Silicon wafer transfer equipment

Abstract

The utility model is suitable for the technical field of silicon wafer circulation processing, and provides silicon wafer circulation equipment, in the silicon wafer circulation equipment, a feeding end and a discharging end are arranged on a first side of a rack in parallel along a first direction, and a feeding conveying assembly and a discharging conveying assembly are also arranged in parallel in the same way. The feeding conveying assembly conveys silicon wafers into the functional device, the silicon wafers pass through the functional device and then are translated and transferred to the discharging conveying assembly through the mechanical arm module in the first direction, and the discharging conveying assembly inserts the silicon wafers into the discharging basket in the direction opposite to the conveying direction of the feeding conveying assembly. Thus, the silicon wafer is circulated in a rotary mode in the circulation process, that is, after the silicon wafer passes through the functional device, the manipulator module only translates the silicon wafer, and then the silicon wafer is discharged in the reverse direction in the rotary mode through the discharging conveying assembly. Therefore, the insertion direction of the silicon wafers in the feeding basket is consistent with the insertion direction of the silicon wafers in the discharging basket.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer circulation processing, in particular to a silicon wafer circulation device. Background Art

[0002] In the field of solar cell technology, in order to detect the quality of silicon wafers or perform process processing such as welding on silicon wafers, it is usually necessary to circulate the silicon wafers through equipment for inspection, coating or welding. During the circulation process, silicon wafers usually come out of the feed basket and are transported to the outlet basket after inspection or process processing.

[0003] In the related art, the feed port and the discharge port of the silicon wafer are usually set at opposite ends of the entire device. During the circulation of the silicon wafer, the silicon wafer enters from one side and flows out from the other side after being detected or processed (i.e., direct-out flow). Such a direct-out flow method will cause the insertion direction of the silicon wafer relative to the flower basket at the feed port to be different from the insertion direction of the silicon wafer relative to the flower basket at the discharge port, that is, in the feed flower basket, one end of the silicon wafer faces the outlet of the flower basket, and in the discharge flower basket, the same end of the silicon wafer faces away from the outlet of the flower basket. In such a case, when performing subsequent processing, the direction needs to be reversed before entering the device for use, resulting in a more complicated process. At the same time, the use of such a direct-out flow method will also cause the structure of the entire device to be more dispersed. Utility Model Content

[0004] The utility model provides a silicon wafer circulation device, aiming to solve the technical problem in the prior art equipment that the insertion direction of the silicon wafer relative to the flower basket at the feed inlet is different from the insertion direction of the silicon wafer relative to the flower basket at the discharge outlet, which leads to a technical problem that the subsequent process is more complicated.

[0005] The utility model is implemented in this way. The silicon wafer transfer equipment of the utility model embodiment includes:

[0006] A rack, wherein a first side of the rack is provided with a feed end and a discharge end in parallel along a first direction, the feed end is used to place a feed basket, the discharge end is used to place a discharge basket, and the feed basket and the discharge basket are both used to store silicon wafers;

[0007] A robot module disposed on the frame, wherein the robot module is located on a second side of the frame, and the first side is opposite to the second side;

[0008] An installation station for installing a functional device is provided on the frame, and the installation station is located between the feed end and the manipulator module;

[0009] A feed conveying assembly is arranged on the frame, the feed conveying assembly is located between the manipulator module and the feed end, the feed end, the feed conveying assembly and the manipulator module are arranged in sequence along a second direction, the second direction is perpendicular to the first direction, and the feed conveying assembly is used to convey the silicon wafers in the feed basket from the feed end to the functional device and the manipulator module in sequence along the second direction;

[0010] A discharging conveying assembly is arranged on the frame, and the discharging conveying assembly is located between the robot module and the discharging end. The discharging conveying assembly and the feeding conveying assembly are arranged side by side along the first direction. The robot module is used to suck silicon wafers from the feeding conveying assembly and translate the silicon wafers along the first direction to the discharging conveying assembly. The discharging conveying assembly is used to convey the silicon wafers to the discharging end in a direction opposite to the second direction, so that the insertion direction of the silicon wafers in the discharging basket is consistent with the insertion direction of the silicon wafers in the feeding basket.

[0011] Furthermore, the silicon wafer circulation equipment also includes a feed lifting mechanism and a discharging lifting mechanism, the feed lifting mechanism is used to drive the feed basket to move up and down along a third direction, the third direction, the first direction and the second direction are perpendicular to each other, and the discharging lifting mechanism is used to drive the discharging basket to move up and down along the third direction.

[0012] Furthermore, the feed conveying assembly includes a material taking mechanism and a feed conveying mechanism;

[0013] The material taking mechanism is located between the feeding conveying mechanism and the feeding end, and is used to take out the silicon wafers in the feeding basket and convey them to the feeding conveying mechanism;

[0014] The feed conveying mechanism is located between the material taking mechanism and the robot module, and is used to transport the silicon wafers to the functional device and the robot module in sequence.

[0015] Furthermore, the material taking mechanism includes a first seat body, a material taking plate, a material taking drive mechanism, a first drive motor, a first wheel train set and a material taking conveyor belt;

[0016] The first seat body is mounted on the frame, the material taking plate is slidably connected to the first seat body, the first wheel train set is arranged on the first seat body, the material taking plate is provided with a first pulley, and the material taking conveying belt is wound around the first wheel train set and the first pulley;

[0017] When picking up materials, the first driving motor is used to drive the picking up conveyor belt to move through the first wheel system group, and the picking up driving mechanism is used to drive the picking up plate to slide in the direction opposite to the second direction, so that the picking up plate extends into the feeding basket, and the picking up plate is used to synchronously drive the picking up conveyor belt through the first pulley to extend into the feeding basket, thereby conveying the silicon wafers out of the feeding basket through the picking up conveyor belt and conveying the silicon wafers to the feeding conveying mechanism.

[0018] Furthermore, the silicon wafer circulation equipment further comprises a feed deviation correction mechanism, and the feed deviation correction mechanism is located between the feed end and the installation station;

[0019] The feed deviation correction mechanism is used to guide the silicon wafers during the process of the silicon wafers being transported by the material taking mechanism and / or the feed conveying mechanism.

[0020] Furthermore, the feed deviation correction mechanism includes a first mounting seat, two first roller assemblies spaced apart on both sides of the first mounting seat, a first motor and a first synchronous drive mechanism;

[0021] The first motor is mounted on the first mounting seat, the first synchronous drive mechanism is mounted on the first mounting seat and connected to the first motor, the two first roller assemblies are connected to the first synchronous drive mechanism, the first motor can drive the two first roller assemblies to move closer to or away from each other through the first synchronous drive mechanism, and the material picking mechanism and / or the feed conveying mechanism can drive the silicon wafer to flow through the area between the two first roller assemblies.

[0022] Furthermore, the first synchronous driving mechanism includes a first driving wheel, a first driven wheel and a first synchronous belt;

[0023] The first driving wheel and the first driven wheel are respectively arranged on two sides of the first mounting seat, and the first synchronous belt is wound around the first driving wheel and the first driven wheel;

[0024] The first motor is connected to the first driving wheel, one of the two first roller assemblies is fixedly connected to a portion of the first synchronous belt located on one side of the first driving wheel and the first driven wheel, and the other is fixedly connected to a portion of the first synchronous belt located on the other side of the first driving wheel and the first driven wheel, and the first motor is used to drive the first driving wheel to rotate to drive the first synchronous belt to move, thereby driving the two first roller assemblies to move closer to or away from each other.

[0025] Furthermore, the silicon wafer circulation equipment also includes a feed temporary storage mechanism, which is located between the material picking mechanism and the feed conveying mechanism. The feed temporary storage mechanism is used to store the silicon wafers on the material picking mechanism, and the material picking mechanism can transport the silicon wafers on the feed temporary storage mechanism to the feed conveying mechanism.

[0026] Furthermore, the feed temporary storage mechanism includes a feed buffer device and a first lifting mechanism, the first lifting mechanism is installed on the frame, the first lifting mechanism is used to drive the feed buffer device to move up and down along a third direction, the third direction, the first direction and the second direction are perpendicular to each other, the feed buffer device has a plurality of feed temporary storage units along the third direction, and each of the feed temporary storage units corresponds to storing a silicon wafer.

[0027] Furthermore, the discharging conveying assembly includes a discharging mechanism and a discharging conveying mechanism;

[0028] The unloading mechanism is located between the unloading conveying mechanism and the unloading end, the robot module is used to suck the silicon wafer and translate the silicon wafer along the first direction to the unloading conveying mechanism, the unloading conveying mechanism is used to convey the silicon wafer to the unloading mechanism along the direction opposite to the second direction, and the unloading mechanism is used to insert the silicon wafer into the unloading basket.

