Intelligent watch circuit board with multi-layer board structure

Abstract

The utility model discloses an intelligent watch circuit board with a multilayer board structure, and the circuit board comprises a bottom layer frame, the center of the bottom layer frame is provided with a bottom layer circuit board, and the periphery of the bottom layer frame is provided with a supporting structure; a middle-layer circuit board is arranged in the center of the bottom-layer frame, middle-layer connecting seats corresponding to the middle of the supporting structure are arranged on the periphery of the bottom-layer frame, and the middle-layer frame is arranged above the bottom-layer frame through the middle-layer connecting seats and the middle end of the supporting structure; a top layer circuit board is arranged in the center of the top layer frame, top layer connecting bases corresponding to the top of the supporting structure are arranged on the periphery of the top layer circuit board, and the top layer frame is arranged above the middle layer frame through the top layer connecting bases and the top end of the supporting structure. The utility model relates to a novel structure.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a smart watch circuit board with a multi-layer board structure. Background Art

[0002] In the development of smart watches, with the continuous increase of functions and the continuous improvement of performance, its internal circuit design faces more and more challenges. Traditional circuit board design is difficult to meet the requirements of smart watches for high integration, low power consumption, lightness, thinness, and high stability. These challenges mainly include:

[0003] 1. The contradiction between function and size: With the increase of smart watch functions (such as health monitoring, communication, entertainment, etc.), more electronic components need to be integrated into the circuit board, which requires the circuit board to be highly integrated in an extremely limited space.

[0004] 2. Heat dissipation: As the integration level increases, the heat generated by the circuit board also increases. The compact design of smart watches makes heat dissipation a difficult problem to deal with. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a smart watch circuit board with a multi-layer board structure to solve the problems existing in the background technology.

[0006] The smart watch circuit board of the utility model with a multi-layer board structure is realized by the following technical solutions, including:

[0007] A bottom frame, wherein a bottom circuit board is arranged in the center of the bottom frame, and supporting structures are arranged around the bottom frame;

[0008] A middle frame, wherein a middle circuit board is arranged in the center of the bottom frame, and middle connection seats corresponding to the middle of the supporting structure are arranged around the bottom frame, and the middle frame is arranged above the bottom frame through the middle connection seats and the middle end of the supporting structure;

[0009] A top frame is provided with a top circuit board in the center of the top frame, and top connection seats corresponding to the top of the supporting structure are provided around the top circuit board. The top frame is provided above the middle frame through the top connection seats and the top of the supporting structure.

[0010] As a preferred technical solution, the support structure includes a bottom fixing seat, a middle connecting piece and a top connecting piece;

[0011] The bottom fixing seat is installed around the bottom frame, the middle connecting piece is arranged above the bottom fixing seat, and the top connecting piece is arranged above the middle connecting piece; the middle connecting piece and the top connecting piece are both provided with positioning and locking structures, and the middle connecting seat and the top connecting seat are both fixed by the positioning and locking structures.

[0012] As a preferred technical solution, the positioning and locking structure includes a spring groove and a positioning ball arranged on the middle connecting piece and the top connecting piece;

[0013] The positioning ball is limitedly arranged at the end of the spring groove, and a spring is arranged between the positioning ball and the spring groove, and the positioning ball is squeezed and arranged in the positioning holes of the middle connecting seat and the top connecting seat by the spring.

[0014] As a preferred technical solution, the bottom frame, middle frame and top frame are all provided with installation cavities, and the bottom circuit board, middle circuit board and top circuit board are respectively arranged in the installation cavities of the bottom frame, middle frame and top frame.

[0015] As a preferred technical solution, a silicone ring is provided on the inner side of the installation cavity, and the silicone ring is used to increase the installation stability of the bottom circuit board, the middle circuit board and the top circuit board.

[0016] As a preferred technical solution, there are gaps between the bottom frame, the middle frame and the top frame for heat dissipation.

[0017] The beneficial effects of the utility model are:

[0018] 1. The utility model adopts a layered design of a bottom frame, a middle frame and a top frame, so that the circuit board can be divided according to function, thereby realizing complex electronic circuit design requirements; it is conducive to modular design and improves the overall functionality and flexibility of the circuit board.

[0019] 2. The utility model ensures a stable connection between frames through a supporting structure and a positioning locking structure; it facilitates the installation and removal of circuit boards and enhances the stability and durability of the entire structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 It is a schematic diagram of the explosion structure of the utility model;

[0023] Figure 3 It is a schematic diagram of the connection structure of the utility model.

[0024] Description of reference numerals:

[0025] 1. Bottom frame; 2. Middle frame; 3. Top frame; 4. Bottom circuit board; 5. Middle circuit board; 6. Top circuit board; 7. Support structure; 8. Middle connecting seat; 9. Top connecting seat; 10. Bottom fixing seat; 11. Middle connecting piece; 12. Top connecting piece; 13. Spring slot; 14. Positioning ball; 15. Installation cavity; 16. Silicone ring. DETAILED DESCRIPTION

[0026] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0027] like Figure 1 As shown, a smart watch circuit board of the utility model has a multi-layer board structure, comprising:

[0028] A bottom frame 1, wherein a bottom circuit board 4 is disposed in the center of the bottom frame 1, and a supporting structure 7 is disposed around the bottom frame 1, which makes it possible to connect the subsequent middle and top frames through the supporting structure;

[0029] The middle frame 2, the middle layer circuit board 5 is arranged in the center of the bottom frame 1, which is responsible for processing the middle layer logic and data transmission in the circuit board; and the bottom frame 1 is surrounded by middle layer connection seats 8 corresponding to the middle of the support structure 7, and the middle frame 2 is arranged above the bottom frame 1 through the middle layer connection seats 8 and the middle end of the support structure 7;

[0030] A top-level frame 3, wherein a top-level circuit board 6 is arranged in the center of the top-level frame 3, and the top-level circuit board 6 is responsible for processing the top-level logic and external interface in the circuit board; and top-level connecting seats 9 corresponding to the top of the supporting structure 7 are arranged around the top-level circuit board 6, and the top-level frame 3 is arranged above the middle-level frame 2 through the top-level connecting seats 9 and the top of the supporting structure 7.

