Power amplifier with efficient heat dissipation mechanism

Abstract

The utility model relates to the technical field of power amplifiers, in particular to a power amplifier with an efficient heat dissipation mechanism, which comprises a machine body, an installation support and a heat dissipation fan, a plurality of adjusting knobs for adjusting power are laid in the middle of the front end of the machine body, and the installation support is arranged on the machine body. An adjusting knob is arranged in the machine body, a connecting sleeve is arranged at the joint of the adjusting knob and the outer surface of the machine body, a PCB integrated with electronic components is erected in the machine body, a heat dissipation fan is erected above a heat source of the PCB, and a plurality of heat dissipation holes are formed in the joint of the machine body and the heat dissipation fan; the heat dissipation fin plate and the aluminum telescopic column serve as heat conduction sources and are connected with the heat dissipation fan in a wrapping connection mode, an air opening of the heat dissipation fan is aligned with the heat dissipation holes, the top of the heat dissipation fin plate makes contact with the heat dissipation holes, airflow of the air opening can only be distributed along the heat dissipation holes, and it is guaranteed that heat conduction airflow can only be discharged from the heat dissipation holes in the upper portion.

Description

Technical Field

[0001] The utility model relates to the field of power amplifiers, in particular to a power amplifier with a high-efficiency heat dissipation mechanism. Background Art

[0002] A power amplifier is a device that can amplify the voltage or power of an input signal. It is composed of electron tubes or transistors, power transformers and other electrical components. It is used in various devices such as communications, broadcasting, radar, television, and automatic control. The power amplifier is used in the final stage of the transmitter to amplify the power of the high-frequency modulated wave signal to meet the transmission power requirements.

[0003] The utility model relates to a heat dissipation structure of a power amplifier and a power amplifier (CN211321861 U), the heat dissipation structure includes a power amplifier tube, and also includes: a box body, the interior of the box body is a hollow structure, the box body is formed by an integrated temperature equalizing plate, and the power amplifier tube is fixed on the inner surface of the box body; a heat dissipation unit, the heat dissipation unit is located on the side of the power amplifier tube close to the box body, when the power amplifier is working, the heat dissipation unit is used to provide different sizes of airflow to heat sources with different temperatures in the box body. In the above scheme provided by the present application, since the box body is formed by an integrated temperature equalizing plate, the power amplifier tube is directly installed on the temperature equalizing plate, so that the heat generated by the power amplifier tube can be quickly expanded to the inner surface of the box body, thereby improving the heat dissipation effect of the power amplifier tube, and at the same time, since the heat dissipation unit can provide different sizes of airflow to heat sources with different temperatures in the box body, the heat source with high temperature in the box body can be quickly dissipated and cooled, thereby achieving a good heat dissipation effect. However, during use, there is a certain distance between the heat dissipation system and the heat source. During the heat exchange process, the heat exchange cannot be fully carried out. At the same time, due to the use of air cooling, there is a certain distance between the airflow and the heat dissipation holes of the machine box, which causes the airflow to diffuse along the box body, which is not conducive to the normal operation of the entire heat dissipation system and brings troubles to users.

[0004] To this end, we propose a power amplifier with an efficient heat dissipation mechanism. Utility Model Content

[0005] The purpose of the utility model is to provide a power amplifier with an efficient heat dissipation mechanism to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: the power amplifier with an efficient heat dissipation mechanism comprises: a body, a mounting bracket and a heat dissipation fan, a plurality of adjustment knobs for adjusting power are laid on the middle part of the front end of the body, and a connecting sleeve is formed at the connection between the adjustment knob and the outer surface of the body, a PCB circuit board with integrated electronic components is mounted inside the body, and a heat dissipation fan is mounted above the heat source of the PCB circuit board, a plurality of heat dissipation holes are opened at the connection between the body and the heat dissipation fan, and heat conduction heat dissipation fins are mounted around the outer wall of the heat dissipation fan, the lower end of the heat dissipation fin is connected to a bottom support, and the lower end of the bottom support is movably connected to an aluminum telescopic column, the lower end of the aluminum telescopic column is coated with a layer of silicone grease pad, and the silicone grease pad is in contact with the heat source of the PCB circuit board.

[0007] Preferably, a mounting bracket is fixed to one side of the machine body, and the mounting bracket and the machine body are fastened with bolts.

[0008] Preferably, a connecting hole is opened in the middle of the mounting bracket, and the two mounting brackets are distributed in an "I"-shaped structure.

[0009] Preferably, an inner cushion sleeve is sleeved at the connection between the adjusting knob and the inner wall of the machine body, and a sealing gasket for friction protection is attached to the connection between the inner cushion sleeve and the inner wall of the machine body.

[0010] Preferably, both ends of the heat dissipation fin are fixedly connected with mounting screw holes, and the inner walls of the mounting screw holes are threadedly connected with spring nuts with a shock-absorbing mounting function.

[0011] Preferably, the heat dissipation fin is detachably connected to the body via a spring nut and a mounting screw hole.

