Environment-friendly rapid refrigeration device

Abstract

An environment-friendly rapid refrigeration device comprises a base, a fence is arranged on the base, a window is arranged on each face of the fence, semiconductor refrigeration sheets are inserted into the windows, inserting grooves used for the semiconductor refrigeration sheets are formed in the top of the fence, and a top cover is arranged at the top of the fence. The utility model provides an environment-friendly rapid refrigeration device which adopts a plurality of semiconductor refrigeration sheets to rapidly cool the interior of a surrounding area, does not use refrigerants, is more environment-friendly, and does not reduce the refrigeration efficiency. In addition, all parts of the refrigeration device are detachable, and installation, replacement and transportation are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to an environmentally friendly rapid refrigeration device. Background Art

[0002] Traditional refrigeration equipment mostly uses a compressor and a refrigerant for heat exchange, which has low overall refrigeration efficiency, slow cooling speed, and a complex structure. The refrigerant has high requirements for sealing. Common refrigerants such as Freon will cause environmental pollution once it leaks, and waste Freon will also cause environmental pollution if it is not handled properly. Although semiconductor refrigeration technology is relatively common in the prior art, there is a lack of semiconductor refrigeration equipment that can quickly and efficiently cool. Summary of the invention

[0003] The technical problem to be solved by the utility model is to provide an environmentally friendly rapid refrigeration device which can rapidly and efficiently perform refrigeration by using a semi-conductive refrigeration sheet.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: an environmentally friendly rapid refrigeration device, including a base, an enclosure is arranged on the base, windows are arranged on each surface of the enclosure, semiconductor refrigeration plates are inserted in the windows, a slot for the semiconductor refrigeration plate is opened on the top of the enclosure, and a top cover is arranged on the top of the enclosure.

[0005] Preferably, a heat sink is provided on the outer side of the semiconductor refrigeration plate, and a heat dissipation fan is provided on the outer side of the heat sink.

[0006] Preferably, mounting ears are provided on both sides of the heat sink, mounting posts matching with the mounting ears are provided on the side walls of the enclosure, and the mounting ears are fixed to the mounting posts by screws.

[0007] Preferably, silicone grease is coated between the semiconductor refrigeration sheet and the heat sink.

[0008] Preferably, a notch is provided on the side wall of the top cover, and the notch is used for allowing the outlet wires of the semiconductor refrigeration plate to pass through.

[0009] Preferably, a spiral cooling pipe is provided below the top cover, and a liquid inlet end and a liquid outlet end of the spiral cooling pipe pass through the surface of the top cover.

[0010] Preferably, the spiral cooling tube includes an inner spiral tube and an outer spiral tube, and the inner spiral tube is connected to the outer spiral tube.

[0011] Preferably, a cooling pipe fixing seat is provided on the top cover.

[0012] The utility model provides an environmentally friendly rapid refrigeration device, which adopts multiple semiconductor refrigeration plates to quickly cool the area in the enclosure without using refrigerant, is more environmentally friendly, and does not reduce the refrigeration efficiency; in addition, all parts of the refrigeration device of the device can be disassembled, which is convenient for installation, replacement and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the enclosure of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of the utility model in which a semiconductor refrigeration sheet is inserted into the enclosure;

[0017] Figure 4 This is a schematic diagram of the installation structure of the semiconductor refrigeration sheet of the utility model;

[0018] Figure 5 It is a schematic diagram of the structure of the top cover of the utility model;

[0019] Figure 6 This is a schematic diagram of the structure of the spiral cooling tube of the utility model;

[0020] Figure 7 It is a schematic diagram of the bottom structure of the spiral cooling tube of the utility model. DETAILED DESCRIPTION

[0021] Embodiment 1, as Figure 1-4 As shown, an environmentally friendly rapid cooling device includes a base 1, an enclosure 2 is provided on the base 1, a window 3 is provided on each surface of the enclosure 2, a semiconductor refrigeration plate 4 is inserted in the window 3, a slot 5 for the semiconductor refrigeration plate 4 is opened on the top of the enclosure 2, and a top cover 6 is provided on the top of the enclosure 2.

[0022] Preferably, a heat sink 7 is provided on the outer side of the semiconductor refrigeration sheet 4, and a heat dissipation fan 8 is provided on the outer side of the heat sink 7 to accelerate heat dissipation.

