Transparent display module and transparent LED display screen

Abstract

The utility model provides a transparent display module and a transparent LED (light-emitting diode) display screen in order to solve the problem that the resolution of a transparent display module in the prior art still needs to be further improved. The utility model provides a transparent display module. The transparent display module comprises a light-transmitting substrate and a light-transmitting back plate, the light-transmitting substrate is provided with a light-transmitting hole, the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate has a transparent effect, light-emitting units are arranged on the front face of the light-transmitting substrate in an array mode, a driving circuit is arranged on the back face of the light-transmitting substrate, and the driving circuit comprises driving units arranged in an array mode; according to the transparent display module disclosed by the invention, the light-emitting unit and the driving unit in the original LED lamp bead are respectively arranged on the front surface and the back surface of the light-transmitting substrate and are electrically connected, so that the light-emitting unit only comprises the light-emitting wafer, and the driving chip is independently arranged on the back surface of the light-transmitting substrate; and a bare chip with the area smaller than or equal to 1.2 mm < 2 > is adopted as the driving chip, so that the area of the light-emitting unit can be effectively reduced, and the light transmittance and the resolution ratio of the light-emitting unit are greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of a transparent LED display screen, in particular to the field of a transparent LED display screen with light-transmitting holes arranged on a circuit board. Background Art

[0002] Transparent LED display screens are gradually being widely used in the market and have developed into various product forms. The prior art provides an improved transparent display module 100, such as Figure 1a , Figure 1b , Figure 2 As shown, it includes a light-transmitting substrate 1 and a light-transmitting cover plate 2; the light-transmitting substrate 1 and the light-transmitting cover plate 2 are both provided with mutually corresponding light-transmitting holes in an array, and the area outside the light-transmitting holes forms a non-light-transmitting area; the light-transmitting hole on the light-transmitting substrate 1 is a first light-transmitting hole 11, and the light-transmitting hole on the light-transmitting cover plate 2 is a second light-transmitting hole 21; a driving circuit and a pixel pad are provided on the front side of the light-transmitting substrate 1, and the pixel pads are arranged in an array in the non-light-transmitting area outside the first light-transmitting hole 11; wherein, a plurality of light-emitting units 12 are mounted on the pixel pads, and the driving circuit is connected through the pixel pads; the light-emitting unit 12 includes a driving chip (not marked in the figure) and a light-emitting chip (not marked in the figure); light-emitting through holes 22 are arranged in an array on the non-light-transmitting area outside the second light-transmitting hole 21 on the light-transmitting cover plate 2, and the light-emitting through holes 22 correspond to the pixel pads so that the light-emitting unit 12 is located in the light-emitting through holes 22. The above method can arrange the light emitting unit 12 in the light emitting through hole 22 formed by the above light-transmitting cover plate 2, and the light emitting unit 12 is not easy to be damaged by bumps. The light emitting unit has no additional exposed welding points, and it is easy to achieve waterproof and moisture-proof.

[0003] However, due to space limitations, the arrangement of the RGB light-emitting chips of this type of light-emitting unit is not on the pixel symmetry axis of the display surface, resulting in obvious color difference when viewed from left to right, making it difficult to meet high-quality display requirements. At the same time, since this type of light-emitting unit includes both the light-emitting chip and the driver chip, the area it occupies is still relatively large, and the spacing between the light-emitting units is relatively large. When the resolution needs to be further improved, the existing arrangement of this type cannot meet the requirements (it is difficult to accommodate the driver chip and the light-emitting chip to be installed at the same time, especially when the RGB light-emitting chip is to be arranged on the center line of the pixel, the space is even more difficult to accommodate. Placing the driver chip and the RGB light-emitting chip at the same time in the single-sided non-light-transmitting area already occupies a relatively large area ratio, the spacing between the light-emitting pixel components cannot be reduced, the resolution is small, and the aperture left for the light-transmitting hole is very small. Usually, under the condition of a pixel spacing less than P3.91mm, the physical transparency is difficult to be higher than 40%.), and its resolution and light transmittance still have room for improvement. Utility Model Content

[0004] In order to overcome the problems in the prior art that color difference is still easily formed when viewing from left to right, and the resolution still needs to be further improved, the utility model provides a transparent display module and a transparent LED display screen.

[0005] On one hand, the present application provides a transparent display module, comprising a light-transmitting substrate and a light-transmitting backplane; the light-transmitting backplane is arranged on the reverse side of the light-transmitting substrate;

[0006] The light-transmitting substrate is provided with a light-transmitting hole, and the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate has a transparent effect; the front side of the light-transmitting substrate is provided with a light-emitting unit array, and the light-emitting unit includes a light-emitting chip; the back side of the light-transmitting substrate is provided with a driving circuit, and the driving circuit includes driving units arranged in an array, and the driving unit includes a driving chip; the driving chip is a bare chip, and the area of ​​the driving chip is less than or equal to 1.2mm 2 ;

[0007] The light emitting unit and the driving unit are electrically connected.

