Liquid cooling heat dissipation LED module and automobile lamp thereof
By adopting liquid-cooled heat dissipation technology in the headlight LED module and using coolant circulation for heat dissipation, the problem of insufficient heat dissipation performance of traditional headlight LED modules under space limitations is solved, the reliability and service life are improved, and the Luminous quality and driving safety.
Patent Information
- Application Number
- CN202421219130.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-05-30
AI Technical Summary
In the case of space limitations, the heat dissipation performance of traditional car light LED modules is insufficient, resulting in low heat dissipation efficiency, increasing costs, and affecting the application and promotion of car lights. In particular, the asymmetric arrangement of LED lamp beads on the PCB leads to thermal conductivity. Even.
Using liquid-cooled heat dissipation LED module, by setting a radiator assembly on the PCB component, including a heat dissipation cover and a heat dissipation member, a cooling cavity is formed and coolant is injected, and the cooling liquid is used to dissipate heat, thereby improving the reliability of the LED module and Service life.
It effectively improves the heat dissipation performance of the car lights, extends the service life, ensures the luminous quality and driving safety, reduces costs, and simplifies the installation process.
Smart Images

Figure CN222363779U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of vehicle lamps, in particular to a liquid cooling and heat dissipation LED module and a vehicle lamp thereof. Background Art
[0002] LED has been fully applied in various automotive lights due to its unique advantages such as energy saving, long service life and strong shock resistance. The LED module of the headlight is a key component of the headlight, and its heat dissipation performance is crucial. The heat dissipation performance of the LED module determines the optical quality and service life of the product. At present, the space for headlights is getting narrower and narrower, and the power of LED modules is getting higher and higher.
[0003] At present, traditional car light LED modules are assembled and fastened by cold rivets or screws to the circuit substrate and the heat sink. If the heat dissipation capacity of the radiator is insufficient, a fan needs to be added outside the radiator to cool the entire LED module and conduct the heat generated by the LED during use through the circuit substrate and the heat sink.
[0004] However, the above installation method is difficult to implement when space is limited, and will increase the cost of the LED module. In addition, the fan has poor vibration resistance, which is not conducive to the application and promotion of automotive LED modules. At the same time, due to the requirements of optical design, the LED lamp beads are arranged asymmetrically on the PCB, which will cause uneven heat conduction of the radiator or low heat dissipation efficiency. Utility Model Content
[0005] Based on this, the purpose of the utility model is to provide a liquid-cooled LED module and its car light, aiming to solve the problem that the current installation method is difficult to implement under limited space and will increase the cost of the LED module. In addition, the fan has poor shock resistance, which is not conducive to the application and promotion of car light LED modules. At the same time, due to the requirements of optical design, the LED lamp beads are arranged asymmetrically on the PCB, which will cause uneven heat conduction of the radiator or low heat dissipation efficiency.
[0006] To achieve the above object, the utility model is implemented through the following technical solutions: a liquid-cooled heat dissipation LED module, the liquid-cooled heat dissipation LED module comprising:
[0007] PCB assembly;
[0008] A heat sink assembly is arranged on the PCB assembly, the heat sink assembly comprises a heat sink cover and a heat sink detachably connected to the heat sink cover, and a sealing ring is provided between the heat sink cover and the heat sink;
[0009] Wherein, the heat dissipation cover is arranged on the PCB assembly, and the heat dissipation cover and the heat dissipation element enclose a cooling cavity for containing cooling liquid.
[0010] In summary, according to a liquid-cooled heat dissipation LED module proposed by the utility model, by arranging a radiator assembly on the PCB assembly, and by injecting coolant into the cooling cavity enclosed between the heat dissipation cover and the heat dissipation element, the PCB assembly is dissipated by the circulation of the coolant, thereby improving the reliability and service life of the LED module and even the entire headlight, and effectively ensuring the light quality of the headlight and driving safety. Specifically, the liquid-cooled heat dissipation LED module includes a PCB assembly, and a radiator assembly arranged on the PCB assembly, the radiator assembly includes a heat dissipation cover, and a heat dissipation element detachably connected to the heat dissipation cover, there is also a sealing ring between the heat dissipation cover and the heat dissipation element, the heat dissipation cover is arranged on the PCB assembly, and the heat dissipation cover and the heat dissipation element enclose a cooling cavity. The sealing ring is used to strengthen the sealing between the heat dissipation cover and the heat dissipation element, and at the same time, coolant is injected into the cooling cavity to dissipate the PCB assembly.
