Alloy electroplating device

Abstract

The utility model provides an alloy electroplating device, which relates to the technical field of electroplating and comprises an electroplating bath, a cathode and an anode, the cathode and the anode are used for hanging a single-sided electroplating workpiece, and the cathode is arranged above the electroplating bath; the anode comprises a main anode for hanging main metal and an auxiliary anode for hanging auxiliary metal, the main anode is arranged on one side opposite to the electroplating surface of the cathode hanging workpiece, and the auxiliary anode is arranged on one side opposite to the electroplating surface of the cathode hanging workpiece; and independent power supplies are respectively arranged between the main anode and the cathode and between the auxiliary anode and the cathode. When the double-anode metal in the alloy needs to be adjusted in a fluctuation range of not more than 20%, the proportion of the main metal or the auxiliary metal in the coating alloy can be adjusted by adjusting the current density of the main power supply and / or the current density of the auxiliary power supply; the technical problem that electroplating adjustment of a double-anode electroplating device in the prior art is tedious is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a device for electroplating alloy. Background Art

[0002] Electroplating functional wear-resistant alloy on the working surface of the crystallizer copper plate is an important measure to increase service life and reduce continuous casting costs. However, alloy coatings always have primary and secondary metals. For example, Ni-Co alloy is a coating alloy with Ni as the main metal and Co as the secondary metal, while Co-Ni alloy is the opposite of Ni-Co alloy, which is a coating alloy with Co as the main metal and Ni as the secondary metal.

[0003] In the prior art, in the electroplating process of primary and secondary metals for alloy coating, the dual anodes are mostly controlled by sharing a DC power supply. The problem with the electroplating device is that the electroplating adjustment is relatively cumbersome, and due to the uneven distribution of metal ions in the areas where the dual anodes are located, the distribution of the electroplated alloy is extremely uneven, which affects the use effect of the electroplated layer. However, due to the different proportions of metals in the alloy coating, the hardness and toughness of the coating are different. For example, when the Ni content of Ni-Co coating is relatively high, the coating toughness is relatively good, and the coating has a relatively strong bonding force with the body of the electroplated workpiece. With the increase of the Co content in the alloy coating, the coating toughness decreases, the coating hardness increases significantly, and its wear resistance increases significantly. For the crystallizer copper plate, the bonding force between the coating and the body is strong, and the coating away from the bonding surface needs to have better wear resistance, so different coating thicknesses are also required. The metal has different changes in different thicknesses of the coating alloy. When the proportion of the metal of the dual anode in the alloy needs to be adjusted within a fluctuation range of no more than 20%, the electroplating adjustment method of the dual anode device in the prior art is relatively cumbersome.

[0004] In view of this, the present utility model is proposed. Utility Model Content

[0005] The utility model aims to provide an alloy electroplating device to at least solve one of the technical problems of the prior art double anode electroplating device, that is, the electroplating adjustment is complicated and the uneven electroplating alloy affects the quality of the electroplating layer.

[0006] In order to achieve the above-mentioned purpose of the utility model, the following technical solutions are adopted:

[0007] In a first aspect, the utility model provides an alloy electroplating device, comprising an electroplating tank, an anode, and a cathode for suspending a single-sided electroplated workpiece, wherein the cathode is arranged above the electroplating tank;

[0008] The anode includes a main anode for suspending the main metal and a sub-anode for suspending the sub-metal, the main anode is arranged on the side opposite to the electroplating surface of the cathode suspending the workpiece, and the sub-anode is arranged on the side opposite to the electroplating surface of the cathode suspending the workpiece;

[0009] Independent power supplies are respectively provided between the main anode and the auxiliary anode and the cathode.

[0010] Furthermore, it also includes a connecting structure arranged on the electroplating tank for circulating the electrolyte in the electroplating tank.

[0011] Furthermore, the power supply includes a main power supply and a secondary power supply, the main power supply is arranged between the main anode and the cathode, and the secondary power supply is arranged between the secondary anode and the cathode.

[0012] Furthermore, the mass ratio of the main metal in the titanium blue of the main anode to the secondary metal in the titanium blue of the secondary anode is equal to the mass ratio of the main metal in the electroplated workpiece coating to the secondary metal in the electroplated alloy.

[0013] Furthermore, the negative electrodes of the main power supply and the secondary power supply are both connected to the cathode, the positive electrode of the main power supply is connected to the main anode, and the positive electrode of the secondary power supply is connected to the secondary anode.

[0014] Furthermore, the connecting structure includes a liquid inlet at one end of the electroplating tank and a liquid outlet at the other end, and the liquid inlet and the liquid outlet are connected through a pipeline.

