In-cabinet installation type frequency converter

Abstract

The utility model provides an in-cabinet installation type frequency converter. The in-cabinet installation type frequency converter comprises an electrical cabinet, wherein an electrical cavity is formed in the electrical cabinet; the frequency conversion mechanism is arranged in the electrical cavity and comprises a power supply assembly, an electronic element and a heat dissipation assembly; a power supply mounting plate and a heat dissipation mounting plate are further arranged in the electrical cavity, the power supply mounting plate and the heat dissipation mounting plate are oppositely arranged, the power supply assembly is arranged on the power supply mounting plate, and the electronic element is arranged between the power supply mounting plate and the heat dissipation mounting plate and is attached to one surface of the heat dissipation mounting plate. According to the in-cabinet installation type frequency converter, the power source installation plate and the heat dissipation installation plate are arranged in the electrical cavity, the electrical cavity is arranged in a layered mode, heat is not prone to accumulation, the heat dissipation assembly is arranged on the heat dissipation installation plate, electronic elements are arranged on the heat dissipation installation plate, the heat dissipation assembly is arranged on the heat dissipation installation plate, and the heat dissipation assembly is arranged on the heat dissipation installation plate. The electronic component and the heat dissipation assembly are effectively isolated, and heat is prevented from being retained around the electronic component.

Description

Technical Field

[0001] The present application relates to the technical field of frequency converters, and in particular to a cabinet-mounted frequency converter. Background Art

[0002] As a common electrical device in the field of industrial automation, cabinet inverters are widely used to control the speed of motors and improve system efficiency. In practical applications, cabinet inverters are usually installed in electrical cabinets to provide protection and organizational structure, which poses challenges to their heat dissipation performance.

[0003] In order to solve the problem of insufficient heat dissipation of cabinet-type inverters, the existing technology adopts some heat dissipation designs, such as adding heat sinks or radiators. However, these solutions still have some limitations when dealing with the heat generated by electronic components. Traditional heat dissipation structures may have difficulty in effectively absorbing and dissipating the high heat generated by electronic components, which may affect the stability and life of the inverter.

[0004] In the current cabinet-type inverter, due to the limitation of heat dissipation design, the high-power operation of electronic components in the closed cabinet space easily causes the inverter to overheat, and the installed heat sink cannot effectively absorb the heat, resulting in temperature accumulation in the cabinet, which in turn affects the normal operation of the equipment. Therefore, there is an urgent need for a structure that can effectively help cabinet-mounted inverters dissipate heat to solve the above problem. Utility Model Content

[0005] In view of this, it is necessary to provide a cabinet installation with a better heat dissipation structure to solve the above problems.

[0006] An embodiment of the present application provides a cabinet-mounted inverter, comprising:

[0007] An electrical cabinet, wherein an electrical cavity is provided in the electrical cabinet;

[0008] A frequency conversion mechanism, disposed in the electrical cavity, comprising a power supply component, an electronic component and a heat dissipation component;

[0009] In which, a power supply mounting plate and a heat dissipation mounting plate are also provided in the electrical cavity, the power supply mounting plate and the heat dissipation mounting plate are arranged opposite to each other, the power supply component is arranged on the power supply mounting plate, the electronic component is arranged between the power supply mounting plate and the heat dissipation mounting plate, and is in contact with one side of the heat dissipation mounting plate, and the heat dissipation component is arranged on the other side of the heat dissipation mounting plate to absorb the heat generated by the electronic component.

[0010] In at least one embodiment of the present application, the power supply mounting plate and the heat dissipation mounting plate divide the electrical cavity into a first layer, a second layer and a third layer, the power supply component is arranged in the first layer, the electronic component is arranged in the second layer, and the heat dissipation component is arranged in the third layer.

[0011] In at least one embodiment of the present application, a plurality of studs are provided between the power supply mounting plate, the heat dissipation mounting plate and the electrical cabinet for supporting the mounting plates.

[0012] In at least one embodiment of the present application, the heat dissipation mounting plate includes a first portion and a second portion, the first portion and the second portion are arranged in parallel, and a heat insulation plate is provided between the first portion and the second portion.