[0011] According to one aspect of the above technical solution, the heat dissipation cover includes a heat dissipation cover body, and a first step and a second step extending toward one side of the heat dissipation element, and the height of the second step is greater than the height of the first step.
[0012] According to one aspect of the above technical solution, the heat dissipation cover body is provided with mounting ears at diagonal positions;
[0013] A first type of positioning pin is provided on one side of the heat dissipation cover body close to the PCB assembly for penetrating the PCB assembly.
[0014] According to one aspect of the above technical solution, at least two of the first step edges are provided with second-type positioning pins penetrating into the heat sink, and at least two first connecting holes for connecting the heat sink, and the second-type positioning pins and the first connecting holes are arranged crosswise and oppositely in pairs.
[0015] According to one aspect of the above technical solution, the second step is recessed toward the heat dissipation cover body to form a first cavity for enclosing a cooling cavity.
[0016] According to one aspect of the above technical solution, the heat sink includes a connection cover and a plurality of heat dissipation fins arranged on a side of the connection cover away from the heat dissipation cover, the heat dissipation fins are equidistantly arranged on the connection cover, and a coolant inlet hole is provided on the side of the connection cover.
[0017] According to one aspect of the above technical solution, the connection cover includes a connection cover body, and a third step and a fourth step that are recessed inwardly toward a side away from the heat dissipation cover, and the depth of the fourth step is greater than the depth of the third step to form a second cavity.
[0018] According to one aspect of the above technical solution, the edge of the connection cover body is provided with at least two positioning holes used in conjunction with the second type of positioning pins, and at least two second connection holes used in conjunction with the first connection holes.
[0019] According to one aspect of the above technical solution, a plurality of heat dissipation grooves are provided on the fourth step, and a cooling liquid circulation channel is provided inside the heat dissipation fin, and the cooling liquid circulation channel is used to connect the heat dissipation grooves.
[0020] The utility model also provides a vehicle lamp, comprising the above-mentioned liquid-cooled heat dissipation LED module.
[0021] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0023] Figure 1 This is a schematic structural diagram of a liquid-cooled LED module in the first embodiment of the utility model;
[0024] Figure 2 This is a schematic diagram of the structure explosion of the liquid-cooled LED module in the first embodiment of the utility model;
[0025] Figure 3 This is a schematic diagram of the structure of the PCB assembly in the first embodiment of the utility model;
[0026] Figure 4 This is the structural intention of the heat dissipation cover in the first embodiment of the utility model;
[0027] Figure 5 This is the structural intention of the heat sink in the first embodiment of the utility model.
[0028] Component symbol description:
[0029] PCB assembly 100, PCB board 110, LED lamp bead 120, connector 130, through hole 140, fixing hole 150, radiator assembly 200, heat dissipation cover 210, heat dissipation cover body 211, first type positioning pin 212, first step 213, second type positioning pin 214, first connecting hole 215, second step 216, first cavity 217, mounting ear 218, heat dissipation element 220, connecting cover 221, connecting cover body 222, positioning hole 223, second connecting hole 224, coolant inlet hole 225, third step 226, fourth step 227, heat dissipation groove 228, second cavity 229, heat dissipation fin 230, coolant circulation channel 231, sealing ring 240, cooling cavity 300. DETAILED DESCRIPTION
[0030] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. Several embodiments of the utility model are given in the accompanying drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.
[0031] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions used herein are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.
[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0033] Embodiment 1
[0034] See also Figure 1-Figure 5, which is a schematic structural diagram of a liquid-cooled heat dissipation LED module provided in the first embodiment of the utility model, the liquid-cooled heat dissipation LED module comprises a PCB assembly 100, and a heat sink assembly 200 arranged on the PCB assembly 100, wherein:
[0035] In order to achieve the lighting effect, the PCB assembly 100 includes a PCB board 110, a connector 130 and an LED lamp bead 120 arranged on the PCB board 110. In this embodiment, the LED lamp bead 120 is arranged asymmetrically on the PCB board 110, and is arranged at the upper left position of the PCB board 110, and the connector 130 is arranged at the lower left position of the PCB board 110. In order to fix the PCB assembly 100, a through hole 140 and a fixing hole 150 are provided on the PCB assembly 100.
