Vapor chamber

Abstract

The utility model discloses a vapor chamber, and relates to the technical field of heat guide plates. The uniform temperature plate is connected with the heating device, the uniform temperature plate comprises a uniform temperature plate main body in which a phase change cavity is formed, and the inner wall of the uniform temperature plate main body is provided with stripe grooves extending in a first direction; a heat source area corresponding to the position of the heating device is arranged in the phase change containing cavity, the heat source area is provided with a layered first capillary structure and a strip-shaped second capillary structure extending in the first direction, the first capillary structure is laid on the stripe grooves, and the second capillary structure is connected with the first capillary structure. According to the vapor chamber, the capillary thermal resistance is reduced in the first direction by utilizing the guiding effect on the working medium and the enhanced capillary composite effect; under the application scene that a heat source is arranged in the mode of deviating from the central area of the vapor chamber and the vapor chamber inclines along the gravity direction, the vapor chamber inclines along the first direction, and due to the fact that a working medium is guided by the gravity and a groove composite capillary, the heat dissipation thermal resistance of the vapor chamber is low.

Description

Technical Field

[0001] The present application relates to the technical field of heat conducting plates, and in particular to a temperature equalizing plate. Background Art

[0002] Vapor Chamber, also known as temperature equalizing plate or superheat conducting plate, works on the principle of utilizing the working fluid to circulate in the vacuum chamber to perform a heat exchange process between the liquid phase and the gas phase, thereby generating the functions of heat conduction and heat diffusion.

[0003] In the process of realizing the utility model, the inventor found that there are at least the following technical problems in the prior art: At present, the existing design of the temperature averaging plate is basically in the form of sintering metal powder or adhering metal woven mesh on the inner side of the upper and lower plate structures. During its use, the heat source generally needs to be arranged in the central area of ​​the temperature averaging plate, and the application scenario of the temperature averaging plate is limited to the horizontal direction. The defects of the above-mentioned temperature averaging plate include at least: the capillary thermal resistance formed by the metal powder or the metal woven mesh is high; for the application scenarios where the heat source deviates from the central area of ​​the temperature averaging plate and the temperature averaging plate is tilted along the gravity, the heat dissipation thermal resistance of the temperature averaging plate is high. Utility Model Content

[0004] The purpose of the present application is to provide a temperature equalizing plate, which provides a guiding effect for the working fluid along a first direction through striped grooves and a second capillary structure, thereby increasing the reflux speed of the working fluid in the liquid phase, thereby reducing the capillary thermal resistance in this direction; in the heat source area, an enhanced capillary composite effect is formed by the striped grooves and the first capillary structure and the second capillary structure, which also reduces the capillary thermal resistance in the first direction; in the application scenario where the heat source is arranged in a manner deviating from the central area of ​​the temperature equalizing plate and the temperature equalizing plate is tilted in the direction of gravity, the temperature equalizing plate is tilted in the first direction, because the working fluid is guided by gravity and the groove composite capillary, so the heat dissipation thermal resistance of the temperature equalizing plate is low.

[0005] To achieve the above-mentioned purpose, the present application provides a temperature equalizing plate, which is used to be connected to a heat-generating device. The temperature equalizing plate includes a temperature equalizing plate body with a phase change cavity formed inside, and the inner wall of the temperature equalizing plate body is provided with striped grooves extending in a first direction; a heat source area corresponding to the position of the heat-generating device is provided in the phase change cavity, and the heat source area is provided with a layered first capillary structure and a strip-shaped second capillary structure extending in the first direction, the first capillary structure is covered on the striped groove, and the second capillary structure is connected to the first capillary structure.

[0006] In some embodiments, there are multiple second capillary structures, and the multiple second capillary structures are spaced apart along the second direction. Spacer air channels are formed between adjacent second capillary structures, and the spacer air channels extend in the first direction. The second direction is perpendicular to the first direction, and the first direction and the second direction intersect to form a relative horizontal plane of the temperature homogenizing plate.

[0007] In some embodiments, the angle between the relative horizontal plane and the gravity direction of the temperature homogenizing plate is less than 90°, and the heat source area is located in a portion of the phase change cavity that is in the direction of gravity of the temperature homogenizing plate.

[0008] In some embodiments, a support portion is disposed inside the second capillary structure, and the support portion is used to support an inner top and an inner bottom of the temperature vapor chamber body; there are multiple support portions, and the multiple support portions are spaced apart along the first direction.

[0009] In some embodiments, the temperature vapor chamber body comprises:

[0010] A heat source substrate, a first side of which is used to connect with a heat generating device;

[0011] A heat dissipation substrate, wherein the phase change cavity is formed between a first side and a second side of the heat source substrate;

[0012] Wherein, the striped groove is arranged on the second side of the heat source substrate and / or the first side of the heat dissipation substrate, the first capillary structure is arranged on the second side of the heat source substrate and / or the first side of the heat dissipation substrate, and the second capillary structure is arranged on the second side of the heat source substrate and / or the first side of the heat dissipation substrate.

[0013] In some embodiments, the temperature equalizing plate body also includes a support column, which is arranged in the phase change cavity, the first end of the support column contacts the second side of the heat source substrate, the second end of the support column contacts the first side of the heat dissipation substrate, and a third capillary structure is arranged on the support column, and the third capillary structure connects the heat source substrate and the heat dissipation substrate.

