PCB film pressing mechanism

Abstract

The utility model discloses a PCB (Printed Circuit Board) film pressing mechanism, which comprises a shell, the top wall of the shell is provided with telescopic rods which are uniformly distributed, a film pressing seat is arranged between the telescopic ends of the telescopic rods, the lower surface of the film pressing seat is provided with telescopic columns which are uniformly distributed, a connecting seat is arranged between the telescopic ends of every two longitudinally adjacent telescopic columns, and a first rotating shaft is rotationally connected between every two transversely adjacent connecting seats through a bearing; the outer sides of the first rotating shafts are provided with smooth film pressing rollers, second rotating shafts which are evenly distributed are rotationally connected between the left wall and the right wall of the shell through bearings, the outer portions of the second rotating shafts are provided with material conveying rollers, and the material conveying rollers and the smooth film pressing rollers are installed in a matched mode. And meanwhile, the device rolls the space between the PCB and the covering film through the elastic element, so that gap bubbles between the PCB and the covering film can be effectively removed, and the device is convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing, in particular to a PCB board film pressing mechanism. Background Art

[0002] PCBs are printed circuit boards and are also the support bodies of electronic components. In the production of circuit boards, in order to protect the circuits on the surface of the circuit boards and prevent leakage, flexible circuit boards are protected by laminating films on the surface. In order to increase the tightness of the adhesion between the laminating film and the flexible circuit boards, the laminating film is pressurized by a laminating device after the laminating film is applied. When using some PCB laminating mechanisms, the laminating PCB board is first placed into the laminating groove on the device. Then, the telescopic end of the hydraulic rod is driven by a hydraulic pump to move the pressing plate vertically downward, thereby laminating the PCB board and its own laminating film. However, the laminating method adopts direct vertical laminating. During direct vertical laminating, since the pressing plate is directly in contact with the surface of the PCB board, the pressure range of the pressing plate is fixed, and bubbles in the laminating film cannot be driven out from the inside of the PCB board to the outside, resulting in bubbles in the laminating film after laminating. At the same time, when the device performs the laminating operation on the PCB board, the PCB boards need to be loaded and unloaded individually, and the efficiency of PCB laminating is insufficient. Utility Model Content

[0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide a PCB board laminating mechanism. The device adopts an assembly line method to perform laminating operations on the PCB board, effectively improving the laminating efficiency of the device on the PCB board. At the same time, the device rolls the gap between the PCB board and its own coating through an elastic element, which can effectively remove the gap bubbles between the PCB board and its own coating. The device is easy to use and can effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the present utility model provides the following technical solutions: a PCB board lamination mechanism, comprising a housing;

[0005] Shell: Its top wall is provided with evenly distributed telescopic rods, a film pressing seat is provided between the telescopic ends of the telescopic rods, and the lower surface of the film pressing seat is provided with evenly distributed telescopic columns, and a connecting seat is provided between the telescopic ends of two longitudinally adjacent telescopic columns, and two laterally adjacent connecting seats are rotatably connected with a rotating shaft 1 through a bearing, and a smooth film pressing roller is provided on the outside of the rotating shaft 1. An evenly distributed rotating shaft 2 is rotatably connected between the left and right walls of the shell through a bearing, and a feed roller is provided on the outside of the rotating shaft 2, and the feed roller is installed in conjunction with the smooth film pressing roller. A material port is opened on the front and back sides of the shell. The device adopts an assembly line method to perform film pressing operations on the PCB board, which effectively improves the film pressing efficiency of the device on the PCB board. At the same time, the device rolls the PCB board and its own coating through an elastic element, which can effectively remove the gap bubbles between the PCB board and its own coating, and is easy to use.

[0006] Furthermore, it also includes a single chip microcomputer, which is arranged on the left side of the shell. The input end of the single chip microcomputer is electrically connected to the external power supply, which is convenient for controlling electrical components.

[0007] Furthermore, an electric push rod is provided between the top wall of the shell and the film pressing seat, and the input end of the electric push rod is electrically connected to the output end of the single chip microcomputer to adjust the film pressing gap of the device according to the thickness of the PCB board itself.

