Clamp and equipment for testing DIP ceramic sealing chip

By designing a fixture for DIP ceramic-sealed chips and using spring pins to penetrate the pads at the root of the chip pins, the problem of inaccurate testing of DIP ceramic-sealed chips in the existing technology has been solved, and efficient and accurate test results have been achieved.

CN222379761UActive Publication Date: 2025-01-21CHONGQING GIGACHIP TECH CO LTD
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Patent Information

Application Number
CN202420841385.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-22
Publication Date
2025-01-21
Estimated Expiration
2034-04-22

AI Technical Summary

Technical Problem

The existing technology cannot effectively test the DIP ceramic seal chip, resulting in the chip pins being easily scratched, affecting the accuracy of the test results.

Method used

A fixture for testing DIP ceramic-sealed chips is designed, using spring pins to directly penetrate the pads at the root of the chip pins to achieve stable and accurate contact and reduce chip appearance damage.

Benefits of technology

This fixture can effectively reduce the appearance damage of DIP ceramic chips, improve testing efficiency and accuracy, and is suitable for automated testing and manual testing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a fixture and equipment for testing a DIP ceramic seal chip, the fixture comprises a fixture base body and a spring needle, the fixture base body comprises a protection plate in the middle and base body parts connected to two ends of the protection plate, two rows of jacks are arranged on two sides of the protection plate, positioning pins for positioning a test plate are arranged on the base body parts, and the spring needle is arranged on the spring needle. The protection plate is provided with a plurality of mounting holes for mounting the test plate; and one end of the spring needle is inserted into the jack and is fixed through the protection plate, and the other end of the spring needle is inserted into a bonding pad at the root part of a chip pin to test the chip. Compared with the prior art, the clamp for testing the DIP ceramic-sealed chip has the advantages that the spring needle extends into the bonding pad at the root of the chip pin to test the chip, and the clamp is simple in structure, easy to manufacture and good in application prospect.
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Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit technology automatic testing, in particular to a fixture and equipment for testing a DIP ceramic package chip. Background Art

[0002] Integrated circuit chip test fixtures play an irreplaceable and important role in the manufacturing and testing process of chips. The chip is placed in the test fixture. By connecting to a PC, a device for testing DIP ceramic chips, the test fixture can effectively connect the chip to the test system and test and analyze the chip to ensure the electrical function and electrical performance of the chip, and avoid damage to the chip appearance as much as possible during the test process.

[0003] The packaging materials of DIP (dual in-line package) chips are divided into two categories: plastic and ceramic. The operating temperature of plastic chips is about 0 to 125°C, while the operating temperature of ceramic chips is about -55°C to 250°C. Since the mainstream DIP package on the market is plastic, the current automated testing equipment is designed for plastic DIP chips, mainly gravity sorting machines and turret sorting machines. These two types of testing equipment cannot perform three-temperature tests on DIP packages. The current translational three-temperature sorting machine uses a machine-tested DIP fixture to test the chip by clamping the chip pins. When the robot arm takes and places the circuit, it is easy to cause friction and extrusion between the chip pins and the fixture reed, so that the chip pins are scratched, which will subsequently cause the chip to fail the appearance inspection, which is very unfavorable for the smooth production of the chip. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a fixture for testing DIP ceramic chips, which is used to solve the problem that there is no dedicated fixture for testing DIP ceramic chips in the prior art, and the chip is easily scratched during the test using a universal fixture.

[0005] In order to achieve the above purpose and other related purposes, the technical solution of the utility model is as follows:

[0006] A fixture for testing a DIP ceramic package chip, comprising:

[0007] Optionally, a fixture base, the fixture base includes a protective plate in the middle and a base part connected to both ends of the protective plate, two rows of jacks are arranged on both sides of the protective plate, a positioning pin for positioning the test board is arranged on the base part, and a plurality of mounting holes for mounting the test board are arranged on the protective plate;

[0008] A spring pin, one end of which is inserted into the jack and fixed by a protection plate, and the other end of which is used to penetrate into the pad at the root of the chip pin to test the chip.

[0009] Optionally, the positioning pins are arranged on the lower end surface of the base portion, and the positioning pins on the two base portions are symmetrically arranged.

[0010] Optionally, a positioning hole is provided on the upper end surface of the base portion, and the positioning holes on the two base portions are staggered.

[0011] Optionally, the base portion is provided with a pin hole, the pin hole is a stepped hole, and the positioning pin is arranged in the pin hole.