[0014] In some embodiments, the temperature equalizing plate body also includes a connecting frame, a first side of the connecting frame is connected to the edge of the second side of the heat source substrate, and a second side of the connecting frame is connected to the edge of the first side of the heat dissipation substrate, and the phase change cavity is formed between the connecting frame, the heat source substrate and the heat dissipation substrate.

[0015] In some embodiments, the temperature equalizing plate body further includes a water injection pipe; the connection frame is provided with a partition opening leading to the phase change chamber, and the water injection pipe is installed at the partition opening.

[0016] In some embodiments, the second capillary structure is an integrated structure with the first capillary structure.

[0017] In some embodiments, the stripe groove includes a plurality of protrusions, and a recessed space is formed between adjacent protrusions; the cross-sectional shape of the protrusions and the recessed space is a trapezoid, the upper side length of the protrusion is smaller than the lower side length, the upper side length of the recessed space is larger than the lower side length, and the lower side length of the recessed space is smaller than the lower side length of the protrusion.

[0018] Compared with the above-mentioned background technology, the temperature equalizing plate provided in the present application is used to be connected to the heating device, and the temperature equalizing plate includes a temperature equalizing plate body with a phase change cavity formed inside, and the inner wall of the temperature equalizing plate body is provided with striped grooves extending in the first direction; there is a heat source area corresponding to the position of the heating device in the phase change cavity, and the heat source area is provided with a layered first capillary structure and a strip-shaped second capillary structure extending in the first direction, the first capillary structure is covered on the striped groove, and the second capillary structure is connected to the first capillary structure.

[0019] Before using the temperature averaging board, fill the phase change chamber inside the temperature averaging board with working fluid, connect the heating device to the designated position of the temperature averaging board, and further connect the temperature averaging board to the cooling device or directly place the temperature averaging board in a low temperature environment.

[0020] During the use of the temperature homogenizer, the heat generating device acts as a heat source to generate heat, and the heat is transferred to the temperature homogenizer; in the heat source area inside the temperature homogenizer, the working fluid absorbs heat in a liquid phase and changes to a gas phase. When the working fluid is in the gas phase, it flows inside the temperature homogenizer to a position far away from the heat source area, such as a low temperature area, to perform a heat exchange process, and then the working fluid releases heat and changes to a liquid phase. When it is in the liquid phase, it flows back to the heat source area, and then the working fluid circulates in the phase change cavity to perform a liquid-gas phase heat exchange process, thereby generating the functions of heat conduction and heat diffusion.

[0021] The temperature averaging plate produces at least the following beneficial effects: in the above process, the temperature averaging plate provides a guiding effect for the working fluid along the first direction through the striped grooves and the second capillary structure, thereby increasing the reflux velocity of the working fluid in the liquid phase, which is equivalent to reducing the resistance to the reflux of the working fluid, thereby reducing the capillary thermal resistance in this direction, and correspondingly improving the heat exchange efficiency and heat dissipation effect; in the heat source area inside the temperature averaging plate, the temperature averaging plate forms an enhanced capillary composite effect through the striped grooves and the first capillary structure and the second capillary structure, which also reduces the capillary thermal resistance in the first direction, and And it improves the heat exchange efficiency and heat dissipation effect; when the temperature equalizing plate is applied eccentrically following gravity, it is equivalent to arranging the heat source in a manner deviating from the central area of ​​the temperature equalizing plate and in the application scenario where the temperature equalizing plate is tilted along the gravity direction, it is only necessary to tilt the temperature equalizing plate along the first direction. Through the guiding effect of the above-mentioned striped grooves and the second capillary structure, the working fluid is guided in the direction of gravity inclination, and an enhanced capillary composite effect is also formed in the heat source area. Therefore, the heat dissipation thermal resistance of the temperature equalizing plate is low, and the temperature equalizing plate has a better application effect when applied eccentrically following gravity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0023] Figure 1 This is an external structural diagram of a temperature homogenizing plate provided in an embodiment of the present application;

[0024] Figure 2 An internal structure diagram of a temperature homogenizing plate provided in an embodiment of the present application;

[0025] Figure 3 A schematic diagram of the arrangement of the second capillary structure provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the application of the temperature homogenizing plate provided in the embodiment of the present application;

[0027] Figure 5 A schematic diagram of the application of the temperature homogenizing plate provided in an embodiment of the present application when erected;

[0028] Figure 6 A schematic diagram of the principle of the temperature homogenizing plate provided in the embodiment of the present application;

[0029] Figure 7 A schematic structural diagram of a second capillary structure provided in an embodiment of the present application;

[0030] Figure 8An exploded schematic diagram of a temperature homogenizing plate provided in an embodiment of the present application;

[0031] Fig. 9 Another structural schematic diagram of the second capillary structure provided in an embodiment of the present application;

[0032] Fig.10 A schematic diagram of the structure of the stripe groove provided in the embodiment of the present application;

[0033] Fig.11 A schematic diagram of the structure of a heat source substrate provided in one embodiment of the present application;

[0034] Fig.12 A schematic diagram of the structure of a heat dissipation substrate provided in one embodiment of the present application;

[0035] Fig.13 A schematic diagram of the structure of a heat source substrate provided in another embodiment of the present application;

[0036] Fig.14 A schematic structural diagram of a heat dissipation substrate provided in another embodiment of the present application.