[0013] In at least one embodiment of the present application, the heat dissipation assembly includes a first heat dissipation member, a second heat dissipation member and a third heat dissipation member, the first heat dissipation member and the second heat dissipation member are arranged on the first part, and the third heat dissipation member is arranged on the second part to prevent hot spot accumulation.

[0014] In at least one embodiment of the present application, the electrical cabinet includes a first surface, a second surface and a third surface, the first surface and the second surface are arranged opposite to each other, the third surface is arranged between the first surface and the second surface, and is arranged around the electrical cabinet, and the first surface, the second surface and the third surface are respectively provided with a first heat dissipation hole, a second heat dissipation hole and a third heat dissipation hole.

[0015] In at least one embodiment of the present application, the first heat dissipation hole and the second heat dissipation hole are relatively arranged on the third layer, and the third heat dissipation hole is arranged on the first layer.

[0016] In at least one embodiment of the present application, the frequency converter is further provided with a fan, the fan is attached to the first surface and located on the third layer, and the first heat dissipation hole is directly opposite to the fan.

[0017] In at least one embodiment of the present application, a mounting rail is provided on the power supply mounting board for adding electronic components or facilitating the addition of a partition.

[0018] In at least one embodiment of the present application, the frequency converter is further provided with a numerical control display panel, which is arranged on the electrical cabinet and is used to control and display various parameters of the frequency converter.

[0019] The above-mentioned cabinet-mounted inverter is provided with a power supply mounting plate and a heat dissipation mounting plate in the electrical cavity, and the electrical cavity is layered so that heat is not easily accumulated. A heat dissipation assembly is provided on the heat dissipation mounting plate, and the electronic components are arranged on the heat dissipation mounting plate, which effectively isolates the electronic components and the heat dissipation assembly, prevents heat from being trapped around the electronic components, and helps to improve the overall heat dissipation effect and prevent temperature accumulation. Through a more effective heat dissipation design, the temperature in the cabinet can be reduced, and the overall stability and life of the cabinet-mounted inverter can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional exploded view of an in-cabinet-mounted inverter in one embodiment of the present application.

[0021] Figure 2 for Figure 1 A three-dimensional diagram of the cabinet-mounted inverter.

[0022] Figure 3 for Figure 1 A front perspective view of a heat dissipation assembly of an in-cabinet mounted frequency converter.

[0023] Main component symbols

[0024] 100. A cabinet-mounted frequency converter; 10. Electrical cabinet; 11. Electrical cavity; 11a. First layer; 11b. Second layer; 11c. Third layer; 12. Power supply mounting plate; 121. Guide rail; 13. Heat dissipation mounting plate; 131. First part; 132. Second part; 14. Heat insulation board; 15. First surface; 151. First heat dissipation hole; 16. Second surface; 161. Second heat dissipation hole; 17. Third surface; 171. Third heat dissipation hole; 20. Frequency conversion mechanism; 21. Power supply assembly; 22. Electronic component; 23. Heat dissipation assembly; 231. First heat dissipation element; 232. Second heat dissipation element; 233. Third heat dissipation element; 30. Stud; 40. Fan; 50. CNC display panel. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0026] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0027] An embodiment of the present application provides a cabinet-mounted inverter, comprising:

[0028] An electrical cabinet, wherein an electrical cavity is provided in the electrical cabinet;

[0029] A frequency conversion mechanism, disposed in the electrical cavity, comprising a power supply component, an electronic component and a heat dissipation component;

[0030] In which, a power supply mounting plate and a heat dissipation mounting plate are also provided in the electrical cavity, the power supply mounting plate and the heat dissipation mounting plate are arranged opposite to each other, the power supply component is arranged on the power supply mounting plate, the electronic component is arranged between the power supply mounting plate and the heat dissipation mounting plate, and is in contact with one side of the heat dissipation mounting plate, and the heat dissipation component is arranged on the other side of the heat dissipation mounting plate to absorb the heat generated by the electronic component.

[0031] The above-mentioned cabinet-mounted inverter is provided with a power supply mounting plate and a heat dissipation mounting plate in the electrical cavity, and the electrical cavity is layered so that heat is not easily accumulated. A heat dissipation assembly is provided on the heat dissipation mounting plate, and the electronic components are arranged on the heat dissipation mounting plate, which effectively isolates the electronic components and the heat dissipation assembly, prevents heat from being trapped around the electronic components, and helps to improve the overall heat dissipation effect and prevent temperature accumulation. Through a more effective heat dissipation design, the temperature in the cabinet can be reduced, and the overall stability and life of the cabinet-mounted inverter can be improved.