[0029] Furthermore, the material discharge mechanism includes a second seat body, a material discharge plate, a material discharge drive mechanism, a second drive motor, a second wheel train set and a material discharge conveyor belt;

[0030] The second seat body is mounted on the frame, the unloading plate is slidably connected to the second seat body, the second wheel train set is arranged on the second seat body, the unloading plate is provided with a second pulley, and the unloading conveying belt is wound around the second wheel train set and the second pulley;

[0031] During unloading, the second driving motor is used to drive the unloading conveyor belt to move through the second wheel system, and the unloading driving mechanism is used to drive the unloading plate to slide in the direction opposite to the second direction, so that the unloading plate extends into the unloading basket, and the unloading plate is used to synchronously drive the unloading conveyor belt through the second pulley to extend into the unloading basket, thereby inserting the silicon wafer into the unloading basket through the unloading conveyor belt.

[0032] Furthermore, the silicon wafer circulation equipment also includes a discharge correction mechanism, which is located between the robot module and the discharge end, and is used to guide the silicon wafers during the process of the discharge conveying mechanism and / or the discharge mechanism transporting the silicon wafers.

[0033] Furthermore, the material discharging deviation correction mechanism includes a second mounting seat, two second roller assemblies spaced apart on both sides of the second mounting seat, a second motor and a second synchronous driving mechanism;

[0034] The second motor is mounted on the second mounting seat, the second synchronous drive mechanism is mounted on the second mounting seat and connected to the second motor, the two second roller assemblies are connected to the second synchronous drive mechanism, the second motor can drive the two second roller assemblies to approach each other or move away from each other through the second synchronous drive mechanism, and the discharging conveying mechanism and / or the discharging mechanism can drive the silicon wafer to flow through the area between the two second roller assemblies.

[0035] Furthermore, the second synchronous driving mechanism includes a second driving wheel, a second driven wheel and a second synchronous belt;

[0036] The second driving wheel and the second driven wheel are respectively arranged on two sides of the second mounting seat, and the second synchronous belt is wound around the second driving wheel and the second driven wheel;

[0037] The second motor is connected to the second driving wheel, one of the two second roller assemblies is fixedly connected to a portion of the second synchronous belt located on one side of the second driving wheel and the second driven wheel, and the other is fixedly connected to a portion of the second synchronous belt located on the other side of the second driving wheel and the second driven wheel, and the second motor is used to drive the second driving wheel to rotate to drive the second synchronous belt to move, thereby driving the two second roller assemblies to move closer to or away from each other.

[0038] Furthermore, the silicon wafer circulation equipment also includes a discharge temporary storage mechanism, which is located between the discharge mechanism and the discharge conveying mechanism, and is used to store the silicon wafers taken off the discharge conveying mechanism by the discharge mechanism, and the discharge mechanism can insert the silicon wafers on the discharge temporary storage mechanism into the discharge basket.

[0039] Furthermore, the material discharging temporary storage mechanism includes a material discharging buffer device and a second lifting mechanism, the second lifting mechanism is installed on the frame, and the second lifting mechanism is used to drive the material discharging buffer device to move up and down along a third direction, the third direction, the first direction and the second direction are perpendicular to each other, and the material discharging buffer device has a plurality of material discharging temporary storage units along the third direction, and each of the material discharging temporary storage units corresponds to storing a silicon wafer.

[0040] Furthermore, the robot module includes:

[0041] A mounting plate, the mounting plate being mounted on the rack;

[0042] A suction cup component, the suction cup component is movably mounted on the mounting plate, and the suction cup component is used to absorb the silicon wafer;

[0043] A linear drive module is installed on the mounting plate, and the linear drive module is used to drive the suction cup component to translate relative to the mounting plate along the first direction and along a direction opposite to the first direction.

[0044] Furthermore, the robot module includes:

[0045] Fixed seat;

[0046] a first suction cup component and a second suction cup component movably connected to the fixing seat, the first suction cup component and the second suction cup component are arranged at intervals on both sides of the fixing seat along the first direction, and the first suction cup component and the second suction cup component do not interfere with each other in a third direction, the third direction, the first direction and the second direction are perpendicular to each other, and the first suction cup component and the second suction cup component are both used for adsorbing silicon wafers; and

[0047] A third synchronous driving mechanism, wherein the third synchronous driving mechanism connects the first suction cup component and the second suction cup component, and is used for driving one of the first suction cup component and the second suction cup component to translate along the first direction while driving the other of the first suction cup component and the second suction cup component to translate along a direction opposite to the first direction.

[0048] Furthermore, the third synchronous driving mechanism includes a third motor, a third driving wheel, a third driven wheel and a third synchronous belt;

[0049] The third driving wheel and the third driven wheel are respectively arranged on both sides of the fixing seat, the third synchronous belt is wound around the third driving wheel and the third driven wheel, and the third motor is connected to the third driving wheel;

[0050] Wherein, the first suction cup component is fixedly connected to a portion of the third synchronous belt located on one side of the third driving wheel and the third driven wheel, the second suction cup component is fixedly connected to a portion of the third synchronous belt located on the other side of the third driving wheel and the third driven wheel, and the third motor is used to drive the third driving wheel to rotate to drive the third synchronous belt to move, thereby driving one of the first suction cup component and the second suction cup component to translate along the first direction while driving the other of the first suction cup component and the second suction cup component to translate along a direction opposite to the first direction.

[0051] In the silicon wafer circulation equipment in the embodiment of the utility model, the feed end and the discharge end are arranged side by side along the first direction on the first side of the frame, and the feed conveying assembly and the discharge conveying assembly are also arranged side by side in the same way. When feeding, the feed conveying assembly conveys the silicon wafer to the functional device along the second direction perpendicular to the first direction. After passing through the functional device, the silicon wafer is translated along the first direction to the discharge conveying assembly by the robot module. The discharge conveying assembly conveys the silicon wafer in a direction opposite to the second direction and inserts the silicon wafer into the discharge basket. Thus, in the silicon wafer circulation equipment, the silicon wafer is circulated in a rotary manner during the circulation process, that is, after the silicon wafer passes through the functional device, the manipulator module only performs a translation operation on the silicon wafer along the first direction, and then discharges the silicon wafer in the opposite direction in a rotary manner through the discharge conveying assembly, so that the insertion direction of the silicon wafer in the feed basket is consistent with the insertion direction of the silicon wafer in the discharge basket, that is, the end of the silicon wafer in the feed basket facing the basket outlet and the end of the silicon wafer in the discharge basket facing the discharge basket inlet are the same end, so that when performing subsequent processes, the discharge basket can be directly transported to the next process equipment for processing without turning the direction of the silicon wafer, saving process steps. At the same time, by adopting a rotary circulation method, the feed end and the discharge end are arranged side by side on the first side of the frame along the first direction, and the feed conveying assembly and the discharge conveying assembly are also arranged side by side along the first direction, which can make the structure of the entire device more compact.

[0052] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a structural schematic diagram of a silicon wafer circulation device provided by an embodiment of the utility model;

[0054] Figure 2 It is a schematic diagram of the component orientation and circulation process of the silicon wafer circulation equipment provided by the embodiment of the utility model;

[0055] Figure 3 It is a structural schematic diagram of the feeding basket lifting mechanism provided by an embodiment of the utility model;

[0056] Figure 4 It is a structural schematic diagram of the feeding flower basket conveying mechanism provided by an embodiment of the utility model;

[0057] Figure 5 It is another component orientation and flow process diagram of the silicon wafer flow device provided by the embodiment of the utility model;

[0058] Figure 6 It is a structural schematic diagram of a material taking mechanism and a material discharging mechanism provided by an embodiment of the utility model;

[0059] Figure 7 It is a structural schematic diagram of a feed deviation correction mechanism and a discharge deviation correction mechanism provided by an embodiment of the utility model;

[0060] Figure 8 It is a structural schematic diagram of a temporary storage mechanism for feeding materials and a temporary storage mechanism for discharging materials provided in an embodiment of the utility model;

[0061] Fig. 9 yes Figure 1 A schematic diagram of the structure of the robot module of the silicon wafer transfer equipment;

[0062] Fig.10 It is another structural schematic diagram of the silicon wafer circulation equipment provided by the embodiment of the utility model;

[0063] Fig.11 yes Fig.10 Schematic diagram of the structure of the robot module of the silicon wafer transfer equipment.

[0064] Description of main component symbols:

[0065] Wafer transfer equipment 100, rack 10, feed end 11, discharge end 12, installation station 13, feed conveying assembly 20, pick-up mechanism 21, feed conveying mechanism 22, manipulator module 30, discharge conveying assembly 40, discharge mechanism 41, discharge conveying mechanism 42, feed lifting mechanism 50, discharge lifting mechanism 60, feed deviation correction mechanism 70, discharge deviation correction mechanism 80, feed temporary storage mechanism 90, discharge temporary storage mechanism 110;

[0066] Functional device 200. DETAILED DESCRIPTION

[0067] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model. In addition, it should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0068] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "top", "bottom", "lateral", "longitudinal", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0070] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0071] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0072] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use scenarios of other materials.