[0037] in:

[0038] 1. Temperature balancing plate body; 1001. Phase change cavity; 1002. Heat source area; 1003. Spacer air channel; 1004. Relative horizontal plane; 1005. Concave space; 11. Stripe groove; 111. Protrusion; 12. First capillary structure; 13. Second capillary structure; 131. Support part; 132. Transverse groove; 14. Third capillary structure; 101. Heat source substrate; 102. Heat dissipation substrate; 103. Support column; 104. Connection frame; 1041. Partition opening; 105. Water injection pipe;

[0039] 2. Heating devices. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0042] In the field of electronic heat dissipation technology, conventional heat spreaders are mainly composed of cavities, capillaries and internally filled working fluids. The cavity is generally made of copper material, and the working fluid is pure water. The inner wall of the heat spreader has a vacuum cavity with a micro-capillary structure. When heat is conducted from the heat source to the evaporation zone, the working fluid in the cavity will begin to produce liquid phase gasification in a low vacuum environment. At this time, the working fluid absorbs heat energy and expands rapidly in volume. The gas phase working fluid will quickly fill the entire cavity and produce a certain saturated vapor pressure, which is generally used within 100°C and has a pressure of less than 1.1Mpa. When the gas phase working fluid contacts a relatively cold heat dissipation area composed of fins, etc., condensation will occur, and the heat accumulated during evaporation will be released through the condensation phenomenon. The condensed liquid phase working fluid will return to the evaporation heat source through the capillary phenomenon of the micro-capillary structure. This operation will repeat heat exchange in the cavity.

[0043] In the prior art, during the use of the temperature equalizing plate, the heat source is generally in a relatively central position, and the upper and lower parts of the temperature equalizing plate involve sintered powder or woven mesh capillaries. The application scenario is generally in the horizontal application direction. The gravity temperature equalizing plate that is used in a relatively far eccentric direction and in the direction of gravity cannot exert its effective low thermal resistance heat conduction, and the heat dissipation effect is poor. Its structure is not optimized enough and the design is not reasonable enough.

[0044] In response to the above technical problems, the present application provides a temperature equalizing plate, which aims to solve the problems of high capillary thermal resistance formed by powder or woven mesh and high thermal resistance of centripetal heat source when applied under gravity.

[0045] Please refer to Figure 1 and Figure 2 , Figure 1 This is an external structural diagram of the temperature homogenizing plate provided in the embodiment of the present application. Figure 2 The internal structure diagram of the temperature equalizing plate provided in the embodiment of the present application. It should be noted that, in order to more clearly understand the orientation relationship of the structure in the temperature equalizing plate, the corresponding coordinate system is marked in the drawings of the specification according to the different viewing angles, wherein the X-axis, Y-axis and Z-axis are the three directions of the coordinate system, the X-axis corresponds to the first direction in this article, the Y-axis corresponds to the second direction in this article, and the Z-axis corresponds to the third direction in this article; in some cases, the X-axis, Y-axis and Z-axis are perpendicular to each other, the X-axis is the length direction of the temperature equalizing plate, the Y-axis is the width direction of the temperature equalizing plate, and the Z-axis is the thickness direction of the temperature equalizing plate.

[0046] In a specific implementation, the temperature equalizer mainly includes a temperature equalizer body 1, which is a hollow structure and has a phase change cavity 1001 formed therein. It should be noted that the phase change cavity 1001 should be in a vacuum state, and a working medium can be injected into the phase change cavity 1001, and then the heat exchange process of the temperature equalizer is realized by using the cyclic change of the working medium between the liquid phase and the gas phase.

[0047] Inside the heat spreader body 1, a striped groove 11 is arranged on its inner wall. The specific position of the striped groove 11 on the inner wall of the heat spreader body 1 is not limited, but the striped groove 11 has directionality and extends in the first direction. Because the direction of the striped groove 11 is along the first direction, the working medium can be guided by the striped groove 11 when flowing in the first direction, which is equivalent to the minimum obstruction of the striped groove 11 when the working medium flows in the first direction. Therefore, the striped groove 11 has a beneficial effect on promoting the movement of the working medium in the first direction.

[0048] Because the temperature averaging plate can be connected to the heating device 2 when in use, and the heating device 2 is used as a heat source, the heat generated by the heating device 2 will be conducted to the temperature averaging plate, and at the key position of the connection between the temperature averaging plate and the heating device 2, that is, the heat conduction, there is a heat source area 1002 corresponding to the position of the heating device 2 in the phase change cavity 1001. Therefore, the heat source area 1002 belongs to the spatial scope of the phase change cavity 1001, but the heat source area 1002 specifically refers to the spatial area corresponding to the position of the heating device 2 in the phase change cavity 1001.

[0049] In the heat source area 1002, the temperature homogenizing plate is also provided with a first capillary structure 12 and a second capillary structure 13. Although the first capillary structure 12 and the second capillary structure 13 are both capillary structures and can also generate capillary forces on the working fluid to promote the flow of the working fluid in the heat exchange process of the temperature homogenizing plate, the structures of the first capillary structure 12 and the second capillary structure 13 are different. The first capillary structure 12 is layered and the first capillary structure 12 is covered on the striped groove 11, while the second capillary structure 13 is strip-shaped and connected to the first capillary structure 12. The second capillary structure 13 is also directional and extends in the first direction. The basic functions of the first capillary structure 12 and the second capillary structure 13 are both to provide capillary action, but the second capillary structure 13 also has a guiding function when the working fluid flows in the first direction. Therefore, the second capillary structure 13 has a beneficial promoting effect on the movement of the working fluid in the first direction.