[0012] Optionally, the width of the protection plate is consistent with the width of the chip, and the clamp base is a clamp base made of insulating material.

[0013] Optionally, a manual test cover is further included, which covers the fixture in the length direction and is used for manually testing the chip.

[0014] Optionally, an isolation gate is further included, wherein the isolation gate is located on both sides of the protection plate, and the isolation gate is used to separate the pins of the chip.

[0015] Optionally, the isolation grille and the base portion are integrally provided.

[0016] Optionally, the spring needle includes a metal sleeve, a spring, and a needle. The needle is installed in the metal sleeve by sliding. The metal sleeve is used to be inserted into the socket. The needle is used to pierce the pad at the root of the chip pin to test the chip.

[0017] Correspondingly, the utility model also provides a device for testing a DIP ceramic package chip, comprising:

[0018] A fixture for testing a DIP ceramic chip, wherein the fixture for testing a DIP ceramic chip is any of the fixtures for testing a DIP ceramic chip described above.

[0019] A test board, wherein the fixture for testing the DIP ceramic chip is equipped on the test board;

[0020] A test machine, wherein the test board is installed on the test machine to send a test signal to the chip;

[0021] A chip sorter, the chip sorter is used to sort the chips and pick and place the chips on the fixture for testing the DIP ceramic chip;

[0022] A host computer is connected to the chip sorting machine and the test machine respectively, and sends communication instructions to the chip sorting machine and the test machine respectively.

[0023] In the utility model, a fixture for testing DIP ceramic sealed chips is arranged on a device for testing DIP ceramic sealed chips, the DIP ceramic sealed chips are installed by the fixture for testing DIP ceramic sealed chips, and the DIP ceramic sealed chips are tested by the device for testing DIP ceramic sealed chips. When installing the DIP ceramic sealed chips, one of the fixtures for testing DIP ceramic sealed chips uses spring needles to directly pierce the pads at the root of the DIP ceramic sealed chip package to test the DIP ceramic sealed chips, which can achieve stable and accurate contact, greatly reducing the damage to the appearance of the DIP ceramic sealed chips, and improving the test efficiency of the DIP ceramic sealed chips, ensuring the accuracy of the test results of the DIP ceramic sealed chips. Compared with the prior art, in the present solution, a fixture for testing DIP ceramic sealed chips is used to test the chips by inserting spring needles into the pads at the root of the chip pins. The structure is simple, easy to manufacture, and has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of an exemplary DIP ceramic chip of the present invention;

[0025] Figure 2 This is a schematic structural diagram of an exemplary fixture for testing a DIP ceramic chip of the present invention;

[0026] Figure 3 It is a side view of an exemplary fixture for testing DIP ceramic package chips of the utility model;

[0027] Figure 4 This is a schematic structural diagram of an exemplary fixture for testing a DIP ceramic chip of the utility model, in which a DIP ceramic chip is assembled;

[0028] Figure 5 This is another exemplary structural diagram of a fixture for testing a DIP ceramic package chip of the present invention;

[0029] Figure 6 This is a structural schematic diagram of another exemplary fixture for testing DIP ceramic package chips of the present invention;

[0030] Figure 7 The present invention is a schematic structural diagram of an exemplary device for testing a DIP ceramic package chip.

[0031] The description of the reference numerals in the embodiments includes:

[0032] DIP package chip 10, pin 11,

[0033] The fixture base 20, the protection plate 21, the base part 22, the spring pin 23, the pin hole 24, the positioning pin 25, the positioning hole 26, the mounting hole 27, the hand measurement cover 28, the isolation fence 29,

[0034] Test board 30 , test machine 31 , host computer 32 , chip sorting machine 33 . DETAILED DESCRIPTION

[0035] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.

[0036] It should be understood that the utility model can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete, and fully convey the scope of the utility model to those skilled in the art. In the accompanying drawings, the same reference numerals represent the same components throughout.

[0037] In the utility model, a fixture for testing a DIP ceramic chip is a part of a device for testing a DIP ceramic chip. The fixture for testing a DIP ceramic chip is used to install the DIP ceramic chip so that the DIP ceramic chip can be tested on the device for testing the DIP ceramic chip. Figure 1 As shown, a specific structure of a device for testing DIP ceramic chips, combined with reference to Figure 7 As shown, it includes a fixture for testing DIP ceramic chips, a test board 30, a test machine 31, a chip sorter 33 and a host computer 32. The fixture for testing DIP ceramic chips can be a fixture for testing DIP ceramic chips in any of the following embodiments. The fixture for testing DIP ceramic chips is equipped on the test board 30; the test board 30 is installed on the test machine 31 to send a test signal to the chip; the chip sorter 33 is used to sort the chip and take and place the chip on the fixture for testing DIP ceramic chips; the host computer 32 is connected to the chip sorter 33 and the test machine 31 respectively, and sends communication instructions to the chip sorter 33 and the test machine 31 respectively.

