Paster surface cleaning mechanism for high-speed chip mounter
By designing the patch surface cleaning mechanism for laying components and anti-touch components in a high-speed patch machine, the problem of damage caused by contact with objects is solved, and more efficient cleaning effect and equipment reliability are achieved.
Patent Information
- Application Number
- CN202420784231.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-16
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-04-16
AI Technical Summary
The patch surface cleaning mechanism of the existing high-speed patch machine is prone to damage when it comes into contact with the object to be patched, and the cleaning effect is poor, so it is impossible to effectively clean the surface of the object.
A patch surface cleaning mechanism including mounting blocks, cleaning components, laying components and anti-touch components is designed. By laying components, the anti-touch components avoid entanglement of power connection wires. In the cleaning era, the anti-touch components contact the surface of the object to reduce collision force.
It enhances the practicality and cleaning effect of the device, avoids direct contact between the cleaning components and the surface of the object, extends the service life of the equipment and improves the cleaning efficiency.
Smart Images

Figure CN222358970U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of high-speed chip mounters, and more specifically to a chip surface cleaning mechanism for high-speed chip mounters. Background Art
[0002] The placement machine is also called the placement machine or surface mount system. In the production line, it is configured after the dispensing machine or screen printing machine. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. High-speed placement machines are widely used in the field of electronic placement technology for their advantages such as fast placement speed, accurate placement, high degree of automation, and stable quality. When the high-speed placement machine is working, the surface of the patch needs to be cleaned by a cleaning mechanism.
[0003] For example, CN216937251U discloses a patch surface cleaning device for a high-speed patch machine, the main points of its technical solution are: it includes a patch and a shell, the two end sides of the shell are provided with an output port and an input port, the patch enters from the input port and exits from the output port, a motor is fixed to the outer side wall of the shell, an upper cleaning cylinder and a lower cleaning cylinder are rotatably connected to the side wall of the shell, a cleaning mechanism is arranged on the upper cleaning cylinder and the lower cleaning cylinder, an outer side end of the upper cleaning cylinder is coaxially fixed with the output end of the motor, the upper cleaning cylinder and A belt roller is coaxially fixed to the outer end of the lower cleaning cylinder, and the outer surfaces of the two belt rollers are commonly covered with belts. The patch passes through between the upper cleaning cylinder and the lower cleaning cylinder, and a suction machine is fixed to the outer wall of the shell. A connecting pipe is fixed to the output end of the suction machine, and a collecting mechanism is connected between the connecting pipe and the cleaning mechanism. When the sucked dust is processed, the dust is sucked into the collection box through the ventilation pipe, and the dust filter plate collects, filters and intercepts the dust in a centralized manner. Opening the cover plate facilitates the centralized collection and cleaning of the dust, and the dust cleaning is convenient.
[0004] The above-mentioned surface cleaning mechanism for a high-speed placement machine still has certain shortcomings: since the cleaning mechanism is arranged horizontally with the placement head, once the cleaning mechanism comes into contact with the object to be placed, the cleaning mechanism will be unable to clean the surface of the object, and once the collision force is too great, the cleaning mechanism will be damaged. Utility Model Content
[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the utility model provides a patch surface cleaning mechanism for a high-speed patch machine to solve the problems existing in the prior art.
[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a patch surface cleaning mechanism for a high-speed patch machine, comprising a mounting block, the lower surface of the mounting block is symmetrically and detachably mounted with two patch heads along the center, the lower surface of the mounting block is symmetrically and inlaidly mounted with two cleaning components along the center, the upper surface of the mounting block is symmetrically and detachably mounted with multiple laying components along the center, and the lower surface of the cleaning component is provided with an anti-touch component.
[0007] Wherein, the outer surface of the mounting block is connected to the interior of the high-speed placement machine, and the cross-sectional area of the anti-touch component is larger than the cross-sectional area of the cleaning component.
