Wafer taking device

Abstract

The utility model provides a wafer material taking device. The wafer material taking device comprises a vertically arranged mounting plate, a power transmission mechanism arranged at the side part of the mounting plate, and a grabbing mechanical arm for driving the grabbing mechanical arm to move along the horizontal direction, the grabbing mechanical arm comprises a positioning extension arm, a locking structure and a transmission connecting arm, and the positioning extension arm is provided with a first clamping part used for clamping the edge of a wafer; and the locking structure comprises a locking clamp of which one side is provided with a second clamping part used for clamping the edge of the wafer, a moving mechanism used for driving the locking clamp to move along the horizontal direction, and a detection module used for detecting whether the grabbing mechanical arm clamps the wafer or not. According to the utility model, a grabbing mode is adopted to carry the wafer, the defects caused by a lifting carrying method are overcome, the device is suitable for putting in or taking away the wafer in some special processes (such as Bernoulli chuck cleaning operation), the application range is wider, the convenience is improved, meanwhile, whether the device clamps the wafer or not is detected, and the detection efficiency is improved. And the wafer carrying reliability is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of equipment for manufacturing semiconductors, and more specifically, relates to a wafer fetching device. Background Art

[0002] Wafer retrieving device, commonly known as wafer transfer robot or wafer loader, is one of the key equipments in the semiconductor chip manufacturing process. This device is precisely designed and accurately operated. It is mainly used to take out a single wafer from a wafer box in a clean room environment and place it accurately and safely into various semiconductor process equipment. It can also return the wafers that have completed the process steps to the wafer box.

[0003] The commonly used wafer retrieving device currently uses a retrieving jig to lift the wafer so that it is placed within the limit position set on the top of the jig to achieve wafer positioning. In some special processes, such as Bernoulli chuck cleaning operations, when the wafer needs to be placed on the chuck for operation, the jig cannot pass through the bottom of the wafer, which will affect the jig's placement or removal of the wafer, reducing the reliability of wafer handling.

[0004] Therefore, how to transport wafers more conveniently and reliably is an issue that needs to be urgently addressed in the industry. Utility Model Content

[0005] The utility model aims to provide a wafer fetching device to solve the problem of insufficient convenience and reliability when wafers are transported by a lifting and transporting method in the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a wafer picking device, characterized in that it comprises: a vertically arranged mounting plate, a power transmission mechanism installed on the side of the mounting plate, a grabbing mechanical arm connected to the power transmission mechanism and driven by the power transmission mechanism to move in the horizontal direction;

[0007] The grabbing robot arm includes: a positioning extension arm and a locking structure located above the top of the mounting plate, and a transmission connecting arm connected to the power transmission mechanism, one side of the positioning extension arm is connected to the locking structure, and the other side of the positioning extension arm away from the locking structure is provided with a first clamping portion for clamping the edge of the wafer, the two sides of the locking structure are respectively connected to the positioning extension arm and the transmission connecting arm, the locking structure includes a locking clamp with a second clamping portion for clamping the edge of the wafer on one side, a moving mechanism connected to the other side of the locking clamp and used to drive the locking clamp to move in a horizontal direction, and a detection module for detecting whether the grabbing robot arm clamps the wafer.

[0008] Furthermore, the moving mechanism includes a moving plate connected to the locking clamp, an advance and retreat cylinder, and a connector for connecting the advance and retreat cylinder and the moving plate.

[0009] Further, the detection module includes a first detection module and a second detection module located on both sides of the connecting head, the first detection module includes a first detection seat with a first detection slot, and a lock empty detection component installed on the movable plate and used to move inside the first detection slot, and the second detection module includes a second detection seat with a second detection slot, and an in-place detection component installed on the movable plate and used to move inside the second detection slot.

[0010] Furthermore, the first clamping part and the second clamping part both adopt locking pads, and the locking pads are provided with slots adapted to the edge size of the wafer.

[0011] Furthermore, there are multiple grabbing mechanical arms, and the positioning extension arms included in the multiple grabbing mechanical arms are arranged at intervals and overlapped.

