Electroplated part spot erasing component

Abstract

The electroplated part spot erasing component can erase the interior of a packaging shell of an electronic component, the electroplated part spot erasing component comprises a rod body and a rubber head at the end of the first end of the rod body, the size of the rubber head is matched with the hole diameter of an opening in the packaging shell, the rubber head can enter the interior of the packaging shell conveniently, and therefore the sealing performance of the packaging shell is improved. Wherein the adaptation comprises equal or slightly smaller. When the electroplated part spot erasing component provided by the utility model is used for erasing the interior of an electroplated packaging shell, spots in the packaging shell can be cleaned, subsequent packaging of electrical components is not influenced, and the yield is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating parts cleaning, and in particular to an electroplating parts spot erasing component. Background Art

[0002] Today, with the booming development of military industry and electronics industry, many electronic components need to be plated with nickel and gold, so that the electronic components have bonding and anti-oxidation corrosion functions. After electroplating, the electroplated parts need to have a cleaning process and be dried after cleaning. Most electroplated parts are qualified products after cleaning and drying. A small number of electroplated parts will produce small particles inside and outside the electroplated parts under the action of tiny particles in water and air, which need to be wiped. Usually, the size of electronic components is very small, and their packaging shells are also miniature, so there are many inconveniences when erasing the spots after electroplating of the packaging shell. In the prior art, the outer surface of the packaging shell is generally wiped with a cotton swab during the erasing process to ensure that the appearance of the electroplated parts is beautiful, and the inside of the electroplated parts is not wiped. However, if the spots inside the packaging shell are not wiped, the subsequent packaging operation may be affected, which leads to a low yield rate of many electroplated packaging shells in the prior art. Summary of the invention

[0003] The technical problem to be solved by the present application is that the packaging shell of electronic components in the prior art lacks a component for erasing spots on the inside after electroplating. If the inside of the packaging shell is not erased, there will be residual spots, resulting in a low yield rate. For this reason, the present application provides a spot erasing component for electroplated parts.

[0004] The technical solution of the present application provides a spot erasing component for electroplated parts, wherein the electroplated parts include a packaging shell of an electronic component after electroplating, and the component includes:

[0005] Rod body;

[0006] A rubber head is arranged at the first end of the rod body, and the size of the rubber head is matched with the aperture of the opening on the packaging shell.

[0007] In some embodiments of the electroplating spot erasing component, the rubber head is an ellipsoid, and the maximum diameter of the ellipsoid is 1.5-3 mm.

[0008] In some schemes, the electroplating spot erasing component described in the invention has a rod body made of stainless steel.

[0009] In some embodiments of the electroplated part spot erasing component, the first end of the rod body is coated with a primer;

[0010] The rubber head is provided with a bonding hole, and the first end of the rod body is inserted into the bonding hole and fixed by bonding with epoxy resin glue.

[0011] In some embodiments of the electroplating spot erasing component, the first end of the rod body is an elbow structure, and the bending angle of the elbow structure is 120°-135°.

[0012] In some embodiments of the electroplating spot erasing component, the rod body includes a telescopic portion.

[0013] In some schemes of the electroplating spot erasing component, the second end of the rod body is sleeved with a silicone sleeve, and the surface of the silicone sleeve is formed with anti-slip patterns.

[0014] The electroplating spot erasing component described in some embodiments further includes:

[0015] A cotton swab head is arranged at the second end of the rod body, and the cotton swab head is used to wipe the outer surface of the packaging shell.

[0016] In some schemes, the electroplating spot erasing component is provided with a silicone sleeve in the middle section, and the surface of the silicone sleeve is formed with anti-slip patterns.

[0017] In some schemes, the electroplating spot erasing component has a first telescopic portion between one side of the silicone sleeve and the rubber head; and a second telescopic portion between the other side of the silicone sleeve and the cotton swab head.

[0018] The above technical solution has the following beneficial effects:

[0019] The present application provides a spot erasing component for electroplating, which can erase the inside of a packaging shell of electronic components. The component includes a rod body and a rubber head at the first end of the rod body. The size of the rubber head is adapted to the aperture of an opening on the packaging shell, so that the rubber head can enter the inside of the packaging shell. The adaptation includes being equal to or slightly smaller than. The spot erasing component for electroplating provided by the present application is used to erase the inside of the packaging shell after electroplating, so that the spots inside the packaging shell can be cleaned up without affecting the subsequent packaging of electrical components, and the yield rate is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of a spot erasing component for electroplating parts according to an embodiment of the present application;

[0021] Figure 2 A schematic diagram of a state in which the electroplating spot erasing component provided in an embodiment of the present application is used to erase the inside of a packaging shell;

[0022] Figure 3 This is a schematic structural diagram of a spot erasing component for electroplating parts according to another embodiment of the present application;

[0023] Figure 4 This is a schematic structural diagram of a spot erasing component for an electroplated part according to another embodiment of the present application.