[0012] Compared with the prior art, the beneficial effects of the utility model are: the entire mounting bracket serves as the connecting and mounting component of the machine body, and the overall "I"-shaped structure design can be well connected with most connecting components. At the same time, the "I"-shaped structure also has a certain clamping function, ensuring that the machine body can operate normally in a suitable environment.

[0013] The utility model provides a power amplifier with an efficient heat dissipation mechanism. The heat dissipation fins and the aluminum telescopic column serve as heat conduction sources and are connected to the heat dissipation fan in a wrapped connection manner. The air outlet of the heat dissipation fan is aligned with the heat dissipation holes. The top of the heat dissipation fins contacts the heat dissipation holes. The airflow of the air outlet can only be distributed along the heat dissipation holes, ensuring that the heat conduction airflow can only be discharged from the upper heat dissipation holes. The bottom of the heat dissipation fan adopts a telescopic aluminum telescopic column to contact the heat source on the PCB circuit board, which can ensure that the aluminum telescopic column is fully close to the heat source on the PCB circuit board for heat conduction, thereby improving the heat dissipation efficiency of the machine body. At the same time, the bottom support and the aluminum telescopic column are both made of aluminum material, which can meet the needs of heat conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the heat dissipation fan of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the adjusting knob of the utility model.

[0017] In the figure: 1, machine body; 11, PCB circuit board; 2, mounting bracket; 21, connection hole; 3, adjustment knob; 31, connection sleeve; 32, inner cushion sleeve; 33, sealing gasket; 4, heat dissipation hole; 5, cooling fan; 51, cooling fin; 52, mounting screw hole; 53, spring nut; 54, bottom support; 55, aluminum telescopic column;

[0018] 56. Silicone pad. DETAILED DESCRIPTION

[0019] In order to make the purpose and technical solution of the utility model clearly and completely described, and the advantages more clearly understood, the embodiments of the utility model are further described in detail in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are part of the embodiments of the utility model, not all of the embodiments, and are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] See also Figure 1-Figure 3The utility model provides a technical solution: the power amplifier with an efficient heat dissipation mechanism comprises: a body 1, a mounting bracket 2 and a heat dissipation fan 5, a plurality of adjusting knobs 3 for adjusting power are laid in the middle of the front end of the body 1, and a connecting sleeve 31 is connected at the connection between the adjusting knob 3 and the outer surface of the body 1, a PCB circuit board 11 with integrated electronic components is set up inside the body 1, and a heat dissipation fan 5 is set up above the heat source of the PCB circuit board 11, a plurality of heat dissipation holes 4 are opened at the connection between the body 1 and the heat dissipation fan 5, and a heat conduction heat dissipation fin 51 is set up around the outer wall of the heat dissipation fan 5, the lower end of the heat dissipation fin 51 is connected to a bottom support 54, and the lower end of the bottom support 54 is movably connected to an aluminum telescopic column 55, and the lower end of the aluminum telescopic column 55 is coated with a layer of silicone grease Pad 56, and the silicone pad 56 is in contact with the heat source of the PCB circuit board 11, a mounting bracket 2 is fixed to one side of the body 1, and the mounting bracket 2 and the body 1 are connected by bolts, a connecting hole 21 is opened in the middle of the mounting bracket 2, and the two mounting brackets 2 are distributed in an "I"-shaped structure. The entire mounting bracket 2 serves as a connecting and mounting component of the body 1, and the overall "I"-shaped structure design is adopted, which can be well connected with most connecting components. At the same time, the "I"-shaped structure also has a certain clamping function, ensuring that the body 1 can operate normally in a suitable environment. At the same time, the mounting bracket 2 is provided with a vertically fixed connecting hole 21, which further ensures the requirement of full connection between the body 1 and the connecting component to prevent the possibility of the body 1 falling from a high altitude.

[0022] Embodiment 2

[0023] On the basis of the first embodiment, the connection between the adjusting knob 3 and the inner wall of the body 1 is sleeved with an inner cushion sleeve 32, and the connection between the inner cushion sleeve 32 and the inner wall of the body 1 is adhered with a sealing gasket 33 for friction protection. The adjusting knob 3 serves as the adjustment system of the body 1 and is connected to the output end of the body 1. The adjusting knob 3 is connected to the body 1 in a high-friction connection manner. The inner cushion sleeve 32 and the connecting sleeve 31 form a clamping space, which is connected to the body 1. At the same time, in order to increase the friction coefficient between the clamping space and the body 1, a layer of sealing gasket 33 is applied to further increase the friction coefficient between the adjusting knob 3 and the body 1, so as to facilitate the user to fine-tune the adjusting knob 3 according to needs.