[0012] Further, the number of the grabbing mechanical arms is four, and the four grabbing mechanical arms include a first grabbing mechanical arm, a second grabbing mechanical arm, a third grabbing mechanical arm and a fourth grabbing mechanical arm which are arranged at intervals;

[0013] The number of the mounting plates is two, and the two mounting plates include a first mounting plate and a second mounting plate which are arranged in parallel and symmetrically;

[0014] The number of the power transmission mechanisms is four, and the four power transmission mechanisms include a first power transmission mechanism and a second power transmission mechanism which are arranged side by side on the first mounting plate and are respectively connected to the first grasping robot arm and the second grasping robot arm, and a third power transmission mechanism and a fourth power transmission mechanism which are arranged side by side on the second mounting plate and are respectively connected to the third grasping robot arm and the fourth grasping robot arm.

[0015] Furthermore, it also includes a stabilizing frame for connecting the first mounting plate and the second mounting plate.

[0016] Furthermore, the power transmission mechanism includes a first transmission wheel and a second transmission wheel installed on both sides of the mounting plate, a driver installed on the mounting plate and connected to the first transmission wheel, and a two-way wheel rod passing through the mounting plate, one end of the two-way wheel rod is connected to the first transmission wheel through a first transmission belt, and the other end of the two-way wheel rod is connected to the second transmission wheel through a second transmission belt, and the second transmission belt is also connected to the grabbing robot arm.

[0017] Furthermore, it also includes an auxiliary positioning mechanism for stabilizing the grabbing robot arm, the auxiliary positioning mechanism includes two steering wheel rods arranged at the front and rear ends of the mounting plate, the two steering wheel rods are connected by a third transmission belt, and the third transmission belt is also connected to the grabbing robot arm.

[0018] Furthermore, it also includes a shell for covering the mounting plate and the power transmission mechanism.

[0019] The beneficial effect of the wafer retrieval device provided by the utility model is that compared with the prior art, the utility model adopts a grasping method to transport the wafer, which solves the disadvantages brought by the lifting and transporting method, is suitable for placing or removing wafers under some special processes (such as Bernoulli chuck cleaning operations), has a wider range of adaptability, and improves convenience. At the same time, it also detects whether the device clamps the wafer, thereby improving the reliability of wafer transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 A schematic diagram of the structure of a wafer retrieving device provided in a preferred embodiment of the utility model;

[0022] Figure 2 A three-dimensional schematic diagram of a wafer retrieving device with part of the outer shell removed provided by a preferred embodiment of the utility model Figure 1 ;

[0023] Figure 3 A three-dimensional schematic diagram of a wafer retrieving device with part of the outer shell removed provided by a preferred embodiment of the utility model Figure 2 ;

[0024] Figure 4 for Figure 3 The enlarged schematic diagram at A in the middle;

[0025] Figure 5 for Figure 3 The enlarged schematic diagram of point B in the middle;

[0026] Figure 6 A schematic top view of a wafer retrieving device with part of the outer shell removed provided by a preferred embodiment of the utility model;

[0027] Figure 7 A schematic front view of a wafer retrieving device with part of the outer shell removed provided by a preferred embodiment of the utility model;

[0028] Figure 8 A schematic side view of a wafer retrieving device with part of the outer shell removed provided by a preferred embodiment of the utility model;

[0029] Among them, the main marks of the drawings in the figure are:

[0030] 1. Mounting plate; 2. Power transmission mechanism; 3. Grasping robot arm; 4. Auxiliary positioning mechanism; 5. Housing; 6. Moving assembly;

[0031] 11. Mounting frame;

[0032] 21. first transmission wheel; 22. second transmission wheel; 23. driver; 24. bidirectional wheel rod; 26. second transmission belt;

[0033] 31. Transmission connecting arm; 32. Positioning extension arm; 33. Locking structure;

[0034] 321, first clamping part; 330, housing; 331, locking clamp; 332, second clamping part; 333, moving mechanism; 334, detection module;

[0035] 3331, moving plate; 3332, advancing and retreating cylinder; 3334, connecting head; 3341, first detection seat; 3342, empty lock detection member; 3343, second detection seat; 3344, in-position detection member; 3345, first detection slot; 3346, second detection slot;

[0036] 41. Steering wheel rod; 42. The third transmission belt; 43. The transmission belt connector. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0038] Aiming at the problem that the conventional technique of transporting wafers by a lifting and transporting method has insufficient convenience and reliability, the utility model provides a novel wafer retrieving device.