[0031] The supporting structure 7 includes a bottom fixing seat 10, a middle connecting piece 11 and a top connecting piece 12;

[0032] The bottom fixing seat 10 is installed around the bottom frame 1, the middle layer connecting piece 11 is arranged above the bottom fixing seat 10, and the top layer connecting piece 12 is arranged above the middle layer connecting piece 11; the middle layer connecting piece 11 and the top layer connecting piece 12 are both provided with positioning and locking structures, and the middle layer connecting seat 8 and the top layer connecting seat 9 are both fixed by the positioning and locking structures.

[0033] In this embodiment, the positioning and locking structure includes a spring groove 13 and a positioning ball 14 arranged on the middle connecting piece 11 and the top connecting piece 12;

[0034] The positioning ball 14 is limitedly set at the end of the spring groove 13, and a spring is set between the positioning ball 14 and the spring groove 13. The positioning ball 14 is squeezed and set in the positioning holes of the middle connecting seat 8 and the top connecting seat 9 through the spring, which can effectively fix the middle connecting seat 8 and the top connecting seat 9 on the middle connecting plate 11 and the top connecting plate 12 of the supporting structure 7.

[0035] In addition, installation cavities 15 are provided on the bottom frame 1, the middle frame 2 and the top frame 3, and the bottom circuit board 4, the middle circuit board 5 and the top circuit board 6 are respectively arranged in the installation cavities 15 of the bottom frame 1, the middle frame 2 and the top frame 3.

[0036] Among them, a silicone ring 16 is arranged on the inner side of the installation cavity 15, and the silicone ring 16 increases the installation stability of the bottom circuit board 4, the middle circuit board 5 and the top circuit board 6; the silicone ring 16 has good elasticity and sealing, and can effectively increase the friction between the circuit board and the installation cavity 15, thereby preventing the circuit board from loosening or falling off during operation.

[0037] In addition, there are gaps between the bottom frame 1, the middle frame 2 and the top frame 3 for heat dissipation, which can effectively reduce the heat generated by the circuit board during operation and ensure the normal operation and stability of the circuit board.

[0038] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A multi-layer structured smart watch circuit board, characterized in that: include: A bottom frame (1), wherein a bottom circuit board (4) is arranged at the center of the bottom frame (1), and support structures (7) are arranged around the bottom frame (1); A middle-layer frame (2), wherein a middle-layer circuit board (5) is arranged at the center of the bottom frame (1), and middle-layer connection seats (8) corresponding to the middle of the support structure (7) are arranged on all four sides of the bottom frame (1), and the middle-layer frame (2) is arranged above the bottom frame (1) through the middle-layer connection seat (8) and the middle end of the support structure (7); A top frame (3), wherein a top circuit board (6) is arranged at the center of the top frame (3), and top connection seats (9) corresponding to the top of the support structure (7) are arranged around the top circuit board (6), and the top frame (3) is arranged above the middle frame (2) through the top connection seat (9) and the top of the support structure (7).

2. The multi-layered circuit board for smart watches according to claim 1, characterized in that: The support structure (7) comprises a bottom fixing seat (10), a middle connecting piece (11) and a top connecting piece (12); The bottom fixing seat (10) is installed around the bottom frame (1), the middle layer connecting piece (11) is arranged above the bottom fixing seat (10), and the top layer connecting piece (12) is arranged above the middle layer connecting piece (11); the middle layer connecting piece (11) and the top layer connecting piece (12) are both provided with a positioning locking structure, and the middle layer connecting seat (8) and the top layer connecting seat (9) are both fixed by the positioning locking structure.

3. The multi-layered circuit board for smart watches according to claim 2, characterized in that: The positioning and locking structure comprises a spring groove (13) and a positioning ball (14) arranged on the middle layer connecting piece (11) and the top layer connecting piece (12); The positioning ball (14) is limitedly arranged at the end of the spring groove (13), and a spring is arranged between the positioning ball (14) and the spring groove (13), and the positioning ball (14) is squeezed and arranged in the positioning holes of the middle connecting seat (8) and the top connecting seat (9) by the spring.

4. The multi-layered smart watch circuit board according to claim 1, characterized in that: The bottom frame (1), the middle frame (2) and the top frame (3) are all provided with mounting cavities (15), and the bottom circuit board (4), the middle circuit board (5) and the top circuit board (6) are respectively arranged in the mounting cavities (15) of the bottom frame (1), the middle frame (2) and the top frame (3).

5. The multi-layered circuit board for smart watches according to claim 4, characterized in that: A silicone ring (16) is provided inside the installation cavity (15), and the silicone ring (16) increases the installation stability of the bottom layer circuit board (4), the middle layer circuit board (5) and the top layer circuit board (6).

6. The multi-layered circuit board for smart watches according to claim 1, characterized in that: There are gaps between the bottom frame (1), the middle frame (2) and the top frame (3) for heat dissipation.

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