[0073] Embodiment 1

[0074] See also Figure 1 and Figure 2 The silicon wafer transfer equipment 100 in the embodiment of the utility model may include a frame 10, a feed conveying assembly 20, a robot module 30 and a discharge conveying assembly 40.

[0075] like Figure 1 As shown, a first side 101 of the frame 10 is provided with a feed end 11 and a discharge end 12 in parallel along a first direction. The feed end 11 is used for placing a feed basket (not shown), and the discharge end 12 is used for placing a discharge basket (not shown). Both the feed basket and the discharge basket are used for storing silicon wafers.

[0076] The robot module 30 is also disposed on the frame 10, and the robot module 30 is located at the second side 102 of the frame 10, and the second side 102 is opposite to the first side 101 in the second direction. The frame 10 is also provided with an installation station 13 for installing the functional device 200, and the installation station 13 is located between the feed end 11 and the robot module 30.

[0077] In the present invention, the silicon wafer circulation equipment 100 can realize different functions by installing different functional devices 200. For example, in some embodiments, the functional device 200 can be a photoluminescence (PL) detection device, which can perform PL detection on the silicon wafer so as to detect the performance of the silicon wafer such as hidden cracks and impurities. For another example, in some embodiments, the functional device 200 can also be a welding device, which can perform welding processing on the silicon wafer. For another example, in some other embodiments, the functional device 200 can also be an electroluminescence (EL), a coating device, a drying device and other components, which are not specifically limited here.

[0078] The "silicon wafer" referred to in the present invention can be understood as a bare silicon wafer, or as a silicon wafer processed by one or more processes (for example, diffusion, coating, electrode printing, etc., which are not specifically limited here).

[0079] See also Figure 1 In the present invention, the feed conveyor assembly 20 and the discharge conveyor assembly 40 are both arranged on the frame 10, and the feed conveyor assembly 20 is located between the manipulator module 30 and the feed end 11. The feed end 11, the feed conveyor assembly 20 and the manipulator module 30 are arranged in sequence along the second direction, and the second direction is perpendicular to the first direction (the first direction and the second direction can be the X-axis direction and the Y-axis direction respectively). The feed conveyor assembly 20 is used to convey the silicon wafers in the feed basket from the feed end 11 to the functional device 200 and the manipulator module 30 in sequence along the second direction. Taking the functional device 200 as a PL detection device as an example, the feed conveyor assembly 20 can take the silicon wafers from the feed basket and convey them to the functional device 200 for PL detection, and convey them out of the functional device 200 after the detection is completed.

[0080] The discharge conveying assembly 40 is located between the robot module 30 and the discharge end 12. The discharge conveying assembly 40 and the feed conveying assembly 20 are also arranged side by side along the first direction. The robot module 30 is used to absorb the silicon wafers from the feed conveying assembly 20 and translate the silicon wafers along the first direction to the discharge conveying assembly 40. The discharge conveying assembly 40 is used to convey the silicon wafers to the discharge end in a direction opposite to the second direction and insert the silicon wafers into the discharge basket so that the insertion direction of the silicon wafers in the discharge basket is consistent with the insertion direction of the silicon wafers in the silicon wafer feed basket.

[0081] In the silicon wafer circulation equipment 100 in the embodiment of the utility model, the feed end 11 and the discharge end 12 are arranged side by side on the first side 101 of the frame 10 along the first direction, and the feed conveying assembly 20 and the discharge conveying assembly 40 are also arranged side by side in the same way. When feeding, the feed conveying assembly 20 conveys the silicon wafer to the functional device 200 along the second direction perpendicular to the first direction. After passing through the functional device 200, the silicon wafer is translated along the first direction to the discharge conveying assembly 40 by the robot module 30. The discharge conveying assembly 40 conveys the silicon wafer in a direction opposite to the second direction and inserts the silicon wafer into the discharge basket. Thus, in the silicon wafer circulation device 100, the silicon wafer is circulated in a rotary manner during the circulation process, that is, after the silicon wafer passes through the functional device 200, the manipulator module 30 only performs a translation operation on the silicon wafer along the first direction, and then the discharging conveying assembly 40 is used to discharging the silicon wafer in the reverse direction in a rotary manner, so that the insertion direction of the silicon wafer in the feeding basket is consistent with the insertion direction of the silicon wafer in the discharging basket, that is, the end of the silicon wafer in the feeding basket located at the outlet of the feeding basket and the end of the silicon wafer in the discharging basket located at the outlet of the discharging basket are the same end, so that when performing the subsequent process, the discharging basket can be directly transported to the next process equipment for processing without turning the direction of the silicon wafer, saving process steps. At the same time, the rotary circulation method is adopted, the feeding end 11 and the discharging end 12 are arranged side by side along the first direction on the first side of the frame 10, and the feeding conveying assembly 20 and the discharging conveying assembly 40 are also arranged side by side along the first direction, which can make the structure of the entire device more compact.

[0082] Specifically, Figure 1 and Figure 2 As shown, Figure 2Shown are the positions and orientations of the various components of the silicon wafer transfer equipment 100 and a schematic diagram of silicon wafer transfer. In the silicon wafer transfer equipment 100, the feed end 11 and the discharge end 12 are arranged side by side on the first side 101 of the frame 10 along a first direction, the feed end 11, the feed conveying assembly 20, the installation station 13, and the robot module 30 are arranged along a second direction, and the discharge end 12 and the discharge conveying assembly 40 are also arranged along the second direction, that is, the entirety formed by the feed end 11 and the feed conveying assembly 20 and the entirety formed by the discharge end 12 and the discharge conveying assembly 40 are arranged side by side along the first direction, and the first direction is perpendicular to the second direction.

[0083] Taking the functional device 200 as a PL detection device as an example, the functional device 200 can be installed on the installation station 13 of the rack 10. During the silicon wafer detection process, the feed basket storing silicon wafers and the discharge basket not storing silicon wafers can be placed at the feed end 11 and the discharge end 12 respectively. The feed conveying component 20 can remove the silicon wafers in the feed basket and convey them to the PL detection device for PL detection. After the detection is completed, the robot module 30 can absorb the detected silicon wafers and place them on the discharge conveying component 40. The discharge conveying component 40 conveys the silicon wafers and inserts them into the discharge basket.

[0084] It is not difficult to understand that since the feed end 11 and the discharge end 12 are arranged side by side on the same side of the frame 10 along the first direction, the feed conveying assembly 20 and the discharge conveying assembly 40 are also arranged side by side in the same way, and the robot module 30 only participates in the translation work. In this way, the silicon wafer enters the functional device 200 along the second direction during feeding. After the robot module 30 translates the silicon wafer, the discharge conveying assembly 40 inserts the silicon wafer into the discharge basket in the opposite direction. In this way, the insertion direction of the silicon wafer in the discharge basket is consistent with the insertion direction of the silicon wafer in the feed basket.

[0085] See also Figure 1 In an embodiment of the utility model, the silicon wafer transfer equipment 100 may also include a feed lifting mechanism 50 (only a partial structure is shown) and a discharge lifting mechanism 60. The feed lifting mechanism 50 is used to drive the feed basket to move up and down along a third direction (the third direction is the up and down direction of the silicon wafer transfer equipment 100, that is, the Z-axis direction). The third direction, the first direction and the second direction are perpendicular to each other. The discharge lifting mechanism 60 is used to drive the discharge basket to move up and down along the third direction.

[0086] Thus, during the feeding process, the feeding basket can be lifted and lowered by the feeding lifting mechanism 50 to achieve wafer-by-wafer feeding. During the discharging process, the discharging basket can be lifted and lowered by the discharging lifting mechanism 60 to achieve wafer-by-wafer discharging.

[0087] Optionally, in such an embodiment, the structures of the feed lifting mechanism 50 and the discharge lifting mechanism 60 may be the same. Taking the feed conveying mechanism 50 as an example, Figure 3 As shown, the feed lifting mechanism 50 may include a frame 501 and a lifting linear module 502 . The frame 501 is used to carry the feed flower basket, and the lifting linear module 502 can drive the frame 501 to lift up and down along a third direction relative to the frame 10 .

[0088] In the utility model, as a possible method, when feeding, the feeding basket can be first raised to the top by the feeding lifting mechanism 50 so that the silicon wafer at the bottom of the feeding basket corresponds to the feeding conveying component 20, and the feeding conveying component 20 removes the silicon wafer at the bottom of the feeding basket and conveys it to the functional device 200. Then, when feeding next time, the feeding lifting mechanism 50 descends a certain distance so that the next silicon wafer can be removed by the feeding conveying component 20.