[0032] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0033] See also Figure 1-Figure 3 The embodiment of the present application provides a cabinet-mounted inverter 100, comprising:

[0034] An electrical cabinet 10, wherein an electrical cavity 11 is provided in the electrical cabinet 10;

[0035] The frequency conversion mechanism 20 is disposed in the electrical cavity 11 and includes a power supply component 21, an electronic component 22 and a heat dissipation component 23;

[0036] Among them, a power supply mounting plate 12 and a heat dissipation mounting plate 13 are also provided in the electrical cavity 11, and the power supply mounting plate 12 and the heat dissipation mounting plate 13 are arranged opposite to each other. The power supply component 21 is arranged on the power supply mounting plate 12, and the electronic component 22 is arranged between the power supply mounting plate 12 and the heat dissipation mounting plate 13, and is in contact with one side of the heat dissipation mounting plate 13. The heat dissipation component 23 is arranged on the other side of the heat dissipation mounting plate 13, and is used to absorb the heat generated by the electronic component 22.

[0037] Specifically, the electrical cabinet 10 provides external protection and structural support, and the electrical cavity 11 is the space inside the electrical cabinet 10. Through the combination of the electrical cabinet 10 and the electrical cavity 11, the frequency conversion mechanism 20 is effectively isolated, the electrical components are protected from the external environment, and the reliability and stability of the equipment are ensured. The frequency conversion mechanism 20 performs motor control, including a power supply component 21, an electronic component 22 and a heat dissipation component 23. The heat dissipation component 23 effectively absorbs and dissipates the heat generated by the electronic component 22 to maintain the stable operation of the system within an appropriate temperature range. The relative arrangement of the power supply mounting plate 12 and the heat dissipation mounting plate 13 provides support for the electronic component 22 and forms a heat dissipation channel. The relative arrangement of the power supply mounting plate 12 and the heat dissipation mounting plate 13 optimizes the system structure and improves the support, while helping to dissipate heat and prevent the electronic component 22 from overheating.

[0038] Furthermore, the heat dissipation component 23 is located on the other side of the heat dissipation mounting plate 13, and is specifically used to absorb and conduct the heat generated by the electronic component 22. The setting of the heat dissipation component 23 effectively transfers the heat of the electronic component 22 to the heat dissipation system, prevents overheating, and ensures that the equipment operates efficiently for a long time. The heat generated by the electronic component 22 is quickly transferred to the heat dissipation component 23 by fitting with the heat dissipation mounting plate 13. The heat dissipation component 23 absorbs this heat and effectively dissipates it to the external environment through the other side of the heat dissipation plate. By optimizing the structure and heat dissipation design, the stability and reliability of the system are improved, ensuring the normal operation of the equipment in harsh environments and long-term operation.

[0039] In a specific embodiment, the power supply mounting plate 12 and the heat dissipation mounting plate 13 divide the electrical cavity 11 into a first layer 11a, a second layer 11b and a third layer 11c, the power supply component 21 is arranged in the first layer 11a, the electronic component 22 is arranged in the second layer 11b, and the heat dissipation component 23 is arranged in the third layer 11c.

[0040] Specifically, by arranging the power supply assembly 21 in the first layer 11a, the heat of the power supply assembly 21 can be isolated to prevent it from directly affecting the components in other layers. This helps to maintain the stability and reliability of the power supply assembly 21. The layered arrangement allows the electronic components 22 to work in a relatively independent space, avoiding direct heat exchange with the power supply assembly 21, and helps to maintain the performance and stability of the electronic components 22. The heat dissipation assembly 23 is used to absorb the heat generated by the electronic components 22 to prevent the temperature from being too high. The layered arrangement places the heat dissipation assembly 23 in the outermost layer, which helps to dissipate heat to the external environment more efficiently, thereby improving the heat dissipation effect of the entire system.

[0041] In a specific embodiment, a plurality of studs 30 are provided between the power supply mounting plate 12 , the heat dissipation mounting plate 13 and the electrical cabinet 10 for supporting the mounting plates.

