PCB (Printed Circuit Board) spot welding equipment
By designing automated PCB circuit board spot welding equipment, we solve the problem of low production efficiency caused by manual welding in the existing technology, realize automated welding, significantly shorten production time and improve efficiency.
Patent Information
- Application Number
- CN202420222074.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-01-30
AI Technical Summary
In the prior art, the production of circuit boards relies on manual welding, resulting in a long production time and reducing production efficiency.
Design a PCB circuit board spot welding equipment. The substrate is transferred into the groove through the loading mechanism. The linear drive component drives the sliding plate to slide, driving the substrate to move under the welding mechanism. The loading mechanism transfers the electrical components to the substrate. The welding mechanism Solder the pins of the electrical components to the base board.
The production time was shortened, the production efficiency was improved, the automated welding was achieved, and the time and error rate of manual operation were reduced.
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Figure CN222386080U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board spot welding, in particular to a PCB circuit board spot welding device. Background Art
[0002] The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Figure 6 The diagram shows a schematic diagram of the structure of a circuit board, which includes a substrate 801 and an electronic component 802. During the production process, the electronic component 802 needs to be spot-welded on the substrate 801 using tin liquid.
[0003] In the prior art, the production of the circuit board is performed by manual soldering. A worker first fixes the substrate 801, then places the electronic component 802 on the substrate 801, and solders the pins of the electronic component 802 to the substrate 801 using a soldering pen. However, manual soldering takes a long time to produce, which greatly reduces production efficiency. Utility Model Content
[0004] The purpose of the utility model is to provide a PCB circuit board spot welding device in view of the deficiencies in the prior art, wherein a substrate is transferred into a groove by a feeding mechanism, a linear drive member a drives a slide plate to slide on a guide rail a, and drives the substrate to move under a welding mechanism, the feeding mechanism transfers electrical components to the substrate, and the welding mechanism solders the pins of the electrical components to the substrate, thereby shortening the production time and improving the production efficiency.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A PCB circuit board spot welding device comprises a workbench, a guide rail a is arranged on the workbench, a slide plate is slidably arranged on the guide rail a, a groove is arranged in the slide plate, and a feeding mechanism and a welding mechanism are arranged on one side of the workbench;
[0007] The feeding mechanism includes: a mounting frame, which is installed on the ground; a material collection box a, which is installed on the mounting frame; a guide rail b, which is arranged above the workbench; a sliding block, which is slidably arranged on the guide rail b; a linear drive member f, which is installed on the sliding block; and an adsorption plate, which is installed at the output end of the linear drive member f.
[0008] A fixing plate is installed on the workbench, a linear driving member a is installed on the fixing plate, and an output end of the linear driving member a is connected to the slide plate.
[0009] The feeding mechanism also includes: a fixed frame a, which is installed on the workbench; a discharge box, which is installed on the fixed frame a; a connecting frame, which is installed on the fixed frame a; a linear drive member b, which is installed on the connecting frame; a push plate, which is installed on the output end of the linear drive member b; and a guide plate, which is installed on the bottom of the discharge box, and a through groove is opened in the discharge box.
[0010] The welding mechanism includes: a fixed frame b, which is installed on the workbench; a linear drive member c, which is installed on the fixed frame b; a moving block, which is installed on the output end of the linear drive member c; a linear drive member d, which is installed on the moving block; and a tin spray nozzle, which is installed on the output end of the linear drive member d.
[0011] A pressing assembly is installed on the slide plate, and the pressing assembly presses the electrical component into the groove.
[0012] The clamping assembly includes: a connecting seat, which is installed on the slide; a rotating driving member e, which is installed on the connecting seat; a swing rod, which is installed on the output end of the rotating driving member e; and a pressing block, which is installed on the swing rod.
[0013] The beneficial effects of the utility model are:
[0014] (1) The utility model transfers the substrate into the groove through the feeding mechanism, and the linear driving member a drives the slide plate to slide on the guide rail a, driving the substrate to move under the welding mechanism. The feeding mechanism transfers the electrical components to the substrate, and the welding mechanism solders the pins of the electrical components to the substrate, thereby shortening the production time and improving the production efficiency.
[0015] (2) A plurality of stacked electrical components are placed in the discharge box of the utility model. The linear drive member b drives the push plate to push the electrical components at the bottom of the discharge box to the top of the substrate in the groove through the guide plate, so as to facilitate welding of the electrical components and the substrate.