[0008] The transparent display module disclosed in the present application arranges the light-emitting unit and the driving unit in the original LED lamp bead on the front and back sides of the light-transmitting substrate respectively and electrically connects them. In this way, the light-emitting unit only contains the light-emitting chip, and the driving chip is independently arranged on the back side of the light-transmitting substrate, and the area of ​​the driving chip is less than or equal to 1.2mm 2 The bare chip can effectively reduce the area of ​​the light-emitting unit and greatly improve its transmittance and resolution.

[0009] Furthermore, it also includes a light-transmitting cover plate; the light-transmitting cover plate is arranged on the front side of the light-transmitting substrate, and the light-transmitting substrate is sandwiched between the light-transmitting cover plate and the light-transmitting back plate.

[0010] Furthermore, the light-emitting unit includes a front soldering area and an unpackaged light-emitting chip mounted on the front soldering area; a plurality of front soldering pads are provided on the front soldering area;

[0011] The driving unit comprises a back side welding area and a driving chip mounted on the back side welding area, and a plurality of back side welding pads are arranged on the back side welding area;

[0012] The front pad and the back pad are electrically connected, so that the driving chip drives the light emitting chip to work.

[0013] Furthermore, the front pad and the back pad are electrically connected through a metal via.

[0014] Furthermore, the light-transmitting hole on the light-transmitting substrate is a first light-transmitting hole, and the light-transmitting cover plate is a non-transparent plate, on which a second light-transmitting hole and a light-emitting through hole are provided; wherein the second light-transmitting hole and the first light-transmitting hole are arranged in a one-to-one correspondence; the light-emitting through hole and the light-emitting unit are arranged in a one-to-one correspondence; so that each of the light-emitting units is located in the light-emitting through hole.

[0015] Furthermore, the light-transmitting back plate is a non-transparent plate, on which a third light-transmitting hole is provided; the third light-transmitting hole is provided in a one-to-one correspondence with the first light-transmitting hole;

[0016] Furthermore, the light-transmitting cover plate is a transparent cover plate formed by curing a transparent potting glue.

[0017] Furthermore, a non-light-transmitting ink layer is provided on the light-transmitting cover plate, and the non-light-transmitting ink layer is arranged to correspond to the non-light-transmitting area of ​​the light-transmitting substrate, so that the light-emitting unit cannot scatter light outward through the non-light-transmitting ink layer.

[0018] Furthermore, the light-transmitting backplane is a packaging layer formed by curing a potting compound, which packages the driving chip in the light-transmitting backplane.

[0019] Furthermore, the light-emitting chip on the light-emitting unit is upright, and the pins on the light-emitting chip are electrically connected to the front pad by bonding wires (or binding wires);

[0020] And / or, the driver chip is mounted upright and is electrically connected to the back pad by bonding with bonding wires (or binding wires).

[0021] Furthermore, at least one light-emitting chip on the light-emitting unit is flipped, and pins of the flipped light-emitting chip are directly soldered to the front pad.

[0022] Furthermore, a light-transmitting glue is filled in the light-emitting through hole to transparently encapsulate the light-emitting unit in the light-emitting through hole; the light-emitting unit and the light-transmitting glue form an LED package accommodated in the light-emitting through hole.

[0023] Furthermore, the light-transmitting back plate is provided with a driving unit hole, and the driving units on the reverse side of the light-transmitting substrate are arranged in the driving unit holes in a one-to-one correspondence.

[0024] Furthermore, the diameter of the light-emitting unit is 0.5-2.5 mm; and the center distance between the light-emitting units is 2-8 mm.

[0025] Furthermore, the light emitting chip includes a red light emitting chip, a green light emitting chip and a blue light emitting chip; the red light emitting chip, the green light emitting chip and the blue light emitting chip are arranged along the center line of the front welding area and are centrally linearly symmetrical. The requirements for RGB mixed light quality in high-end display application scenarios can be met. There is no color difference when viewing.

[0026] Furthermore, the thickness of the transparent display module is 0.8 mm to 2.8 mm, and the thickness can be made very thin to reduce the weight of the transparent display module.

[0027] Furthermore, the light-emitting unit includes a front welding area and an LED lamp bead without a driving chip formed by packaging the light-emitting chip; a plurality of front welding pads are arranged on the front welding area; and the LED lamp bead is mounted on the front welding pad.

[0028] On the other hand, the present application provides a transparent LED display screen, including the above-mentioned transparent display module.

[0029] The transparent LED display screen provided by the present application includes the above-mentioned improved transparent display module and is electrically connected. Thus, the light-emitting unit only includes the light-emitting chip, and the driver chip is independently arranged on the back side of the transparent substrate, and the driver chip adopts an area of ​​less than or equal to 1.2mm 2 The bare chip can effectively reduce the area of ​​the light-emitting unit and greatly improve its transmittance and resolution.

