Component mounting steel mesh structure

Abstract

The utility model relates to an element mounting steel mesh structure. The element mounting steel mesh structure comprises a printed board, a bonding pad and a steel mesh, wherein the bonding pad is arranged on the printed board; the steel mesh is arranged on the bonding pad, the steel mesh is provided with a tinning area, the tinning area is used for printing solder paste, the tinning area is provided with a to-be-flowed sub-area and a material placing sub-area, and the to-be-flowed sub-area is located on one side of the material placing sub-area. According to the scheme provided by the invention, the undesirable phenomenon of inclination or floating of the element after reflow soldering can be avoided, so that the element can be completely attached to the bonding pad.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit design, in particular to a component mounting steel mesh structure. Background Art

[0002] At present, there are many types of component packaging used in electronic products, which are used in different working environments. Component manufacturers will develop, design and produce according to the shape and packaging parameters specified by the customer, suitable for different needs and scenarios.

[0003] In the related art, the body of some components is not parallel to the pins. Generally, the body of the component is higher than the pins, and the cross-sectional structure of the steel mesh opening is usually rectangular. In this case, when mounting, the components will tilt and float after reflow soldering, so that the pins cannot be completely attached to the pads. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a component mounting steel mesh structure, which can avoid the undesirable phenomenon of components tilting or floating after reflow soldering, so that the components can be completely attached to the pads.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] The first aspect of the present application provides a component mounting steel mesh structure, comprising: a printed circuit board; a solder pad, the solder pad being arranged on the printed circuit board; a steel mesh, the steel mesh being arranged on the solder pad, a tinning area being provided on the steel mesh, the tinning area being used for printing solder paste, the tinning area having a sub-area to be flowed and a material placement sub-area, the sub-area to be flowed being located on one side of the material placement sub-area.

[0007] The material placement sub-area has a hexagonal cross-sectional structure.

[0008] The material placement sub-area is provided with a first side edge, the pad is provided with a second side edge, and the first side edge overlaps with the second side edge.

[0009] The material placement sub-area is provided with a third side edge, the pad is provided with a fourth side edge, and the third side edge overlaps with the fourth side edge.

[0010] The material placement sub-area is provided with a fifth side edge, the pad is provided with a sixth side edge, and the fifth side edge overlaps with the sixth side edge.

[0011] The length of the fifth side is in the range of 0.4 mm to 0.5 mm.

[0012] The material placement sub-area is provided with a seventh side edge, the pad is provided with an eighth side edge, and the seventh side edge overlaps with the eighth side edge.

[0013] The distance from the fifth side to the seventh side ranges from 0.325 mm to 0.032 mm.

[0014] The sub-region to be flowed has a triangular cross-sectional structure.

[0015] The fifth side and the seventh side are parallel to each other.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] By setting up a sub-area to be flowed and a sub-area to be placed, solder paste is placed in the sub-area to be placed, and components are mounted on the printed board and then soldered by the reflow soldering equipment. The solder paste is melted by the heat conduction principle of the reflow temperature so that the solder paste flows into the sub-area to be flowed. Due to the filling of the solder paste, the pins of the components can be kept horizontal with the printed board for soldering, avoiding the undesirable phenomenon of component tilting and floating, and making the pins completely fit on the pads. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a structural schematic diagram of a component mounting steel mesh structure in one embodiment of the utility model. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0022] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] In the related art, the body of some components is not parallel to the pins. Generally, the body of the component is higher than the pins, and the cross-sectional structure of the steel mesh opening is usually rectangular. In this case, when mounting, the components will tilt and float after reflow soldering, so that the pins cannot be completely attached to the pads.

[0024] In view of the above problems, an embodiment of the present application provides a component mounting steel mesh structure, which can avoid the undesirable phenomenon of components tilting or floating after reflow soldering, so that they can be completely attached to the pad.

[0025] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0026] See also Figure 1 A component mounting steel mesh structure includes: a printed circuit board 100, a soldering pad and a steel mesh 200, wherein the soldering pad is arranged on the printed circuit board 100; the steel mesh 200 is arranged on the soldering pad, and a tinning area 210 is opened on the steel mesh 200, and the tinning area 210 is used for printing solder paste. The tinning area 210 has a sub-area to be flowed 211 and a material placement sub-area 212, and the sub-area to be flowed 211 is located on one side of the material placement sub-area 212.

[0027] It should be noted that the steel mesh 200 plays a role in making the solder paste shape of the pad the same as the shape of the steel mesh 200. Furthermore, the material placement sub-area 212 has a hexagonal cross-sectional structure, and the flow sub-area 211 has a triangular cross-sectional structure. The material placement sub-area 212 is used to print solder paste. After the printed circuit board 100 is mounted with components, it is soldered by the reflow soldering equipment. The heat conduction principle of the reflow temperature is used to melt the solder paste so that the solder paste flows into the flow sub-area 211. Due to the filling of the solder paste, the pins of the components can be welded in a horizontal state with the printed circuit board, avoiding the undesirable phenomenon of component tilting and floating, so that the pins are completely attached to the pad. Among them, the direction of the arrow is the flow of the solder paste to the flow sub-area 211 after the solder paste melts.