[0039] Please also read Figure 1 , Figure 2 The wafer retrieving device provided by the utility model comprises a mounting plate 1, a power transmission mechanism 2 and a grabbing robot arm 3. The mounting plate 1 is vertically arranged, the power transmission mechanism 2 is installed on the side of the mounting plate 1, and the grabbing robot arm 3 is connected to the power transmission mechanism 2 and moves in the horizontal direction under the drive of the power transmission mechanism 2.

[0040] like Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, the grabbing robot arm 3 includes: a transmission connecting arm 31, a positioning extension arm 32 and a locking structure 33. Among them, the positioning extension arm 32 and the locking structure 33 are located above the top of the mounting plate 1, and the two sides of the locking structure 33 are respectively connected to the positioning extension arm 32 and the transmission connecting arm 31, and the transmission connecting arm 31 is connected to the power transmission mechanism 2. One side of the positioning extension arm 32 is connected to the locking structure 33, and the other side of the positioning extension arm 32 away from the locking structure 33 is provided with a first clamping part 321 for clamping the edge of the wafer, and the locking structure 33 includes a locking clamp 331 with a second clamping part 332 for clamping the edge of the wafer on one side, a moving mechanism 333 connected to the other side of the locking clamp 331 and used to drive the locking clamp 331 to move in the horizontal direction, and a detection module 334 for detecting whether the grabbing robot arm 3 clamps the wafer.

[0041] When the wafer picking device provided by the utility model is used to clamp the wafer, the power transmission mechanism 2 is first used to drive the grabbing mechanical arm 3 to move as a whole, so that the first clamping part 321 on the positioning extension arm 32 clamps one side edge of the wafer, and then the moving mechanism 333 drives the locking clamp 331 to move, so that the second clamping part 332 on the locking clamp 331 clamps the other side edge of the wafer, so as to realize the wafer handling by grabbing the wafer. At the same time, the detection module 334 is used to detect whether the grabbing mechanical arm 3 clamps the wafer.

[0042] It can be seen that the wafer retrieval device provided by the utility model adopts a grasping method to transport wafers, which solves the disadvantages brought by the lifting and transporting method. It is suitable for placing or removing wafers under some special processes (such as Bernoulli chuck cleaning operations), has a wider range of adaptability, and improves convenience. At the same time, it also detects whether the device clamps the wafer, thereby improving the reliability of wafer transportation.

[0043] In a preferred embodiment, if Figure 3 As shown, two first clamping parts 321 are arranged at intervals on the positioning extension arm 32, and the first clamping parts 321 are used for clamping and protecting the wafer. The first clamping parts 321 use locking pads, and the locking pads are provided with a slot adapted to the edge size of the wafer.

[0044] In a preferred embodiment, if Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the locking structure 33 includes a housing 330, a detection module 334 and a moving mechanism 333 are arranged inside the housing 330, and a locking clamp 331 is slidably connected to the outside of the housing 330. There are two locking clamps 331, and the two locking clamps 331 are arranged at intervals on the same side of the housing 330. The two locking clamps 331 are each provided with a second clamping portion 332, and the second clamping portion 332 is used for clamping and protecting the wafer. The second clamping portion 332 adopts a locking pad, and the locking pad is provided with a slot adapted to the edge size of the wafer.

[0045] In a preferred embodiment, if Figure 6 As shown, the moving mechanism 333 includes a moving plate 3331 connected to the locking clamp 331, an advance and retreat cylinder 3332, and a connector 3334 for connecting the advance and retreat cylinder 3332 and the moving plate 3331. It can be understood that the advance and retreat cylinder 3332 provides a power source for the locking clamp 331, and the locking clamp 331 is used to lock the wafer to prevent the wafer from falling during transportation. When the advance and retreat cylinder 3332 is started to work, the advance and retreat cylinder 3332 drives the moving plate 3331 to move through the connector 3334, and at the same time, the movement of the moving plate 3331 drives the locking clamp 331 to move, so that the locking clamp 331 moves in the horizontal direction.

[0046] In a preferred embodiment, if Figure 4 As shown, there are two detection modules 334 , and the two detection modules 334 include a first detection module and a second detection module located on both sides of the connector 3334 .