[0089] Similarly, when discharging, the discharging lifting mechanism 60 can first correspond the top of the discharging basket to the discharging conveying assembly 40. After the robot module 30 places the silicon wafer on the discharging conveying assembly 40, the discharging conveying assembly 40 inserts the silicon wafer into the top of the discharging basket. Subsequently, the discharging lifting mechanism 60 raises the discharging basket a certain distance so that the next silicon wafer can be inserted into the next position of the discharging basket by the discharging conveying assembly 40.

[0090] Also, see Figure 1 In some embodiments, the silicon wafer circulation equipment 100 may further include a feed basket conveying mechanism 51 and a discharge basket conveying mechanism 61. The feed basket conveying mechanism 51 may convey the corresponding feed basket to the corresponding position of the feed end 11 and convey the feed basket to the feed lifting mechanism 50. The discharge basket conveying mechanism 61 may convey the discharge basket that is full of silicon wafers.

[0091] Specifically, Figure 1 As shown, the structures of the feeding basket conveying mechanism 51 and the discharging basket conveying mechanism 61 are basically the same, and they are only different in conveying direction. Figure 4 As shown, the feed flower basket conveying mechanism 51 may be a synchronous belt conveying mechanism, which may include a drive motor 511, a synchronous conveyor belt 512, a roller 513 and a stopper 514. The drive motor 511 may drive the synchronous conveyor belt 512 to move so as to drive the feed flower basket placed on the synchronous conveyor belt 512 to move so that it can be conveyed to the feed lifting mechanism 50. The roller 513 and the stopper 514 may guide the movement of the feed flower basket.

[0092] Similarly, the structure of the discharge flower basket conveying mechanism 61 is similar, the only difference is that the movement direction of the synchronous belt of the discharge flower basket conveying mechanism 61 is opposite to the movement direction of the synchronous belt of the discharge flower basket conveying mechanism 51 to achieve reverse conveyance of the discharge flower basket.

[0093] In addition, if Figure 3 As shown, the feeding lifting mechanism 50 may also include a conveying device 503 disposed at the bottom of the frame 501. In the initial position, the conveying device 503 corresponds to the feeding basket conveying mechanism 51. When the feeding basket conveying mechanism 51 conveys the feeding basket to the feeding lifting mechanism 50, the conveying device 503 can drive the feeding basket to move further into the frame 501 of the feeding lifting mechanism 50 so that the feeding basket moves into place. In other words, the conveying device 503 of the feeding lifting mechanism 50 is used to continuously convey the feeding basket from the feeding basket conveying mechanism 51 to the frame 501 of the lifting mechanism 50. Similarly, for the discharging lifting mechanism 60, it also has a conveying device, and the conveying device of the discharging lifting mechanism 60 is used to convey the discharging basket to the discharging basket conveying device 61 to realize the output of the discharging basket.

[0094] Embodiment 2

[0095] See also Figure 1 and Figure 5 , in some embodiments, the feed conveying assembly 20 may include a material taking mechanism 21 and a feed conveying mechanism 22;

[0096] The material taking mechanism 21 is located between the feeding conveying mechanism 22 and the feeding end 11, and the material taking mechanism 21 is used to take out the silicon wafers in the feeding basket and convey them to the feeding conveying mechanism 22;

[0097] The feed conveyor mechanism 22 is located between the material picking mechanism 21 and the robot module 30 . The feed conveyor mechanism 22 is used to transport the silicon wafers to the functional device 200 and the robot module 30 in sequence. The robot module 30 is used to absorb the silicon wafers on the feed conveyor mechanism 22 .

[0098] In this way, the material taking mechanism 21 can automatically take the silicon wafers on the feeding basket and transport them to the feeding conveying mechanism 22 , and the feeding conveying mechanism 22 can transport the silicon wafers to the functional device 200 .

[0099] For further information, see Figure 6 In some embodiments, the material picking mechanism 21 may include a first seat body 211, a material picking plate 212, a material picking driving mechanism 213, a first driving motor 214, a first wheel train group 215 and a material picking conveying belt 216.

[0100] The first base body 211 is mounted on the frame 10, the material taking plate 212 is slidably connected to the first base body 211, and the first wheel group 215 is arranged on the first base body 211. Specifically, a material taking conveying belt 216 and a first wheel group 215 are arranged on both sides of the material taking plate 212. A first pulley 217 is arranged on the material taking plate 212, and the material taking conveying belt 216 is wound around the first wheel group 215 and the first pulley 217. The material taking driving mechanism 213 is used to drive the material taking plate 212 to reciprocate along the second direction and in the direction opposite to the second direction through the first wheel group 215.

[0101] When picking up materials, the first driving motor 214 is used to drive the picking conveyor belt 216 to move through the first wheel group 215, and the picking driving mechanism 213 is used to drive the picking plate 212 to slide in the direction opposite to the second direction relative to the first base body 211, so that the picking plate 212 extends into the feeding basket, and the picking plate 212 is used to synchronously drive the picking conveyor belt 216 to extend into the feeding basket through the first pulley 217, so that the silicon wafers are transported out of the feeding basket through the picking conveyor belt 216 and transported to the feeding conveyor mechanism 22.

[0102] That is to say, while the material taking driving mechanism 213 drives the material taking plate 212 to move, the first driving motor 214 can simultaneously drive the material taking conveying belt 216 to move. When taking materials, the first driving motor 214 drives the material taking conveying belt 216 to move through the first gear train group 215, and the material taking driving mechanism 213 pushes the material taking plate 212 in the direction opposite to the second direction, and the material taking plate 212 extends to the feeding basket to drive the material taking conveying belt 216 to extend into the feeding basket synchronously, and then the silicon wafer is conveyed out of the feeding basket by the material taking conveying belt 216, and is conveyed to the feeding conveying mechanism 22 by the material taking conveying belt 216.

[0103] In such an embodiment, the material picking drive mechanism 213 may preferably be a cylinder assembly, and the cylinder assembly may be a rodless cylinder or a rod cylinder, which is not specifically limited here. Of course, the material picking drive mechanism 213 may also be other drive mechanisms, such as a screw nut drive mechanism, a gear rack drive mechanism, which is not specifically limited here.

[0104] In such an embodiment, the feed conveyor mechanism 22 can be a synchronous belt conveyor mechanism, and the material picking conveyor belt 216 of the material picking mechanism 21 can take the silicon wafer out of the feed basket and convey the silicon wafer to the feed conveyor mechanism 22, and then the feed conveyor mechanism 22 conveys the silicon wafer to the functional device 200 for the next process, for example, PL detection.

[0105] Likewise, in some embodiments, the discharge conveying assembly 40 may include a discharge mechanism 41 and a discharge conveying mechanism 42;

[0106] The unloading mechanism 41 is located between the unloading conveying mechanism 42 and the unloading end 12. The robot module 30 is used to suck the silicon wafer and translate the silicon wafer along a first direction to the unloading conveying mechanism 42. The unloading conveying mechanism 42 is used to convey the silicon wafer to the unloading mechanism 41 along a direction opposite to the second direction. The unloading mechanism 41 is used to insert the silicon wafer into the unloading basket in reverse.

[0107] In this way, the unloading mechanism 41 can automatically insert the silicon wafers on the discharging conveying mechanism 42 into the discharging basket so that the insertion direction of the silicon wafers in the discharging basket is consistent with the insertion direction of the silicon wafers in the feeding basket.

[0108] In such an embodiment, the structure of the material discharging mechanism 41 may be similar to the structure of the material taking mechanism 21. Specifically, further, please refer to Figure 6 In some embodiments, the unloading mechanism 41 may include a second seat body 411 , a unloading plate 412 , a unloading driving mechanism 413 , a second driving motor 414 , a second wheel train set 415 and an unloading conveying belt 416 .

[0109] The second base body 411 is mounted on the frame 10, the unloading plate 412 is slidably connected to the second base body 411, and the second wheel group 415 is arranged on the second base body 411. Specifically, an unloading conveying belt 416 and a second wheel group 415 are arranged on both sides of the unloading plate 412. A second pulley 417 is arranged on the unloading plate 412, and the unloading conveying belt 416 is wound around the second wheel group 415 and the second pulley 215. The unloading driving mechanism 413 can drive the unloading plate 412 to reciprocate along the second direction and in the direction opposite to the second direction.

[0110] During material discharge, the second driving motor 414 is used to drive the material discharge conveyor belt 416 to move through the second wheel group 415, and the material discharge driving mechanism 413 is used to drive the material discharge plate 412 to slide in the direction opposite to the second direction relative to the second base body 411, so that the material discharge plate 412 extends into the material discharge basket, and the material discharge plate 412 is synchronously driven by the material discharge conveyor belt 416 through the second pulley 417 to extend into the material discharge basket, thereby inserting the silicon wafer into the material discharge basket through the material discharge conveyor belt 416.