[0023] Preferably, mounting ears 9 are provided on both sides of the heat sink 7, and mounting posts 10 matching with the mounting ears are provided on the side walls of the enclosure 2, and the mounting ears 9 are fixed to the mounting posts 10 by screws.

[0024] Preferably, silicone grease is coated between the semiconductor refrigeration sheet 4 and the heat sink 7 .

[0025] Preferably, a notch 11 is provided on the side wall of the top cover 6 , and the notch 11 is used for the outlet wires of the semiconductor cooling plate 4 to pass through.

[0026] Preferably, the enclosure 2 is a rectangular structure having four faces.

[0027] The utility model uses semiconductor cooling sheets 4 on four sides to quickly cool the enclosure area. Objects that need to be cooled can be placed in the enclosure 2.

[0028] Embodiment 2, as Figure 5-7 As shown, a spiral cooling pipe 12 is provided below the top cover 6 , and a liquid inlet end and a liquid outlet end of the spiral cooling pipe 12 pass through the surface of the top cover 6 .

[0029] Preferably, the spiral cooling tube 12 includes an inner spiral tube and an outer spiral tube, and the inner spiral tube is connected to the outer spiral tube.

[0030] Preferably, a cooling pipe fixing seat 13 is provided on the top cover 6. In addition to directly placing the items into the enclosure 2 for cooling, the device can also be provided with a spiral cooling pipe 12, and the gas or liquid medium to be cooled is passed into the spiral cooling pipe 12 for cooling in the enclosure 2.

[0031] When the device is used, the semiconductor refrigeration sheet is first inserted in the enclosure, and then the heat sink and the fan are installed on the outside of the semiconductor refrigeration sheet, and then the cooling and cooling can be carried out. When cooling and cooling, the top cover 6 is covered.

[0032] The above embodiments are only preferred technical solutions of the present invention and should not be regarded as limitations of the present invention. The protection scope of the present invention shall be the technical solutions recorded in the claims, including equivalent replacement solutions of the technical features in the technical solutions recorded in the claims. That is, equivalent replacement improvements within this scope are also within the protection scope of the present invention.

Claims

1. An environmentally friendly rapid refrigeration device, characterized in that: The invention comprises a base (1), an enclosure (2) is provided on the base (1), a window (3) is provided on each surface of the enclosure (2), a semiconductor cooling sheet (4) is inserted in the window (3), a slot (5) for inserting the semiconductor cooling sheet (4) is provided on the top of the enclosure (2), and a top cover (6) is provided on the top of the enclosure (2).

2. An environmentally friendly rapid refrigeration device according to claim 1, characterized in that: A heat sink (7) is provided on the outer side of the semiconductor cooling sheet (4), and a heat dissipation fan (8) is provided on the outer side of the heat sink (7).

3. An environmentally friendly rapid refrigeration device according to claim 2, characterized in that: Mounting ears (9) are provided on both sides of the heat sink (7), and mounting posts (10) matching the mounting ears are provided on the side walls of the enclosure (2), and the mounting ears (9) are fixed to the mounting posts (10) by means of screws.

4. An environmentally friendly rapid refrigeration device according to claim 3, characterized in that: Silicone grease is coated between the semiconductor refrigeration sheet (4) and the heat sink (7).

5. The environmentally friendly rapid refrigeration device according to claim 1, characterized in that: A notch (11) is provided on the side wall of the top cover (6), and the notch (11) is used for the outlet wire of the semiconductor cooling plate (4) to pass through.

6. The environmentally friendly rapid refrigeration device according to claim 1, characterized in that: A spiral cooling pipe (12) is provided below the top cover (6), and a liquid inlet end and a liquid outlet end of the spiral cooling pipe (12) extend out from the surface of the top cover (6).

7. An environmentally friendly rapid refrigeration device according to claim 6, characterized in that: The spiral cooling tube (12) comprises an inner spiral tube and an outer spiral tube, and the inner spiral tube is connected to the outer spiral tube.

8. The environmentally friendly rapid refrigeration device according to claim 6, characterized in that: A cooling pipe fixing seat (13) is provided on the top cover (6).

Images