BGA solder ball surface roundness detection device

Abstract

The utility model discloses a BGA solder ball surface roundness detection device, which comprises a detection mechanism and a collection mechanism, the detection mechanism comprises a base, the shape of the base is a triangular prism, the bevel edge of the base is provided with a movable plate, the upper surface of the movable plate is provided with a groove, the groove is internally provided with a plurality of semi-circular grooves, and the semi-circular grooves are connected with the detection mechanism. A protruding block is arranged on the surface of the groove, a baffle is connected to the surface of the protruding block in a clamped mode, and a connecting plate is fixedly connected to the lower surface of the movable plate. The surface roundness of the BGA solder balls can be conveniently detected through the detection mechanism, the solder balls with regular roundness can conveniently roll to the bottom from the surface of the movable plate through the vibration machine, the connecting plate and the movable plate, the solder balls with incomplete roundness can slowly move on the movable plate, and the collecting mechanism is arranged to collect the solder balls with incomplete roundness. And the tin balls after roundness detection can be conveniently collected, so that the detection mechanism can detect the roundness of the surfaces of the tin balls.

Description

Technical Field

[0001] The utility model relates to the technical field of solder ball detection, in particular to a device for detecting the surface roundness of a BGA solder ball. Background Art

[0002] Solder balls are widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and the assembly of multiple integrated circuits in the electronics industry. They are also used as reagents and reducing agents for the determination of arsenic and phosphate, and tin-plated products. High-quality BGA solder balls must have the characteristics of true roundness, brightness, good electrical conductivity and mechanical connection performance, small ball diameter tolerance, and low oxygen content. Precision and advanced solder ball production equipment is the key to providing high-quality solder ball products.

[0003] BGA solder balls are an important part of BGA welding. There are two main methods for automatic BGA solder ball feeding: cutting and remelting molding and injection molding. The former is to cut solder wires of different diameters into units of consistent quality, and then melt them into balls in glycerin; the latter is to melt the solder in a specific container (crucible), and then inflate the crucible to increase the pressure so that the molten solder sprays out from the specific small holes at the bottom of the crucible, and then use high-frequency oscillation to make it into balls; no matter whether the cutting and remelting molding method or the injection molding method is used, the surface roundness of the formed solder balls needs to be tested to ensure the quality of the solder balls.

[0004] The main indicators of BGA solder balls include ball diameter, tolerance control, roundness and anti-oxidation performance, and roundness screening is the main process of BGA solder ball detection. However, the existing solder ball screening process generally has problems such as low screening efficiency and low screening accuracy. Therefore, it is necessary to improve the existing technology to achieve the purpose of improving screening efficiency. Utility Model Content

[0005] The utility model aims to provide a device for detecting the roundness of the surface of a BGA solder ball, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a device for detecting the roundness of the surface of a BGA solder ball, comprising a detection mechanism and a collection mechanism, the detection mechanism comprising a base, and the shape of the base is a triangular prism, a movable plate is arranged on the hypotenuse of the base, a groove is provided on the upper surface of the movable plate, and a plurality of semicircular grooves are provided in the groove, a protrusion is provided on the surface of the groove, and a baffle is clamped on the surface of the protrusion, a connecting plate is fixedly connected to the lower surface of the movable plate, a positioning rod and a transmission rod are respectively provided on the side of the connecting plate, and a vibrator is fixedly connected to the end of the transmission rod away from the connecting plate, the collection mechanism comprises a collection box, and a plug-in plate is fixedly connected to the side of the collection box, and the side of the plug-in plate is plugged into the side of the movable plate, a protective plate is fixedly connected to the side of the collection box, and a discharge pipe is provided on the side of the collection box.

[0007] On the basis of the above technical solution, the present invention can also be improved as follows.

[0008] Preferably, the surface of the protrusion is arranged in an arc shape, and a groove matching the lower surface of the baffle is longitudinally opened on the surface of the protrusion, and a square hole is opened on the side of the baffle. By setting the baffle, it is convenient to temporarily block the solder balls with roundness of the surface being tested.