[0008] Wherein, the cleaning component includes an installation frame, a protective mesh plate, a mounting frame and a bearing. The side wall of the installation frame is fixedly connected to the protective mesh plate, the other side wall of the installation frame is fixedly connected to the mounting frame, and a bearing is embedded and installed at the center of the side wall of the mounting frame.
[0009] Among them, a motor is detachably installed in the middle of the side wall of the mounting frame, one end of the motor is connected to a power connection line through a laying component, the other end of the motor is fixedly installed with a connecting shaft through the bearing, and one end of the connecting shaft is detachably installed with three fan blades in a circular array.
[0010] The anti-touch assembly comprises an anti-touch frame, telescopic rods and buffer springs. Four telescopic rods are fixedly mounted on the side wall of the anti-touch frame in a rectangular array, and buffer springs are fixedly sleeved on the outer surfaces of the telescopic rods.
[0011] Wherein, one end of the telescopic rod is fixedly connected to a second connecting plate, and a side wall of the second connecting plate is connected to one side of the lower surface of the mounting block.
[0012] The laying assembly comprises a limit frame, connecting rods and laying wheels. Two connecting rods are movably sleeved along the center symmetrically inside the limit frame, and the laying wheels are movably sleeved in the middle of the outer surface of the connecting rods.
[0013] Wherein, the side wall of the connecting rod is fixedly connected with a first connecting disk, the side wall of the first connecting disk is fixedly connected with a return spring, and the side wall of the limiting frame is connected to one side of the upper surface of the mounting block.
[0014] The beneficial effects of the above technical solution of the utility model are as follows:
[0015] 1. In the above scheme, the patch surface cleaning mechanism is provided with a laying component. When the cleaning component is connected to the mounting block, the two groups of connecting rods inside the laying component are stretched outward. When stretched to a certain distance, one end of the power connection line is passed through the center of the two groups of laying wheels and connected to one end of the motor, and then the two groups of connecting rods are slowly loosened. Then the reset spring will restore the two groups of connecting rods to their original positions, so that the two groups of laying wheels limit the position of the power connection line to avoid the power connection line from being entangled with other objects, thereby enhancing the practicality of the device;
[0016] 2. In the above scheme, the patch surface cleaning mechanism is provided with an anti-touch component. When it is necessary to clean the surface of the object to be patched, the mounting block connected to the high-speed patch machine will move downward until the patch head contacts the surface of the object. At this time, the cleaning component will also move downward, and then the anti-touch component provided on the surface of the cleaning component will replace the lower surface of the cleaning component to contact the surface of the object, so as to avoid the lower surface of the cleaning component from fitting with the surface of the object, thereby ensuring that the cleaning component can work normally. Because the anti-touch component is provided with a telescopic rod and a buffer spring inside, when the anti-touch frame contacts the surface of the object, the telescopic rod and the buffer spring can partially offset the external force exerted on the anti-touch frame, so as to ensure the quality of the cleaning component, thereby enhancing the practicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 It is a schematic diagram of the overall structure flipping of the utility model;
[0019] Figure 3 This is a schematic diagram of the disassembly of the cleaning component of the utility model;
[0020] Figure 4 This is a schematic diagram of the disassembly of the anti-touch component of the utility model;
[0021] Figure 5 This is a schematic diagram of the disassembly of the laying components of the utility model.
[0022] [reference numerals]
[0023] 1. Mounting block; 2. SMT head; 3. Cleaning assembly; 4. Laying assembly; 5. Anti-touch assembly; 31. Mounting frame; 32. Protective mesh; 33. Mounting frame; 34. Bearing; 35. Motor; 36. Power connection line; 37. Connecting shaft; 38. Fan blade; 41. Limiting frame; 42. Connecting rod; 43. Laying wheel; 44. First connecting plate; 45. Reset spring; 51. Anti-touch frame; 52. Telescopic rod; 53. Buffer spring; 54. Second connecting plate. DETAILED DESCRIPTION
[0024] In order to make the technical problems to be solved, technical solutions and advantages of the present invention more clear, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.
