shown, in one embodiment, the copper leakage area 16 is set at the lower left corner of the bottom of the front side of the FPC1, and the conductive device 12 covers the top of the copper leakage area 16 and fits together. It should be noted that the copper leakage area 16 is set at a position where no circuit is set on the FPC1.

[0032] like Figure 1As shown, in one embodiment, the ground wire of the mainboard 2 is connected to the product housing, and the ground wire of the mainboard 2 is connected to the conductive device 12. It should be noted that this design allows static electricity on the conductive device 12 to be introduced into the ground wire of the mainboard 2.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A structure for improving the antistatic ability of FPC, characterized in that: include: FPC (1) and motherboard (2), An electronic component (14) is arranged on the front of the FPC (1); a reinforcing plate (15) is arranged at a position close to the bottom of the right center of the front of the FPC (1); a copper leakage area (16) is arranged at the bottom of the front of the FPC (1); and a conductive device (12) is arranged on the front of the copper leakage area (16); The conductive device (12) and the main board (2) are connected to each other.

2. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: An EMI circuit (11) is arranged at the center of the front side of the FPC (1). The EMI circuit (11) covers the central area of ​​the FPC (1), and the area occupied by the EMI circuit (11) is 70% of the central area of ​​the FPC (1).

3. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: The electronic component (14) is arranged on the right side of the top of the front side of the FPC (1), and insulating paper (13) is arranged on the surface of the electronic component (14).

4. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: A layer of foam is provided on the front side of the reinforcing plate (15), and an FPC binding area is provided at a corresponding position of the FPC (1) on the back side of the reinforcing plate (15).

5. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: A SUS reinforcing plate is provided on the right side of the front side of the FPC (1) and at the back side of the electronic component (14); the area of ​​the front side of the SUS reinforcing plate is the same as the area of ​​the front side of the electronic component (14).

6. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: The conductive device (12) is conductive cloth or conductive double-sided adhesive.

7. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: A plurality of heat dissipation components are arranged at the back of the FPC (1) near the electronic component (14).

8. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: The copper leakage area (16) is arranged at the lower left corner of the bottom of the front surface of the FPC (1), and the conductive device (12) covers the top of the copper leakage area (16) and is bonded together.

9. The structure for improving the antistatic ability of FPC according to claim 1, characterized in that: The ground wire of the main board (2) and the outer shell of the product are connected to each other, and the ground wire of the main board (2) and the conductive device (12) are connected to each other.

10. The structure for improving the antistatic ability of FPC according to claim 3, characterized in that: The area of ​​the front side of the insulating paper (13) is larger than the area of ​​the front side of the electronic component (14), and the insulating paper (13) covers the entire electronic component (14).

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