[0042] Specifically, a plurality of studs 30 are used to support and fix the power supply mounting plate 12, the heat dissipation mounting plate 13 and the electrical cabinet 10. The studs 30 provide a stable support for the structure, ensure the proper position between each mounting plate, and help maintain the stability of the entire system. The studs 30 support the power supply mounting plate 12 and the heat dissipation mounting plate 13 to keep them in the correct position in the electrical cabinet 10. The correct relative position of the power supply component 21 and the heat dissipation component 23 is ensured to prevent the position of the components from changing due to vibration or external factors during the operation of the equipment. In an environment with high vibration or other external interference, the supporting effect of the studs 30 can effectively reduce the swing of the structure and ensure the structural safety of the equipment during operation. Furthermore, during the assembly stage, the studs 30 are connected to the power supply mounting plate 12, the heat dissipation mounting plate 13 and the electrical cabinet 10 to complete the structural support between the various components. The tightening process of the studs 30 ensures the stability of the entire system.

[0043] In a specific embodiment, the heat dissipation mounting plate 13 includes a first portion 131 and a second portion 132 . The first portion 131 and the second portion 132 are arranged in parallel, and a heat insulation plate 14 is arranged between the first portion 131 and the second portion 132 .

[0044] Specifically, the heat dissipation mounting plate 13 is divided into two parts, and the heat dissipation assembly 23 is arranged in different areas, which helps to manage and disperse heat more effectively. By dividing the heat dissipation area, the heat in different areas can be more finely controlled and processed, and the heat dissipation effect can be improved. The first part 131 and the second part 132 are arranged in parallel, so that the two heat dissipation areas are arranged in parallel in the horizontal direction. The parallel arrangement helps to evenly distribute the heat dissipation assembly 23, avoids uneven heat distribution in the vertical direction, and improves the balance of the entire heat dissipation system.

[0045] Furthermore, the heat insulation board 14 is located between the two parts to isolate the two heat dissipation areas and prevent mutual interference. The setting of the heat insulation board 14 avoids the transfer of heat between the heat dissipation areas, ensures the independent heat dissipation of each area, and improves the efficiency of the entire system. When the inverter is running, the heat dissipation component 23 generates heat. This heat is first divided into the first part 131 and the second part 132. The heat insulation board 14 isolates the two areas to ensure that their heat is independent of each other. Through this setting, the heat dissipation process can be more accurately controlled and optimized. The parallel setting of the first part 131 and the second part 132 and the use of the heat insulation board 14 make the entire heat dissipation system more efficient.

[0046] In a specific embodiment, the heat dissipation assembly 23 includes a first heat dissipation member 231, a second heat dissipation member 232 and a third heat dissipation member 233, wherein the first heat dissipation member 231 and the second heat dissipation member 232 are disposed on the first part 131, and the third heat dissipation member 233 is disposed on the second part 132, for preventing hot spot accumulation.

[0047] Specifically, the heat dissipation assembly 23 is divided into three parts, which are used to increase the heat dissipation area and improve the heat dissipation efficiency. By setting up multiple heat sinks, the heat dissipation capacity of the entire heat dissipation system is increased, and the heat dissipation effect of the system is improved. The first heat sink 231 and the second heat sink 232 are arranged on the first part 131, and the third heat sink 233 is arranged on the second part 132: the heat sinks are distributed in different parts to ensure that the heat dissipation assemblies 23 in different heat dissipation areas work in relatively independent spaces. Avoiding interference between heat dissipation assemblies 23 in different areas helps to improve the stability and heat dissipation efficiency of the entire system.

[0048] Furthermore, the heat sinks are distributed in different parts to prevent hot spots from gathering, that is, to form an overheating area in a certain part, thereby improving the heat dissipation balance of the system. By distributing heat sinks in different positions, the concentrated appearance of hot spots is effectively avoided, local overheating is prevented, and the stability of the system is improved. When the heat dissipation assembly 23 is working, the first heat sink 231 and the second heat sink 232 absorb and conduct the heat of the first part 131, and the third heat sink 233 absorbs and conducts the heat of the second part 132. This process ensures that the heat of different parts is relatively independent. During long-term operation, by preventing the gathering of hot spots, the heat dissipation assembly 23 maintains operation under a relatively uniform temperature distribution. This helps to improve the reliability of the entire system and prevent equipment failures caused by overheating.

