Anti-edging chip material box

Abstract

The utility model relates to the technical field of semiconductor chip storage equipment, and particularly discloses an anti-edge-grinding chip material box which comprises a material box body, and through grooves are formed in the inner walls of the two sides of the material box body in the length direction; the number of the through grooves is multiple, and a bearing piece is formed between every two adjacent through grooves in the vertical direction; a supporting strip is arranged above the bearing piece; and the supporting strips are located at the ends, away from the inner wall of the material box body, of the bearing pieces, the tops of the supporting strips are chamfered, and the two supporting strips located on the same horizontal plane bear the chip substrate. The supporting strips are arranged on the bearing piece between the two adjacent through grooves, after the supporting strips are chamfered, surface contact between the supporting strips and the chip substrate is changed into line contact, and abrasion between the chip substrate and the bearing piece is reduced; and meanwhile, the chip substrate is suspended and slightly bent under the action of gravity, and the edge of the chip substrate is far away from the through groove, so that the possibility that the edge of the chip substrate is in contact with the through groove is reduced, and the problem that the chip substrate is easy to wear in the material box is solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip storage devices, and more specifically, to an anti-edge wear chip material box. Background Art

[0002] During the chip processing and production process, the chip substrate needs to be transported to different processing jigs for processing, and the transport carrier of the chip substrate is a chip material box. The chip material box generally includes a box body, and the two end faces of the box body are open in the length direction. A slide groove is opened on the inner wall of the box body, so that the convex strip between two adjacent slide grooves on the inner wall of the box body serves as a supporting member. The chip substrate selects a slide groove at a suitable position at the opening and slides into the box body. The edge of the chip substrate overlaps the supporting member, and the supporting member supports the chip substrate.

[0003] However, the above chip material box still has the following defects during use: since the chip substrate is changed from the original stamping process to the corrosion cutting process, many burrs are generated on the edge of the copper frame of the chip, which rub against the supporting parts, and it is easy for copper wire to fall onto the chip, causing a short circuit. Utility Model Content

[0004] In order to solve the problem that the chip substrate is easily worn in the material box, the present application provides an anti-edge wear chip material box.

[0005] The present application provides an anti-edge wear chip box, which adopts the following technical solution:

[0006] An anti-edge wear chip box, comprising:

[0007] The material box body has through grooves on the inner walls of both sides along the length direction;

[0008] A plurality of through grooves are provided, and a supporting member is formed between two adjacent through grooves in the vertical direction;

[0009] A supporting member, with a supporting bar disposed on the top;

[0010] The support bar is located at the end of the supporting member away from the inner wall of the material box body. The top of the support bar is chamfered, and two support bars located on the same horizontal plane support the chip substrate.

[0011] Furthermore, one end of the through slot close to the inner wall of the material box body is arc-shaped.

[0012] Furthermore, the vertical distance between two adjacent through grooves is 5 to 7 mm.

[0013] Furthermore, the width of the through slot is 1.5±0.1 mm.

[0014] Furthermore, the chamfer angle of the support bar is 30±15°.

[0015] Furthermore, the height of the support bar is 0.3±0.1 mm.

[0016] In summary, this application has at least the following advantages:

[0017] First, the present application arranges a support bar on the supporting member between two adjacent through grooves. After the support bar is chamfered, the contact area between the support bar and the chip substrate is small, and the surface contact between the support bar and the chip substrate is changed to line contact, thereby reducing the wear between the chip substrate and the supporting member; at the same time, the chip substrate is suspended in the air and slightly bends under the action of gravity, and the edge of the chip substrate is away from the through groove, thereby reducing the possibility of the edge of the chip substrate contacting the through groove, thereby solving the problem of easy wear of the chip substrate in the material box.

[0018] Second, in the present application, the arc-shaped setting at one end of the through groove increases the opening depth of the through groove in the horizontal direction, and the groove wall of the through groove is further away from the edge of the chip substrate, thereby further reducing the possibility of contact between the edge of the chip substrate and the through groove.

[0019] Second, the present application optimizes the slot width of the through slot and the spacing between adjacent through slots to ensure that the chip substrate can enter the through slot smoothly. At the same time, the upper surface of the chip substrate does not contact the slot wall of the through slot, thereby ensuring the quality of the chip substrate; and, as many chip substrates as possible can be placed in the material box body.

[0020] Third, the chamfer angle and height of the support bar are optimized in the present application, so that the chip substrate can be stably placed on the support bar, while further reducing the possibility of the edge and upper surface of the chip substrate contacting the through groove wall. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of the anti-edge wear chip box shown in Example 1 of the present application when viewed from the side.

[0022] Figure 2 for Figure 1 A magnified schematic diagram.