[0030] Furthermore, it also includes a transparent motherboard, and a plurality of the transparent display modules are mounted on the transparent motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1a It is a decomposed stereoscopic schematic diagram of a transparent display module provided in the prior art;

[0032] Figure 1b yes Figure 1a The enlarged schematic diagram at E in the middle;

[0033] Figure 2 It is a three-dimensional schematic diagram of a transparent display module provided in the prior art;

[0034] Figure 3 It is a front perspective schematic diagram of a transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0035] Figure 4 It is a reverse three-dimensional schematic diagram of a transparent display module provided in Example 1 of the specific implementation mode of the present application;

[0036] Figure 5This is a front exploded perspective schematic diagram of a transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0037] Figure 6 It is a reverse exploded three-dimensional schematic diagram of a transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0038] Figure 7 yes Figure 5 The enlarged schematic diagram at A in the middle;

[0039] Figure 8 yes Figure 6 The enlarged schematic diagram of point B in the middle;

[0040] Fig. 9 It is a partial front perspective schematic diagram of a transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0041] Fig.10 It is a partial three-dimensional schematic diagram of the reverse side of a transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0042] Fig.11 It is a front plan view schematic diagram of a light-transmitting substrate provided in Example 1 of the specific implementation manner of the present application;

[0043] Fig.12 It is a schematic top view of the reverse side of a light-transmitting substrate provided in Example 1 of the specific implementation manner of the present application;

[0044] Fig.13 yes Fig.11 The enlarged schematic diagram at C in the middle;

[0045] Fig.14 yes Fig.12 The enlarged schematic diagram at D in the middle;

[0046] Fig.15 This is a top view schematic diagram of another transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0047] Fig.16 It is a partial front perspective schematic diagram of another transparent display module provided in Example 1 of the specific implementation manner of the present application;

[0048] Fig.17 It is a three-dimensional schematic diagram of a transparent LED display screen provided in Example 2 of the specific implementation method of the present application;

[0049] Fig.18 It is a front perspective schematic diagram of a transparent display module provided in Example 3 of the specific implementation manner of the present application;

[0050] Fig.19It is a reverse three-dimensional schematic diagram of a transparent display module provided in Example 3 of the specific implementation manner of the present application;

[0051] Fig. 20 This is a front plan view of a transparent display module provided in Example 3 of the specific implementation manner of the present application;

[0052] Fig.21 yes Fig. 20 The enlarged schematic diagram at F in the middle;

[0053] Fig. 22 It is a schematic diagram of a top view of the back side of a transparent display module provided in Example 3 of the specific implementation manner of the present application;

[0054] Fig.23 yes Fig. 22 The enlarged schematic diagram at G in the middle;

[0055] Fig.24 It is a partial cross-sectional schematic diagram of a transparent display module provided in Example 3 of the specific implementation manner of the present application;

[0056] Fig.25 It is a schematic exploded three-dimensional diagram of a transparent LED display screen provided in Example 4 of the specific implementation method of the present application.

[0057] The reference numerals are as follows: 1000, transparent LED display screen; 100, transparent display module; 200, transparent motherboard;

[0058] 1. Translucent substrate; 2. Translucent cover plate; 3. Translucent back plate;

[0059] 11. First light-transmitting hole; 12. Light-emitting unit; 12a. LED lamp bead; 12a1. Cathode pin; 12a2. Red pin; 12a3. Green pin; 12a4. Blue pin; 13. Driving unit; 21. Second light-transmitting hole; 22. Light-emitting through hole; 221. Light-transmitting glue; 120. Front solder pad; 121. Light-emitting chip; 122. Metal via; 130. Back solder pad; 131. Driving chip; 31. Third light-transmitting hole; 32. Driving unit hole. DETAILED DESCRIPTION

[0060] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0061] In the description of the present invention, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0062] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] Example 1

[0064] In order to overcome the problems in the prior art that color difference is still easily formed when viewing from left to right and the resolution still needs to be further improved, the utility model provides a transparent display module and a transparent LED display screen.

[0065] like Figure 3-Figure 8 As shown, the present application provides a transparent display module, including a light-transmitting substrate 1, a light-transmitting cover plate 2 and a light-transmitting back plate 3; the light-transmitting substrate 1 is sandwiched between the light-transmitting cover plate 2 and the light-transmitting back plate 3; wherein the light-transmitting cover plate 2 is arranged on the front side of the light-transmitting substrate 1, and the light-transmitting back plate 3 is arranged on the reverse side of the light-transmitting substrate 1; wherein Figure 3 , Figure 4 The three-dimensional images from the front and back of the transparent display module are shown respectively, and it can be seen that the entire transparent display module is provided with light-transmitting holes, so that the entire product presents a light-transmitting effect. It should be noted that the light-transmitting cover plate 2 in this example is not a necessary structure, but a preferred structure.