[0111] That is to say, while the unloading drive mechanism 413 drives the unloading plate 412 to move, the second drive motor 414 can simultaneously drive the unloading conveyor belt 416 to move. During unloading, the second drive motor 414 drives the unloading conveyor belt 416 to move through the second gear train 415, and the unloading drive mechanism 413 pushes the unloading plate 412 in a direction opposite to the second direction, and the unloading plate 412 extends to the unloading basket to synchronously drive the unloading conveyor belt 416 to extend into the unloading basket, and then the silicon wafer is inserted into the unloading basket through the unloading conveyor belt 416.

[0112] In such an embodiment, the discharge drive mechanism 413 may also preferably be a cylinder assembly, and the cylinder assembly may be a rodless cylinder or a rod cylinder, which is not specifically limited here. Of course, the discharge drive mechanism 413 may also be other drive mechanisms, such as a screw nut drive mechanism, a gear rack drive mechanism, which is not specifically limited here.

[0113] In such an embodiment, the discharge conveyor mechanism 42 may also be a synchronous belt conveyor mechanism. During discharge, the robot module 30 will translate the silicon wafers flowing out of the functional device 200 and place them on the discharge conveyor mechanism 42 for conveyance in the opposite direction (i.e., the direction opposite to the second direction). The discharge conveyor mechanism 42 conveys the silicon wafers to the discharge conveyor belt 416 of the discharge mechanism 41. During discharge, since the discharge plate 412 extends into the discharge basket, a part of the discharge conveyor belt 416 will also extend into the discharge basket, so that the discharge conveyor belt 416 can insert the silicon wafers into the discharge basket.

[0114] Embodiment 3

[0115] See also Figure 1 , Figure 5 and Figure 7 In some embodiments, the silicon wafer transfer equipment 100 may further include a feed deviation correction mechanism 70, which is located between the feed end 11 and the installation station 13. The feed deviation correction mechanism is used to guide the silicon wafers during the process of the material picking mechanism 21 and / or the feed conveying mechanism 22 transporting the silicon wafers.

[0116] For example, in some embodiments, the material picking mechanism 21 can transport the silicon wafers to the feed correction mechanism 70, and then transport the silicon wafers to the feed conveying mechanism 22. For example, in other embodiments, the feed correction mechanism 70 can correct the direction of the silicon wafers on the feed conveying mechanism 22. No specific limitation is made here.

[0117] In this way, during the feeding process, the feeding deviation correction mechanism 70 can correct the direction and angle of the silicon wafer during the feeding process to avoid the silicon wafer from deviating during the transportation process.

[0118] Furthermore, if Figure 7 As shown, in such an embodiment, the feed deviation correction mechanism 70 may include a first mounting seat 71 , two first roller assemblies 72 spaced apart on both sides of the first mounting seat 71 , a first motor 74 and a first synchronous drive mechanism 73 .

[0119] The two first roller assemblies 72 can move relative to the mounting seat 71 to move closer to or away from each other. The first motor 74 is installed on the first mounting seat 71. The first synchronous drive mechanism 73 is also installed on the first mounting seat 71 and connected to the first motor 74. The two first roller assemblies 72 are both connected to the first synchronous drive mechanism 73.

[0120] The first motor 74 can drive the two first roller assemblies 72 to move closer to or away from each other through the first synchronous drive mechanism 73. The material picking mechanism 21 and / or the feeding conveying mechanism 22 can drive the silicon wafer to flow through the area between the two first roller assemblies 72. The two first roller assemblies 72 are used to correct the angle of the silicon wafer.

[0121] Specifically, in some embodiments, the material picking mechanism 21 drives the silicon wafer to flow through the area between the two first roller assemblies 72. In this case, during the feeding process, the material picking mechanism 21 removes the silicon wafer from the feeding basket 300. During the conveying process, the silicon wafer passes through the area between the two first roller assemblies 72. The two first roller assemblies 72 can correct the angle of the silicon wafer so that the silicon wafer can be conveyed to the feeding conveying mechanism 22 at an accurate angle, thereby avoiding angle deviation of the silicon wafer.

[0122] In other embodiments, the feed conveyor mechanism 22 drives the silicon wafers to flow through the area between the two first roller assemblies 72. In this case, during the feeding process, the material picking mechanism 21 removes the silicon wafers from the feed basket 300 and then transports them to the feed conveyor mechanism 22. During the process of transporting the silicon wafers by the feed conveyor mechanism 22, the silicon wafers pass through the area between the two first roller assemblies 72. The two first roller assemblies 72 can correct the angle of the silicon wafers so that the silicon wafers can be transported to the feed conveyor mechanism 22 at an accurate angle, thereby avoiding angle deviation of the silicon wafers.

[0123] In addition, a feed deviation correction mechanism 70 may be provided on the conveying paths of the feed conveying mechanism 22 and the material taking mechanism 21 , so as to correct the direction of the silicon wafer twice, and the details are not limited here.

[0124] It is understandable that, since the two first roller assemblies 72 can be relatively close to or away from each other to change the distance therebetween, the distance between the two first roller assemblies 72 can be adjusted so that the silicon wafers of different sizes can be corrected.

[0125] Please continue reading Figure 7 In some embodiments, the first synchronous driving mechanism 73 may include a first driving wheel 731, a first driven wheel 732 and a first synchronous belt 733;

[0126] The first driving wheel 731 and the first driven wheel 732 are respectively arranged on both sides of the first mounting seat 71, the first synchronous belt 733 is wound around the first driving wheel 731 and the first driven wheel 732, the first motor 74 is connected to the first driving wheel 731, one of the two first roller assemblies 72 is fixedly connected to the part of the first synchronous belt 733 located on one side of the first driving wheel 731 and the first driven wheel 732, and the other is fixedly connected to the part of the first synchronous belt 733 located on the other side of the first driving wheel 731 and the first driven wheel 732, the first motor 74 is used to drive the first driving wheel 731 to rotate to drive the first synchronous belt 733 to move, thereby driving the two first roller assemblies 72 to approach or move away from each other.

[0127] In this way, by setting two pulleys and a synchronous belt, and connecting the two first roller assemblies 72 to the two sides of the first synchronous belt 733 respectively, the first synchronous belt 733 can drive the two first roller assemblies 72 to move closer to and away from each other.

[0128] Of course, it is understandable that in other embodiments, the first synchronous drive mechanism 73 may also be a gear rack transmission mechanism, for example, two racks may be provided on both sides of the gear, the two racks are respectively fixedly connected to the two first roller assemblies 72, and the first motor 74 drives the gear to rotate to drive the two racks to move in opposite directions to achieve the approach or separation of the two first roller assemblies 72. Of course, in other embodiments, the first synchronous drive mechanism 73 may also adopt other driving modes, as long as it can achieve the synchronous approach or separation of the two first roller assemblies 72, and there is no specific limitation here.

[0129] See also Figure 1 , Figure 5 and Figure 7 In some embodiments, the silicon wafer transfer equipment 100 may further include a discharge correction mechanism 80, which is located between the robot module 30 and the discharge end 12. The discharge correction mechanism 80 is used to guide the silicon wafers during the process of the discharge conveying mechanism 42 and / or the discharge mechanism 41 transporting the silicon wafers.

[0130] For example, in some embodiments, the discharge conveying mechanism 42 can convey the silicon wafers to the discharge correction mechanism 80, and then convey the silicon wafers to the discharge mechanism 41. For example, in other embodiments, the discharge conveying mechanism 42 can convey the silicon wafers to the discharge mechanism 41. During the process of conveying the silicon wafers by the discharge mechanism 41, the silicon wafers flow through the feed correction mechanism 70 to correct the direction of the silicon wafers. No specific limitation is made here.

[0131] Thus, during the discharging process, the discharging deviation correction mechanism 80 can correct the angle of the silicon wafer. It is understandable that if the silicon wafer is offset, the discharging mechanism 41 may not be able to accurately insert the silicon wafer into the discharging basket.

[0132] Furthermore, if Figure 7 As shown, in such an embodiment, the structure of the material discharging correction mechanism 80 may be the same as the structure of the material feeding correction mechanism 70. Specifically, as Figure 7 As shown, the discharging correction mechanism 80 may include a second mounting seat 81, two second roller assemblies 82 spaced apart on both sides of the second mounting seat 81, a second motor 84 and a second synchronous drive mechanism 83, and its structure is the same as that of the feeding correction mechanism 70.

[0133] The two second roller assemblies 82 can move relative to the mounting seat 81 to approach or move away from each other. The second motor 84 is mounted on the second mounting seat 81 . The second synchronous drive mechanism 83 is also mounted on the second mounting seat 81 and connected to the second motor 84 .

[0134] The second motor 84 can drive the two second roller assemblies 82 to move closer to or away from each other through the second synchronous drive mechanism 83. The discharge mechanism 41 and / or the discharge conveyor mechanism 42 can drive the silicon wafer to flow through the area between the two second roller assemblies 82. The two second roller assemblies 82 are used to correct the direction of the silicon wafer.