[0023] Reference numerals:

[0024] 1. Material box body; 2. Through slot; 3. Supporting member; 4. Support bar; 41. Chamfer. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical scheme and advantages of the utility model clearer, the device proposed in the utility model is further described in detail below in combination with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings adopt a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated by the accompanying drawings of this specification are only used to match the content disclosed in the specification, so that people familiar with this technology can understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should fall within the scope of the technical content disclosed by the utility model.

[0026] Example

[0027] Example 1

[0028] See also Figure 1 and Figure 2 A chip material box with anti-edge wear comprises a material box body 1, both sides of the material box body 1 in the width direction are open, and the chip substrate enters the material box from the open; through grooves 2 are provided on the inner walls on both sides in the length direction of the material box body 1, and a plurality of through grooves 2 are arranged along the length direction of the material box body 1; in the vertical direction, a supporting member 3 is formed between two adjacent through grooves 2; a supporting bar 4 is integrally formed at the end of the supporting member 3 away from the inner wall of the material box body 1, and two supporting bars 4 at the same horizontal position lift the chip substrate, reduce the possibility of contact between the edge of the chip substrate and the through groove 2, and reduce the possibility of wear on the edge of the chip substrate; at the same time, the chip substrate is changed from surface contact to line contact, reducing the possibility of wear on the surface of the chip substrate.

[0029] See also Figure 1 and Figure 2 One end of the through slot 2 close to the inner wall of the material box body 1 is arc-shaped. The arc-shaped setting increases the opening depth of the through slot 2 in the horizontal direction, and the slot wall of the through slot 2 is further away from the edge of the chip substrate, thereby further reducing the possibility of contact between the edge of the chip substrate and the through slot 2.

[0030] See also Figure 1 In the vertical direction, the spacing between the through slots 2 determines the number of chip substrates that can be installed in each chip material box. The spacing between two adjacent through slots 2 is 5 to 7 mm. Controlling the thickness within this range can not only ensure a large number of chip substrates to be installed, but also ensure that there is no contact between two adjacent chip substrates, thereby ensuring the quality of the chip substrates.

[0031] See also Figure 1 The slot width of the through slot 2 is 1.5±0.1mm. Within this width range, the chip substrate can be smoothly inserted into the through slot 2. At the same time, the upper surface of the chip substrate does not contact the slot wall of the through slot 2, thereby ensuring the quality of the chip substrate; it can also ensure that the number of chip substrates installed can be increased as much as possible.

[0032] See also Figure 2 The top of the support bar 4 is chamfered 41, and the degree of the chamfer 41 is 30±15°. The angle of the chamfer 41 determines the contact area between the support bar 4 and the chip substrate. Within this angle range, the chip substrate can be stably mounted on the support bar 4, and the contact area between the chip substrate and the support bar 4 can be reduced, thereby ensuring that the chip substrate can be stably placed in the chip material box and reducing the possibility of chip substrate wear, thereby ensuring the quality of the chip substrate.

[0033] See also Figure 2 The height of the support bar 4 is 0.3±0.1 mm. When the height of the support bar 4 is controlled within this range, it can ensure that the edge and upper surface of the chip substrate are away from the groove wall of the through groove 2, and can also ensure that the chip substrate is stably placed on the support bar 4.

[0034] The working principle of Example 1 of the present application is as follows: the chip substrate enters the material box from the opening, the chip substrate passes through the through groove 2, and the edge and the upper surface are away from the groove wall of the through groove 2, and is stably placed in the chip material box.

[0035] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0036] Moreover, the above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. An anti-edge wear chip box, comprising: The material box body (1) has through grooves (2) formed on the inner walls of both sides along the length direction; A plurality of through grooves (2) are provided, and a supporting member (3) is formed between two adjacent through grooves (2) in the vertical direction; The invention is characterized in that a support bar (4) is arranged on the supporting member (3); The support bar (4) is located at the end of the supporting member (3) away from the inner wall of the material box body (1), the top of the support bar (4) is chamfered (41), and the two support bars (4) located on the same horizontal plane support the chip substrate.

2. The anti-edge wear chip box according to claim 1, characterized in that: One end of the through groove (2) close to the inner wall of the material box body (1) is arc-shaped.

3. The anti-edge wear chip box according to claim 1, characterized in that: The vertical distance between two adjacent through grooves (2) is 5 to 7 mm.

4. The anti-edge wear chip box according to claim 1, characterized in that: The slot width of the through slot (2) is 1.5±0.1 mm.

5. The anti-edge wear chip box according to claim 1, characterized in that: The chamfer (41) of the support bar (4) has a degree of 30±15°.

6. The anti-edge wear chip box according to claim 1, characterized in that: The height of the support bar (4) is 0.3±0.1 mm.

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