[0050] It should be noted that the striped groove 11 provides capillary action in the entire phase change cavity 1001 of the temperature equalizer, and the capillary action provided by the striped groove 11 has a guiding effect in a specified direction, so that the resistance encountered by the working fluid along the path in the first direction is minimized; the first capillary structure 12 and the second capillary structure 13 only provide capillary action in a part of the temperature equalizer, namely the heat source area 1002. On the one hand, they form a strong siphon effect in combination with the striped groove 11. On the other hand, the capillary action provided by the second capillary structure 13 also has a guiding effect in a specified direction, which can well reduce the condensation reflux resistance of the working fluid. In addition, because the striped groove 11, the first capillary structure 12 and the second capillary structure 13 are set up, the internal structure of the phase change cavity 1001 is increased, which is equivalent to increasing the internal gas-liquid heat exchange area, so the heat exchange efficiency and heat dissipation effect are correspondingly improved.

[0051] The relevant process of the temperature equalizing plate is described as follows.

[0052] Before using the temperature averaging board, fill the phase change cavity 1001 inside the temperature averaging board with working fluid, connect the heating device 2 at the designated position of the temperature averaging board, and further connect the temperature averaging board with a cooling device or directly place the temperature averaging board in a low temperature environment.

[0053] During the use of the temperature equalizing plate, the heating device 2 generates heat as a heat source, and the heat is transferred to the temperature equalizing plate; in the heat source area 1002 inside the temperature equalizing plate, the working fluid absorbs heat in a liquid phase and changes to a gas phase. When the working fluid is in the gas phase, it flows inside the temperature equalizing plate to a position far away from the heat source area 1002, such as a low temperature area, to perform a heat exchange process, and then the working fluid releases heat and changes to a liquid phase. When the working fluid is in the liquid phase, it flows back to the heat source area 1002, and then the working fluid circulates in the phase change cavity 1001 to perform a liquid-gas phase heat exchange process, thereby generating the functions of heat conduction and heat diffusion.

[0054] The temperature averaging plate produces at least the following beneficial effects: in the above process, the temperature averaging plate provides a guiding effect for the working fluid along the first direction through the striped grooves 11 and the second capillary structure 13, thereby increasing the condensation reflux speed of the working fluid in the liquid phase, which is equivalent to reducing the resistance to the reflux of the working fluid, thereby reducing the capillary thermal resistance in this direction, and correspondingly improving the heat exchange efficiency and heat dissipation effect; in the heat source area 1002 inside the temperature averaging plate, the temperature averaging plate forms an enhanced capillary composite effect through the striped grooves 11 and the first capillary structure 12 and the second capillary structure 13, and also reduces the capillary resistance in the first direction. Thermal resistance, and improves heat exchange efficiency and heat dissipation effect; when the temperature equalizing plate is applied eccentrically following gravity, it is equivalent to arranging the heat source in a manner deviating from the central area of ​​the temperature equalizing plate and in the application scenario where the temperature equalizing plate is tilted along the gravity direction, it is only necessary to tilt the temperature equalizing plate along the first direction. Through the guiding effect of the above-mentioned striped grooves 11 and the second capillary structure 13, the working fluid is guided in the direction of gravity inclination, and an enhanced capillary composite effect is also formed in the heat source area 1002. Therefore, the heat dissipation thermal resistance of the temperature equalizing plate is low, and the temperature equalizing plate has a better application effect when applying eccentrically following gravity.

[0055] It should be noted that the present embodiment does not limit the cross-sectional shape of the stripe groove 11 , and the stripe groove 11 with a square, V-shaped, arc-shaped or other cross-sectional shapes should also fall within the description scope of the present embodiment.

[0056] Please refer to Figure 3 , Figure 3 A schematic diagram of the arrangement of the second capillary structure provided in an embodiment of the present application.

[0057] like Figure 3 As shown, the illustrated structure includes a temperature homogenizing plate body 1 and a second capillary structure 13. In some embodiments, there are multiple second capillary structures 13, and the multiple second capillary structures 13 are arranged at intervals along the second direction, and an interval air channel 1003 is formed between adjacent second capillary structures 13, and the interval air channel 1003 can enhance the temperature uniformity of the working medium in the first direction; at the same time, the interval air channel 1003 can also be arranged to be staggered, that is, the interval air channel 1003 has a staggered part in the second direction, which can make the airflow diffuse and flow to the left and right sides, thereby enhancing the temperature uniformity of the working medium in the second direction.

[0058] In this embodiment, the spacer air channel 1003 belongs to the space scope of the heat source area 1002. Although the setting position of the second capillary structure 13 is not limited, the spacer air channel 1003 formed between adjacent second capillary structures 13 has directionality, and the spacer air channel 1003 extends in the first direction together with the stripe groove 11. Therefore, through the stripe structure of the second capillary structure 13 and the spacer air channel 1003 formed between adjacent second capillary structures 13, the condensation reflux resistance of the working medium can be reduced in the first direction, and the replenishment speed of the working medium to the heat source area 1002 can be increased, thereby improving the heat exchange efficiency of the working medium.

[0059] Please continue to refer to Figure 3 In this embodiment, the second direction is perpendicular to the first direction, corresponding to the Y-axis shown in the figure being perpendicular to the X-axis, with the X-axis corresponding to the length direction of the temperature equalizing plate and the Y-axis corresponding to the width direction of the temperature equalizing plate. The temperature equalizing plate is divided into a heat source area 1002 and an area outside the heat source area 1002 along the length direction. The striped grooves 11 and the second capillary structure 13 are arranged along the length direction of the temperature equalizing plate, and multiple second capillary structures 13 are arranged at intervals along the width direction of the temperature equalizing plate.