[0036] In order to connect the PCB assembly 100 and achieve heat dissipation, the radiator assembly 200 includes a heat dissipation cover 210 and a heat dissipation member 220 detachably connected to the heat dissipation cover 210, wherein the heat dissipation cover 210 is used to connect the above-mentioned PCB assembly 100, and the heat dissipation cover 210 includes a heat dissipation cover body 211, and a first step 213 and a second step 216 extending toward one side of the heat dissipation member 220, and the height of the second step 216 is greater than the height of the first step 213.
[0037] In order to connect the PCB assembly 100, a first type of positioning pin 212 is extended toward the PCB assembly 100 from the side of the heat dissipation cover body 211 close to the PCB assembly 100. The first type of positioning pin 212 is relatively arranged at the diagonal position of the heat dissipation cover body 211 to improve the stability of the connection. The first type of positioning pin 212 is passed through the through hole 140 on the PCB board 110 to pre-fix the PCB board 110, and the PCB board 110 is connected to the heat dissipation cover body 211 by using a fastener through the fixing hole 150. It is worth emphasizing that in order to achieve a better heat conduction effect, thermal conductive silicone grease is applied between the PCB board 110 and the heat dissipation cover body 211 to ensure full contact between the PCB assembly 100 and the radiator, promote heat conduction, and enhance heat dissipation.
[0038] Furthermore, mounting ears 218 are provided at the diagonal positions of the heat dissipation cover body 211 for mounting the LED module assembly. In addition, at least two second-type positioning pins 214 are provided on the edge of the first step 213 for penetrating into the heat dissipation element 220, and at least two first connection holes 215 for connecting the heat dissipation element 220. The second-type positioning pins 214 and the first connection holes 215 are arranged in a cross pattern in pairs. The above arrangement can simplify the installation of components and play a role in preventing mistakes and fools.
[0039] Furthermore, the second step 216 is recessed toward the heat dissipation cover body 211 to form a first cavity 217 for enclosing a cooling cavity 300 .
[0040] In order to achieve a better heat dissipation effect when used in conjunction with the heat dissipation cover 210, the heat dissipation element 220 includes a connecting cover 221 and a plurality of heat dissipation fins 230 arranged on the side of the connecting cover 221 away from the heat dissipation cover 210. The heat dissipation fins 230 are arranged equidistantly on the connecting cover 221, and a coolant inlet hole 225 is provided on the side of the connecting cover 221.
[0041] In order to enclose the cooling cavity 300 together with the first cavity 217, the connection cover 221 includes a connection cover body 222, and a third step 226 and a fourth step 227 which are recessed inwardly toward the side away from the heat dissipation cover 210. The depth of the fourth step 227 is greater than the depth of the third step 226 to form a second cavity 229. The edge of the connection cover body 222 is provided with at least two positioning holes 223 used in conjunction with the second type positioning pins 214, and at least two second connection holes 224 used in conjunction with the first connection holes 215. When the heat dissipation cover body 211 is connected to the connection cover body 222, the second type of positioning pin 214 is inserted into the positioning hole 223, and the first connection hole 215 and the second connection hole 224 are connected by bolts and nuts. At this time, the second step 216 abuts against the fourth step 227, and the first step 213 abuts against the first step 213 to complete the assembly of the heat dissipation cover 210 and the heat dissipation element 220. Therefore, the first cavity 217 and the second cavity 229 jointly enclose the cooling cavity 300. In addition, a liquid inlet hole is provided on the side of the connection cover body 222 for injecting coolant into the cooling cavity 300, and it needs to be blocked after the coolant is injected. In addition, a sealing ring 240 is also provided between the heat dissipation cover body 211 and the connection cover body 222 to improve the sealing between the two.