[0135] Specifically, in some embodiments, the unloading mechanism 41 drives the silicon wafers to flow through the area between the two second roller assemblies 82. In this case, during the unloading process, the unloading conveying mechanism 42 transports the silicon wafers to the unloading mechanism 41. During the unloading process of the silicon wafers, the silicon wafers pass through the area between the two second roller assemblies 82. The two second roller assemblies 82 can correct the angle of the silicon wafers so that the silicon wafers can be inserted into the unloading basket at an accurate angle, thereby avoiding the angle deviation of the silicon wafers, which may cause the unloading mechanism 41 to be unable to accurately insert the silicon wafers into the unloading basket.

[0136] In other embodiments, the discharge conveyor mechanism 42 drives the silicon wafer to flow through the area between the two second roller assemblies 82. In this case, during the discharge process, when the discharge conveyor mechanism 42 transports the silicon wafer to the discharge mechanism 41, the silicon wafer passes through the area between the two second roller assemblies 82, and the two second roller assemblies 82 can correct the angle of the silicon wafer.

[0137] In addition, a discharge correction mechanism 80 may be provided on the conveying paths of the discharge conveying mechanism 42 and the discharge mechanism 41 , so as to correct the directions of the silicon wafers twice, which is not specifically limited here.

[0138] Similarly, it can be understood that since the two second roller assemblies 82 of the discharge correction mechanism 80 can be relatively close to or away from each other to change the distance between them, the distance between the two second roller assemblies 82 can be adjusted so that silicon wafers of different sizes can be corrected.

[0139] Please continue reading Figure 7 In some embodiments, the second synchronous mechanism 83 has a substantially identical structure to the first synchronous drive mechanism 73 , and the second synchronous drive mechanism 83 may include a second driving wheel 831 , a second driven wheel 832 , and a second synchronous belt 833 ;

[0140] The second driving wheel 831 and the second driven wheel 832 are respectively arranged on both sides of the second mounting seat 71, the second synchronous belt 833 is wound around the second driving wheel 831 and the second driven wheel 832, the second motor 74 is connected to the second driving wheel 831, one of the two second roller assemblies 82 is fixedly connected to the part of the second synchronous belt 833 located on one side of the second driving wheel 831 and the second driven wheel 832, and the other is fixedly connected to the part of the second synchronous belt 833 located on the other side of the second driving wheel 831 and the second driven wheel 832, the second motor 74 is used to drive the second driving wheel 831 to rotate to drive the second synchronous belt 833 to move, thereby driving the two second roller assemblies 82 to approach or move away from each other.

[0141] In this way, by setting two pulleys and a synchronous belt, and connecting the two second roller assemblies 82 to the two sides of the second synchronous belt 833 respectively, the second synchronous belt 833 can drive the two second roller assemblies 82 to move closer to and away from each other.

[0142] Of course, it is understandable that in other embodiments, the second synchronous drive mechanism 83 may also be a gear rack transmission mechanism, for example, two racks may be provided on both sides of the gear, the two racks are respectively fixedly connected to the two second roller assemblies 82, and the second motor 74 drives the gear to rotate to drive the two racks to move in opposite directions to achieve the approach or separation of the two second roller assemblies 82. Of course, in other embodiments, the second synchronous drive mechanism 83 may also adopt other driving modes, as long as it can achieve the synchronous approach or separation of the two second roller assemblies 82, and there is no specific limitation here.

[0143] Embodiment 4

[0144] See also Figure 1 , Figure 5 and Figure 8In some embodiments, the silicon wafer circulation equipment 100 may further include a feed temporary storage mechanism 90, which is located between the material picking mechanism 21 and the feed conveying mechanism 22. The feed temporary storage mechanism 90 is used to store silicon wafers from the material picking mechanism 21, and the material picking mechanism 21 can transport the silicon wafers on the feed temporary storage mechanism 90 to the feed conveying mechanism 22.

[0145] In this way, when the suction efficiency of the robot module 30 cannot meet the feeding speed, or when the feeding conveying mechanism 22 and the robot module 30 fail, the material picking mechanism 21 can temporarily store the silicon wafers on the feeding temporary storage mechanism 90 to avoid collision and damage to the silicon wafers.

[0146] Furthermore, if Figure 8 As shown, in such an embodiment, the feed temporary storage mechanism 90 may include a feed buffer device 92 and a first lifting mechanism 91. The first lifting mechanism 91 is installed on the frame 10. The first lifting mechanism 91 is used to drive the feed buffer device 92 to rise and fall along a third direction (the third direction is the up and down direction of the silicon wafer transfer equipment 100, that is, the Z-axis direction). The third direction, the first direction and the second direction are perpendicular to each other. The feed buffer device 92 has a plurality of feed temporary storage units 921 along the third direction, and each feed temporary storage unit 921 corresponds to storing a silicon wafer.

[0147] In this way, when the silicon wafers need to be temporarily stored, the material taking mechanism 21 can insert the silicon wafers into the material feeding temporary storage unit 921 to achieve temporary storage of the silicon wafers.

[0148] Specifically, in such an embodiment, when the silicon wafer needs to be temporarily stored, the material picking mechanism 21 removes the silicon wafer from the feed basket and then inserts it into the feed temporary storage unit 921 for temporary storage. When storing the next silicon wafer, the first lifting mechanism 91 can drive the feed buffer device 92 to rise a certain distance so that the material picking mechanism 21 can insert the next silicon wafer into the next feed temporary storage unit 921, and so on.

[0149] When it is necessary to transport the silicon wafers on the feed temporary storage mechanism 90 to the feed conveying mechanism 22 again, the silicon wafers on the feed temporary storage mechanism 90 can be removed one by one through the material picking mechanism 21 and transported to the feed conveying mechanism 22. During this process, the material picking mechanism 21 can first transport the lowest silicon wafer on the feed buffer device to the feed conveying mechanism 22, and then drive the feed buffer device 92 to descend a certain distance through the first lifting mechanism 91 so that the material picking mechanism 21 can remove the next silicon wafer and transport it to the feed conveying mechanism 22.

[0150] In such an embodiment, the feed temporary storage mechanism 90 and the feed deviation correction mechanism 70 are arranged in sequence between the material picking mechanism 21 and the feed conveying mechanism 22. The position, quantity and order of the two can be adjusted according to the actual production process, and no specific limitation is made here.

[0151] Embodiment 5

[0152] See also Figure 1 , Figure 5 and Figure 8 In some embodiments, the silicon wafer circulation equipment 100 may further include a discharge temporary storage mechanism 110, which is located between the discharge mechanism 41 and the discharge conveying mechanism 42. The discharge temporary storage mechanism 110 is used to store the silicon wafers removed from the discharge conveying mechanism 42 by the discharge mechanism 41, and the discharge mechanism 41 can insert the silicon wafers on the discharge temporary storage mechanism 110 into the discharge basket.

[0153] In this way, when the discharge mechanism 41 cannot meet the discharge speed and requirements, or the discharge mechanism 41 fails, or the discharge basket is full and needs to be replaced, the discharge conveying mechanism 42 can temporarily store the silicon wafers on the discharge temporary storage mechanism 110 to avoid collision and damage to the silicon wafers.

[0154] Furthermore, if Figure 8 As shown, in such an embodiment, the structure of the material discharging temporary storage mechanism 110 is substantially the same as that of the material feeding temporary storage mechanism 90. Specifically, the material discharging temporary storage mechanism 110 may include a material discharging buffer device 112 and a second lifting mechanism 111, the second lifting mechanism 111 is installed on the frame 10, and the second lifting mechanism 111 is used to drive the material discharging buffer device 112 to move up and down along the third direction. The material discharging buffer device 112 has a plurality of material discharging temporary storage units 1121 along the third direction, and each material discharging temporary storage unit 1121 stores a silicon wafer.

[0155] In this way, when the silicon wafers need to be temporarily stored during the outgoing material transfer mechanism 42 , the silicon wafers can be inserted into the outgoing material temporary storage unit 1121 to achieve temporary storage of the silicon wafers.

[0156] Specifically, in such an embodiment, when it is necessary to temporarily store the silicon wafers on the discharge conveying mechanism 42, the discharge conveying mechanism 42 transports the silicon wafers to the unloading mechanism 41, and the unloading mechanism 41 inserts them into the discharge temporary storage unit 1121 for temporary storage. When storing the next silicon wafer, the discharge buffer device 112 can be driven to rise a certain distance by the second lifting mechanism 111 so that the unloading mechanism 41 can insert the next silicon wafer into the next discharge temporary storage unit 1121, and so on.