[0015] Furthermore, the liquid inlet is arranged at one end of the electroplating tank where a main anode is arranged, and the liquid outlet is arranged at one end of the electroplating tank where a secondary anode is arranged.

[0016] Furthermore, the level of the liquid inlet is lower than the level of the liquid outlet.

[0017] Furthermore, a circulation pump is provided between the liquid inlet and the liquid outlet.

[0018] Furthermore, a filter for filtering the electroplating liquid is provided between the liquid outlet and the circulation pump.

[0019] The utility model provides an alloy electroplating device, which, by setting a main anode and a sub-anode, can, according to the surface orientation of the electroplating layer, allow the main anode to be suspended on the side of the electroplating layer facing the single-sided electroplated workpiece, and the sub-anode to be hung on the back side of the electroplating layer, so that the plating layer away from the bonding surface has better wear resistance. When the metal of the double anode in the alloy needs to be adjusted within an upper and lower fluctuation range of no more than 20%, the proportion of the main metal or the sub-metal in the plated alloy can be adjusted by adjusting the current density of the main power supply and / or the current density of the sub-power supply, thereby solving the technical problem of complicated electroplating adjustment in the double anode electroplating device in the prior art. At the same time, this structure can also adjust the proportion of positive metal ions and secondary metal ions in the electroplating solution during the electroplating process by adjusting the current density of independent power supplies respectively set between the main anode and the secondary anode and the cathode, and gradually make the proportion of main metal ions and secondary metal ions in the electroplating solution reach the proportion of main metal and secondary metal in the required electroplating alloy, so that the proportion of main metal ions and secondary metal ions in the electroplating solution in the entire electroplating process maintains a dynamic balance, thereby improving the bonding strength and wear resistance of the coating, and solving the problem of low steel passing rate caused by poor bonding strength and wear resistance of the crystallizer copper plate coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 The utility model provides an overall structural schematic diagram of an alloy electroplating device.

[0022] Icon: 1- electroplating tank; 11- liquid inlet; 12- liquid outlet;

[0023] 2- cathode;

[0024] 31-main anode; 32-auxiliary anode;

[0025] 41-main power supply; 42-secondary power supply;

[0026] 5-Circulation pump;

[0027] 6-Workpiece. DETAILED DESCRIPTION

[0028] Unless otherwise defined herein, scientific and technical terms used in conjunction with the present invention shall have the meanings commonly understood by those of ordinary skill in the art. The meaning and scope of the terms should be clear, however, in the case of any potential ambiguity, the definitions provided herein take precedence over any dictionary or external definitions. In this application, unless otherwise stated, the use of "or" means "and / or". In addition, the use of the term "including" and other forms is non-limiting.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0030] In the description of the present utility model, it should be noted that the terms "proximal end", "distal end", "front end", "rear end", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0031] Terms such as "horizontal" and "vertical" do not mean that the components must be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a communication between the two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] The utility model provides an alloy electroplating device, comprising an electroplating tank 1, an anode and a cathode 2 for hanging a single-sided electroplated workpiece, wherein the cathode 2 is arranged above the electroplating tank 1;

[0034] The anode includes a main anode 31 for suspending the main metal and a secondary anode 32 for suspending the secondary metal, wherein the main anode 31 is arranged on the side opposite to the electroplating surface of the cathode 2 suspending the workpiece, and the secondary anode 32 is arranged on the side opposite to the electroplating surface of the cathode 2 suspending the workpiece;

[0035] Independent power supplies are respectively provided between the main anode 31 and the auxiliary anode 32 and the cathode 2 .

[0036] By setting the main anode and the auxiliary anode, the main anode can be hung on the side of the electroplating layer facing the single-sided electroplated workpiece according to the orientation of the electroplating layer, and the auxiliary anode can be hung on the back side of the electroplating layer, so that the plating layer away from the bonding surface has better wear resistance. When the metal of the dual anode in the alloy needs to be adjusted within an upper and lower fluctuation range of no more than 20%, the proportion of the main metal or the auxiliary metal in the plating alloy can be adjusted by adjusting the current density of the main power supply 41 and / or the current density of the auxiliary power supply 42, thereby solving the technical problem of complicated electroplating adjustment in the dual anode electroplating device in the prior art.