[0066] Figure 5 Schematic diagram of separating the light-transmitting cover plate 2 from the front of the transparent display module; Figure 6Schematic diagram of separating the light-transmitting backplane 3 from the back side of the transparent display module; in this way, the effects of installing the light-emitting units 12 and the driving units 13 on the light-transmitting substrate 1 can be seen respectively. The light-transmitting substrate 1 is provided with a light-transmitting hole, and the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate 1 is transparent, wherein the light-emitting units 12 are arranged in an array on the front side of the light-transmitting substrate 1, and a driving circuit is arranged on the back side thereof, and the driving circuit includes driving units 13 arranged in an array, and the light-emitting units and the driving units are electrically connected.

[0067] Specifically, the binding pads of the R, G, and B pins of the corresponding driving chip of the driving unit 13 on the front and back sides of the transparent substrate 1 are respectively electrically connected to the pin pads of one pole of the R, G, and B light-emitting chips of the light-emitting unit 12 through the metal vias 122; in general, the larger the area ratio of the transparent area to the non-transparent area, the higher the transparency of the transparent display module 100 and the better the permeability. The size of the above-mentioned transparent hole can be optimized and designed according to actual needs during the production process, and a balance can be found between maintaining transparency and ensuring the display performance of the product. For those skilled in the art, in the case where the idea has been introduced in this example, the skilled artisans can obtain it without creative labor. In this application, the transparent substrate 1 is generally formed of a non-transparent material, for example, it is generally directly a printed circuit board, and circuit patterns are respectively provided on both sides of the printed circuit board for transmitting signals and providing electrical energy. The transparent cover plate 2 is a printed circuit board, and it is preferred to use a printed circuit board containing a shielding circuit (short-circuited with the ground terminal GND on the transparent substrate 1) as the transparent cover plate 2. The transparent substrate 1 and the transparent cover plate 2 are formed by pressing or bonding. The transparent cover plate 2 can also be formed by a plastic material die-casting, or a plate-like structure made of any other material that can be bonded to the transparent substrate 1.

[0068] The shape of the light-transmitting hole can be a circular through hole as shown in the figure, or a triangle, a quadrilateral or other polygon or any other regular or irregular form, preferably a circular through hole.

[0069] like Figure 7-Figure 14 As shown, the light-emitting unit 12 includes a front soldering area and a light-emitting chip 121 mounted on the front soldering area; a plurality of front soldering pads 120 are provided on the front soldering area; the light-emitting chip 121 in this application is known to the public, and the light-emitting chip 121 includes a red light-emitting chip, a green light-emitting chip and a blue light-emitting chip. Each light-emitting unit 12 is a light-emitting pixel, which can be combined to emit light of various colors. The light-emitting unit 12 in this example includes a light-emitting chip 121 that is not packaged and soldered on the front soldering area.

[0070] The driving unit 13 includes a back soldering area and a driving chip 131 mounted on the back soldering area, and a plurality of back solder pads 130 are disposed on the back soldering area;

[0071] The front pad 120 and the back pad 130 are electrically connected, so that the driving chip 131 drives the light emitting chip 121 to work. Preferably, the front pad 120 and the back pad 130 are electrically connected through the metal via 122. The metal via 122 is well known to those skilled in the art in the field of circuit boards. After punching holes in the circuit board, the inner wall of the via connecting the front and back sides is metalized to connect the circuits on both sides of the circuit board. No further description is given.

[0072] The diameter of the area occupied by the light-emitting unit 12 is 0.5-2.5 mm; the center distance between the light-emitting units 12 is 2-8 mm. The driver chip 131 is an unpackaged bare chip, and the area of ​​the driver chip is less than or equal to 1.2 mm. 2 The advantage of using the driver chip 131 as a bare chip is that it saves installation space. If the driver chip 131 is not a bare chip but is packaged in a shell, the size will become very large and cannot meet the installation requirements of the light-transmitting substrate under the condition of small pitch. The general driver chip 131 package size is greater than 4mm x 4mm, and the small-size package can be as small as 2mm x 4mm, but it is still difficult to install in a transparent display module with a transparent effect and a pixel pitch less than 4mm x 4mm. By using the light-emitting unit 12 in this example, the size of each light-emitting pixel can be greatly reduced, and the gap between light-emitting pixels can be reduced.

[0073] In this example, if Figure 7 , Fig. 9 , Fig.13 As shown in the figure, the light-emitting chip 121 on the light-emitting unit 12 is upright, and the so-called upright is well known to those skilled in the art. The light-emitting surface of the light-emitting chip 121 faces upward, and pins are arranged on the light-emitting surface, and the pins are electrically connected to the front pad 120 by bonding wires. The specific method of binding and connecting the light-emitting chip 121 is known to the public and will not be repeated here.