[0060] Please refer to Figure 4 , Figure 4 A schematic diagram of the application of the temperature equalizing plate provided in an embodiment of the present application.

[0061] like Figure 4 As shown, the first direction and the second direction, i.e., the X-axis and the Y-axis, in this embodiment intersect to form a relative horizontal plane 1004 of the temperature-averaging plate. It should be noted that the relative horizontal plane 1004 is a reference plane with the temperature-averaging plate as a reference system, rather than a reference plane under an absolute reference system, so the relative horizontal plane 1004 will change position as the temperature-averaging plate moves in space. With the temperature-averaging plate as a reference object, the relative horizontal plane 1004 is a plane formed by the length and width directions of the temperature-averaging plate, and is perpendicular to the thickness direction of the temperature-averaging plate.

[0062] Please continue to refer to Figure 4 In some embodiments, the angle between the relative horizontal plane 1004 and the gravity direction of the temperature homogenizing plate is less than 90°, and the heat source region 1002 is located in the part of the phase change cavity 1001 that is in the direction of gravity of the temperature homogenizing plate.

[0063] In this embodiment, the projection of the gravity direction of the temperature equalizer on the relative horizontal plane 1004 is the first direction. Therefore, the angle between the relative horizontal plane 1004 and the gravity direction of the temperature equalizer is less than 90°, which means that the angle between the gravity direction of the temperature equalizer and the first direction is less than 90°. This setting is equivalent to tilting the temperature equalizer along the gravity direction, which is different from the horizontal state of the temperature equalizer in the prior art. In addition, the heating device 2 is connected to the lower half of the temperature equalizer body 1, which is equivalent to the heat source area 1002 being located in the phase change cavity 1001 in the direction of gravity of the temperature equalizer, i.e., the lower half. The above limits the eccentric heat source gravity application of the temperature equalizing plate, that is, the application scenario in which the heat source is arranged in a manner deviating from the central area of ​​the temperature equalizing plate and the temperature equalizing plate is inclined along the gravity direction; in this application scenario, the angle between the gravity direction of the temperature equalizing plate and the first direction is less than 90°, and the acute angle between the gravity direction of the temperature equalizing plate and the first direction is equivalent to the first direction being along the gravity direction of the temperature equalizing plate. At this time, the temperature equalizing plate has better working medium guidance that conforms to gravity, thereby solving the problem of high thermal resistance of heat dissipation in one-dimensional gravity application of traditional horizontal temperature equalizing plates.

[0064] Please refer to Figure 5 , Figure 5 A schematic diagram of the application of the temperature homogenizing plate provided in an embodiment of the present application when in an upright position.

[0065] In a specific embodiment, Figure 5 As shown, the temperature equalizer is in an upright state, and the heating device 2 is connected to the lower half of the temperature equalizer body 1. At this time, the length direction of the temperature equalizer is in the same direction as the gravity direction of the temperature equalizer, so the temperature equalizer is in full gravity application. Compared with the traditional horizontal temperature equalizer, the temperature equalizer can still be used normally in an upright state, because the striped grooves 11 and the second capillary structure 13 can provide guidance for the working fluid in the first direction, that is, the gravity direction, and reduce the resistance to the working fluid. Therefore, compared with the traditional horizontal temperature equalizer, the temperature equalizer will not produce a sharp increase in heat dissipation thermal resistance due to the change of state, which can solve the problem of high heat dissipation thermal resistance of the traditional horizontal temperature equalizer in one-dimensional gravity application.

[0066] Please refer to Figure 6 , Figure 6 A schematic diagram of the principle of the temperature equalizing plate provided in an embodiment of the present application.

[0067] like Figure 6As shown, a schematic diagram of the working principle of the temperature-averaging plate to achieve heat dissipation balance through phase change is given. From the figure, it can be seen that the phase change gas-liquid circulation flow direction of the product when it is working. The solid arrow represents the flow direction when the working fluid changes to the gas phase. At this time, the gas phase working fluid flows in the direction away from the heat source area 1002, which is equivalent to flowing from the evaporation area of ​​the temperature-averaging plate to the condensation area; the broken line arrow represents the flow direction when the working fluid changes to the liquid phase. At this time, the liquid phase working fluid flows in the direction close to the heat source area 1002, which is equivalent to flowing from the condensation area of ​​the temperature-averaging plate back to the evaporation area.

[0068] Please refer to Figure 7 , Figure 7 A schematic structural diagram of a second capillary structure provided in an embodiment of the present application.

[0069] like Figure 7 As shown, in some embodiments, a support portion 131 is disposed inside the second capillary structure 13, and the support portion 131 is used to support the inner top and inner bottom of the temperature vapor chamber body 1. There are multiple support portions 131, and the multiple support portions 131 are spaced apart along the first direction.