[0009] Preferably, the inclined surface of the base is provided with a movable groove for facilitating the movement of the connecting plate, and the inner side walls of the movable groove are respectively provided with grooves for movement with the positioning rod and the transmission rod, and the interior of the base is provided with a groove adapted to the vibration machine, and the number of the positioning rods is two, and the two positioning rods are respectively arranged on both sides of the transmission rod. By arranging the positioning rod and the transmission rod, it is convenient for the vibration machine to drive the positioning rod and the connecting plate to shake through the transmission rod, thereby making the connecting plate have a vibration effect.

[0010] Preferably, a plug-in slot compatible with the plug-in board is opened on the side of the movable plate, and a magnet is embedded on the side of the plug-in board. By setting the plug-in board, it is convenient to connect the collecting mechanism with the detecting mechanism. The magnet is set to increase the connectivity between the plug-in board and the movable plate.

[0011] Preferably, two protective plates are provided on the sides of the collection box, and the opposite surfaces of the two protective plates are overlapped with the front and back surfaces of the movable plate respectively. By providing the protective plates and the collection box, it is convenient to prevent the solder balls that are shaken to the bottom of the movable plate from falling to the outside.

[0012] Preferably, the internal cavity of the collection box is Z-shaped, and a fan blade plate connected to the inner wall of the groove is provided on the side of the collection box. By providing the collection box and the fan blade plate, it is convenient for the solder balls whose surface roundness has been tested to roll into the collection box, thereby increasing the effect of the collection box in collecting solder balls.

[0013] Beneficial Effects

[0014] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0015] The utility model is convenient for detecting the surface roundness of BGA solder balls through the detection mechanism provided, and is convenient for making solder balls with regular roundness roll from the surface of the movable plate to the bottom by arranging a vibrator, a connecting plate and a movable plate, while solder balls with incomplete roundness slowly move on the movable plate, and is convenient for collecting solder balls after roundness detection by arranging a collecting mechanism, so that the detection mechanism has the function of detecting the roundness of the surface of the solder balls. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the front section structure of the utility model;

[0017] Figure 2 This is a side view of the structure of the utility model;

[0018] Figure 3 for Figure 1 Enlarged structural diagram at A in the middle.

[0019] In the figure: 1. base; 2. movable plate; 3. groove; 4. semicircular groove; 5. protrusion; 6. baffle; 7. connecting plate; 8. positioning rod; 9. transmission rod; 10. vibrator; 11. collection box; 12. plug-in board; 13. protective plate; 14. discharge pipe. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3 The utility model provides a technical solution: a detection device for the roundness of the surface of a BGA solder ball, comprising a detection mechanism and a collection mechanism, the detection mechanism comprising a base 1, and the base 1 is in the shape of a triangular prism, a movable plate 2 is arranged on the hypotenuse of the base 1, a groove 3 is provided on the upper surface of the movable plate 2, and a plurality of semicircular grooves 4 are provided in the groove 3, a protrusion 5 is provided on the surface of the groove 3, and a baffle 6 is clamped on the surface of the protrusion 5, the surface of the protrusion 5 is provided with an arc shape, and a groove 3 adapted to the lower surface of the baffle 6 is longitudinally provided on the surface of the protrusion 5, and a square hole is provided on the side of the baffle 6, and by arranging the baffle 6, it is convenient to temporarily block the solder ball whose surface roundness is detected.

[0022] A connecting plate 7 is fixedly connected to the lower surface of the movable plate 2, and a positioning rod 8 and a transmission rod 9 are respectively provided on the sides of the connecting plate 7. The end of the transmission rod 9 away from the connecting plate 7 is fixedly connected to a vibrator 10. The inclined surface of the base 1 is provided with a movable groove for facilitating the movement of the connecting plate 7, and the inner side walls of the movable groove are respectively provided with grooves for the movement of the positioning rod 8 and the transmission rod 9. A groove adapted to the vibrator 10 is provided inside the base 1. There are two positioning rods 8, and the two positioning rods 8 are respectively provided on both sides of the transmission rod 9. By providing the positioning rod 8 and the transmission rod 9, it is convenient for the vibrator 10 to drive the positioning rod 8 and the connecting plate 7 to shake through the transmission rod 9, thereby making the connecting plate 7 have a vibrating effect.