[0074] and / or, if Figure 8 , Fig.10 , Fig.14 As shown in FIG. 1 , the driver chip 131 is upright in this example, and pins are arranged on the driver chip 131 , which are electrically connected to the back pad 130 by bonding wires. The specific method of bonding the driver chip 131 is known to the public and will not be described in detail.

[0075] Of course, generally the driving unit 13 is provided with power and signals through a driving circuit formed on the back side of the transparent substrate 1 or the transparent back plate 3. How to provide power and signals to the driving unit 13 is not the focus of this application and can be implemented in a manner known to those skilled in the art and will not be described in detail.

[0076] The transparent display module disclosed in the present application sets the light-emitting chip 121 and the driving chip 131 in the original LED lamp bead on the front and back sides of the light-transmitting substrate 1 respectively, and electrically connects them by means of metal vias 122. In this way, the light-emitting unit 12 only includes the light-emitting chip 121, and the driving chip 131 is independently set on the back side of the light-transmitting substrate 1, which can effectively reduce the area occupied by the light-emitting unit 12 and greatly improve its light transmittance and resolution. At the same time, when the driving chip and the light-emitting chip are packaged together in the same lamp cup, it is easy to produce defects due to the large number of binding wires. The present application sets the driving chip and the light-emitting chip on the front and back sides separately, which can check the binding quality of the light-emitting chip and the driving chip in steps, making it easier to detect and repair.

[0077] The metal vias 122 are directly connected to the corresponding pads, which also directly reduces the space occupied by wiring on the circuit board.

[0078] The light-transmitting hole on the light-transmitting substrate 1 is the first light-transmitting hole 11, and the material of the light-transmitting cover plate 2 can be a non-transparent structure as a whole, and a light-transmitting hole is set on it to transmit light, or the light-transmitting cover plate 2 can also be a transparent material as a whole. Figure 5 As shown, as an implementation mode, the light-transmitting cover plate 2 in this example is a non-transparent plate, on which a second light-transmitting hole 21 and a light-emitting through hole 22 are provided; wherein the second light-transmitting hole 21 and the first light-transmitting hole 11 are arranged in a one-to-one correspondence; the light-emitting through hole 22 and the light-emitting unit 12 are arranged in a one-to-one correspondence; so that each of the light-emitting units 12 is located in the light-emitting through hole 22. The light-emitting through hole 22 is used to accommodate the light-emitting unit 12, so the number of the light-emitting through hole 22 is the same as that of the light-emitting unit 12.

[0079] The light-transmitting back plate 3 is used to cover the back side of the light-transmitting substrate 1 and play a protective role. It can be a transparent light-transmitting back plate 3 or a non-transparent light-transmitting back plate 3. As an embodiment, Figure 6 As shown, the light-transmitting back plate 3 is a non-transparent plate, on which a third light-transmitting hole 31 is provided; the third light-transmitting hole 31 is arranged in a one-to-one correspondence with the first light-transmitting hole 11; similarly, it can also be arranged in a one-to-one correspondence with the second light-transmitting hole 21. In order to minimize the impact on the transparency of the light-transmitting substrate 1, the second light-transmitting hole 21 and the third light-transmitting hole 31 should be larger than or equal to the first light-transmitting hole 11.

[0080] As a preferred embodiment, the transparent cover plate 2 is a transparent cover plate formed by curing a transparent potting glue. The material of the transparent potting glue is generally epoxy resin, and the thickness of the transparent cover plate 2 formed after curing is generally 300μm-600μm; on this basis, in order to prevent the chip of the light-emitting unit 12 from scattering through the transparent cover plate, a non-light-transmitting ink layer is generally provided on the transparent cover plate 2, and the non-light-transmitting ink layer is set to correspond to the non-light-transmitting area of ​​the light-transmitting substrate 1; so that the light-emitting unit 12 cannot scatter light outward through the non-light-transmitting ink layer.

[0081] As another way, Figure 4 , Figure 6 As shown, the transparent back plate 3 is provided with a driving unit hole 32, and the driving units 13 on the reverse side of the transparent substrate 1 are arranged in the driving unit holes 32 in a one-to-one correspondence. The driving unit holes 32 are filled with epoxy resin, which protects the driving units 13 after curing. As another embodiment, Fig.10 As shown, the light-transmitting backplane 3 is an encapsulation layer formed by curing the potting glue, which encapsulates the driving chip 131 in the light-transmitting backplane 3. The potting glue is generally dark or black, and the material is generally epoxy resin. The projected geometric shape of the light-transmitting backplane 3 formed by curing the potting glue is consistent with the projected geometric shape of the light-transmitting substrate 1, and the thickness is 300μm-500μm. In this example, the thickness of the final transparent display module after encapsulation is 0.8mm-2.8mm. The thickness can be made very thin. To reduce the weight of the transparent display module.