[0070] In this embodiment, by providing the support portion 131, the structural strength of the second capillary structure 13 can be enhanced on the one hand, and the connection strength between the second capillary structure 13 and the temperature-vaporizing plate body 1 can be improved on the other hand. Therefore, as a part of the second capillary structure 13, the support portion 131 enhances the support effect of the temperature-vaporizing plate body 1 between the inner top and the inner bottom through the second capillary structure 13, and suppresses the deformation of the temperature-vaporizing plate body 1 in the thickness direction; in addition, because the second capillary structure 13 is strip-shaped and extends in the first direction, the connection effect of the second capillary structure 13 with the temperature-vaporizing plate body 1 in the length direction of the temperature-vaporizing plate body 1 is enhanced, and the deformation of the temperature-vaporizing plate body 1 in the length direction can also be suppressed, so that the anti-expansion plate strength of the temperature-vaporizing plate is increased.

[0071] Please refer to Figure 8 , Figure 8 An exploded schematic diagram of the temperature homogenizing plate provided in an embodiment of the present application.

[0072] In a specific implementation, the temperature homogenizing plate body 1 mainly includes a heat source substrate 101 and a heat dissipation substrate 102 , and the heat source substrate 101 and the heat dissipation substrate 102 are combined to form a phase change cavity 1001 therein.

[0073] Specifically, the first side of the heat source substrate 101 is used to connect with the heating device 2, and a phase change cavity 1001 is formed between the first side of the heat dissipation substrate 102 and the second side of the heat source substrate 101. Figure 8 The second side of the heat source substrate 101 refers to the lower side of the heat source substrate 101, and the second side of the heat source substrate 101 refers to the inner side of the heat source substrate 101. Figure 8 The first side of the heat source substrate 101 refers to the inner side of the heat source substrate 101; the first side of the heat dissipation substrate 102 refers to the inner side of the heat dissipation substrate 102. Figure 8 The lower side of the heat dissipation substrate 102, and the heat dissipation substrate 102 also has a second side, which refers to the outer side of the heat dissipation substrate 102, i.e. Figure 8 The upper side of the heat dissipation substrate 102.

[0074] In this embodiment, the striped groove 11 is arranged on the second side of the heat source substrate 101 and / or the first side of the heat dissipation substrate 102, the first capillary structure 12 is arranged on the second side of the heat source substrate 101 and / or the first side of the heat dissipation substrate 102, and the second capillary structure 13 is arranged on the second side of the heat source substrate 101 and / or the first side of the heat dissipation substrate 102.

[0075] It should be noted that the above embodiment only defines that the temperature vapor chamber body 1 is composed of a heat source substrate 101 and a heat dissipation substrate 102, and does not define the arrangement of the stripe grooves 11, the first capillary structure 12, and the second capillary structure 13. Therefore, there are multiple arrangements of the stripe grooves 11, the first capillary structure 12, and the second capillary structure 13 on the temperature vapor chamber body 1, including but not limited to being arranged only on the heat source substrate 101, only on the heat dissipation substrate 102, and simultaneously on the heat source substrate 101 and the heat dissipation substrate 102, which should all fall within the scope of the description of this embodiment.

[0076] In some cases, taking the second capillary structure 13 disposed on the heat source substrate 101 as an example, a transverse channel extending in the second direction is formed between the second capillary structure 13 and the heat source substrate 101, and the transverse channel is perpendicular to the spacing air channel 1003. The transverse channel can connect the two sides of the second capillary structure 13, and the airflow can diffuse and flow to the left and right sides, thereby increasing the temperature uniformity on both sides. The transverse channel can be a structure disposed on the heat source substrate 101, and the structure is located below the second capillary structure 13; the transverse channel can also be a structure disposed on the second capillary structure 13, and the structure is located above the heat source substrate 101.

[0077] Please refer to Fig. 9 , Fig. 9 Another structural schematic diagram of the second capillary structure provided in an embodiment of the present application.

[0078] like Fig. 9As shown, continuing to take the second capillary structure 13 set on the heat source substrate 101 as an example, a transverse groove 132 is set in the length direction of the second capillary structure 13, and the extension direction of the transverse groove 132 is the same as the width direction of the temperature equalizing plate. At this time, a transverse channel that transversely penetrates the second capillary structure 13 is formed by the transverse groove 132 on the second capillary structure 13. The transverse channel is perpendicular to the spacing airway 1003, which helps to realize the diffusion of airflow to the left and right sides and increase the temperature uniformity on both sides.

[0079] Please continue to refer to Figure 8 In some embodiments, the temperature equalizing plate body 1 further includes a support column 103, which is disposed in the phase change cavity 1001, wherein a first end of the support column 103 contacts a second side of the heat source substrate 101, and a second end of the support column 103 contacts a first side of the heat dissipation substrate 102.

[0080] In this embodiment, the support column 103 is a supporting structure between the heat source substrate 101 and the heat dissipation substrate 102. The support column 103 provides the main support for the temperature equalizing plate body 1 between the inner top and the inner bottom, thereby suppressing the deformation of the temperature equalizing plate body 1 in the thickness direction.

[0081] Furthermore, a third capillary structure 14 is disposed on the support column 103 , and the third capillary structure 14 connects the heat source substrate 101 and the heat dissipation substrate 102 .

[0082] In this embodiment, by setting the third capillary structure 14 on the support column 103, the connection between the heat source substrate 101 and the heat dissipation substrate 102 can be achieved at the position of the support column 103, which is equivalent to shortening the distance for the working fluid to return from the heat dissipation substrate 102 to the heat source substrate 101 after condensation through the support column 103, thereby enriching the working fluid reflux route and improving the working fluid reflux effect.