[0049] In a specific embodiment, the electrical cabinet 10 includes a first surface 15, a second surface 16 and a third surface 17, the first surface 15 and the second surface 16 are arranged opposite to each other, the third surface 17 is arranged between the first surface 15 and the second surface 16, and is arranged around the electrical cabinet, and the first surface 15, the second surface 16 and the third surface 17 are respectively provided with a first heat dissipation hole 151, a second heat dissipation hole 161 and a third heat dissipation hole 171.

[0050] Specifically, the outer shell of the electrical cabinet 10 provides external environmental protection and protects the internal electrical equipment from external physical damage. The arrangement of the outer shell ensures that the internal equipment of the electrical cabinet can operate safely under various external environmental conditions. The relative arrangement of the first surface 15 and the second surface 16 and the surrounding arrangement of the third surface 17 form the overall structure of the electrical cabinet. This design increases the stability and strength of the electrical cabinet, making it more resistant to external shocks and vibrations.

[0051] Furthermore, the heat generated inside the electrical cabinet 10 is promoted to be dissipated to the external environment through the heat dissipation holes. The heat dissipation effect of the electrical cabinet is improved, and the internal equipment is prevented from overheating, thereby ensuring the normal operation of the equipment. When the equipment inside the electrical cabinet is running, the heat generated is transferred to the external environment through the first heat dissipation hole 151, the second heat dissipation hole 161 and the third heat dissipation hole 171. This process realizes the effective dissipation of internal heat through the design of the ventilation heat dissipation holes. In an environment of high temperature or high load operation, the setting of the heat dissipation holes can effectively slow down the temperature rise of the electrical equipment, prevent the equipment from overheating and causing failure, and improve the reliability of the electrical cabinet.

[0052] In a specific embodiment, the first heat dissipation hole 151 and the second heat dissipation hole 161 are relatively arranged on the third layer 11 c , and the third heat dissipation hole 171 is arranged on the first layer 11 a .

[0053] Specifically, the first heat dissipation hole 151 and the second heat dissipation hole 161 are located on the third layer 11c of the electrical cabinet, so that the heat dissipation holes in different heat dissipation areas are arranged relatively. This arrangement helps to evenly distribute air circulation, prevent heat from concentrating in the vertical direction, and improve the balance of the entire heat dissipation system. The third heat dissipation hole 171 is located on the first layer 11a of the electrical cabinet, separated from the first heat dissipation hole 151 and the second heat dissipation hole 161, and dissipates heat to the power supply component 21 and the heat dissipation component 23 respectively without affecting each other and causing heat accumulation. The overall heat dissipation efficiency of the system is improved.

[0054] In a specific embodiment, the frequency converter is further provided with a fan 40 , which is attached to the first surface 15 and located on the third layer 11 c , and the first heat dissipation hole 151 is directly opposite to the fan 40 .

[0055] Specifically, the fan 40 is located on the third layer 11c, directly facing the heat dissipation component 23, and has a direct air cooling effect, accelerating the heat transfer and dissipation of the heat dissipation component 23 through the blowing of wind. The fan 40 directly blows fresh air to the heat dissipation component 23, effectively increasing the air circulation speed, accelerating the heat transfer and dissipation, and making the heat dissipation effect more significant. The direct heat dissipation effect of the fan 40 helps to reduce the temperature of the heat dissipation component 23, prevent overheating, and improve the stability and reliability of the entire system.

[0056] Furthermore, the position of the first heat dissipation hole 151 is designed to face the fan 40 to ensure that the fan 40 can introduce fresh air into the heat dissipation system. Such an arrangement enables the fan 40 to absorb fresh air to the greatest extent, increases the circulation of air inside the system, and improves the efficiency of the entire heat dissipation system. After the fan 40 is started, the wind flow generated blows directly to the heat dissipation component 23 located on the third layer 11c. The fresh air absorbs the heat generated by the heat dissipation component 23 and brings the hot air to the external environment of the electrical cabinet. The arrangement of the fan 40 allows the cooling effect to be directly concentrated on the heat dissipation component 23, avoids local resistance to air flow, and improves heat dissipation efficiency.