[0016] (3) The utility model places a plurality of stacked substrates in a material collection box a, and the sliding block slides on the guide rail b until the adsorption plate moves to the top of the material collection box a. The linear drive member f drives the adsorption plate to move downward to contact the circuit board. The adsorption plate adsorbs the substrate and moves the substrate into the groove. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the first overall structure of the utility model;
[0018] Figure 2This is a second overall structural schematic diagram of the utility model;
[0019] Figure 3 This is a schematic diagram of the welding mechanism structure of the utility model;
[0020] Figure 4 This is a schematic diagram of the structure of the clamping assembly of the utility model;
[0021] Figure 5 This is a schematic diagram of the structure of the feeding mechanism of the utility model;
[0022] Figure 6 It is a structural schematic diagram of the circuit board of the utility model.
[0023] Reference numerals
[0024] 100, workbench; 101, guide rail a; 102, slide plate; 1021, groove; 103, fixed plate; 104, linear drive member a; 2, feeding mechanism; 200, adsorption plate; 201, mounting frame; 202, material collection box a; 203, guide rail b; 204, sliding block; 205, linear drive member f; 206, material discharge box; 2061, through groove; 207, fixed frame a; 208, connection Frame; 209, linear drive member b; 210, push plate; 211, guide plate; 3, welding mechanism; 301, fixed frame b; 302, linear drive member c; 303, moving block; 304, linear drive member d; 305, tin spray nozzle; 4, clamping assembly; 401, connecting seat; 402, rotating drive member e; 403, swing rod; 404, pressing block; 801, substrate; 802, electrical components. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0028] Embodiment 1
[0029] like Figure 1-Figure 6 As shown, this embodiment provides a PCB circuit board spot welding device, including a workbench 100, a guide rail a101 is provided on the workbench 100, a slide plate 102 is slidably provided on the guide rail a101, a groove 1021 is provided in the slide plate 102, and a loading mechanism 2 and a welding mechanism 3 are provided beside the workbench 100; a fixed plate 103 is installed on the workbench 100, a linear driving member a104 is installed on the fixed plate 103, and the output end of the linear driving member a104 is connected to the slide plate 102.
[0030] In this embodiment, the substrate 801 is transferred to the groove 1021 by the feeding mechanism 2, the linear driving member a104 drives the slide plate 102 to slide on the guide rail a101, and drives the substrate 801 to move below the welding mechanism 3, the feeding mechanism 2 transfers the electrical component 802 to the substrate 801, and the welding mechanism 3 solders the pins of the electrical component 802 to the substrate 801, thereby shortening the production time and improving the production efficiency;
[0031] like Figure 1 and Figure 2 As shown, the loading mechanism 2 includes: a mounting frame 201, which is mounted on the ground; a material collecting box a202, which is mounted on the mounting frame 201; a guide rail b203, which is arranged above the workbench 100; a sliding block 204, which is slidably arranged on the guide rail b203; a linear driving member f205, which is installed on the sliding block 204; an adsorption plate 200, which is installed on the output end of the linear driving member f205, and the guide rail b203 is arranged in the air. The adsorption plate 200 adsorbs the substrate 801 through negative pressure. This is a conventional technical means and will not be described in detail here.
[0032] In this embodiment, a plurality of stacked substrates 801 are placed in the material collecting box a202, and the sliding block 204 slides on the guide rail b203 until the adsorption plate 200 moves to the top of the material collecting box a202, and the linear driving member f205 drives the adsorption plate 200 to move downward to contact the substrate 801, and the adsorption plate 200 adsorbs the substrate 801 and moves the substrate 801 into the groove 1021;
[0033] like Figure 1 , Figure 2 and Figure 5 As shown, the feeding mechanism 2 also includes: a fixing frame a207, the fixing frame a207 is installed on the workbench 100; a material discharge box 206, the material discharge box 206 is installed on the fixing frame a207; a connecting frame 208, the connecting frame 208 is installed on the fixing frame a207; a linear drive member b209, the linear drive member b209 is installed on the connecting frame 208; a push plate 210, the push plate 210 is installed at the output end of the linear drive member b209; a guide plate 211, the guide plate 212 is installed on the fixing frame a207; a ... 11 is installed at the bottom of the discharge box 206, and a through slot 2061 is opened in the discharge box 206, and the through slot 2061 is used to avoid the pins of the electrical component 802; a plurality of stacked electrical components 802 are placed in the discharge box 206, and the linear drive member b209 drives the push plate 210 to push the electrical component 802 at the bottom of the discharge box 206 to the top of the substrate 801 in the groove 1021 through the guide plate 211, so as to facilitate welding of the electrical component 802 and the substrate 801;
[0034] like Figure 1-Figure 3 As shown, the welding mechanism 3 includes: a fixed frame b301, which is installed on the workbench 100; a linear drive member c302, which is installed on the fixed frame b301; a moving block 303, which is installed on the output end of the linear drive member c302; a linear drive member d304, which is installed on the moving block 303; a tin spray nozzle 305, which is installed on the output end of the linear drive member d304, and a pipeline is provided on the tin spray nozzle 305. After the tin liquid is passed into the pipeline, it is sprayed from the tin spray nozzle 305. This is a conventional technical means and will not be described in detail here.