[0082] like Fig. 9 , Fig.10 As shown, the light-emitting unit 12 and the driving unit 13 on the transparent display module are partially enlarged and displayed. In this example, as an implementation method, a light-emitting through hole 22 is provided on the transparent cover plate 2 on the front side of the transparent substrate 1, and the light-emitting unit 12 is arranged in the light-emitting through hole 22. The transparent back plate 3 on the back side of the transparent substrate 1 is encapsulated by integrally potting with transparent material.

[0083] like Fig.15 As shown, as a preferred method, a light-transmitting glue 221 is potted in the light-emitting through hole to transparently encapsulate the light-emitting unit 12 in the light-emitting through hole; the light-emitting unit 12 and the light-transmitting glue 221 form an LED package accommodated in the light-emitting through hole. The light-transmitting glue 221 is potted for further protection, and the encapsulated transparent display module 100 has better airtightness and better waterproof and moisture resistance. The light-emitting unit 12 in the light-emitting through hole 22 is further protected.

[0084] like Fig.16As shown, in addition to the above-mentioned upright mounting of the light emitting chip 121, the light emitting chip 121 on the light emitting unit 12 can also be flipped, and at least part of the pins of the light emitting chip 121 are directly soldered to the front pad 120. The so-called flip-chip is well known to the public, and the light emitting surface of the light emitting chip 121 faces upward, and the pins thereon are arranged on the opposite side of the light emitting surface, and the pins are directly soldered to the front pad 120 without the need for additional bonding wires.

[0085] As a preferred method, Fig. 9 , Fig.13 , Fig.16 As shown in , the red light emitting chip, the green light emitting chip and the blue light emitting chip are arranged along the center line of the front welding area, and are centrally linearly symmetrical. The requirements for RGB mixed light quality in high-end display application scenarios can be met. There is no color difference between left and right viewing angles when watching.

[0086] The transparent display module 100 disclosed in this example arranges the light-emitting unit 12 and the driving unit 13 in the original LED lamp bead on the front and back sides of the transparent substrate 1 respectively and electrically connects them. Thus, the light-emitting unit 12 only includes the light-emitting chip 121, and the driving chip 131 is independently arranged on the back side of the transparent substrate 1, and the driving chip 131 adopts an area less than or equal to 1.2mm 2 The bare chip can effectively reduce the area of ​​the light-emitting unit 12 and greatly improve its transmittance and resolution.

[0087] Example 2

[0088] On the other hand, the present application provides a transparent LED display screen 1000, comprising the transparent display module 100 in the above-mentioned embodiment 1. A large transparent LED display screen is formed by assembling a plurality of transparent display modules 100.

[0089] As a preferred method, Fig.18 As shown, it also includes a transparent motherboard 200, and several of the transparent display modules 100 are installed on the transparent motherboard 200. The transparent motherboard 200 is provided with a transmission circuit (not shown in the figure) for providing power and signals to the transparent display module 100; the transparent motherboard 200 and the transparent display module 100 present a transparent display effect as a whole. The transparent display module 100 is also provided with an electrical connection structure (not shown in the figure) for electrically connecting with the transmission circuit on the transparent motherboard 200; so as to electrically connect each of the transparent display modules 100 to the transparent motherboard 200, and provide power and control signals for the light-emitting units on the transparent display module 100.

[0090] The transparent LED display screen disclosed in this example includes a transparent display module, in which the light-emitting unit 12 and the driving unit 13 in the original LED lamp beads are respectively arranged on the front and back sides of the transparent substrate 1, and are electrically connected by means of metal vias 122. In this way, the light-emitting unit 12 only includes the light-emitting chip 121, and the driving chip 131 is independently arranged on the back side of the transparent substrate 1, and the driving chip 131 adopts an area less than or equal to 1.2mm 2 The bare chip can effectively reduce the area of ​​the light-emitting unit 12 and greatly improve its transmittance and resolution.

[0091] Example 3

[0092] This example provides a new transparent display module 100, the internal structure of which is mostly the same as the transparent display module 100 in Example 1, and the only difference is the following: 1. It does not contain a transparent cover plate 2, and its light-emitting unit is not an unpackaged light-emitting chip; but a packaged LED lamp bead 12a without a driving chip. Figure 18-Figure 24 The light emitting chip 121 is packaged to form an LED lamp bead 12a without a driver chip 131; and the LED lamp bead 12a is installed on the front welding area. As for the design of the light-transmitting substrate 1, the light-transmitting backplane 3, the driver chip, the light-transmitting hole and other structures, the selection of materials, the way of metal via connection, etc. are the same, which can be directly cited in Example 1, so only a brief description is given in this example without repeated description.

