Water cooling device

Abstract

The utility model discloses a water cooling device which comprises a box body, a water storage tank and a water cooling mechanism, wherein the water storage tank and the water cooling mechanism are arranged in the box body; the water cooling mechanism comprises a water cooling frame, an upper refrigeration module and a lower refrigeration module, wherein the upper refrigeration module and the lower refrigeration module are arranged on the water cooling frame and stacked up and down. Each of the upper refrigeration module and the lower refrigeration module comprises a temperature conduction fin, a semiconductor chip connected with the temperature conduction fin and a refrigeration flow channel arranged in the temperature conduction fin. According to the refrigerator, the upper refrigerating module and the lower refrigerating module are arranged in the refrigerator body, so that liquid in the corresponding refrigerating flow channels can be refrigerated through the upper refrigerating module and the lower refrigerating module respectively, the refrigerating efficiency is greatly improved, and when one refrigerating module breaks down, the refrigerating module can be used for refrigerating the liquid in the corresponding refrigerating flow channels. And the other refrigeration module also can normally refrigerate, so that the water cooling device can be ensured to continuously operate, and the loss of a user caused by the damage of the water cooling device is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration, in particular to a water cooling device. Background Art

[0002] With the development of society, the level of science and technology continues to improve, various scientific and technological equipment is constantly updated and iterated, and refrigeration equipment is also the same, constantly updated and iterated. Water cooling device, as a kind of refrigeration equipment, also plays an important role in scientific and technological activities. Water cooling device is usually a refrigeration module that cools the high-temperature liquid flowing into the water cooling device to form a low-temperature liquid or heats the low-temperature liquid flowing into the water cooling device to form a high-temperature liquid before it flows out of the water cooling device, thereby achieving the effect of cooling or heating the liquid medium. Semiconductor chips are widely used in water cooling devices due to their characteristics of being able to cool or heat when powered on in both directions. Existing semiconductor chip water cooling devices only use a plate of refrigeration chip to cool the built-in refrigeration flow channel. The refrigeration effect is general, and when the refrigeration chip is damaged, the water cooling device cannot operate, so that the storage material in the storage device connected to the water cooling device cannot be preserved, thereby causing losses to users. Utility Model Content

[0003] The utility model provides a water cooling device to solve the technical problems raised in the above background technology.

[0004] The utility model provides a water cooling device, comprising a box body, a water storage tank installed in the box body and having a water inlet connected to a liquid inlet of the water cooling device, and a water cooling mechanism connected to a water outlet of the water storage tank; the water cooling mechanism comprises a water cooling rack installed in the box body, an upper refrigeration module and a lower refrigeration module installed on the water cooling rack and stacked up and down; the upper refrigeration module and the lower refrigeration module both comprise temperature conduction fins, a semiconductor chip connected to the temperature conduction fins, and a refrigeration channel arranged in the temperature conduction fins, the channel inlets of the refrigeration channels of the upper refrigeration module and the lower refrigeration module are both connected to the water outlet of the water storage tank, and the channel outlets of the refrigeration channels of the upper refrigeration module and the lower refrigeration module are both connected to the liquid outlet of the water cooling device.

[0005] Furthermore, the water cooling device also includes a water pump connected to the water outlet of the water storage tank, and the pump outlet of the water pump is connected to the flow channel inlet of the refrigeration flow channel of the upper refrigeration module and the lower refrigeration module.

[0006] Furthermore, the flow channel outlets of the upper refrigeration module and the lower refrigeration module are both connected to the liquid outlet through a liquid outlet pipe, and the liquid outlet pipe is provided with a flow meter.

[0007] Furthermore, the liquid inlet is connected to the water inlet of the water storage tank through a liquid inlet pipe, and the water cooling device also includes a filter, and the filter is installed on the liquid inlet pipe.

[0008] Furthermore, the water cooling device also includes a filter, the flow channel outlets of the upper refrigeration module and the lower refrigeration module are both connected to the liquid outlet through a liquid outlet pipe, and the filter is arranged on the liquid outlet pipe.

[0009] Furthermore, the water cooling mechanism also includes a heat dissipation component; the heat dissipation component includes a heat dissipation fan group installed on the temperature conduction fins.

[0010] Furthermore, the heat dissipation fan group includes two heat dissipation fans connected to the temperature conduction fins of the upper refrigeration module and arranged in parallel; the heat dissipation fan group also includes two heat dissipation fans connected to the temperature conduction fins of the lower refrigeration module and arranged in parallel.

[0011] Furthermore, the water storage tank is spaced apart from the bottom of the box body, a cleaning opening is provided at the bottom of the water storage tank, and the cleaning opening is communicated with a cleaning pipe.

[0012] Furthermore, a water level sensor is provided in the water tank, and / or an anti-overflow drain is provided on the side wall of the water tank.