[0008] Furthermore, the right wall of the shell is rotatably connected to a uniformly distributed rotating shaft three through a bearing, the right end of the rotating shaft three is provided with a gear one, the right end of the rotating shaft two is provided with a gear two, and the gear one is meshed with the adjacent gear two. A motor is provided on the right side of the shell, the input end of the motor is electrically connected to the output end of the single-chip microcomputer, and the output shaft of the motor is fixedly connected to the right end of the rotating shaft two on the front side, driving the feed roller of the device to rotate synchronously in the opposite direction, so that the PCB board can be conveyed by assembly line lamination.

[0009] Furthermore, evenly distributed springs are provided between the connecting seat and the laminating seat, and the springs are movably connected to the outer ends of adjacent telescopic columns, so that the laminating roller applies elastic extrusion force to the PCB board and the upper film.

[0010] Furthermore, both left and right ends of the rotating shaft 1 are provided with limiting rings to limit the lateral movement of the PCB board lamination and transportation.

[0011] Furthermore, the left wall of the shell is provided with evenly distributed auxiliary plates, which are installed in conjunction with the feed rollers to prevent the PCB board from being stuck between two longitudinally adjacent feed rollers during the lamination and conveying process.

[0012] Compared with the prior art, the beneficial effects of the present invention are: the PCB board lamination mechanism has the following advantages:

[0013] 1. The PCB board with the film on the upper side is transported to the front material port through the external conveying device. The single chip microcomputer starts the motor so that its output shaft drives the frontmost rotating shaft 2 to rotate in the opposite direction. The frontmost rotating shaft 2 drives the corresponding rotating shaft 3 to rotate synchronously in the forward direction through the meshing connection between gear 2 and gear 1. The rotating shaft 3 drives the adjacent rotating shaft 2 to rotate synchronously in the opposite direction through the meshing connection between the gears. The rotating shaft 2 drives the feed roller to rotate in the opposite direction. The contact friction between the feed roller and the lower side of the PCB board is used to convey the PCB board in an assembly line manner, thereby improving the molding efficiency of the PCB board. During the film conveying process of the PCB board, the lateral movement of the PCB board is limited by the limit ring, and the feeding gap between the two longitudinally adjacent feed rollers is reduced by the auxiliary plate to prevent the PCB board from being stuck between the two longitudinally adjacent feed rollers during movement. The PCB board lamination mechanism adopts an assembly line method to perform film lamination on the PCB board, effectively improving the film lamination efficiency of the device.

[0014] 2. During the PCB lamination process, the spring is always in a compressed state. The compression force of the spring enables the connecting seat to indirectly drive the smooth lamination roller to vertically roll the upper film of the PCB. As the PCB moves longitudinally backward, the bubbles in the gap between the PCB and its own film are pushed forward by rolling to be removed, thereby improving the lamination effect of the device on the PCB. The PCB is laminated multiple times by multiple smooth lamination rollers, which is easy to use. The PCB lamination mechanism uses elastic elements to roll between the PCB and its own film, which can effectively remove bubbles in the gap between the PCB and its own film and is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of the utility model;

[0017] Figure 3 This is an enlarged structural diagram of point A of the utility model;

[0018] Figure 4 This is an enlarged structural diagram of point B of the present invention.

[0019] In the figure: 1 housing, 2 single chip microcomputer, 3 telescopic rod, 4 film pressing seat, 5 electric push rod, 6 telescopic column, 7 spring, 8 connecting seat, 9 rotating shaft 1, 10 smooth film pressing roller, 11 rotating shaft 2, 12 feeding roller, 13 limiting ring, 14 rotating shaft 3, 15 gear 1, 16 gear 2, 17 motor, 18 auxiliary plate, 19 material port. DETAILED DESCRIPTION

[0020] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1-4 , this embodiment provides a technical solution: a PCB board lamination mechanism, comprising a housing 1;