[0083] Please continue to refer to Figure 8 In some embodiments, the temperature vapor chamber body 1 further includes a connection frame 104 , a first side of the connection frame 104 is connected to an edge of a second side of the heat source substrate 101 , and a second side of the connection frame 104 is connected to an edge of a first side of the heat dissipation substrate 102 .

[0084] In this embodiment, a sealed phase change chamber 1001 is formed between the connection frame 104, the heat source substrate 101 and the heat dissipation substrate 102. Compared with the existing temperature equalization board, because the heat source substrate 101 and the heat dissipation substrate 102 are connected by the connection frame 104, the material processing problems such as the difficulty of stamping and forging of thicker plates with a thickness of more than 1.0 mm for special needs can be solved, the manufacturing process is simplified, and the cost is reduced. Among them, there are many ways to connect the connection frame 104, including but not limited to diffusion welding, brazing, resistance welding, friction welding, etc.

[0085] Please continue to refer to Figure 8 In some embodiments, the temperature homogenizing plate body 1 further includes a water injection pipe 105 ; a partition opening 1041 leading to the phase change chamber 1001 is provided on the connection frame 104 , and the water injection pipe 105 is installed at the partition opening 1041 .

[0086] In some cases, the material of the temperature homogenizing plate may be pure copper, titanium, stainless steel, aluminum, etc., and the working fluid filled inside may be a liquid working fluid such as pure water, acetone, ethanol, etc.

[0087] Please refer to Fig.10 , Fig.10 A schematic diagram of the structure of the stripe grooves provided in an embodiment of the present application.

[0088] In some embodiments, the stripe groove 11 includes a plurality of protrusions 111 , and a recessed space 1005 is formed between adjacent protrusions 111 .

[0089] like Fig.10 As shown, the cross-sectional shape of the protrusion 111 and the recessed space 1005 is a trapezoid, the upper side length of the protrusion 111 is smaller than the lower side length, the upper side length of the recessed space 1005 is larger than the lower side length, and the lower side length of the recessed space 1005 is smaller than the lower side length of the protrusion 111.

[0090] In some cases, the side lengths of the protrusion 111 and the recessed space 1005 are both less than 1 mm, the thickness of the first capillary structure 12 is less than 1 mm, and the spacing of the second capillary structure 13 is 0.2 mm to 3.0 mm.

[0091] In some embodiments, the second capillary structure 13 and the first capillary structure 12 are an integrated structure.

[0092] In this embodiment, the first capillary structure 12 and the second capillary structure 13 are designed as one body, which can improve the convenience of assembly with the temperature equalizer body 1. In addition, the first capillary structure 12 and the second capillary structure 13 can be sequentially arranged in the temperature equalizer body 1.

[0093] In a specific implementation, please refer to Fig.11 and Fig.12 , Fig.11 This is a schematic diagram of the structure of a heat source substrate provided in one embodiment of the present application. Fig.12 A schematic structural diagram of a heat dissipation substrate provided in one embodiment of the present application.

[0094] Fig.11 and Fig.12 FIG. 1 shows a configuration of the heat source substrate 101 and the heat dissipation substrate 102. Fig.11In the embodiment, the heat source substrate 101 is provided with stripe grooves 11 covering the range of the phase change cavity 1001, and the first capillary structure 12 and the second capillary structure 13 are provided in the heat source region 1002. The first capillary structure 12 is a layer of evaporation capillary layer sintered on the heat source substrate 101, which can be formed by sintering powder, woven mesh, etc.; the second capillary structure 13 can be sintered into strips, or can be formed by sintering capillaries such as cylinders and square columns and arranged in a layer of powder rings. Fig.12 In the embodiment, the heat dissipation substrate 102 is designed as a smooth flat substrate. Since the support pillars 103 are arranged on the heat source substrate 101 , holes matching with the support pillars 103 are arranged on the heat dissipation substrate 102 .

[0095] It should be noted that, because the heat dissipation substrate 102 is not provided with stripe grooves 11, the temperature equalizer is mainly suitable for situations with low power requirements. After the vaporized working fluid is cooled on the heat dissipation substrate 102, the condensate is returned to the heat source area by gravity and the stripe grooves. The capillary combination of the stripe grooves and the heat source area forms a strong siphon effect, which can well reduce the working fluid condensation reflux resistance and increase the internal gas-liquid heat exchange area.

[0096] On this basis, by setting the third capillary structure 14 on the support column 103, after the vaporized working medium is cooled on the heat dissipation substrate 102, it is connected to the capillary layer of the heat source substrate by gravity, the capillary force of the grooves and the capillary powder ring on the support column. At this time, the working medium condensed on the heat dissipation substrate can be returned to the heating substrate over a short distance, reducing the condensation reflux speed of the working medium. Among them, the third capillary structure 14 set on the support column 103 can be a capillary powder ring.

[0097] In addition to the above-mentioned embodiments, stripe grooves 11 may also be provided on the heat dissipation substrate 102 .

[0098] In this embodiment, both the heat source substrate 101 and the heat dissipation substrate 102 are provided with stripe grooves 11, and the heat source substrate 101 is also provided with a first capillary structure 12 and a second capillary structure 13. Optionally, the heat dissipation substrate 102 is also provided with a first capillary structure 12, and the support column 103 is provided with a third capillary structure 14.

[0099] In a specific implementation, please refer to Fig.13 and Fig.14 , Fig.13 This is a schematic diagram of the structure of a heat source substrate provided in another embodiment of the present application. Fig.14 A schematic structural diagram of a heat dissipation substrate provided in another embodiment of the present application.