[0013] Furthermore, the upper refrigeration module and the lower refrigeration module each include a control chip connected to the corresponding semiconductor chip, and the control chips of the upper refrigeration module and the lower refrigeration module are both connected to a controller of the water cooling device.

[0014] By adopting the above-mentioned technical scheme, the utility model provides an upper refrigeration module and a lower refrigeration module in the box body, so that the upper refrigeration module and the lower refrigeration module can respectively refrigerate the liquid in the corresponding refrigeration channel, thereby greatly improving the refrigeration efficiency, and when one of the refrigeration modules fails, the other refrigeration module can still refrigerate normally, thereby ensuring that the water cooling device can continue to operate, avoiding losses to users due to damage to the water cooling device. Specifically, the external liquid flows into the water storage tank through the liquid inlet and is stored in the water storage tank. When refrigeration is required, the liquid in the water storage tank flows into the corresponding refrigeration channel from the channel inlet of the upper refrigeration module and the channel inlet of the lower refrigeration module through the water outlet, and in the process of the liquid flowing through the refrigeration channel, the semiconductor chip is cooled, that is, the cold temperature generated by the semiconductor chip is conducted to the liquid in the refrigeration channel through the stable conduction fins, thereby achieving the effect of cooling the liquid, and then the liquid in the upper refrigeration module and the lower refrigeration module are respectively converged from the corresponding channel outlets and flow into the equipment to be cooled through the liquid outlet, thereby cooling the equipment to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a stereoscopic diagram of the water cooling device of the utility model.

[0016] Figure 2 This is another stereoscopic view of the water cooling device of the present invention.

[0017] Figure 3 It is a three-dimensional diagram of the hidden box of the water cooling device of the utility model.

[0018] Figure 4 This is another stereoscopic view of the hidden box of the water cooling device of the present invention.

[0019] Figure 5 It is a three-dimensional diagram of the water cooling mechanism of the utility model.

[0020] Figure 6 It is another three-dimensional diagram of the water cooling mechanism of the utility model.

[0021] Figure 7 It is a three-dimensional diagram of the upper refrigeration module or the lower refrigeration module of the utility model.

[0022] Figure 8 It is a stereoscopic diagram of the water storage tank of the utility model. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below by means of specific implementation methods in combination with the accompanying drawings. It should be understood that the embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but cannot be understood as limiting the present invention. Moreover, in the absence of conflict, the features in the embodiments of the present invention can be combined with each other.

[0024] like Figure 1-Figure 8As shown, the utility model provides a water cooling device, including a box body 1, and a water storage tank 13 installed in the box body 1 and having a water inlet 131 connected to a liquid inlet 121 of the water cooling device, and a water cooling mechanism 14 connected to a water outlet 132 of the water storage tank 13; the water cooling mechanism 14 includes a water cooling frame 141 installed in the box body 1, an upper refrigeration module 142 and a lower refrigeration module 143 installed on the water cooling frame 141 and stacked up and down; the upper refrigeration module 142 and the lower refrigeration module 143 both include a temperature The conduction fins 1421, the semiconductor chip 1427 connected to the temperature conduction fins 1421 and the cooling channel 1422 arranged in the temperature conduction fins 1421, the channel inlet 1423 of the cooling channel 1422 of the upper cooling module 142 and the lower cooling module 143 are both connected to the water outlet 132 of the water storage tank 13, and the channel outlet 1426 of the cooling channel 1422 of the upper cooling module 142 and the lower cooling module 143 are both connected to the liquid outlet 122 of the water cooling device.

[0025] In this embodiment, an upper refrigeration module 142 and a lower refrigeration module 143 are provided in the box body 1, so that the liquid in the corresponding refrigeration channel 1422 can be refrigerated by the upper refrigeration module 142 and the lower refrigeration module 143 respectively, which greatly improves the refrigeration efficiency. When one of the refrigeration modules fails, the other refrigeration module can still refrigerate normally, thereby ensuring that the water cooling device can continue to operate and avoiding losses to users due to damage to the water cooling device. Specifically, the external liquid flows into the water storage tank 13 through the liquid inlet 121 and is stored in the water storage tank 13. When refrigeration is needed, the liquid in the water storage tank 13 is discharged through the water outlet 13. 2 respectively flows into the corresponding refrigeration channel 1422 from the channel inlet 1423 of the upper refrigeration module 142 and the channel inlet 1423 of the lower refrigeration module 143, and in the process of the liquid flowing through the refrigeration channel 1422, the semiconductor chip 1427 performs cooling, that is, the cold temperature generated by the semiconductor chip 1427 is conducted to the liquid in the refrigeration channel 1422 through the stable conduction fins, thereby achieving the effect of cooling the liquid, and then the liquid in the upper refrigeration module 142 and the lower refrigeration module 143 respectively converges from the corresponding channel outlet 1426 and flows into the device to be cooled through the liquid outlet 122, thereby cooling the device to be cooled.