[0022] Shell 1: Its top wall is provided with evenly distributed telescopic rods 3, and a film pressing seat 4 is provided between the telescopic ends of the telescopic rods 3. The lower surface of the film pressing seat 4 is provided with evenly distributed telescopic columns 6. The telescopic ends of the two longitudinally adjacent telescopic columns 6 are provided with a connecting seat 8. The two horizontally adjacent connecting seats 8 are rotatably connected to a rotating shaft 9 through a bearing. The outer side of the rotating shaft 9 is provided with a smooth film pressing roller 10. The left and right walls of the shell 1 are rotatably connected to an evenly distributed rotating shaft 2 11 through a bearing. The outer side of the rotating shaft 2 11 is provided with a smooth film pressing roller 10. The housing 1 is provided with a feed roller 12, which is installed in conjunction with the smooth film pressing roller 10. A feed port 19 is provided on both the front and rear sides of the housing 1. The housing 1 also includes a single-chip microcomputer 2, which is arranged on the left side of the housing 1. The input end of the single-chip microcomputer 2 is electrically connected to the external power supply. An electric push rod 5 is provided between the top wall of the housing 1 and the film pressing seat 4. The input end of the electric push rod 5 is electrically connected to the output end of the single-chip microcomputer 2. A uniformly distributed spring 7 is provided between the connecting seat 8 and the film pressing seat 4. The spring 7 is connected to the outer end of the adjacent telescopic column 6. The PCB board laminating mechanism rolls the PCB board and its own film through the elastic element, which can effectively remove the gap bubbles between the PCB board and its own film, and is easy to use.

[0023] Among them, the right wall of the shell 1 is rotatably connected with an evenly distributed rotating shaft 3 14 through a bearing, the right end of the rotating shaft 3 14 is provided with a gear 15, and the right end of the rotating shaft 2 11 is provided with a gear 2 16, and the gear 15 is meshed with the adjacent gear 2 16. A motor 17 is provided on the right side of the shell 1, and the input end of the motor 17 is electrically connected to the output end of the single-chip microcomputer 2. The output shaft of the motor 17 is fixedly connected to the right end of the rotating shaft 2 11 on the front side, and the left and right ends of the rotating shaft 1 11 are provided with a limiting ring 13. The left wall of the shell 1 is provided with evenly distributed auxiliary plates 18, and the auxiliary plates 18 are installed in conjunction with the feed roller 12. When the PCB board is laminated, the PCB board with the upper side coating is first conveyed to the front end material port 19 through an external conveying device. The single-chip microcomputer 2 starts the motor 17 so that its output shaft drives the front end rotating shaft 2 11 to rotate in the opposite direction, and the front end rotating shaft 2 11 is passed through The meshing connection between gear 2 16 and gear 1 15 drives the corresponding rotating shaft 3 14 to rotate forward synchronously. The rotating shaft 3 14 drives the adjacent rotating shaft 2 11 to rotate reversely synchronously through the meshing connection between the gears. The rotating shaft 2 11 drives the feed roller 12 to rotate in the opposite direction. The contact friction between the feed roller 12 and the lower side of the PCB board is used to perform assembly line film conveying on the PCB board, thereby improving the die pressing efficiency of the PCB board. During the film pressing and conveying process of the PCB board, the limit ring 13 is used to limit the lateral movement of the PCB board, and the auxiliary plate 18 is used to reduce the feeding gap between the two longitudinally adjacent feed rollers 12 to prevent the PCB board from being stuck between the two longitudinally adjacent feed rollers 12 during the movement process. The PCB board film pressing mechanism adopts an assembly line method to perform film pressing operations on the PCB board, effectively improving the film pressing efficiency of the device on the PCB board.