[0100] like Fig.13 and Fig.14As shown, the capillary layer of the heat source substrate 101 has no grooves, and the heat source substrate 101 is formed by sintering powder of a smooth plate or a woven mesh; the heat dissipation substrate 102 is provided with both stripe grooves 11 and a first capillary structure 12 as a capillary layer, so the heat dissipation substrate 102 is a local composite capillary layer of the grooved plate, and a single-sided grooved plate structure is formed at this time, which has a small resistance and can solve the problem of high thermal resistance under low power application. Furthermore, the heat source substrate 101 is provided with a circular hole position that cooperates with the support column 103 and a strip hole position that cooperates with the second capillary structure 13 as a strip capillary structure, which facilitates the assembly of the temperature equalization plate.

[0101] After experimental demonstration, the inventor found that the temperature equalizer can exert its better heat dissipation effect and low thermal resistance heat conduction in the application scenarios where the heat source is arranged in a manner deviating from the central area of ​​the temperature equalizer and the temperature equalizer is inclined in the direction of gravity; the temperature equalizer has a higher capillary force arranged in the heat source area, has an evaporation groove, and a strip capillary structure in the direction of gravity, which has better airflow guidance that conforms to gravity; the capillary coupling of the groove and the evaporation area designed in the heat dissipation substrate forms a strong composite effect capillary, and under the application of gravity, the reflux speed of the working fluid is faster, the corresponding exchange efficiency is improved, and the heat dissipation thermal resistance is reduced; the traditional heat source substrate adopts stamping or die casting, forging to form a cavity structure, and now a connecting frame is used to connect the upper and lower substrates and weld them to form a sealed vacuum cavity, which solves the problem of complex process and high cost.

[0102] It should be noted that many of the components mentioned in this application are universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0103] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0104] The above is a detailed introduction to the temperature equalizing plate provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A temperature equalizing plate, characterized in that: The temperature equalizing plate is used to be connected to the heating device, and the temperature equalizing plate includes a temperature equalizing plate body with a phase change cavity formed inside, and the inner wall of the temperature equalizing plate body is provided with stripe grooves extending in a first direction; a heat source area corresponding to the position of the heating device is provided in the phase change cavity, and the heat source area is provided with a layered first capillary structure and a strip-shaped second capillary structure extending in the first direction, the first capillary structure is covered on the stripe groove, and the second capillary structure is connected to the first capillary structure.

2. The temperature equalizing plate according to claim 1, characterized in that: There are multiple second capillary structures, which are spaced apart along the second direction, and spacer air channels are formed between adjacent second capillary structures, and the spacer air channels extend in the first direction; the second direction is perpendicular to the first direction, and the first direction and the second direction intersect to form a relative horizontal plane of the temperature homogenizing plate.

3. The temperature equalizing plate according to claim 2, characterized in that: The angle between the relative horizontal plane and the gravity direction of the temperature homogenizing plate is less than 90°, and the heat source area is located in a portion of the phase change cavity that is in the direction of gravity of the temperature homogenizing plate.

4. The temperature equalizing plate according to claim 2, characterized in that: A supporting part is arranged inside the second capillary structure, and the supporting part is used to support the inner top and inner bottom of the temperature homogenizing plate body; there are multiple supporting parts, and the multiple supporting parts are arranged at intervals along the first direction.

5. The temperature homogenizing plate according to claim 1, characterized in that: The temperature homogenizing plate body comprises: A heat source substrate, a first side of which is used to connect with a heat generating device; A heat dissipation substrate, wherein the phase change cavity is formed between a first side and a second side of the heat source substrate; Wherein, the striped groove is arranged on the second side of the heat source substrate and / or the first side of the heat dissipation substrate, the first capillary structure is arranged on the second side of the heat source substrate and / or the first side of the heat dissipation substrate, and the second capillary structure is arranged on the second side of the heat source substrate and / or the first side of the heat dissipation substrate.

6. The temperature homogenizing plate according to claim 5, characterized in that: The temperature equalizing plate body also includes a support column, which is arranged in the phase change cavity, the first end of the support column contacts the second side of the heat source substrate, the second end of the support column contacts the first side of the heat dissipation substrate, and a third capillary structure is arranged on the support column, and the third capillary structure connects the heat source substrate and the heat dissipation substrate.

7. The temperature homogenizing plate according to claim 5, characterized in that: The temperature homogenizing plate body also includes a connecting frame, a first side of the connecting frame is connected to the edge of the second side of the heat source substrate, and a second side of the connecting frame is connected to the edge of the first side of the heat dissipation substrate, and the phase change cavity is formed between the connecting frame, the heat source substrate and the heat dissipation substrate.

8. The temperature equalizing plate according to claim 7, characterized in that: The temperature equalizing plate body also includes a water injection pipe; the connection frame is provided with a partition opening leading to the phase change chamber, and the water injection pipe is installed at the partition opening.

9. The temperature equalizing plate according to claim 1, characterized in that: The second capillary structure and the first capillary structure are an integrated structure.

10. The temperature homogenizing plate according to claim 1, characterized in that: The stripe groove includes a plurality of protrusions, and a recessed space is formed between adjacent protrusions; the cross-sectional shape of the protrusions and the recessed space is a trapezoid, the upper side length of the protrusion is smaller than the lower side length, the upper side length of the recessed space is larger than the lower side length, and the lower side length of the recessed space is smaller than the lower side length of the protrusion.

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