[0025] Embodiment 1:
[0026] See also Figure 1-5 A patch surface cleaning mechanism for a high-speed patch machine comprises a mounting block 1, two patch heads 2 are detachably mounted on the lower surface of the mounting block 1 along the center symmetry, two cleaning components 3 are inlaid and mounted along the center symmetry, a plurality of laying components 4 are detachably mounted on the upper surface of the mounting block 1 along the center symmetry, and an anti-touch component 5 is arranged on the lower surface of the cleaning component 3;
[0027] The outer surface of the mounting block 1 is connected to the interior of the high-speed placement machine. The cross-sectional area of the anti-touch component 5 is larger than the cross-sectional area of the cleaning component 3. The cleaning component 3 includes a mounting frame 31, a protective mesh plate 32, a mounting frame 33 and a bearing 34. The side wall of the mounting frame 31 is fixedly connected with the protective mesh plate 32, and the other side wall of the mounting frame 31 is fixedly connected with the mounting frame 33. The center of the side wall of the mounting frame 33 is inlaid with a bearing 34. The middle part of the side wall of the mounting frame 33 is detachably installed with a motor 35. One end of the motor 35 is connected to a power connection line 36 through the laying component 4. The other end of the motor 35 is fixedly installed with a connecting shaft 37 through the bearing 34. One end of the connecting shaft 37 is detachably installed with three fan blades 38 in a circular array. The anti-touch component 5 includes an anti-touch frame 5 1. Telescopic rods 52 and buffer springs 53. Four telescopic rods 52 are fixedly installed on the side walls of the anti-touch frame 51 in a rectangular array. The buffer springs 53 are fixedly sleeved on the outer surfaces of the telescopic rods 52. One end of the telescopic rods 52 is fixedly connected to a second connecting disk 54. The side wall of the second connecting disk 54 is connected to one side of the lower surface of the mounting block 1. The laying component 4 includes a limit frame 41, a connecting rod 42 and a laying wheel 43. Two connecting rods 42 are movably sleeved along the center of the limit frame 41. The middle part of the outer surface of the connecting rod 42 is movably sleeved with a laying wheel 43. The side wall of the connecting rod 42 is fixedly connected to a first connecting disk 44. The side wall of the first connecting disk 44 is fixedly connected to a reset spring 45. The side wall of the limit frame 41 is connected to one side of the upper surface of the mounting block 1.
[0028] Benefits: The provision of the cleaning component 3 is helpful for cleaning the surface of the object to be patched, thereby enhancing the practicability of the device.
[0029] The working process of the utility model is as follows:
[0030] When the cleaning mechanism is working, in order to avoid the power connection line 36 from getting entangled during use, a laying component 4 is provided. After the cleaning component 3 is connected to the mounting block 1, the two groups of connecting rods 42 inside the laying component 4 are stretched outward. After being stretched to a certain distance, one end of the power connection line 36 is passed through the center of the two groups of laying wheels 43 and connected to one end of the motor 35. Then the two groups of connecting rods 42 are slowly loosened, and then the reset spring 45 restores the two groups of connecting rods 42 to their original positions, so that the two groups of laying wheels 43 limit the position of the power connection line 36 to avoid the power connection line 36 from getting entangled with other objects, thereby enhancing the practicability of the device.