[0024] The working principle of a PCB laminating mechanism provided by the present invention is as follows: when laminating a PCB, the PCB with the film on the upper side is first conveyed to the material port 19 at the front end through an external conveying device, the single chip microcomputer 2 starts the motor 17 so that its output shaft drives the frontmost rotating shaft 2 11 to rotate in the opposite direction, the frontmost rotating shaft 2 11 drives the corresponding rotating shaft 3 14 to rotate forward synchronously through the meshing connection between the gear 2 16 and the gear 1 15, the rotating shaft 3 14 drives the adjacent rotating shaft 2 11 to rotate in the opposite direction synchronously through the meshing connection between the gears, the rotating shaft 2 11 drives the feeding roller 12 to rotate in the opposite direction, and the contact friction between the feeding roller 12 and the lower side of the PCB is used to convey the PCB in a pipeline-type laminating manner, thereby improving the laminating efficiency of the PCB. During the laminating and conveying process of the PCB, the PCB is conveyed for lateral movement and limitation through the limiting ring 13, and the auxiliary plate 1 is used. 8 thereby reduces the feeding gap between the two longitudinally adjacent feeding rollers 12, and avoids the PCB board being stuck between the two longitudinally adjacent feeding rollers 12 during the movement process. During the PCB board lamination process, the spring 7 is always in a compressed state. The compression elastic force of the spring 7 enables the connecting seat 8 to indirectly drive the smooth lamination roller 10 to vertically roll the upper film of the PCB board. As the PCB board moves longitudinally backward, the gap bubbles between the PCB board and its own lamination are pushed to the front side by rolling to be removed, thereby improving the lamination effect of the device on the PCB board. The PCB board is laminated multiple times by multiple smooth lamination rollers 10, which is easy to use. According to the PCB board itself and the thickness of the lamination, the single chip microcomputer 2 starts the electric push rod 5 so that its telescopic end drives the lamination seat 4 to move vertically, and the lamination seat 4 indirectly drives the smooth lamination roller 10 to move vertically, thereby regulating the lamination gap of the device on the PCB board.

[0025] It is worth noting that the single chip microcomputer 2 disclosed in the above embodiment can adopt MSP430, the electric push rod 5 can adopt DTZ630, and the motor 17 can adopt Y80M1-2. The single chip microcomputer 2 controls the operation of the electric push rod 5 and the motor 17 using methods commonly used in the prior art.

[0026] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A PCB board lamination mechanism, characterized in that: comprising a housing (1); The outer shell (1) comprises: a top wall thereof is provided with evenly distributed telescopic rods (3), a film pressing seat (4) is provided between the telescopic ends of the telescopic rods (3), a lower surface of the film pressing seat (4) is provided with evenly distributed telescopic columns (6), a connecting seat (8) is provided between the telescopic ends of two longitudinally adjacent telescopic columns (6), a rotating shaft (9) is rotatably connected between two transversely adjacent connecting seats (8) via a bearing, a smooth film pressing roller (10) is provided on the outer side of the rotating shaft (9), an evenly distributed rotating shaft (11) is rotatably connected between the left and right walls of the outer shell (1) via a bearing, a feeding roller (12) is provided on the outer side of the rotating shaft (11), the feeding roller (12) is installed in cooperation with the smooth film pressing roller (10), and a material port (19) is provided on the front and rear sides of the outer shell (1).

2. A PCB lamination mechanism according to claim 1, characterized in that: It also comprises a single-chip microcomputer (2), wherein the single-chip microcomputer (2) is arranged on the left side of the housing (1), and an input end of the single-chip microcomputer (2) is electrically connected to an external power supply.

3. A PCB board lamination mechanism according to claim 2, characterized in that: An electric push rod (5) is provided between the top wall of the housing (1) and the film pressing seat (4), and an input end of the electric push rod (5) is electrically connected to an output end of the single chip computer (2).

4. A PCB board lamination mechanism according to claim 2, characterized in that: The right wall of the housing (1) is rotatably connected to evenly distributed rotating shafts (14) via bearings, the right end of each rotating shaft (14) is provided with a gear (15), the right end of each rotating shaft (11) is provided with a gear (16), and each gear (15) is meshedly connected with an adjacent gear (16). A motor (17) is provided on the right side of the housing (1), the input end of the motor (17) is electrically connected to the output end of the single-chip computer (2), and the output shaft of the motor (17) is fixedly connected to the right end of the second rotating shaft (11) at the front side.

5. A PCB lamination mechanism according to claim 1, characterized in that: Evenly distributed springs (7) are provided between the connecting seat (8) and the film pressing seat (4), and the springs (7) are movably sleeved with the outer ends of adjacent telescopic columns (6).

6. A PCB lamination mechanism according to claim 1, characterized in that: Limiting rings (13) are provided at both left and right ends of the rotating shaft 1 (9).

7. A PCB lamination mechanism according to claim 1, characterized in that: The left wall of the housing (1) is provided with evenly distributed auxiliary plates (18), and the auxiliary plates (18) are installed in coordination with the feed roller (12).

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