[0037] At the same time, this structure can also adjust the proportion of positive metal ions and secondary metal ions in the electroplating solution during the electroplating process by adjusting the current density of independent power supplies respectively arranged between the main anode 31 and the secondary anode 32 and the cathode 2, and gradually make the proportion of main metal ions and secondary metal ions in the electroplating solution reach the proportion of main metal and secondary metal in the required electroplating alloy, so that the proportion of main metal ions and secondary metal ions in the electroplating solution in the entire electroplating process maintains a dynamic balance, thereby improving the bonding strength and wear resistance of the coating, and solving the problem of low steel passing rate caused by poor bonding strength and wear resistance of the crystallizer copper plate coating.

[0038] It should be noted that, for the metal plated on the coating, when the current density of the main power supply 41 and / or the current density of the auxiliary power supply 42 is changed, although the ratio of the main metal or secondary metal ionized at the anode to the current density is consistent, the concentration of the main metal or secondary metal ions in the plating solution cannot change immediately with the change of the current density of the main power supply 41 and / or the current density of the auxiliary power supply 42. Therefore, the concentration of the main metal or secondary metal ions in the plating solution has a gradual process. When the concentration of the main metal or secondary metal ions is consistent with the current density of the main power supply 41 and / or the current density of the auxiliary power supply 42 during the gradual process, the balance between electrolysis and electroplating is achieved. Therefore, the ratio of the main metal to the secondary metal in the coating alloy has a certain lag relative to the change of the current density of the main power supply 41 and / or the current density of the auxiliary power supply 42.

[0039] Since the metal ions ionized by the main anode 31 and the auxiliary anode 32 are unevenly distributed on the electroplated surface of the electroplated workpiece without intervention, the metal distribution in various parts of the electroplated layer is affected. In some specific embodiments, a connecting structure is also included on the electroplating tank 1 for circulating the electrolyte in the electroplating tank 1.

[0040] The plating solution can be circulated by the connecting structure in the plating tank 1, so that the metal ions are distributed more evenly in the entire plating tank, thereby making the metal distribution in each part of the alloy plating layer more even, improving the quality of the plating layer, and solving the technical problem in the prior art that the electroplating alloy is uneven in the same plating layer section, affecting the quality of the electroplating layer.

[0041] In some specific embodiments, the power source includes a main power source 41 and a secondary power source 42 , wherein the main power source 41 is disposed between the main anode 31 and the cathode, and the secondary power source 42 is disposed between the secondary anode 32 and the cathode.

[0042] When the metal of the dual anode in the alloy needs to be adjusted within a fluctuation range of no more than 20%, the proportion of the main metal or the secondary metal in the plated alloy can be adjusted by adjusting the current density of the main power supply 41 and / or the current density of the secondary power supply 42 to meet the requirements of alloy electroplating.

[0043] In some specific embodiments, the mass ratio of the main metal in the titanium blue of the main anode 31 to the secondary metal in the titanium blue of the secondary anode 32 is equal to the mass ratio of the main metal to the secondary metal in the alloy.

[0044] In some specific embodiments, the negative poles of the main power supply 41 and the secondary power supply 42 are both connected to the cathode 2 , the positive pole of the main power supply 41 is connected to the main anode 31 , and the positive pole of the secondary power supply 42 is connected to the secondary anode 32 .

[0045] In some specific embodiments, the connecting structure includes a liquid inlet 11 disposed at one end of the electroplating tank 1 and a liquid outlet 12 disposed at the other end, and the liquid inlet 11 and the liquid outlet 12 are connected via a pipeline.

[0046] By providing a liquid inlet 11 at one end of the electroplating tank 1 and a liquid outlet 12 at the other end, the liquid inlet 11 and the liquid outlet 12 are connected by a pipeline to realize the circulation of the electroplating solution, so that the distribution of metal ions in the entire electroplating tank is more uniform, thereby making the metal distribution in various parts of the alloy plating layer more uniform, improving the quality of the plating layer, and solving the technical problem in the prior art that the uneven electroplating alloy affects the quality of the electroplating layer.

[0047] In some specific embodiments, the level of the liquid inlet 11 is lower than the level of the liquid outlet 12 .

[0048] To ensure that the level of the liquid inlet position is always lower than the level of the liquid outlet position, so that the circulating liquid can be fully diffused and mixed.

[0049] In some specific embodiments, the liquid inlet 11 is disposed at one end of the electroplating tank 1 where the main anode 31 is disposed, and the liquid outlet 12 is disposed at one end of the electroplating tank 1 where the secondary anode 32 is disposed.

[0050] In some specific implementations, a circulation pump 5 is further provided between the first liquid port 11 and the second liquid port 12 .

[0051] The liquid flow is assisted by a circulation pump 5. The electrolyte flows from the anode end of the metal with a low content to the anode end of the metal with a high content.