[0042] It is worth noting that a plurality of heat dissipation slots 228 are provided on the fourth step 227, and a cooling liquid circulation channel 231 is provided inside the heat dissipation fin 230, and the cooling liquid circulation channel 231 is used to connect the heat dissipation slots 228. The coolant flows through the cooling cavity 300 and the cooling liquid circulation channel 231 to remove the heat from the PCB assembly 100. In this embodiment, the lengths of the heat dissipation fins 230 are different, and they can be reasonably designed according to the limited space in the headlight for heat dissipation.
[0043] In summary, according to a liquid-cooled heat dissipation LED module proposed by the utility model, by arranging a radiator assembly on the PCB assembly, and by injecting coolant into the cooling cavity enclosed between the heat dissipation cover and the heat dissipation element, the PCB assembly is dissipated by the circulation of the coolant, thereby improving the reliability and service life of the LED module and even the entire headlight, and effectively ensuring the light quality of the headlight and driving safety. Specifically, the liquid-cooled heat dissipation LED module includes a PCB assembly, and a radiator assembly arranged on the PCB assembly, the radiator assembly includes a heat dissipation cover, and a heat dissipation element detachably connected to the heat dissipation cover, there is also a sealing ring between the heat dissipation cover and the heat dissipation element, the heat dissipation cover is arranged on the PCB assembly, and the heat dissipation cover and the heat dissipation element enclose a cooling cavity. The sealing ring is used to strengthen the sealing between the heat dissipation cover and the heat dissipation element, and at the same time, coolant is injected into the cooling cavity to dissipate the PCB assembly.
[0044] Embodiment 2
[0045] This embodiment provides a vehicle lamp, comprising the liquid-cooled LED module mentioned in the first embodiment.
[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0047] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A liquid-cooled LED module, characterized in that: The liquid-cooled heat dissipation LED module comprises: PCB assembly; A heat sink assembly is arranged on the PCB assembly, the heat sink assembly comprises a heat sink cover and a heat sink detachably connected to the heat sink cover, and a sealing ring is provided between the heat sink cover and the heat sink; Wherein, the heat dissipation cover is arranged on the PCB assembly, and the heat dissipation cover and the heat dissipation element enclose a cooling cavity for containing cooling liquid.
2. The liquid-cooled LED module according to claim 1, characterized in that: The heat dissipation cover comprises a heat dissipation cover body, and a first step and a second step extending toward one side of the heat dissipation element, wherein the height of the second step is greater than the height of the first step.
3. The liquid-cooled LED module according to claim 2, characterized in that: The heat dissipation cover body is provided with mounting ears at the diagonal positions; A first type of positioning pin is provided on one side of the heat dissipation cover body close to the PCB assembly for penetrating the PCB assembly.
4. The liquid-cooled LED module according to claim 3, characterized in that: At least two of the first step edges are provided with second type positioning pins penetrating into the heat sink, and at least two first connection holes for connecting to the heat sink, and the second type positioning pins and the first connection holes are arranged crosswise and oppositely in pairs.
5. The liquid-cooled LED module according to claim 4, characterized in that: The second step is recessed toward the heat dissipation cover body to form a first cavity for enclosing a cooling cavity.
6. The liquid-cooled LED module according to claim 1, characterized in that: The heat sink comprises a connection cover and a plurality of heat dissipation fins arranged on a side of the connection cover away from the heat dissipation cover. The heat dissipation fins are arranged on the connection cover at equal distances. A coolant inlet hole is arranged on a side of the connection cover.
7. The liquid-cooled LED module according to claim 6, characterized in that: The connection cover comprises a connection cover body, and a side facing away from the heat dissipation cover is inwardly recessed to form a third step and a fourth step, wherein the depth of the fourth step is greater than the depth of the third step to form a second cavity.
8. The liquid-cooled LED module according to claim 7, characterized in that: The edge of the connection cover body is provided with at least two positioning holes used in conjunction with the second type of positioning pins, and at least two second connection holes used in conjunction with the first connection holes.
9. The liquid-cooled LED module according to claim 7, characterized in that: A plurality of heat dissipation grooves are arranged on the fourth step, and a cooling liquid circulation channel is arranged inside the heat dissipation fin, and the cooling liquid circulation channel is used to connect the heat dissipation grooves.
10. A vehicle lamp, characterized in that: It comprises a liquid-cooled heat dissipation LED module as described in any one of claims 1 to 9 above.