[0093] like Fig.18 The transparent display module 100 is a front perspective view and Fig. 20 As shown in the front top view, the transparent display module 100 includes a transparent substrate 1 and a transparent backplane 3, wherein the LED lamp bead 12a without the driving chip 131 is installed on the non-transparent area on the front side of the transparent substrate 1 of the transparent display module 100, specifically, at the position formed between each light-transmitting hole, on which a front welding area for installing the LED lamp bead 12a is arranged, and the LED lamp bead 12a is installed in the manner described in Example 1, and is welded on the front welding area. Specifically, as Fig.21 As shown in the enlarged schematic diagram; the LED lamp bead 12a is generally provided with 4 pins, namely VCC pin 12a1, red pin 12a2, green pin 12a3 and blue pin 12a4, which are respectively soldered to the corresponding front pads 120 on the front welding area; the corresponding pads generally include the corresponding front VCC pad, front red pad, front green pad and front blue pad, etc.

[0094] The LED lamp bead 12a can be a TOP type lamp bead or a CHIP type lamp bead, which is well known to those skilled in the art and will not be described in detail.

[0095] like Fig.19 The back perspective view of the transparent display module 100 is shown in FIG. Fig. 22 As shown in the top view of the back side, the driver chip 131 is installed on the back side of the transparent substrate 1 of the transparent display module 100, and is also installed in the non-transparent area, specifically at the position formed between each light-transmitting hole, on which a reverse soldering area for installing the driver chip 131 is arranged; Fig.23 As shown in the enlarged schematic diagram, the back pads 130 corresponding to the pins on the driver chip are provided on the back pad area, and the back pads 130 generally include a GND pad, a VCC pad, a signal input (DI) pad, a signal output (DO) pad, a back red pad, a back green pad, a back red pad, etc. The front pads and the back pads are connected one by one through metal vias 122, for example, the front red pad corresponds to the back red pad, the front green pad corresponds to the back green pad, the front blue pad corresponds to the back blue pad, etc.

[0096] like Fig.24 As shown, the LED lamp bead 12a which contains the light-emitting chip 121 of three colors of RGB but does not contain the driver chip 131 is packaged, and the pins are welded on the corresponding front pad 120 of the transparent substrate 1, and it is connected to the back pad 130 on the back side of the transparent substrate 1 through the corresponding metal via 122, and the driver chip 131 is installed on the back pad 130 by binding connection. Among them, the back side of the transparent substrate 1 is provided with a driver unit hole 32, and the driver chips 131 on the back side of the transparent substrate 1 are arranged in the driver unit hole 32 in a one-to-one correspondence.

[0097] In this embodiment, the light-emitting unit 12 on the front side is packaged with a light-emitting chip 121 to form an LED lamp bead 12a without a driving chip 131. In addition to the beneficial effects of Example 1, it also has the advantages of simple structure, higher integration, easier implementation in process, and further cost reduction.

[0098] Example 4

[0099] This example is similar to Embodiment 2. In another aspect, the present application provides a transparent LED display screen 1000, which includes the transparent display module 100 in the above Embodiment 3. A large transparent LED display screen is formed by assembling a plurality of transparent display modules 100.

[0100] As a preferred method, Fig.25As shown, it also includes a transparent motherboard 200, and several of the transparent display modules 100 are installed on the transparent motherboard 200. The transparent motherboard 200 is provided with a transmission circuit (not shown in the figure) for providing power and signals to the transparent display module 100; the transparent motherboard 200 and the transparent display module 100 present a transparent display effect as a whole. The transparent display module 100 is also provided with an electrical connection structure (not shown in the figure) for electrically connecting with the transmission circuit on the transparent motherboard 200; so as to electrically connect each of the transparent display modules 100 to the transparent motherboard 200, and provide power and control signals for the light-emitting units on the transparent display module 100.

[0101] The transparent LED display screen disclosed in the present application includes a transparent display module, wherein the light-emitting unit 12 and the driving unit 13 in the original LED lamp beads are respectively arranged on the front and back sides of the transparent substrate 1, so that the light-emitting unit 12 only includes the light-emitting chip 121, and the driving chip 131 is independently arranged on the back side of the transparent substrate 1, and the driving chip 131 adopts an area less than or equal to 1.2mm 2 The bare chip can effectively reduce the area of ​​the light-emitting unit 12, greatly improving its light transmittance and resolution. At the same time, the light-emitting unit 12 on the front side uses the light-emitting chip 121 to form an LED lamp bead 12a without a driver chip 131 after packaging, which has a simple structure, a higher degree of integration, and is easier to implement in terms of process, which can further reduce costs.

[0102] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A transparent display module, characterized in that: It comprises a light-transmitting substrate and a light-transmitting backplane; the light-transmitting backplane is arranged on the reverse side of the light-transmitting substrate; The light-transmitting substrate is provided with a light-transmitting hole, and the area outside the light-transmitting hole is a non-light-transmitting area, so that the light-transmitting substrate has a transparent effect; the front surface of the light-transmitting substrate is provided with a light-emitting unit array, and the light-emitting unit includes a light-emitting chip; the back surface of the light-transmitting substrate is provided with a driving circuit, and the driving circuit includes driving units arranged in an array, and the driving unit includes a driving chip; the driving chip is a bare chip, and the area of ​​the driving chip is less than or equal to 1.2 mm²; The light emitting unit and the driving unit are electrically connected.