[0052] In some specific embodiments, a filter for filtering the electroplating liquid is provided at the front end of the circulation pump 5 along the liquid flow direction between the first liquid port 11 and the second liquid port 12 .

[0053] The technical solution of the utility model will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0054] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] Example 1

[0056] Combination Figure 1 An alloy electroplating device is described below, wherein the workpiece 6 is a crystallizer copper plate that needs to be electroplated with Ni-Co alloy on one side.

[0057] The device comprises an electroplating tank 1 , a cathode 2 arranged above the electroplating tank 1 for suspending a single-sided electroplated workpiece, a main anode 31 and a secondary anode 32 .

[0058] The titanium blue of the main anode 31 contains a metal Ni cake of the electroplated alloy, and the titanium blue of the secondary anode 32 contains a metal Co cake of the electroplated alloy. The main power supply 41 is arranged between the main anode 31 and the cathode 2, and the secondary power supply 42 is arranged between the secondary anode 32 and the cathode 2. The positive electrode of the main power supply 41 is connected to the main anode 31, and the negative electrode is connected to the workpiece 6; the positive electrode of the secondary power supply 42 is connected to the secondary anode 32, and the negative electrode is connected to the workpiece 6.

[0059] The liquid inlet 11 is connected to the liquid outlet 12. The circulation pump 5 between the liquid inlet 11 and the liquid outlet 12 is turned on to realize the circulation of the electrolyte in the electroplating tank 1 and improve the uniformity of the metal ions in the electrolyte.

[0060] At the same time, the filter between the liquid outlet 12 and the circulation pump 5 is started to filter the electrolyte and remove impurities.

[0061] The electroplating alloy Ni / Co of the workpiece 6 is 84 / 16, the mass ratio of the metal Ni cake containing the electroplating alloy in the titanium blue of the main anode 31 to the metal Co cake containing the electroplating alloy in the titanium blue of the secondary anode 32 is 84 / 16, and the electroplating surface of the workpiece 6 faces the main anode 31.

[0062] The workpiece 6 is electroplated according to the following steps: the current density ratio of the main power supply 41 and the auxiliary power supply 42 is adjusted three times from 90 / 10, so that the Co content in the coating is gradually increased to increase the wear resistance of the coating. Among them, the first adjustment is performed 10 hours after the start of electroplating, so that the current ratio of the main power supply 41 to the auxiliary power supply 42 reaches 85 / 15, and the auxiliary power supply 42 is adjusted for the second time after the electroplating continues for 10 hours, so that the current density of the main power supply 41 and the current density of the auxiliary power supply 42 reach 80 / 20, and the auxiliary power supply 42 is adjusted for the third time after the electroplating continues for 30 hours, and the Co content in the coating begins to be reduced, so that the current ratio of the main power supply 41 to the auxiliary power supply 42 returns to the initial state, reaching 90 / 10, and the electroplating is stopped after a total of 60 hours, and the chemical composition of the plating solution is restored to the initial state, which is convenient for the subsequent electroplating of the workpiece. Finally, electroplating was continued for 10 hours. Although the Co content in the coating decreased during this process, the thickness of most of the coatings had met the size requirement of 1mm at this time. The reason for continuing electroplating was that, first, some coatings still did not reach the required thickness, and all coatings must meet the thickness requirement. The excess parts were removed by mechanical processing to make the coating surface of the workpiece smooth and beautiful. Second, the composition of the plating solution was restored to the original requirements to facilitate the subsequent electroplating of other workpieces.

[0063] Example 2

[0064] Different from the embodiment 1, the workpiece 6 is a crystallizer copper plate which needs to be electroplated with Co—Ni alloy on one side.

[0065] Correspondingly, the titanium blue of the main anode 31 contains a metal Co cake of the electroplated alloy, and the titanium blue of the secondary anode 32 contains a metal Ni cake of the electroplated alloy.

[0066] The electroplating alloy Co / Ni of the workpiece 6 is 74 / 26, the mass ratio of the metal Ni cake containing the electroplating alloy in the titanium blue of the main anode 31 to the metal Ni cake containing the electroplating alloy in the titanium blue of the secondary anode 32 is 85 / 15, and the electroplating surface of the workpiece 6 faces the main anode 31.

[0067] The Co / Ni electroplated alloy coating of workpiece 6 has a Co / Ni ratio that is gradually adjusted from 60 / 40 at the initial bonding surface to 74 / 26 in three steps to improve the bonding strength between the coating and the bonding surface of workpiece 6. At the same time, the coating far from the bonding surface becomes more wear-resistant and has a longer service life due to the high Co content.