[0047] The first detection module includes a first detection seat 3341 and a lock empty detection member 3342. Among them, a detection sensor, such as a laser sensor, is provided on the first detection seat 3341, and a first detection slot 3345 is opened in the first detection seat 3341. The lock empty detection member 3342 is installed on the moving plate 3331, and is used to move inside the first detection slot 3345, and the overall width of the lock empty detection member 3342 is consistent. When the lock empty detection member 3342 moves synchronously with the moving plate 3331, if any position of the lock empty detection member 3342 is inside the first detection slot 3345, the first detection seat 3341 detects the lock empty detection member 3342; and if the lock empty detection member 3342 is out of the first detection slot 3345, the first detection seat 3341 does not detect the lock empty detection member 3342.

[0048] The second detection module includes a second detection seat 3343 and an in-place detection member 3344. Among them, a detection sensor, such as a laser sensor, is provided on the second detection seat 3343, and a second detection slot 3346 is provided on the second detection seat 3343. The in-place detection member 3344 is mounted on the moving plate 3331 and is used to move inside the second detection slot 3346. The end width of the in-place detection member 3344 is larger, and the width of other positions is smaller. When the in-place detection member 3344 moves synchronously with the moving plate 3331, if the end of the in-place detection member 3344 is inside the second detection slot 3346, the second detection seat 3343 detects the in-place detection member 3344; and if the empty lock detection member 3342 is out of the second detection slot 3346 or other positions of the empty lock detection member 3342 except the end are inside the second detection slot 3346, the second detection seat 3343 does not detect the in-place detection member 3344.

[0049] When two detection modules 334 (i.e., the first detection module and the second detection module) are used to detect whether the grasping robot arm 3 has clamped the wafer, if the first detection seat 3341 detects the lock-empty detection component 3342 and the second detection seat 3343 detects the in-place detection component 3344, it is determined that the grasping robot arm 3 has clamped the wafer; if the first detection seat 3341 does not detect the lock-empty detection component 3342, or the second detection seat 3343 does not detect the in-place detection component 3344, it is determined that the grasping robot arm 3 does not clamp the wafer, or even grasps it empty.

[0050] In a preferred embodiment, if Figure 2 , Figure 7 , Figure 8 As shown, the power transmission mechanism 2 includes a first transmission wheel 21 and a second transmission wheel 22 installed on both sides of the mounting plate 1, a driver 23 installed on the mounting plate 1 and connected to the first transmission wheel 21, and a two-way wheel rod 24 passing through the mounting plate 1, one end of the two-way wheel rod 24 is connected to the first transmission wheel 21 through a first transmission belt (not shown in the figure), and the other end of the two-way wheel rod 24 is connected to the second transmission wheel 22 through a second transmission belt 26, and the second transmission belt 26 is also connected to the grasping robot arm 3.

[0051] It can be understood that the driver 23 is used as a power source to drive the grabbing robot arm 3 to work. The first transmission wheel 21, the second transmission wheel 22, the two-way wheel rod 24, the first transmission belt and the second transmission belt 26 jointly transmit the power brought by the driver 23 to the grabbing robot arm 3. When the driver 23 is started to work, the driver 23 drives the first transmission wheel 21 to rotate, the first transmission wheel 21 drives the two-way wheel rod 24 to rotate through the first transmission belt (not shown in the figure), the two-way wheel rod 24 drives the second transmission wheel 22 to rotate through the second transmission belt 26, and at the same time, the second transmission belt 26 rotates to drive the grabbing robot arm 3 to move in the horizontal direction as a whole, so that the power transmission mechanism 2 transmits power to the grabbing robot arm 3.

[0052] In a preferred embodiment, if Figure 2 As shown, the wafer picking device also includes an auxiliary positioning mechanism 4 for stabilizing the grabbing robot arm 3, and the auxiliary positioning mechanism 4 includes two steering wheel rods 41 arranged at the front and rear ends of the mounting plate 1, and the two steering wheel rods 41 are connected by a third transmission belt 42, and the third transmission belt 42 is also connected to the grabbing robot arm 3. The two steering wheel rods 41 each include a link rod and two rotating wheels arranged at both ends of the link rod, and the two steering wheel rods 41 are used to provide a rotation circulation plane for the third transmission belt 42. The third transmission belt 42 is connected to the grabbing robot arm 3 through a transmission belt connector 43.

[0053] In a preferred embodiment, if Figure 1 As shown, the wafer picking device also includes a housing 5 for covering the mounting plate 1 and the power transmission mechanism 2. The housing 5 is provided to protect the internal parts of the device.

