Device for rapid spot test of TO-247 packaging tube
By designing a device including a fixture and a heatable metal probe, the cumbersome problem of the TO-247 packaging tube IC body sampling process is solved, and a fast and safe testing process is achieved.
Patent Information
- Application Number
- CN202323432958.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-16
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2033-12-16
AI Technical Summary
In the prior art, the IC body sampling process of TO-247 packaging tube is cumbersome and needs to be disassembled and assembled, which affects safety and efficiency.
A device including a fixture and a metal probe is designed, which can be heated through the packaging tube to contact the IC body for testing, avoiding disassembly and assembly operations.
It realizes rapid testing of the IC body in the TO-247 packaging tube, saving time, avoiding static damage, and improving testing safety.
Smart Images
Figure CN222365060U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sampling testing devices, in particular to a device for rapid sampling testing of TO-247 packaging tubes. Background Art
[0002] TO-247 is a commonly used small-outline package, one of the surface mount packages, and 247 is the serial number of the package standard. The IC body of the TO-247 package is placed evenly in the packaging tube. The IC body needs to be sampled for subsequent testing. In the AQL (ACCEPTABLE QUALITY LEVEL) test, sampling is used to understand whether the product defects are within the acceptable range.
[0003] In the existing sampling test, the packaging tube needs to be opened, the selected IC body needs to be picked out, and placed in the socket for testing. The operation is relatively cumbersome, and repeated disassembly and assembly will affect the safety of the IC body. In view of the above problems, a device for rapid sampling testing of TO-247 packaging tubes is proposed. Utility Model Content
[0004] The utility model aims to provide a device for rapid sampling and testing of TO-247 packaging tubes, so as to solve the problems raised in the above-mentioned background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A device for rapid sampling of TO-247 packaging tubes, comprising a jig and a metal probe;
[0007] The jig is provided with a placement cavity for placing the packaging tube, one side of the placement cavity is provided with an opening, the metal probe is arranged on a side of the jig away from the opening, and the jig is provided with a through hole for the metal probe to pass through.
[0008] In an optional solution: a plurality of evenly placed IC bodies are arranged in the packaging tube.
[0009] In an optional solution: four probes are provided on the metal probe.
[0010] In an optional solution: a group of the metal probes corresponds to a group of IC bodies, and three probes of the metal probes correspond to three pins of the IC body.
[0011] In an optional solution: the wall thickness of the packaging tube is 0.6-0.8 mm.
[0012] In an optional solution: the probe heating temperature of the metal probe is 200° C., and the probe diameter is 5 mm.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] The utility model can directly test the IC body in the packaging tube, saving test time, and does not need to take the IC body out of the packaging tube, thus avoiding static electricity damage caused by friction between the IC body and the test environment when the IC body is taken out;
[0015] The metal probe in the utility model can be heated and then pass through the packaging tube to contact the test point of the IC body for testing. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of the utility model.
[0017] Figure 2 It is a schematic diagram of the structure corresponding to the metal probe and the IC body in the utility model.
[0018] Figure 3 It is a schematic cross-sectional structural diagram of the packaging tube and the IC body in the utility model.
[0019] In the figure: 100, a fixture; 200, a placement cavity; 300, a metal probe; 400, an IC body; 500, a packaging tube. DETAILED DESCRIPTION
[0020] See also Figure 1-Figure 3 In an embodiment of the utility model, a device for rapid sampling of TO-247 packaging tubes includes a fixture 100 and a metal probe 300; the size of the fixture 100 is set according to actual needs;
[0021] The fixture 100 is provided with a placement cavity 200 for placing the packaging tube 500. The packaging tube 500 can be directly placed in the placement cavity 200. The size of the placement cavity 200 is set according to the size of the packaging tube.
[0022] An opening is provided on one side of the placement cavity 200 , and the metal probe 300 is disposed on a side of the fixture 100 away from the opening. A through hole is provided on the fixture 100 for the metal probe 300 to pass through.
[0023] A plurality of IC bodies 400 are evenly placed in the packaging tube 500 , and the packaging tube 500 is made of a transparent material.
[0024] The metal probe 300 is provided with four probes; the probes of the metal probe 300 are in contact with the test points of the IC body 400 .
[0025] A group of the metal probes 300 corresponds to a group of IC bodies 400 , and three probes in the metal probes 300 correspond to three pins of the IC body 400 .
[0026] The wall thickness of the packaging tube 500 is 0.6-0.8 mm, and the melting point of the packaging tube 500 is about 150° C. When the probe is heated, it can pass through the wall of the tube.
[0027] The probe heating temperature of the metal probe 300 is 200° C., the probe diameter is 5 mm, and the probe of the metal probe 300 will not cause damage to the IC body 400 .
[0028] When the present invention is in use, the metal probe 300 is connected to the corresponding component, the packaging tube 500 is placed in the placement cavity 200, the metal probe 300 is heated to 200°C, and the metal probe 300 is moved so that the probe penetrates the tube wall and contacts the IC body 400 for detection.
Claims
1. A device for rapid sampling of TO-247 packaging tubes, comprising a fixture (100) and a metal probe (300); Features: The jig (100) is provided with a placement cavity (200) for placing the packaging tube (500), one side of the placement cavity (200) is provided with an opening, the metal probe (300) is arranged on a side of the jig (100) away from the opening, and the jig (100) is provided with a through hole for the metal probe (300) to pass through; A plurality of IC bodies (400) are evenly placed inside the packaging tube (500).
2. The device for rapid sampling of TO-247 packaging tubes according to claim 1 is characterized in that: The metal probe (300) is provided with four probes.
3. The device for rapid sampling of TO-247 packaging tubes according to claim 2 is characterized in that: A group of the metal probes (300) corresponds to a group of IC bodies (400), and three probes in the metal probes (300) correspond to three pins of the IC body (400).
4. The device for rapid sampling of TO-247 packaging tubes according to claim 1 is characterized in that: The wall thickness of the packaging tube (500) is 0.6-0.8 mm.
5. The device for rapid sampling of TO-247 packaging tubes according to claim 3 is characterized in that: The probe heating temperature of the metal probe (300) is 200° C., and the probe diameter is 5 mm.