2. The transparent display module according to claim 1, characterized in that: It also includes a light-transmitting cover plate; the light-transmitting cover plate is arranged on the front side of the light-transmitting substrate, and the light-transmitting substrate is sandwiched between the light-transmitting cover plate and the light-transmitting back plate.

3. The transparent display module according to claim 2, characterized in that: The light-emitting unit comprises a front soldering area and an unpackaged light-emitting chip mounted on the front soldering area; a plurality of front soldering pads are arranged on the front soldering area; The driving unit comprises a back side welding area and a driving chip mounted on the back side welding area, and a plurality of back side welding pads are arranged on the back side welding area; The front pad and the back pad are electrically connected, so that the driving chip drives the light emitting chip to work.

4. The transparent display module according to claim 3, characterized in that: The front pad and the back pad are electrically connected through a metal via.

5. The transparent display module according to claim 2, characterized in that: The light-transmitting hole on the light-transmitting substrate is a first light-transmitting hole, and the light-transmitting cover plate is a non-transparent plate, on which a second light-transmitting hole and a light-emitting through hole are provided; wherein the second light-transmitting hole and the first light-transmitting hole are arranged in a one-to-one correspondence; the light-emitting through hole and the light-emitting unit are arranged in a one-to-one correspondence; so that each of the light-emitting units is located in the light-emitting through hole.

6. The transparent display module according to claim 5, characterized in that: The light-transmitting back plate is a non-transparent plate, and a third light-transmitting hole is arranged on the back plate; the third light-transmitting hole is arranged in a one-to-one correspondence with the first light-transmitting hole.

7. The transparent display module according to claim 2, characterized in that: in, The light-transmitting cover plate is a transparent cover plate formed by curing a transparent potting glue.

8. The transparent display module according to claim 7, characterized in that: in, A non-light-transmitting ink layer is disposed on the light-transmitting cover plate, and the non-light-transmitting ink layer is arranged to correspond to the non-light-transmitting area of ​​the light-transmitting substrate, so that the light-emitting unit cannot scatter light outward through the non-light-transmitting ink layer.

9. The transparent display module according to claim 1, characterized in that: The light-transmitting backplane is a packaging layer formed by curing the potting glue, which packages the driving chip in the light-transmitting backplane.

10. The transparent display module according to claim 3, characterized in that: The light-emitting chip on the light-emitting unit is upright, and the pins on the light-emitting chip are electrically connected to the front pad by bonding wires; And / or, the driver chip is front mounted and electrically connected to the back pad by bonding wires.

11. The transparent display module according to claim 3, characterized in that: At least one light-emitting chip on the light-emitting unit is flipped, and pins of the flipped light-emitting chip are directly soldered to the front pad.

12. The transparent display module according to claim 5, characterized in that: The light-emitting through hole is filled with a light-transmitting glue to transparently encapsulate the light-emitting unit in the light-emitting through hole; the light-emitting unit and the light-transmitting glue form an LED package accommodated in the light-emitting through hole.

13. The transparent display module according to claim 6, characterized in that: The light-transmitting back plate is provided with a driving unit hole, and the driving units on the reverse side of the light-transmitting substrate are arranged in the driving unit holes in a one-to-one correspondence.

14. The transparent display module according to claim 1, characterized in that: The diameter of the light-emitting unit is 0.5-2.5 mm; the center distance between the light-emitting units is 2-8 mm.

15. The transparent display module according to claim 3, characterized in that: The light emitting chip comprises a red light emitting chip, a green light emitting chip and a blue light emitting chip; the red light emitting chip, the green light emitting chip and the blue light emitting chip are arranged along the center line of the front welding area and are centrally linearly symmetrical.

16. The transparent display module according to claim 1, characterized in that: The thickness of the transparent display module is 0.8 mm-2.8 mm.

17. The transparent display module according to claim 1, characterized in that: The light-emitting unit comprises a front welding area and an LED lamp bead without a driving chip formed by packaging a light-emitting chip; a plurality of front welding pads are arranged on the front welding area; and the LED lamp bead is mounted on the front welding pads.

18. The transparent display module according to claim 17, characterized in that: The LED lamp bead is provided with a plurality of pins, and the pins are welded to the front soldering pads of the front soldering area.

19. A transparent LED display screen, characterized in that: A transparent display module comprising any one of claims 1-18.

20. The transparent LED display screen according to claim 19, characterized in that: It also includes a transparent motherboard, and a plurality of transparent display modules are mounted on the transparent motherboard.

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