[0054] The wafer retrieving device provided by the utility model also concentrates a plurality of grabbing mechanical arms 3 for wafer transportation on one device, so that the wafer can perform multiple processes simultaneously during transportation, thereby improving the efficiency of wafer transportation.

[0055] The positioning extension arms 32 included in the plurality of grabbing mechanical arms 3 are arranged at intervals and overlapped, and the locking structures 33 included in the plurality of grabbing mechanical arms 3 are arranged at intervals and overlapped.

[0056] The utility model does not limit the number of the grabbing mechanical arms 3, and an appropriate number of the grabbing mechanical arms 3 can be selected according to actual application requirements.

[0057] In a preferred embodiment, if Figure 1 , Figure 2 , Figure 3 As shown, there are four grabbing mechanical arms 3. The following is an example in which a wafer picking device is provided with four grabbing mechanical arms 3.

[0058] The wafer retrieving device comprises four grabbing mechanical arms 3 arranged at intervals, namely a first grabbing mechanical arm, a second grabbing mechanical arm, a third grabbing mechanical arm and a fourth grabbing mechanical arm. The specific structure of the grabbing mechanical arm 3 has been described in detail above and will not be repeated here.

[0059] The wafer retrieval device further comprises two parallel and symmetrically arranged mounting plates 1, namely a first mounting plate and a second mounting plate, and a stabilizing frame 11 for connecting the first mounting plate and the second mounting plate.

[0060] The wafer retrieving device also includes four power transmission mechanisms 2 corresponding to the four grabbing mechanical arms 3, namely the first power transmission mechanism, the second power transmission mechanism, the third power transmission mechanism, and the fourth power transmission mechanism. The specific structure of the power transmission mechanism 2 has been described in detail above and will not be repeated here.

[0061] The first power transmission mechanism and the second power transmission mechanism are arranged side by side on the first mounting plate and are respectively connected to the first grabbing robot arm and the second grabbing robot arm. The third power transmission mechanism and the fourth power transmission mechanism are arranged side by side on the second mounting plate and are respectively connected to the third grabbing robot arm and the fourth grabbing robot arm.

[0062] The wafer picking device also includes four auxiliary positioning mechanisms 4 corresponding to the four grabbing robot arms 3. The specific structure of the auxiliary positioning mechanism has been described in detail above and will not be repeated here.

[0063] A moving assembly 6 is installed at the bottom of the wafer retrieval device, and the moving assembly 6 drives the wafer retrieval device as a whole to perform vertical and / or horizontal movements.

[0064] The working principle of the wafer retrieval device is: when the device needs to take out the wafer from the wafer storage basket, the moving component 6 installed at the bottom of the device will first work to move the positioning extension arm 32 of the device toward the basket position, and then the four grasping robot arms 3 arranged on the device will move to the inside of the storage basket in turn to clamp the wafer.

[0065] When one of the grabbing mechanical arms 3 needs to be extended, the power transmission mechanism 2 corresponding to the grabbing mechanical arm 3 is started. At this time, the driver 23 works to drive the corresponding first transmission wheel 21 to work, and the first transmission wheel 21 transmits power to the two-way wheel rod 24 through the first transmission belt. The two-way wheel rod 24 works to drive the second transmission belt 26 to rotate along the two-way wheel rod 24 and the second transmission wheel 22. The rotation of the second transmission belt 26 drives the grabbing mechanical arm 3 to move, and while the grabbing mechanical arm 3 moves, the third transmission belt 42 included in the auxiliary positioning mechanism 4 assists in positioning the grabbing mechanical arm 3.

[0066] When the positioning extension arm 32 extends into the storage basket, the mobile structure installed at the bottom of the device drops slightly, so that the wafer is between the four clamping parts (i.e., two first clamping parts 321 and two second clamping parts 332) of the grabbing robot 3. First, the two first clamping parts 321 of the positioning extension arm 32 clamp the edge of the wafer, and then the advance and retreat cylinder 3332 contained in the locking structure 33 is started. The advance and retreat cylinder 3332 pushes the moving plate 3331 to move through the connector 3334. The movement of the moving plate 3331 drives the two locking clamps 331 to move, so that the second clamping parts 332 of the two locking clamps 331 clamp the edge of the wafer, thereby realizing the positioning and clamping of the wafer. At the same time, two detection modules 334 (i.e., the first detection module and the second detection module) are used to detect whether the grabbing robot 3 clamps the wafer. If it is determined that the grabbing robot 3 does not clamp the wafer, the advance and retreat cylinder 3332 is closed and an alarm is sounded.