[0024] The accompanying drawings are denoted as follows:

[0025] 10-rod body; 20-rubber head; 30-encapsulation shell; 40-spot; 50-cotton swab head; 101-elbow structure; 102-telescopic part; 103-silicone sleeve; 1021-first telescopic part; 1022-second telescopic part. DETAILED DESCRIPTION

[0026] The specific implementation of the present application is further described below with reference to the accompanying drawings.

[0027] It is easy to understand that according to the technical solution of the present application, without changing the essential spirit of the present application, a variety of structural modes and implementation modes that can be replaced by those skilled in the art can be replaced with each other. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the present application, and should not be regarded as the entirety of the present application or as a limitation or restriction on the technical solution of the application.

[0028] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to different positions and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0029] The present application embodiment provides a spot erasing component for electroplated parts, wherein the electroplated parts include a packaging shell of an electronic component after electroplating, such as Figure 1 and Figure 2 As shown, the components include a rod body 10 and a rubber head 20. The rod body 10 can be made of a material that is not easy to rust. The rubber head 20 is arranged at the first end of the rod body 10. The size of the rubber head 20 is adapted to the aperture of the opening on the packaging shell 30. The material of the rubber head 20 can be the same as that of ordinary rubber, but the size is reduced, so as to clean up the tiny space. Figure 2As shown, when it is necessary to perform an erasing operation on the interior of the packaging shell 30, one end of the rubber head 20 of the component is extended into the interior of the packaging shell 30 through the opening on the packaging shell, and the rubber head 20 is used to erase the interior to eliminate the spot 40. It can be understood that in actual application scenarios, the spot 40 is located inside. In this solution, it is marked for the sake of clarity. In actual erasing, an electroplating spot erasing component can be used to insert into different openings for erasing operations, and after each erasing, it can be pulled out from the current opening and then inserted into other openings for erasing operations. It is also possible to insert an electroplating spot erasing component into each opening, as shown in the figure, and then pull them all out after the erasing is completed.

[0030] The scheme in the above embodiment can erase the inside of the packaging shell 30 of the electronic components. The components include a rod body 10 and a rubber head 20 at the first end of the rod body. The size of the rubber head 20 is adapted to the aperture of the opening on the packaging shell 30, so that the rubber head 20 can enter the inside of the packaging shell 30. The adaptation includes being equal or slightly smaller. The electroplating spot erasing component provided by the present application is used to erase the inside of the electroplated packaging shell 30, so that the spots 40 inside the packaging shell 30 can be cleaned, which will not affect the subsequent packaging of electrical components, and the yield rate is greatly improved.

[0031] like Figure 1 As shown, the rubber head 20 is preferably an ellipsoid, and the maximum diameter of the ellipsoid is 1.5-3 mm. In a specific implementation, the maximum diameter of the ellipsoid is 2 mm. This size can be easily inserted into the opening of the packaging shell 30.

[0032] Furthermore, the rod body 10 is made of stainless steel. Preferably, it is made of SUS304 stainless steel. Compared with the rod body made of bamboo or wood in the prior art, the rod body 10 provided in the present application will not produce debris or excess materials, thereby reducing the impact on the performance and reliability of electronic components in the purification plant. In addition, bamboo, wood, and paper materials are relatively tough and easily bend with force, and water stains cannot be completely removed, while the stainless steel material provided in the present application can solve the above-mentioned bending problem and avoid rust.

[0033] In some preferred embodiments, Figure 1 As shown, the first end of the rod body 10 is an elbow structure 101, and the bending angle of the elbow structure 101 is 120°-135°. The elbow structure in this solution can increase the stress degree between the rubber head 20 and the inner wall of the packaging shell 10, and can also increase its erasable range.

[0034] In the above scheme, the first end of the rod body 10 is coated with a primer, which is a colorless, solvent-containing liquid with siloxane as the main raw material, and can assist in the bonding between materials such as silicone, rubber and other component materials. The rubber head 20 is provided with a bonding hole, and the first end of the rod body 10 is inserted into the bonding hole and fixed by epoxy resin glue. In a specific implementation, the first end is frosted, and then the primer is coated on the first end to increase the bonding force, and then the rubber head 20 is bonded to the first end using epoxy resin glue.