[0157] When it is necessary to transport the silicon wafers on the discharge temporary storage mechanism 110 to the discharge conveying mechanism 42 again, the silicon wafers on the discharge temporary storage mechanism 110 can be removed one by one through the discharge mechanism 41 and inserted into the discharge basket. During this process, the discharge mechanism 41 can first insert the lowest silicon wafer on the discharge buffer device 112 into the discharge basket, and then drive the discharge buffer device 112 to descend a certain distance through the second lifting mechanism 111 so that the discharge mechanism 41 can remove the next silicon wafer and insert it into the discharge basket.

[0158] Embodiment 6

[0159] See also Fig. 9 In some embodiments, the manipulator module 30 may include a mounting plate 31, a suction cup component 32, and a linear drive module 33. The mounting plate 31 is mounted on the frame 10. The suction cup component 32 is movably mounted on the mounting plate 31. The suction cup component 32 is used to absorb the silicon wafer. The linear drive module 33 is mounted on the mounting plate 31. The linear drive module 33 is used to drive the suction cup component 32 to translate relative to the mounting plate 31 along a first direction and in a direction opposite to the first direction.

[0160] In this way, the silicon wafer can be adsorbed by the suction cup component 32 to ensure the reliability of the silicon wafer during the transfer process, and the silicon wafer can be driven to perform a translation operation through the linear drive module 33 to achieve the transfer of the silicon wafer.

[0161] As a possible embodiment, the suction cup component 32 may include components such as a suction cup 321 and a cylinder. When transferring a silicon wafer, the cylinder may be driven to absorb the silicon wafer through the suction cup 321, and then the linear drive module 33 may drive the suction cup component 32 to translate the silicon wafer along the first direction so that it is transferred to the top of the discharge conveyor mechanism 42, and then the cylinder stops working, the suction cup 321 releases the silicon wafer, and the discharge conveyor mechanism 42 conveys the silicon wafer out in the reverse direction. When sucking the next silicon wafer, the linear drive module 33 drives the suction cup component 32 to translate in the direction opposite to the first direction to the top of the feed conveyor mechanism 22 and suck the silicon wafer, and then the linear drive module 33 drives the suction cup component 32 to translate in the first direction so that the silicon wafer is transferred to the discharge conveyor mechanism 42, and this cycle is used to achieve continuous transfer of silicon wafers.

[0162] It is understandable that in such an embodiment, the linear drive module 33 can drive the suction cup component to perform translation operation by means of screw nut drive, gear rack drive, belt drive, etc., and no specific limitation is made here.

[0163] Embodiment 7

[0164] See also Fig.10 and Fig.11 , Fig.10 The silicon wafer transfer equipment 100 and Figure 1The structure of the silicon wafer transfer device 100 is only different from the structure of the robot module 30. Fig.10 and Fig.11 In the illustrated embodiment, the robot module 30 may include a fixing base 310 , a first suction cup component 320 , a second suction cup component 330 and a third synchronous driving mechanism 340 .

[0165] The first suction cup component 320 and the second suction cup component 330 are movably connected to the fixing seat 310, and the first suction cup component 320 and the second suction cup component 330 are spaced apart on both sides of the fixing seat 310 along the first direction, and the first suction cup component 320 and the second suction cup component 330 do not interfere with each other in the third direction, and the first suction cup component 320 and the second suction cup component 330 are both used for adsorbing silicon wafers.

[0166] The third synchronous driving mechanism 340 connects the first suction cup component 320 and the second suction cup component 330. The third synchronous driving mechanism 340 is used to drive one of the first suction cup component 320 and the second suction cup component 330 to translate along the first direction while driving the other of the first suction cup component 320 and the second suction cup component 330 to translate along the direction opposite to the first direction.

[0167] In this way, through the cross-reciprocating translation of the first suction cup component 320 and the second suction cup component 330 , the first suction cup component 320 and the second suction cup component 330 can alternately adsorb and place the silicon wafer, thereby improving the transfer efficiency of the robot module 30 .

[0168] It should be noted that “the first suction cup component 320 and the second suction cup component 330 do not interfere with each other in the third direction” means that the first suction cup component 320 and the second suction cup component 330 do not collide with each other during the translation process.

[0169] Furthermore, if Fig.11 As shown, in some embodiments, the third synchronous driving mechanism 340 may be a synchronous belt driving mechanism, which may include a third motor 341, a third driving wheel (not shown in the figure), a third driven wheel (not shown in the figure) and a third synchronous belt 342;

[0170] The third driving wheel and the third driven wheel are respectively arranged on both sides of the fixing seat 310, the third synchronous belt 342 is wound around the third driving wheel and the third driven wheel, and the third motor 341 is connected to the third driving wheel;

[0171] Among them, the first suction cup component 320 is fixedly connected to the part of the third synchronous belt 342 located on one side of the third driving wheel and the third driven wheel, the second suction cup component 330 is fixedly connected to the part of the third synchronous belt 342 located on the other side of the third driving wheel and the third driven wheel, and the third motor 341 is used to drive the third driving wheel to rotate to drive the third synchronous belt 342 to move, thereby driving the first suction cup component 320 to translate along the first direction while driving the second suction cup component 330 to translate in the direction opposite to the first direction.

[0172] Specifically, in such an embodiment, the first suction cup component 320 and the second suction cup component 330 can be slidably connected to the fixed seat 310 through a linear guide rail. When the third motor 341 drives the third synchronous belt 342 to move, the third synchronous belt 342 drives one of the first suction cup component 320 and the second suction cup component 330 to translate along a first direction, and the other to translate along a direction opposite to the first direction. For example, while the first suction cup component 320 is driven to the top of the feeding conveyor mechanism 22 to adsorb the silicon wafer, the second suction cup component 330 is driven to the discharging conveyor mechanism 42 to release the silicon wafer, thereby realizing the alternating transfer of the silicon wafers to improve the transfer efficiency of the silicon wafers.

[0173] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0174] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer transfer device, characterized in that: include: A rack, wherein a first side of the rack is provided with a feed end and a discharge end in parallel along a first direction, the feed end is used to place a feed basket, the discharge end is used to place a discharge basket, and the feed basket and the discharge basket are both used to store silicon wafers; A robot module disposed on the frame, wherein the robot module is located on a second side of the frame, and the first side is opposite to the second side; An installation station for installing a functional device is provided on the frame, and the installation station is located between the feed end and the manipulator module; A feed conveying assembly is arranged on the frame, the feed conveying assembly is located between the manipulator module and the feed end, the feed end, the feed conveying assembly and the manipulator module are arranged in sequence along a second direction, the second direction is perpendicular to the first direction, and the feed conveying assembly is used to convey the silicon wafers in the feed basket from the feed end to the functional device and the manipulator module in sequence along the second direction; A discharging conveying assembly is arranged on the frame, and the discharging conveying assembly is located between the robot module and the discharging end. The discharging conveying assembly and the feeding conveying assembly are arranged side by side along the first direction. The robot module is used to suck silicon wafers from the feeding conveying assembly and translate the silicon wafers along the first direction to the discharging conveying assembly. The discharging conveying assembly is used to convey the silicon wafers to the discharging end in a direction opposite to the second direction, so that the insertion direction of the silicon wafers in the discharging basket is consistent with the insertion direction of the silicon wafers in the feeding basket.

2. The silicon wafer transfer equipment according to claim 1, characterized in that: The silicon wafer circulation equipment also includes a feed lifting mechanism and a discharge lifting mechanism. The feed lifting mechanism is used to drive the feed basket to move up and down along a third direction. The third direction, the first direction and the second direction are perpendicular to each other. The discharge lifting mechanism is used to drive the discharge basket to move up and down along the third direction.

3. The silicon wafer transfer equipment according to claim 1, characterized in that: The feed conveying assembly includes a material taking mechanism and a feed conveying mechanism; The material taking mechanism is located between the feeding conveying mechanism and the feeding end, and is used to take out the silicon wafers in the feeding basket and convey them to the feeding conveying mechanism; The feed conveying mechanism is located between the material taking mechanism and the robot module, and is used to transport the silicon wafers to the functional device and the robot module in sequence.

4. The silicon wafer transfer equipment according to claim 3, characterized in that: The material taking mechanism comprises a first seat body, a material taking plate, a material taking drive mechanism, a first drive motor, a first wheel train set and a material taking conveying belt; The first seat body is mounted on the frame, the material taking plate is slidably connected to the first seat body, the first wheel train set is arranged on the first seat body, the material taking plate is provided with a first pulley, and the material taking conveying belt is wound around the first wheel train set and the first pulley; When picking up materials, the first driving motor is used to drive the picking up conveyor belt to move through the first wheel system group, and the picking up driving mechanism is used to drive the picking up plate to slide in the direction opposite to the second direction, so that the picking up plate extends into the feeding basket, and the picking up plate is used to synchronously drive the picking up conveyor belt through the first pulley to extend into the feeding basket, thereby conveying the silicon wafers out of the feeding basket through the picking up conveyor belt and conveying the silicon wafers to the feeding conveying mechanism.