[0067] After the previous grabbing robot arm 3 is reset, the next grabbing robot arm 3 is extended to repeat the above work, so as to realize batch wafer taking. Of course, in other application scenarios, four grabbing robot arms 3 can also be controlled to synchronously carry out wafer handling.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer retrieving device, characterized in that: include: A vertically arranged mounting plate, a power transmission mechanism installed on the side of the mounting plate, and a grabbing mechanical arm connected to the power transmission mechanism and moving in a horizontal direction under the drive of the power transmission mechanism; The grabbing robot arm includes: a positioning extension arm and a locking structure located above the top of the mounting plate, and a transmission connecting arm connected to the power transmission mechanism, one side of the positioning extension arm is connected to the locking structure, and the other side of the positioning extension arm away from the locking structure is provided with a first clamping portion for clamping the edge of the wafer, the two sides of the locking structure are respectively connected to the positioning extension arm and the transmission connecting arm, the locking structure includes a locking clamp with a second clamping portion for clamping the edge of the wafer on one side, a moving mechanism connected to the other side of the locking clamp and used to drive the locking clamp to move in a horizontal direction, and a detection module for detecting whether the grabbing robot arm clamps the wafer.

2. The wafer retrieving device according to claim 1, characterized in that: The moving mechanism comprises a moving plate connected to the locking clamp, an advancing and retreating air cylinder, and a connecting head for connecting the advancing and retreating air cylinder and the moving plate.

3. The wafer retrieving device according to claim 2, characterized in that: The detection module includes a first detection module and a second detection module located on both sides of the connecting head, the first detection module includes a first detection seat with a first detection slot, and a lock empty detection member installed on the movable plate and used to move inside the first detection slot, and the second detection module includes a second detection seat with a second detection slot, and an in-place detection member installed on the movable plate and used to move inside the second detection slot.

4. The wafer retrieving device according to claim 1, characterized in that: The first clamping part and the second clamping part both adopt locking pads, and the locking pads are provided with slots adapted to the edge size of the wafer.

5. The wafer retrieving device according to claim 1, characterized in that: There are multiple grabbing mechanical arms, and the positioning extension arms included in the multiple grabbing mechanical arms are arranged at intervals and overlapped.

6. The wafer retrieving device according to claim 5, characterized in that: The number of the grabbing mechanical arms is four, and the four grabbing mechanical arms include a first grabbing mechanical arm, a second grabbing mechanical arm, a third grabbing mechanical arm and a fourth grabbing mechanical arm which are arranged at intervals; The number of the mounting plates is two, and the two mounting plates include a first mounting plate and a second mounting plate which are arranged in parallel and symmetrically; The number of the power transmission mechanisms is four, and the four power transmission mechanisms include a first power transmission mechanism and a second power transmission mechanism which are arranged side by side on the first mounting plate and are respectively connected to the first grasping robot arm and the second grasping robot arm, and a third power transmission mechanism and a fourth power transmission mechanism which are arranged side by side on the second mounting plate and are respectively connected to the third grasping robot arm and the fourth grasping robot arm.

7. The wafer retrieving device according to claim 6, characterized in that: Also included is a stabilizing frame for connecting the first mounting plate and the second mounting plate.

8. The wafer retrieving device according to claim 1, characterized in that: The power transmission mechanism includes a first transmission wheel and a second transmission wheel installed on both sides of the mounting plate, a driver installed on the mounting plate and connected to the first transmission wheel, and a two-way wheel rod passing through the mounting plate, one end of the two-way wheel rod is connected to the first transmission wheel through a first transmission belt, and the other end of the two-way wheel rod is connected to the second transmission wheel through a second transmission belt, and the second transmission belt is also connected to the grabbing robot arm.

9. The wafer retrieving device according to claim 1, characterized in that: It also includes an auxiliary positioning mechanism for stabilizing the grabbing robot arm, the auxiliary positioning mechanism includes two steering wheel rods arranged at the front and rear ends of the mounting plate, the two steering wheel rods are connected by a third transmission belt, and the third transmission belt is also connected to the grabbing robot arm.

10. The wafer retrieving device according to claim 1, characterized in that: Also included is a housing for covering the mounting plate and the power transmission mechanism.

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