[0038] Specifically, in the actual implementation process, a fixture for testing DIP ceramic package chips is installed on a test board 30 (PCB), and the test board 30 is installed on an ATE test machine 31; the translational three-temperature chip sorter 33 takes and places the chip through the negative pressure suction head on the mechanical arm, and the chip is sucked and placed in the fixture during the test. The chip is connected to the test board 30 through the fixture, and the test equipment is used to apply a test signal to the spring pin 23 by an automated test equipment to test the DIP package components. The test equipment can also be an electronic test instrument, and the test screening is performed manually.

[0039] The specific structure of the fixture for testing DIP ceramic chip in the utility model is combined with reference to Figures 2 to 4 A fixture for testing a DIP ceramic chip comprises:

[0040] A fixture base 20, the fixture base 20 includes a protective plate 21 in the middle and a base part 22 connected to both ends of the protective plate 21, two rows of jacks are provided on both sides of the protective plate 21, a positioning pin 25 for positioning the test board 30 is provided on the base part 22, and a plurality of mounting holes 27 for mounting the test board 30 are provided on the protective plate 21;

[0041] A spring pin 23, one end of which is inserted into the jack and fixed by the protection plate 21, and the other end of which is used to penetrate into the pad at the root of the chip pin 11 to test the chip.

[0042] The fixture base 20 is made of insulating materials (such as plastics, ceramics, etc.) with good insulation performance and stability, including but not limited to PEEK+ceramic composite materials, PEI materials, etc. The shape and size of the fixture base 20 are designed according to the size and shape of the DIP ceramic chip. The position and number of the jacks are determined according to the position and number of the pads of the DIP ceramic chip, and the size and depth of the jacks are determined according to the selection of the spring pins 23.

[0043] In the actual implementation process, a fixture for testing DIP ceramic sealed chips uses a spring needle 23 to directly pierce the pad at the root of the DIP ceramic sealed chip package to test the DIP ceramic sealed chip when installing the DIP ceramic sealed chip, which can achieve stable and accurate contact, greatly reducing the damage to the appearance of the DIP ceramic sealed chip, and improving the test efficiency of the DIP ceramic sealed chip, ensuring the accuracy of the test results of the DIP ceramic sealed chip. The fixture in this solution can conveniently perform automated testing of DIP ceramic sealed chips, improve test efficiency, reduce labor costs, and improve the accuracy of test results. At the same time, the fixture in this solution is simple and practical in design, easy to implement, stable in structure, and durable, and can meet the needs of large-scale production, and can be widely used in the testing of various DIP packaged chips 10.

[0044] In some embodiments, the positioning pins 25 are disposed on the lower end surface of the base portion 22, and the positioning pins 25 on the two base portions 22 are symmetrically disposed. Figure 3 The positioning pins 25 shown are used to guide the assembly of the protection plate 21 and the assembly between the fixture and the test plate 30. The number and size of the positioning pins 25 are determined according to actual needs. If foolproofing is required, positioning pins 25 of different sizes can be used.

[0045] In some embodiments, the upper end surface of the base portion 22 is provided with a positioning hole 26, and the positioning holes 26 on the two base portions 22 are staggered. Figure 2 , Figure 4 As shown, the positioning holes 26 can assist in the assembly between the fixture and the test board 30 .

[0046] In some embodiments, the base portion 22 is provided with a pin hole 24, the pin hole 24 is a stepped hole, and the positioning pin 25 is disposed in the pin hole 24. For example, Figure 2 , Figure 4 As shown, the pin hole 24 facilitates the installation and setting of the positioning pin 25 and facilitates the use of the positioning pin 25.

[0047] In some embodiments, the width of the protection plate 21 is consistent with the width of the chip, and the clamp base 20 is a clamp base 20 made of insulating material. For example, Figures 2 to 4 As shown, the protection plate 21 is used to install the spring pins 23, and its width corresponds to the chip, so it is convenient to assemble the two.