[0026] The utility model can be used to refrigerate a reagent refrigerating pot, and can also be used for refrigeration or heating in other equipment. Specifically, it is only necessary to connect the liquid outlet 122 of the water cooling device to the water cooling inlet of the corresponding equipment.

[0027] In a specific embodiment, the water cooling device also includes a water pump 15 connected to the water outlet 132 of the water storage tank 13, and the pump outlet of the water pump 15 is connected to the channel inlet 1423 of the refrigeration channel 1422 of the upper refrigeration module 142 and the lower refrigeration module 143. In this embodiment, the water storage tank 13 and the channel inlet 1423 of the refrigeration channel 1422 can be connected by the water pump 15, so that the liquid in the water storage tank 13 can be pumped into the refrigeration channel 1422 of the upper refrigeration module 142 and the lower refrigeration module 143 by the water pump 15. The water pump 15 is connected to the channel inlet 1423 through a pump flow tube. The water pump 15 can be connected to the controller 192, and the controller 192 controls the flow rate and flow velocity of the liquid according to actual needs, thereby achieving the effect of auxiliary temperature control.

[0028] In a specific embodiment, the flow channel outlet 1426 of the upper refrigeration module 142 and the lower refrigeration module 143 are connected to the liquid outlet 122 through the liquid outlet pipe 172. The liquid outlet pipe 172 is provided with a flow meter 16. The flow meter 16 is used to measure the liquid flow rate flowing out of the water cooling device. The flow meter 16 can be set on the middle section of the liquid outlet pipe 172, or at one end of the liquid outlet pipe 172 close to the flow channel outlet 1426, or at one end of the liquid outlet pipe 172 close to the liquid outlet 122.

[0029] In a specific embodiment, the liquid inlet 121 is connected to the water inlet 131 of the water storage tank 13 through a liquid inlet pipe 171. The water cooling device also includes a filter 18, which is installed on the liquid inlet pipe 171. By arranging the filter 18 on the liquid inlet pipe 171, the inflowing liquid can be filtered to prevent impurities from entering the water cooling device and affecting the operation of the water cooling device. The filter 18 can be arranged on the middle section of the liquid inlet pipe 171, or at one end of the liquid inlet pipe 171 close to the liquid inlet 121, or at one end of the liquid inlet pipe 171 close to the water inlet 131.

[0030] In a specific embodiment, the water cooling device also includes a filter 18. The flow channel outlets 1426 of the upper refrigeration module 142 and the lower refrigeration module 143 are connected to the liquid outlet 122 through a liquid outlet pipe 172. The filter 18 is arranged on the liquid outlet pipe 172. By arranging the filter 18 on the liquid outlet pipe 172, the liquid flowing into the corresponding equipment can be filtered to prevent impurities from entering the corresponding equipment and affecting the cooling effect of the corresponding equipment.

[0031] In a specific embodiment, the water cooling mechanism 14 also includes a heat dissipation component; the heat dissipation component includes a heat dissipation fan group installed on the temperature conduction fins 1421, and the heat dissipation fan group can dissipate the heat at the heating end of the semiconductor chip 1427, so that the semiconductor chip 1427 can operate normally.

[0032] In a specific embodiment, the cooling fan group includes two cooling fans 1424 connected to the temperature conduction fins 1421 of the upper cooling module 142 and arranged in parallel; the cooling fan group also includes two cooling fans 1424 connected to the temperature conduction fins 1421 of the lower cooling module 143 and arranged in parallel. The upper cooling module 142 and the lower cooling module 143 are respectively cooled by two cooling fans 1424, thereby improving the uniformity of heat dissipation when cooling the semiconductor chip 1427.

[0033] In a specific embodiment, the water tank 13 is spaced apart from the bottom of the box body 1, and a cleaning opening 136 is provided at the bottom of the water tank 13. The cleaning opening 136 is connected to the cleaning pipe 173. The water tank 13 is spaced apart from the bottom of the box body 1 to prevent the outside of the water tank 13 from being oxidized and corroded, and a cleaning opening 136 is provided at the bottom of the water tank 13. When the liquid in the water tank 13 needs to be replaced, the outlet of the cleaning pipe 173 can be opened so that the liquid in the water tank 13 can flow out from the cleaning pipe 173. Since the cleaning opening 136 is provided at the bottom of the box body 1, it is convenient to discharge impurities in the water tank 13.

[0034] In a specific embodiment, a liquid replenishing port 135 is further provided on the top of the water storage tank 13 , and the liquid replenishing port 135 is used for replenishing liquid when the liquid in the water storage tank 13 is insufficient.