[0024] Embodiment 3

[0025] On the basis of the second embodiment, both ends of the heat dissipation fin 51 are fixedly connected with mounting screw holes 52, and the inner wall of the mounting screw hole 52 is threadedly connected with a spring nut 53 with a shock-absorbing mounting function. The heat dissipation fin 51 is detachably connected to the body 1 through the spring nut 53 and the mounting screw hole 52. The heat dissipation fin 51 and the aluminum telescopic column 55 are used as heat conduction sources and are connected to the heat dissipation fan 5 in a wrapped connection manner. The air outlet of the heat dissipation fan 5 is aligned with the heat dissipation hole 4, and the top of the heat dissipation fin 51 is in contact with the heat dissipation hole 4. The airflow of the air outlet can only be distributed along the heat dissipation hole 4, ensuring that the heat conduction airflow can only be discharged from the upper heat dissipation hole 4. The bottom of the body 1 is also provided with a heat dissipation hole 4 to meet the demand for air flow. Since most of the heat fans 5 on the market have a constant size, the bottom heat-conducting layer thereof has a certain distance from the heat source on the PCB circuit board 11, which reduces the heat conduction effect. The bottom of the heat dissipating fan 5 adopts a retractable aluminum telescopic column 55 to contact the heat source on the PCB circuit board 11, which can meet the requirement that the aluminum telescopic column 55 is sufficiently close to the heat source on the PCB circuit board 11 for heat conduction, thereby improving the heat dissipation efficiency of the body 1. At the same time, the bottom support 54 and the aluminum telescopic column 55 are both made of aluminum material, which can meet the demand for heat conduction.

[0026] In actual use, the screw holes 52 and the spring nuts 53 are installed to align the heat dissipation fins 51 with the hole grooves around the heat dissipation holes 4. At this time, the aluminum telescopic column 55 is pulled, and the aluminum telescopic column 55 slides downward along the outer wall of the bottom support 54, and the bottom surface of the aluminum telescopic column 55 is contacted with the heat source of the PCB circuit board 11 as much as possible. At the same time, the silicone grease pad 56 can also be attached to the heat source of the PCB circuit board 11 to fully exchange heat. Then the heat dissipation fan 5 is started, and the heat dissipation fan 5 drives the air flow to flow upward along the heat dissipation holes 4 at the bottom of the body 1, driving the air around the heat dissipation fins 51 to flow upward along the heat dissipation fan 5 until the inside of the body 1 is cooled. Finally, the user tries to rotate the adjustment knob 3, and its inner cushion sleeve 32 and the connecting sleeve 31 form a clamping space, which is connected to the body 1. The inner cushion sleeve 32 is attached with a layer of sealing gasket 33 to increase the friction coefficient between the adjustment knob 3 and the body 1, so that the user can fine-tune the adjustment knob 3 according to needs.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A power amplifier with an efficient heat dissipation mechanism, characterized in that: The power amplifier with an efficient heat dissipation mechanism comprises: a body (1), a mounting bracket (2) and a heat dissipation fan (5); a plurality of adjusting knobs (3) for adjusting power are arranged at the middle of the front end of the body (1); a connecting sleeve (31) is arranged at the connection between the adjusting knobs (3) and the outer surface of the body (1); a PCB circuit board (11) with integrated electronic components is arranged inside the body (1); a heat dissipation fan (5) is arranged above the heat source of the PCB circuit board (11); A plurality of heat dissipation holes (4) are provided at the connection between the machine body (1) and the heat dissipation fan (5), and heat-conducting heat dissipation fins (51) are arranged around the outer wall of the heat dissipation fan (5), the lower end of the heat dissipation fins (51) is connected to a bottom support (54), and the lower end of the bottom support (54) is movably connected to an aluminum telescopic column (55), the lower end of the aluminum telescopic column (55) is coated with a layer of silicone grease pad (56), and the silicone grease pad (56) is in contact with the heat source of the PCB circuit board (11).

2. A power amplifier with a high-efficiency heat dissipation mechanism according to claim 1, characterized in that: A mounting bracket (2) is fixed to one side of the machine body (1), and the mounting bracket (2) and the machine body (1) are fastened with bolts.

3. A power amplifier with a high-efficiency heat dissipation mechanism according to claim 2, characterized in that: A connecting hole (21) is provided in the middle of the mounting bracket (2), and the two mounting brackets (2) are arranged in an "I"-shaped structure.

4. A power amplifier with a high-efficiency heat dissipation mechanism according to claim 1, characterized in that: An inner cushion sleeve (32) is sleeved at the connection between the adjusting knob (3) and the inner wall of the machine body (1), and a sealing gasket (33) for friction protection is attached to the connection between the inner cushion sleeve (32) and the inner wall of the machine body (1).

5. A power amplifier with a high-efficiency heat dissipation mechanism according to claim 1, characterized in that: Both ends of the heat dissipation fin (51) are fixedly connected with mounting screw holes (52), and the inner wall of the mounting screw hole (52) is threadedly connected with a spring nut (53) with a shock-absorbing mounting function.

6. A power amplifier with a high-efficiency heat dissipation mechanism according to claim 5, characterized in that: The heat dissipation fin (51) is detachably connected to the machine body (1) via a spring nut (53) and a mounting screw hole (52).

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