[0048] In some embodiments, a manual test cover 28 is further included, and the manual test cover 28 covers the fixture from the length direction, and the manual test cover 28 is used to perform manual testing on the chip. Figure 5 As shown, when the fixture is used, if manual testing and screening is performed, the hand test cover 28 can be used in conjunction with it.

[0049] In some embodiments, an isolation gate 29 is further included. The isolation gate 29 is located on both sides of the protection plate 21. The isolation gate 29 is used to separate the pins 11 of the chip. For example, Figure 6 As shown, the isolation barrier 29 is used to separate the chip pins 11 to prevent short circuits caused by the staggered pins 11.

[0050] In some embodiments, the isolation grid 29 and the base are integrally formed. Figure 6 As shown, the isolation grid 29 and the base portion are integrally arranged to make the clamp base 20 more stable.

[0051] In some embodiments, the spring needle 23 includes a metal sleeve, a spring, and a needle. The needle is installed in the metal sleeve by sliding. The metal sleeve is used to be inserted into the jack. The needle is used to pierce the pad at the root of the chip pin 11 to test the chip. For example, Figure 2 , Figure 3 As shown, the spring pin 23 is composed of a spring, a metal sleeve, and a needle head, and has good elasticity and conductivity. One end of the spring pin 23 is inserted into the spring pin 23 jack and fixed with a protective plate 21, and the other end forms a test needle tip, which is directly inserted into the gold-plated pad on the inner side of the root of the DIP ceramic chip pin 11. The installation of the spring pin 23 is to insert the spring pin 23 into the jack, ensure that the test needle tip of the spring pin 23 can accurately pierce the pad at the root of the DIP ceramic chip, assemble the protective plate 21 on the fixture along the positioning pin 25, and fix it with screws; the downward stroke of the spring pin 23 can be adjusted to make the test needle tip contact with the pad best.

[0052] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A fixture for testing DIP ceramic chip, characterized in that: include: A fixture base, the fixture base comprising a protective plate in the middle and a base part connected to both ends of the protective plate, two rows of jacks are arranged on both sides of the protective plate, a positioning pin for positioning the test plate is arranged on the base part, and a plurality of mounting holes for mounting the test plate are arranged on the protective plate; A spring pin, one end of which is inserted into the jack and fixed by a protection plate, and the other end of which is used to penetrate into the pad at the root of the chip pin to test the chip.

2. A fixture for testing a DIP ceramic chip according to claim 1, characterized in that: The positioning pins are arranged on the lower end surface of the base part, and the positioning pins on the two base parts are symmetrically arranged.

3. A fixture for testing a DIP ceramic chip according to claim 1, characterized in that: The upper end surface of the base part is provided with a positioning hole, and the positioning holes on the two base parts are staggered.

4. A fixture for testing a DIP ceramic chip according to claim 2, characterized in that: The base portion is provided with a pin hole, the pin hole is a stepped hole, and the positioning pin is arranged in the pin hole.

5. The fixture for testing a DIP ceramic chip according to claim 3, characterized in that: The width of the protection plate is consistent with the width of the chip, and the clamp base is a clamp base made of insulating material.

6. A fixture for testing a DIP ceramic chip according to claim 1, characterized in that: It also includes a manual test cover, which covers the fixture from the length direction and is used for manual testing of the chip.

7. A fixture for testing a DIP ceramic chip according to claim 1, characterized in that: It also includes an isolation gate, which is located on both sides of the protection plate and is used to separate the pins of the chip.

8. The fixture for testing a DIP ceramic chip according to claim 7, characterized in that: The isolation grid and the base portion are integrally arranged.

9. The fixture for testing a DIP ceramic chip according to claim 1, characterized in that: The spring needle comprises a metal sleeve, a spring and a needle. The needle is installed in the metal sleeve by sliding. The metal sleeve is used to be inserted into the jack. The needle is used to pierce the pad at the root of the chip pin to test the chip.

10. A device for testing DIP ceramic chip, characterized in that: include A fixture for testing a DIP ceramic chip, wherein the fixture for testing a DIP ceramic chip is a fixture for testing a DIP ceramic chip according to any one of claims 1 to 9. A test board, wherein the fixture for testing the DIP ceramic chip is equipped on the test board; A test machine, wherein the test board is installed on the test machine to send a test signal to the chip; A chip sorter, the chip sorter is used to sort the chips and pick and place the chips on the fixture for testing the DIP ceramic chip; A host computer is connected to the chip sorting machine and the test machine respectively, and sends communication instructions to the chip sorting machine and the test machine respectively.