[0035] In a specific embodiment, a water level sensor 133 is provided in the water tank 13, and the water level sensor 133 is connected to the controller 192 for detecting the water level change in the water tank 13, thereby controlling the liquid replenishing mechanism to replenish liquid through the liquid replenishing port 135. The side wall of the water tank 13 is provided with an anti-overflow drain port 134, and the height of the anti-overflow drain port 134 is set according to demand. When the liquid level in the water tank 13 is higher than the preset height, the liquid will flow out from the anti-overflow drain port 134, and the water level sensor 133 can also be triggered at this time, thereby notifying the controller 192 to make corresponding instructions.

[0036] In a specific embodiment, the upper refrigeration module 142 and the lower refrigeration module 143 also include a control chip 1425 connected to the corresponding semiconductor chip 1427. The control chips 1425 of the upper refrigeration module 142 and the lower refrigeration module 143 are connected to the controller 192 of the water cooling device. By providing the corresponding control chips 1425, the upper refrigeration module 142 and the lower refrigeration module 143 can be independently controlled. When a problem occurs in one of them, the other refrigeration module can operate independently.

[0037] In a specific embodiment, the flow channel inlet 1423 or the flow channel outlet 1426 of the upper refrigeration module 142 and the lower refrigeration module 143 are provided with solenoid valves. When the corresponding refrigeration module fails, the controller 192 can control the corresponding solenoid valve to close the corresponding refrigeration flow channel 1422, thereby preventing unrefrigerated liquid from flowing into the corresponding device.

[0038] In a specific embodiment, a control panel 191 connected to the controller 192 is disposed outside the box body 1 , and a user can control the water cooling device according to the control panel 191 .

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these examples without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water cooling device, characterized in that: It comprises a box body, a water storage tank installed in the box body and having a water inlet connected to a liquid inlet of a water cooling device, and a water cooling mechanism connected to a water outlet of the water storage tank; the water cooling mechanism comprises a water cooling rack installed in the box body, an upper refrigeration module and a lower refrigeration module installed on the water cooling rack and stacked up and down; the upper refrigeration module and the lower refrigeration module both comprise temperature conduction fins, a semiconductor chip connected to the temperature conduction fins, and a refrigeration channel arranged in the temperature conduction fins, the channel inlets of the refrigeration channels of the upper refrigeration module and the lower refrigeration module are both connected to the water outlet of the water storage tank, and the channel outlets of the refrigeration channels of the upper refrigeration module and the lower refrigeration module are both connected to the liquid outlet of the water cooling device.

2. The water cooling device according to claim 1, characterized in that: The water cooling device also includes a water pump connected to the water outlet of the water storage tank, and the pump outlet of the water pump is connected to the flow channel inlets of the refrigeration flow channels of the upper refrigeration module and the lower refrigeration module.

3. The water cooling device according to claim 1, characterized in that: The flow channel outlets of the upper refrigeration module and the lower refrigeration module are both connected to the liquid outlet through a liquid outlet pipe, and the liquid outlet pipe is provided with a flow meter.

4. The water cooling device according to any one of claims 1 to 3, characterized in that: The liquid inlet is communicated with the water inlet of the water storage tank through a liquid inlet pipe. The water cooling device also includes a filter, and the filter is installed on the liquid inlet pipe.

5. The water cooling device according to claim 3, characterized in that: The water cooling device further comprises a filter, and the filter is arranged on the liquid outlet pipe.

6. The water cooling device according to any one of claims 1 to 3, characterized in that: The water cooling mechanism also includes a heat dissipation component; the heat dissipation component includes a heat dissipation fan group installed on the temperature conduction fins.

7. The water cooling device according to claim 6, characterized in that: The heat dissipation fan group includes two heat dissipation fans connected to the temperature conduction fins of the upper refrigeration module and arranged in parallel; the heat dissipation fan group also includes two heat dissipation fans connected to the temperature conduction fins of the lower refrigeration module and arranged in parallel.

8. The water cooling device according to any one of claims 1 to 3, characterized in that: The water storage tank is spaced apart from the bottom of the box body, a cleaning opening is provided at the bottom of the water storage tank, and the cleaning opening is communicated with a cleaning pipe.

9. The water cooling device according to any one of claims 1 to 3, characterized in that: A water level sensor is arranged in the water storage tank, and / or an anti-overflow drain port is arranged on the side wall of the water storage tank.

10. The water cooling device according to any one of claims 1 to 3, characterized in that: The upper refrigeration module and the lower refrigeration module each further include a control chip connected to a corresponding semiconductor chip, and the control chips of the upper refrigeration module and the lower refrigeration module are both connected to a controller of the water cooling device.

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