[0068] Stress detection test

[0069] In this experiment, stress test strips were used to electroplate different coatings shown in Table 1 using the electroplating devices in Example 1 and Example 2, and the electroplating time was 2 hours. The corresponding stress magnitude was determined according to the distance opened by the stress test strips. The greater the distance opened, the greater the stress and the smaller the bonding force. Conversely, the smaller the stress, the greater the bonding force. The specific stress strip test is shown in Table 1.

[0070] Table 1

[0071]

[0072] According to Table 1, in Example 1, the stress values ​​of the coating with Ni:Co=90:10 and the coating with Ni:Co=80:20 are both greater than those of the pure nickel coating; in Example 2, the stress values ​​of the coating with Ni:Co=40:60 and the coating with Ni:Co=20:80 are both greater than those of the pure nickel coating, that is, increasing the Co content can increase the wear resistance, but reduces the bonding strength of the alloy coating, which is also verified in the statistics of abnormal coating block falling during the steel passing process of the crystallizer copper plate.

[0073] The crystallizer copper plates with different coatings in Table 1 are respectively applied to the continuous casting machine with a cross section of 1500*270. Among them, the one-time steel passing amount of the pure nickel coating in Example 1 is 70,000 tons, the one-time steel passing amount of the Ni:Co=90:10 coating is 90,000 tons, and the one-time steel passing amount of the coating from Ni:Co=90:10 to Ni:Co=80:20 is 105,000 tons. In Example 2, the one-time steel passing amount of the pure nickel coating is 70,000 tons, the one-time steel passing amount of the Ni:Co=40:60 coating is 120,000 tons, and the one-time steel passing amount of the coating from Ni:Co=40:60 to Ni:Co=20:80 is 145,000 tons. It shows that the wear resistance of the coating of Ni:Co=90:10, the coating of Ni:Co=80:20, the coating of Ni:Co=40:60, and the coating of Ni:Co=20:80 has been improved, and with the increase of Co content, the wear resistance is gradually improved.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. An alloy electroplating device, characterized in that: It comprises an electroplating tank (1), an anode, and a cathode (2) for suspending a single-sided electroplated workpiece, wherein the cathode (2) is arranged above the electroplating tank (1); The anode comprises a main anode (31) for suspending a main metal and a secondary anode (32) for suspending a secondary metal, wherein the main anode (31) is arranged on the side opposite to the electroplating surface of the cathode (2) suspending the workpiece, and the secondary anode (32) is arranged on the side opposite to the electroplating surface of the cathode (2) suspending the workpiece; Independent power supplies are respectively provided between the main anode (31) and the auxiliary anode (32) and the cathode (2).

2. The alloy electroplating device according to claim 1, characterized in that: It also includes a connecting structure arranged on the electroplating tank (1) for circulating the electrolyte in the electroplating tank (1).

3. The alloy electroplating device according to claim 1, characterized in that: The power supply comprises a main power supply (41) and a secondary power supply (42), wherein the main power supply (41) is arranged between a main anode (31) and a cathode, and the secondary power supply (42) is arranged between a secondary anode (32) and a cathode.

4. The alloy electroplating device according to claim 3, characterized in that: The mass ratio of the main metal in the titanium blue of the main anode (31) to the secondary metal in the titanium blue of the secondary anode (32) is equal to the mass ratio of the main metal in the coating of the electroplated workpiece to the secondary metal in the electroplated alloy.

5. The alloy electroplating device according to claim 3, characterized in that: The negative poles of the main power supply (41) and the auxiliary power supply (42) are both connected to the cathode (2), the positive pole of the main power supply (41) is connected to the main anode (31), and the positive pole of the auxiliary power supply (42) is connected to the auxiliary anode (32).

6. The alloy electroplating device according to claim 2, characterized in that: The communication structure comprises a liquid inlet (11) arranged at one end of the electroplating tank (1) and a liquid outlet (12) arranged at the other end, and the liquid inlet (11) and the liquid outlet (12) are connected via a pipeline.

7. The alloy electroplating device according to claim 6, characterized in that: The liquid inlet (11) is arranged at one end of the electroplating tank (1) provided with a main anode (31), and the liquid outlet (12) is arranged at one end of the electroplating tank (1) provided with a secondary anode (32).

8. The alloy electroplating device according to claim 7, characterized in that: The level of the liquid inlet (11) is lower than the level of the liquid outlet (12).

9. The alloy electroplating device according to claim 8, characterized in that: A circulation pump (5) is provided between the liquid inlet (11) and the liquid outlet (12).

10. The alloy electroplating device according to claim 9, characterized in that: A filter for filtering the electroplating liquid is provided between the liquid outlet (12) and the circulation pump (5).

Images