[0031] In the above scheme, when the cleaning mechanism is working, in order to ensure the cleaning effect of the device, an anti-touch component 5 is provided. When the surface of the object to be patched needs to be cleaned, the mounting block 1 connected to the high-speed patch machine will move downward until the patch head 2 is in contact with the surface of the object. At this time, the cleaning component 3 will also move downward, and then the anti-touch component 5 provided on the surface of the cleaning component 3 will replace the lower surface of the cleaning component 3 to contact the surface of the object, so as to avoid the lower surface of the cleaning component 3 from being in contact with the surface of the object, thereby ensuring that the cleaning component 3 can work normally. Because the anti-touch component 5 is provided with a telescopic rod 52 and a buffer spring 53 inside, when the anti-touch frame 51 is in contact with the surface of the object, the telescopic rod 52 and the buffer spring 53 can partially offset the external force exerted on the anti-touch frame 51, so as to ensure the quality of the cleaning component 3, thereby enhancing the practicability of the device.
[0032] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;
[0033] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;
[0034] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.
Claims
1. A chip surface cleaning mechanism for a high-speed chip mounter, comprising a mounting block (1), characterized in that: Two patch heads (2) are detachably mounted on the lower surface of the mounting block (1) in a centrally symmetrical manner, two cleaning components (3) are inlaid and mounted in a centrally symmetrical manner, a plurality of laying components (4) are detachably mounted on the upper surface of the mounting block (1) in a centrally symmetrical manner, and an anti-touch component (5) is arranged on the lower surface of the cleaning component (3).
2. The surface cleaning mechanism for a high-speed chip mounter according to claim 1, characterized in that: The outer surface of the mounting block (1) is connected to the interior of the high-speed placement machine, and the cross-sectional area of the anti-touch component (5) is larger than the cross-sectional area of the cleaning component (3).
3. The surface cleaning mechanism for a high-speed chip mounter according to claim 1, characterized in that: The cleaning assembly (3) comprises a mounting frame (31), a protective screen (32), a mounting frame (33) and a bearing (34); a side wall of the mounting frame (31) is fixedly connected to the protective screen (32); another side wall of the mounting frame (31) is fixedly connected to the mounting frame (33); and a bearing (34) is inlaid and mounted at the center of the side wall of the mounting frame (33).
4. The chip surface cleaning mechanism for a high-speed chip mounter according to claim 3, characterized in that: A motor (35) is detachably mounted in the middle of the side wall of the mounting frame (33); one end of the motor (35) is connected to a power connection line (36) via a laying assembly (4); the other end of the motor (35) is fixedly mounted with a connecting shaft (37) via the bearing (34); one end of the connecting shaft (37) is detachably mounted with three fan blades (38) in a circular array.
5. The chip surface cleaning mechanism for a high-speed chip mounter according to claim 1, characterized in that: The anti-touch assembly (5) comprises an anti-touch frame (51), telescopic rods (52) and a buffer spring (53); four telescopic rods (52) are fixedly mounted on the side wall of the anti-touch frame (51) in a rectangular array; and the buffer spring (53) is fixedly sleeved on the outer surface of the telescopic rod (52).
6. The chip surface cleaning mechanism for a high-speed chip mounter according to claim 5, characterized in that: One end of the telescopic rod (52) is fixedly connected to a second connection plate (54), and a side wall of the second connection plate (54) is connected to one side of the lower surface of the mounting block (1).
7. The chip surface cleaning mechanism for a high-speed chip mounter according to claim 1, characterized in that: The laying assembly (4) comprises a limit frame (41), a connecting rod (42) and a laying wheel (43); two connecting rods (42) are movably sleeved in a centrally symmetrical manner inside the limit frame (41); and the laying wheel (43) is movably sleeved in the middle of the outer surface of the connecting rod (42).
8. The chip surface cleaning mechanism for a high-speed chip mounter according to claim 7, characterized in that: The side wall of the connecting rod (42) is fixedly connected to a first connecting disk (44), the side wall of the first connecting disk (44) is fixedly connected to a return spring (45), and the side wall of the limiting frame (41) is connected to one side of the upper surface of the mounting block (1).
Citation Information
Patent Citations
Paster surface cleaning device for high-speed chip mounter
CN216937251U
Cited By
Chip surface cleaning mechanism for chip mounter
CN223946315U