[0035] Embodiment 2
[0036] like Figure 4 As shown, the components identical or corresponding to those in the first embodiment are marked with the corresponding reference numerals in the first embodiment. For the sake of simplicity, only the differences from the first embodiment are described below. The second embodiment differs from the first embodiment in that:
[0037] like Figure 4 As shown, a clamping assembly 4 is installed on the skateboard 102, and the clamping assembly 4 presses the electrical component into the groove 1021. The clamping assembly 4 includes: a connecting seat 401, which is installed on the skateboard 102; a rotating driving member e402, which is installed on the connecting seat 401; a swing rod 403, which is installed on the output end of the rotating driving member e402; and a pressing block 404, which is installed on the swing rod 403.
[0038] In this embodiment, the substrate 801 is transferred into the groove 1021 by the loading mechanism 2, and the electrical component 802 is transferred to above the substrate 801 in the groove 1021. At this time, the rotating driving member e402 drives the swing rod 403 to swing, and the electrical component 802 is pressed onto the substrate 801 by the pressing block 404.
[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A PCB circuit board spot welding device, comprising a workbench (100), characterized in that: The workbench (100) is provided with a guide rail a (101), a slide plate (102) is slidably provided on the guide rail a (101), a groove (1021) is provided in the slide plate (102), and a loading mechanism (2) and a welding mechanism (3) are provided on one side of the workbench (100); The feeding mechanism (2) comprises: A mounting frame (201), wherein the mounting frame (201) is mounted on the ground; A material collection box a (202), wherein the material collection box a (202) is installed on the mounting frame (201); A guide rail b (203), wherein the guide rail b (203) is disposed above the workbench (100); A sliding block (204), the sliding block (204) being slidably disposed on the guide rail b (203); A linear drive member f (205), the linear drive member f (205) being mounted on the sliding block (204); An adsorption plate (200), wherein the adsorption plate (200) is mounted on the output end of the linear drive member f (205).
2. A PCB circuit board spot welding device according to claim 1, characterized in that: A fixing plate (103) is installed on the workbench (100), a linear driving member a (104) is installed on the fixing plate (103), and an output end of the linear driving member a (104) is connected to the slide plate (102).
3. A PCB circuit board spot welding device according to claim 2, characterized in that: The feeding mechanism (2) further comprises: A fixing frame a (207), wherein the fixing frame a (207) is installed on the workbench (100); A material discharge box (206), wherein the material discharge box (206) is mounted on the fixing frame a (207); A connecting frame (208), the connecting frame (208) is installed on the fixing frame a (207); A linear drive member b (209), wherein the linear drive member b (209) is mounted on the connecting frame (208); A push plate (210), the push plate (210) being mounted on the output end of the linear drive member b (209); A guide plate (211) is installed at the bottom of the discharge box (206), and a through slot (2061) is provided in the discharge box (206).
4. A PCB circuit board spot welding device according to claim 3, characterized in that: The welding mechanism (3) comprises: A fixing frame b (301), wherein the fixing frame b (301) is installed on the workbench (100); A linear drive member c (302), wherein the linear drive member c (302) is mounted on the fixing frame b (301); A motion block (303), the motion block (303) being mounted on an output end of the linear drive member c (302); A linear drive member d (304), the linear drive member d (304) being mounted on the motion block (303); A tin spray nozzle (305), wherein the tin spray nozzle (305) is installed at the output end of the linear drive member d (304).
5. A PCB circuit board spot welding device according to claim 4, characterized in that: A pressing assembly (4) is installed on the slide plate (102), and the pressing assembly (4) presses the electrical component into the groove (1021).
6. A PCB circuit board spot welding device according to claim 5, characterized in that: The pressing assembly (4) comprises: A connecting seat (401), wherein the connecting seat (401) is mounted on the slide plate (102); A rotating driving member e (402), wherein the rotating driving member e (402) is mounted on the connecting seat (401); A swing rod (403), the swing rod (403) being mounted on the output end of the rotary drive member e (402); A pressing block (404), wherein the pressing block (404) is mounted on the swing rod (403).