[0057] In a specific embodiment, a mounting rail 121 is provided on the power supply mounting plate 12 for mounting electronic components 22 or adding a partition.

[0058] Specifically, the installation of the mounting rail 121 on the power supply mounting plate 12 provides a convenient way to easily add electronic components 22 or add a partition. The mounting rail 121 makes the power supply mounting plate 12 more flexible, and the electronic components 22 can be easily added, replaced or upgraded as needed. By installing the rail 121, the system can more easily achieve modular design and simplify the maintenance and upgrade process. By making full use of the rail 121, the space for the electronic components 22 can be effectively arranged, and the overall performance of the system can be improved.

[0059] In a specific embodiment, the frequency converter is further provided with a numerical control display panel 50 , which is provided on the electrical cabinet 10 and is used to control and display various parameters of the frequency converter.

[0060] Specifically, the numerical control display panel 50 is used as a user interface to set, monitor and display the operating parameters of the inverter. Through the numerical control display panel 50, the user can monitor the operating status and various parameters of the inverter in real time. The user sets the operating parameters of the inverter, such as frequency, current, speed, etc., through buttons, touch screens or other input methods on the numerical control display panel 50. At the same time, the numerical control display panel 50 will feedback the operating status and related information of the inverter in real time.

[0061] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A cabinet-mounted inverter, characterized in that: include: An electrical cabinet, wherein an electrical cavity is provided in the electrical cabinet; A frequency conversion mechanism, disposed in the electrical cavity, comprising a power supply component, an electronic component and a heat dissipation component; In which, a power supply mounting plate and a heat dissipation mounting plate are also provided in the electrical cavity, the power supply mounting plate and the heat dissipation mounting plate are arranged opposite to each other, the power supply component is arranged on the power supply mounting plate, the electronic component is arranged between the power supply mounting plate and the heat dissipation mounting plate, and is in contact with one side of the heat dissipation mounting plate, and the heat dissipation component is arranged on the other side of the heat dissipation mounting plate to absorb the heat generated by the electronic component.

2. The cabinet-mounted inverter according to claim 1, characterized in that: The power supply mounting plate and the heat dissipation mounting plate divide the electrical cavity into a first layer, a second layer and a third layer. The power supply component is arranged in the first layer, the electronic component is arranged in the second layer, and the heat dissipation component is arranged in the third layer.

3. The cabinet-mounted inverter according to claim 2, characterized in that: A plurality of studs are provided between the power supply mounting plate, the heat dissipation mounting plate and the electrical cabinet for supporting the mounting plates.

4. The cabinet-mounted inverter according to claim 1, characterized in that: The heat dissipation mounting plate includes a first part and a second part, the first part and the second part are arranged in parallel, and a heat insulation plate is arranged between the first part and the second part.

5. The cabinet-mounted inverter according to claim 4, characterized in that: The heat dissipation assembly includes a first heat dissipation member, a second heat dissipation member and a third heat dissipation member. The first heat dissipation member and the second heat dissipation member are arranged on the first part, and the third heat dissipation member is arranged on the second part to prevent hot spots from gathering.

6. The cabinet-mounted inverter according to claim 2, characterized in that: The electrical cabinet includes a first surface, a second surface and a third surface, the first surface and the second surface are arranged opposite to each other, the third surface is arranged between the first surface and the second surface and surrounds the electrical cabinet, and the first surface, the second surface and the third surface are respectively provided with a first heat dissipation hole, a second heat dissipation hole and a third heat dissipation hole.

7. The cabinet-mounted inverter according to claim 6, characterized in that: The first heat dissipation hole and the second heat dissipation hole are arranged on the third layer opposite to each other, and the third heat dissipation hole is arranged on the first layer.

8. The cabinet-mounted inverter according to claim 7, characterized in that: The frequency converter is further provided with a fan, which is attached to the first surface and located on the third layer, and the first heat dissipation hole faces the fan.

9. The cabinet-mounted inverter according to claim 1, characterized in that: The power supply mounting plate is provided with mounting rails for installing electronic components or adding interlayers.

10. The cabinet-mounted inverter according to claim 1, characterized in that: The frequency converter is also provided with a numerical control display panel, which is arranged on the electrical cabinet and is used to control and display various parameters of the frequency converter.

Images