5. The silicon wafer transfer equipment according to claim 3, characterized in that: The silicon wafer circulation equipment further comprises a feed deviation correction mechanism, wherein the feed deviation correction mechanism is located between the feed end and the installation station; The feed deviation correction mechanism is used to guide the silicon wafers during the process of the silicon wafers being transported by the material taking mechanism and / or the feed conveying mechanism.

6. The silicon wafer transfer equipment according to claim 5, characterized in that: The feed deviation correction mechanism includes a first mounting seat, two first roller assemblies spaced apart on both sides of the first mounting seat, a first motor and a first synchronous driving mechanism; The first motor is mounted on the first mounting seat, the first synchronous drive mechanism is mounted on the first mounting seat and connected to the first motor, the two first roller assemblies are connected to the first synchronous drive mechanism, the first motor can drive the two first roller assemblies to move closer to or away from each other through the first synchronous drive mechanism, and the material picking mechanism and / or the feed conveying mechanism can drive the silicon wafer to flow through the area between the two first roller assemblies.

7. The silicon wafer transfer equipment according to claim 6, characterized in that: The first synchronous driving mechanism includes a first driving wheel, a first driven wheel and a first synchronous belt; The first driving wheel and the first driven wheel are respectively arranged on two sides of the first mounting seat, and the first synchronous belt is wound around the first driving wheel and the first driven wheel; The first motor is connected to the first driving wheel, one of the two first roller assemblies is fixedly connected to a portion of the first synchronous belt located on one side of the first driving wheel and the first driven wheel, and the other is fixedly connected to a portion of the first synchronous belt located on the other side of the first driving wheel and the first driven wheel, and the first motor is used to drive the first driving wheel to rotate to drive the first synchronous belt to move, thereby driving the two first roller assemblies to move closer to or away from each other.

8. The silicon wafer transfer equipment according to claim 3, characterized in that: The silicon wafer circulation equipment also includes a feed temporary storage mechanism, which is located between the material picking mechanism and the feed conveying mechanism. The feed temporary storage mechanism is used to store the silicon wafers on the material picking mechanism, and the material picking mechanism can transport the silicon wafers on the feed temporary storage mechanism to the feed conveying mechanism.

9. The silicon wafer transfer equipment according to claim 8, characterized in that: The feed temporary storage mechanism includes a feed buffer device and a first lifting mechanism, wherein the first lifting mechanism is installed on the frame, and the first lifting mechanism is used to drive the feed buffer device to move up and down along a third direction, wherein the third direction, the first direction and the second direction are perpendicular to each other, and the feed buffer device has a plurality of feed temporary storage units along the third direction, and each of the feed temporary storage units stores a silicon wafer.

10. The silicon wafer transfer equipment according to claim 1, characterized in that: The discharging conveying assembly includes a discharging mechanism and a discharging conveying mechanism; The unloading mechanism is located between the unloading conveying mechanism and the unloading end, the robot module is used to suck the silicon wafer and translate the silicon wafer along the first direction to the unloading conveying mechanism, the unloading conveying mechanism is used to convey the silicon wafer to the unloading mechanism along the direction opposite to the second direction, and the unloading mechanism is used to insert the silicon wafer into the unloading basket.

11. The silicon wafer transfer equipment according to claim 10, characterized in that: The material discharge mechanism comprises a second seat body, a material discharge plate, a material discharge drive mechanism, a second drive motor, a second wheel train set and a material discharge conveyor belt; The second seat body is mounted on the frame, the unloading plate is slidably connected to the second seat body, the second wheel train set is arranged on the second seat body, the unloading plate is provided with a second pulley, and the unloading conveying belt is wound around the second wheel train set and the second pulley; During unloading, the second driving motor is used to drive the unloading conveyor belt to move through the second wheel system, and the unloading driving mechanism is used to drive the unloading plate to slide in the direction opposite to the second direction, so that the unloading plate extends into the unloading basket, and the unloading plate is used to synchronously drive the unloading conveyor belt through the second pulley to extend into the unloading basket, thereby inserting the silicon wafer into the unloading basket through the unloading conveyor belt.

12. The silicon wafer transfer equipment according to claim 10, characterized in that: The silicon wafer circulation equipment also includes a discharge correction mechanism, which is located between the robot module and the discharge end, and is used to guide the silicon wafers during the process of the discharge conveying mechanism and / or the discharge mechanism conveying the silicon wafers.

13. The silicon wafer transfer equipment according to claim 12, characterized in that: The material discharging correction mechanism comprises a second mounting seat, two second roller assemblies spaced apart on both sides of the second mounting seat, a second motor and a second synchronous driving mechanism; The second motor is mounted on the second mounting seat, the second synchronous drive mechanism is mounted on the second mounting seat and connected to the second motor, the two second roller assemblies are connected to the second synchronous drive mechanism, the second motor can drive the two second roller assemblies to approach each other or move away from each other through the second synchronous drive mechanism, and the discharging conveying mechanism and / or the discharging mechanism can drive the silicon wafer to flow through the area between the two second roller assemblies.

14. The silicon wafer transfer equipment according to claim 13, characterized in that: The second synchronous driving mechanism includes a second driving wheel, a second driven wheel and a second synchronous belt; The second driving wheel and the second driven wheel are respectively arranged on two sides of the second mounting seat, and the second synchronous belt is wound around the second driving wheel and the second driven wheel; The second motor is connected to the second driving wheel, one of the two second roller assemblies is fixedly connected to a portion of the second synchronous belt located on one side of the second driving wheel and the second driven wheel, and the other is fixedly connected to a portion of the second synchronous belt located on the other side of the second driving wheel and the second driven wheel, and the second motor is used to drive the second driving wheel to rotate to drive the second synchronous belt to move, thereby driving the two second roller assemblies to move closer to or away from each other.

15. The silicon wafer transfer equipment according to claim 10, characterized in that: The silicon wafer circulation equipment also includes a discharge temporary storage mechanism, which is located between the discharge mechanism and the discharge conveying mechanism. The discharge temporary storage mechanism is used to store the silicon wafers taken from the discharge conveying mechanism by the discharge mechanism, and the discharge mechanism can insert the silicon wafers on the discharge temporary storage mechanism into the discharge basket.

16. The silicon wafer transfer equipment according to claim 15, characterized in that: The material discharging temporary storage mechanism includes a material discharging buffer device and a second lifting mechanism, the second lifting mechanism is installed on the frame, and the second lifting mechanism is used to drive the material discharging buffer device to move up and down along a third direction, the third direction, the first direction and the second direction are perpendicular to each other, and the material discharging buffer device has a plurality of material discharging temporary storage units along the third direction, and each of the material discharging temporary storage units corresponds to storing a silicon wafer.

17. The silicon wafer transfer equipment according to any one of claims 1 to 16, characterized in that: The robot module comprises: A mounting plate, the mounting plate being mounted on the rack; A suction cup component, the suction cup component is movably mounted on the mounting plate, and the suction cup component is used to absorb the silicon wafer; A linear drive module is installed on the mounting plate, and the linear drive module is used to drive the suction cup component to translate relative to the mounting plate along the first direction and along a direction opposite to the first direction.

18. The silicon wafer transfer equipment according to any one of claims 1 to 16, characterized in that: The robot module comprises: Fixed seat; a first suction cup component and a second suction cup component movably connected to the fixing seat, the first suction cup component and the second suction cup component are arranged at intervals on both sides of the fixing seat along the first direction, and the first suction cup component and the second suction cup component do not interfere with each other in a third direction, the third direction, the first direction and the second direction are perpendicular to each other, and the first suction cup component and the second suction cup component are both used for adsorbing silicon wafers; and A third synchronous driving mechanism, wherein the third synchronous driving mechanism connects the first suction cup component and the second suction cup component, and is used for driving one of the first suction cup component and the second suction cup component to translate along the first direction while driving the other of the first suction cup component and the second suction cup component to translate along a direction opposite to the first direction.

19. The silicon wafer transfer equipment according to claim 18, characterized in that: The third synchronous driving mechanism includes a third motor, a third driving wheel, a third driven wheel and a third synchronous belt; The third driving wheel and the third driven wheel are respectively arranged on both sides of the fixing seat, the third synchronous belt is wound around the third driving wheel and the third driven wheel, and the third motor is connected to the third driving wheel; Wherein, the first suction cup component is fixedly connected to a portion of the third synchronous belt located on one side of the third driving wheel and the third driven wheel, the second suction cup component is fixedly connected to a portion of the third synchronous belt located on the other side of the third driving wheel and the third driven wheel, and the third motor is used to drive the third driving wheel to rotate to drive the third synchronous belt to move, thereby driving one of the first suction cup component and the second suction cup component to translate along the first direction while driving the other of the first suction cup component and the second suction cup component to translate along a direction opposite to the first direction.

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