[0028] See also Figure 1In one embodiment, a first side 212a is provided on the placement sub-area 212, a second side is provided on the pad, and the first side 212a overlaps with the second side. Specifically, a third side 212b is provided on the placement sub-area 212, a fourth side is provided on the pad, and the third side 212b overlaps with the fourth side. Specifically, a fifth side 212c is provided on the placement sub-area 212, a sixth side is provided on the pad, and the fifth side 212c overlaps with the sixth side. The length of the fifth side 212c ranges from 0.4mm to 0.5mm. Specifically, a seventh side 212d is provided on the placement sub-area 212, an eighth side is provided on the pad, and the seventh side overlaps with the eighth side. Specifically, the distance from the fifth side 212c to the seventh side 212d ranges from 0.325mm to 0.032mm. Specifically, the fifth side 212c and the seventh side 212d are parallel to each other.

[0029] It should be noted that the placement sub-area 212 is a hexagonal structure, and the solder paste is melted by the temperature change of the reflow soldering, so that the solder paste flows to the sub-area 211 to be flowed. Compared with the traditional rectangular structure, due to the temperature change of the reflow soldering, the solder paste flows unevenly at the pad, resulting in floating or tilting. The amount of solder paste in the present application is accurately calculated through the contact surface between the component and the pad, and the solder paste is made to flow to the sub-area 211 to be flowed through the heat conduction principle of the reflow temperature, so that the solder paste and the component are kept in a horizontal state for welding. Furthermore, the length of the fifth side 212c of the present application and the length from the fifth side 212c to the seventh side 212d can be flexibly adjusted according to the actual components.

[0030] It should also be noted that the present application first places the printed circuit board 100 in the SMT carrier, and the printed circuit board 100 enters the SPI device. The hexagonal steel mesh covers the printed circuit board 100 to print the solder paste. The scraper swings up and down to print the solder paste on the PCB, and the pads on the printed circuit board 100 present the solder paste shape of the hexagonal steel mesh. The printed PCB is checked for the quality of solder paste printing by the SPI device. The placement machine mounts the components on the printed circuit board and detects the component status by the AOI device, and then passes through the reflow soldering equipment for soldering. There are blowers operating at the left and right ends of the reflow soldering equipment, which use the principle of heat conduction to heat and melt the solder paste on the printed circuit board 100. The solder paste on the pad slowly melts with the temperature, according to the solder paste flow conditions: the solder paste flows in the direction of the high temperature end. Furthermore, the solder paste printed on the hexagonal steel screen will expose the copper surface of the pads at the upper and lower corners. The purpose is to use the solder paste to flow to the uncovered pads, i.e., the flow sub-area 112 after melting, so that the pads are evenly coated with solder paste and more area is in contact with the component pins, so that the component pins and the pads remain in a horizontal state for welding and fixing.

[0031] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0032] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A component mounting steel mesh structure, characterized in that: include: Printed circuit boards; A soldering pad, the soldering pad being arranged on the printed circuit board; A steel mesh is arranged on the pad, a tinning area is provided on the steel mesh, the tinning area is used for printing solder paste, the tinning area has a sub-area to be flowed and a material placement sub-area, and the sub-area to be flowed is located on one side of the material placement sub-area.

2. The component mounting steel mesh structure according to claim 1, characterized in that: The material placement sub-area has a hexagonal cross-sectional structure.

3. The component mounting steel mesh structure according to claim 1, characterized in that: The material placement sub-area is provided with a first side edge, the pad is provided with a second side edge, and the first side edge overlaps with the second side edge.

4. The component mounting steel mesh structure according to claim 1, characterized in that: The material placement sub-area is provided with a third side edge, the pad is provided with a fourth side edge, and the third side edge overlaps with the fourth side edge.

5. The component mounting steel mesh structure according to claim 1, characterized in that: The material placement sub-area is provided with a fifth side edge, the pad is provided with a sixth side edge, and the fifth side edge overlaps with the sixth side edge.

6. The component mounting steel mesh structure according to claim 5, characterized in that: The length of the fifth side is in the range of 0.4 mm to 0.5 mm.

7. The component mounting steel mesh structure according to claim 6, characterized in that: The material placement sub-area is provided with a seventh side edge, the pad is provided with an eighth side edge, and the seventh side edge overlaps with the eighth side edge.

8. The component mounting steel mesh structure according to claim 7, characterized in that: The distance from the fifth side to the seventh side ranges from 0.325 mm to 0.032 mm.

9. The component mounting steel mesh structure according to claim 1, characterized in that: The sub-region to be flowed has a triangular cross-sectional structure.

10. The component mounting steel mesh structure according to claim 8, characterized in that: The fifth side and the seventh side are parallel to each other.

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