[0035] In some embodiments, the rod body 10 includes a telescopic portion. Figure 3 As shown, the rod body 10 has a telescopic portion 102, which can change the length of the rod body 10 after being extended or contracted, so that the electroplating spot erasing component can be applied to packaging shells of different depths to perform erasing operations. The telescopic portion 102 can be implemented in the form of a telescopic sleeve, which is also made of stainless steel.

[0036] Some of the electroplated parts described in the scheme include spot erasing parts, such as Figure 3 As shown, the second end of the rod body 10 is sleeved with a silicone sleeve 103, and the surface of the silicone sleeve 103 is formed with anti-slip patterns. The present application solution can facilitate the operator to hold with two fingers during the erasing process, conforms to the ergonomic design, and greatly reduces the labor intensity of the operator.

[0037] Some preferred solutions include Figure 4 As shown, the electroplated part spot erasing component further includes a cotton swab head 50, which is disposed at the second end of the rod body 10, and the cotton swab head 50 is used to wipe the outer surface of the packaging shell 30. The above-mentioned component provided by the present application includes a cotton swab head 50 and a rubber head 20, and the rubber head 20 can be used to erase the inside of the packaging shell 10, and the cotton swab head 50 can be used to erase the outside of the packaging shell 10, or the rubber head 20 and the cotton swab head 50 are used to erase different types of electroplated parts. By increasing the types of erasing heads, it has higher flexibility and application occasions.

[0038] Preferably, if Figure 4 As shown, a silicone sleeve 103 is provided in the middle section of the rod body 10, and the surface of the silicone sleeve 103 is formed with anti-slip textures, and its effect is similar to Figure 3The function of the silicone sleeve in is the same. Further preferably, the telescopic part includes a first telescopic part 1021 and a second telescopic part 1022, and the first telescopic part 1021 and the second telescopic part 1022 are respectively located on both sides of the silicone sleeve 103. The first telescopic part 1021 and the second telescopic part 1022 can be realized by means of a prior telescopic sleeve and the like, and both are made of stainless steel. In the present application, when the rubber head 20 or the cotton swab head 50 is used for erasing operation, the length of the rod body can be adjusted. When the head in one direction is used for erasing, the telescopic part in the other direction is shortened to the shortest. For example, when using the rubber head 20, the first telescopic part 1021 is extended and the second telescopic part is shortened to the shortest, which is convenient for the operator to use.

[0039] As needed, the above technical solutions can be combined to achieve the best technical effect.

[0040] The above are only the principles and preferred embodiments of the present application. It should be noted that, for ordinary technicians in this field, on the basis of the principles of the present application, several other modifications can be made, which should also be considered as the protection scope of the present application.

Claims

1. A spot erasing component for electroplating parts, characterized in that: The electroplated part includes a packaging shell of an electroplated electronic component, and the part includes: Rod body; A rubber head is arranged at the first end of the rod body, and the size of the rubber head is matched with the aperture of the opening on the packaging shell.

2. The electroplating spot erasing component according to claim 1, characterized in that: The rubber head is an ellipsoid, and the maximum diameter of the ellipsoid is 1.5-3 mm.

3. The electroplating spot erasing component according to claim 1, characterized in that: The rod body is made of stainless steel.

4. The electroplating part spot erasing component according to claim 1, characterized in that: The first end of the rod body is coated with a primer; The rubber head is provided with a bonding hole, and the first end of the rod body is inserted into the bonding hole and fixed by bonding with epoxy resin glue.

5. The electroplating spot erasing component according to claim 4, characterized in that: The first end of the rod body is an elbow structure, and the bending angle of the elbow structure is 120°-135°.

6. The electroplating spot erasing component according to claim 5, characterized in that: The rod body includes a telescopic portion.

7. The electroplating part spot erasing component according to any one of claims 1 to 6, characterized in that: The second end of the rod body is sleeved with a silicone sleeve, and the surface of the silicone sleeve is formed with anti-slip patterns.

8. The electroplating part spot erasing component according to any one of claims 1 to 6, characterized in that: Also includes: A cotton swab head is arranged at the second end of the rod body, and the cotton swab head is used to wipe the outer surface of the packaging shell.

9. The electroplating spot erasing component according to claim 8, characterized in that: A silicone sleeve is arranged in the middle section of the component, and a surface of the silicone sleeve is formed with anti-slip patterns.

10. The electroplating spot erasing component according to claim 9, characterized in that: A first telescopic portion is provided between one side of the silicone sleeve and the rubber head; A second telescopic portion is provided between the other side of the silicone sleeve and the cotton swab head.

Images