[0023] The collecting mechanism includes a collecting box 11, the internal cavity of the collecting box 11 is in a Z-shape, and a fan blade plate connected to the inner wall of the groove 3 is provided on the side of the collecting box 11. By providing the collecting box 11 and the fan blade plate, it is convenient for the solder balls whose surface roundness has been detected to roll into the collecting box 11, thereby increasing the effect of the collecting box 11 in collecting solder balls.

[0024] A plug-in board 12 is fixedly connected to the side of the collection box 11, and the side of the plug-in board 12 is plugged into the side of the movable plate 2. The side of the movable plate 2 is provided with a plug-in groove compatible with the plug-in board 12, and a magnet is embedded in the side of the plug-in board 12. By setting the plug-in board 12, it is convenient to connect the collection mechanism with the detection mechanism. The magnet is set to increase the connectivity between the plug-in board 12 and the movable plate 2.

[0025] A protective plate 13 is fixedly connected to the side of the collecting box 11, and a discharge pipe 14 is arranged on the side of the collecting box 11. Two protective plates 13 are arranged on the side of the collecting box 11, and the opposite surfaces of the two protective plates 13 are overlapped with the front and back sides of the movable plate 2 respectively. By arranging the protective plates 13 and the collecting box 11, it is convenient to prevent the solder balls that are shaken to the bottom of the movable plate 2 from falling to the outside.

[0026] In this embodiment, the detection mechanism is provided to facilitate the detection of the surface roundness of the BGA solder ball. By providing the vibrator 10, the connecting plate 7 and the movable plate 2, the solder balls with regular roundness can be easily rolled from the surface of the movable plate 2 to the bottom, while the solder balls with incomplete roundness can be slowly moved on the movable plate 2. By providing the collecting mechanism, the solder balls after the roundness detection can be easily collected, so that the detection mechanism can detect the roundness of the surface of the solder ball.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for detecting the roundness of a BGA solder ball surface, characterized in that: The invention comprises a detection mechanism and a collection mechanism, wherein the detection mechanism comprises a base (1), and the base (1) is in the shape of a triangular prism, a movable plate (2) is arranged on the hypotenuse of the base (1), a groove (3) is provided on the upper surface of the movable plate (2), and a plurality of semicircular grooves (4) are provided in the groove (3), a convex block (5) is provided on the surface of the groove (3), and a baffle (6) is clamped on the surface of the convex block (5), a connecting plate (7) is fixedly connected to the lower surface of the movable plate (2), a positioning rod (8) and a transmission rod (9) are respectively arranged on the side surfaces of the connecting plate (7), and a vibrator (10) is fixedly connected to the end of the transmission rod (9) away from the connecting plate (7); The collecting mechanism comprises a collecting box (11), and a plug-in plate (12) is fixedly connected to the side of the collecting box (11), and the side of the plug-in plate (12) is plugged into the side of the movable plate (2), a protective plate (13) is fixedly connected to the side of the collecting box (11), and a discharge pipe (14) is arranged on the side of the collecting box (11).

2. A BGA solder ball surface roundness detection device according to claim 1, characterized in that: The surface of the protrusion (5) is arranged in an arc shape, and a groove (3) which matches the lower surface of the baffle (6) is longitudinally opened on the surface of the protrusion (5), and a square hole is opened on the side surface of the baffle (6).

3. The device for detecting the roundness of a BGA solder ball surface according to claim 1, characterized in that: The inclined surface of the base (1) is provided with a movable groove for facilitating the movement of the connecting plate (7), and the inner side walls of the movable groove are respectively provided with grooves for movement with the positioning rod (8) and the transmission rod (9), and the interior of the base (1) is provided with a groove adapted to the vibration machine (10).

4. The device for detecting the roundness of a BGA solder ball surface according to claim 1, characterized in that: The side surface of the movable plate (2) is provided with a plug-in slot matched with the plug-in plate (12), and the side surface of the plug-in plate (12) is embedded with a magnet.

5. The device for detecting the roundness of a BGA solder ball surface according to claim 1, characterized in that: Two protective plates (13) are arranged on the side of the collection box (11), and the opposite surfaces of the two protective plates (13) are overlapped with the front and back surfaces of the movable plate (2) respectively.

6. The device for detecting the roundness of a BGA solder ball surface according to claim 1, characterized in that: The internal cavity of the collection box (11) is in a Z-shape, and a fan blade plate connected to the inner side wall of the groove (3) is provided on the side of the collection box (11).

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