Infrared receiving module and support thereof

Abstract

The utility model provides an infrared receiving module and a support thereof, the support comprises an upper wiring layer, a middle wiring layer and a lower wiring layer, the upper wiring layer and the lower wiring layer are both provided with large-area grid ground wires, and all functional wires of the support are uniformly distributed on the middle wiring layer; the shielding layer on the upper wiring layer adopts a copper-laid grid structure, and the ground wire on the upper wiring layer adopts a rewinding structure. According to the utility model, the grid ground wires are arranged on the upper wiring layer and the lower wiring layer of the support in a large area, and all functional wires are arranged on the middle wiring layer, so that the anti-interference performance of the infrared receiving module after packaging can be improved. And the copper-laid grid structure on the upper wiring layer can increase the binding force between the epoxy resin and the support plate, so that the packaging quality of the module can be improved. The ground wire of the upper wiring layer is of a rewinding structure, so that an avoiding space is provided for epoxy resin equivalently, and the epoxy resin in a wafer adhesive can be prevented from diffusing to pollute a bonding wire and a bonding pad.

Description

Technical Field

[0001] The utility model belongs to the field of infrared sensors, and in particular relates to an infrared receiving module and a bracket thereof. Background Art

[0002] The infrared receiving module is a device that receives infrared rays and converts them into electrical signals. The current infrared receiving module has poor anti-interference performance of the overall package and a large volume after the module is packaged due to the imperfect design layout of its bracket. In addition, when applying the wafer adhesive on the bracket, the epoxy resin of the wafer adhesive spreads and easily contaminates the surrounding wire bonding pads. Utility Model Content

[0003] The utility model aims to improve the circuit structure of the existing infrared receiving module bracket to solve the problem that the infrared receiving module in the prior art has poor anti-interference performance and when applying chip adhesive on the bracket, the epoxy resin diffusion easily causes pollution to the surrounding welding wire pads.

[0004] The utility model is implemented as follows: a bracket of an infrared receiving module comprises an upper wiring layer, a middle wiring layer and a lower wiring layer, wherein the upper wiring layer and the lower wiring layer are provided with grid ground wires, and all functional wirings of the bracket are arranged on the middle wiring layer; the shielding layer on the upper wiring layer adopts a copper-plated grid structure, and the ground wire on the upper wiring layer adopts a winding structure.

[0005] Furthermore, the grid ground wires on the upper wiring layer are arranged around the periphery of the upper wiring layer.

[0006] Furthermore, the grid ground wires on the lower wiring layer are arranged in a middle area of ​​the lower wiring layer.

[0007] Furthermore, the ground wire on the upper wiring layer includes a first direction extension segment, a second direction extension segment and a wraparound segment, the length direction of the first direction extension segment is perpendicular to the edge of the chip pad on the upper wiring layer, the length direction of the second direction extension segment is parallel to the edge of the chip pad, the wraparound segment extends from the end of the second direction extension segment toward the chip pad, and the end of the wraparound segment is a distance away from the edge of the chip pad.

[0008] Furthermore, the ground wire on the upper wiring layer is L-shaped.

[0009] Furthermore, a bridge pad is provided between the electronic circuit on the upper wiring layer and the chip pad, and the bridge pad is electrically connected to the electronic circuit on the upper wiring layer through wires.

[0010] In order to achieve the above-mentioned purpose of the utility model, the utility model also provides an infrared receiving module, including a chip, a pin, a wire and a bracket of any of the above items, the chip is welded and fixed on the chip pad of the upper wiring layer of the bracket, the chip pad is electrically connected to the electronic circuit on the upper wiring layer through the wire, the pin is arranged at the edge of the lower wiring layer of the bracket, and the multiple pins are insulated from each other.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. Lay out grid ground wires over a large area on the upper and lower wiring layers of the bracket, and all functional wiring is routed through the middle wiring layer, which can improve the anti-interference performance of the infrared receiving module after packaging.

[0013] 2. The shielding layer on the upper wiring layer of the bracket adopts a copper grid structure, which can increase the bonding strength between the epoxy resin and the bracket sheet, which is beneficial to improving the module packaging quality.

[0014] 3. The ground wire of the upper wiring layer adopts a wrap-around structure to prevent the epoxy resin in the chip adhesive from diffusing and contaminating the wire bonding pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of the upper wiring layer of the bracket provided by the embodiment of the utility model;

[0016] Figure 2 It is a schematic structural diagram of a middle wiring layer of a bracket provided by an embodiment of the utility model;

[0017] Figure 3 It is a schematic diagram of the structure of the lower wiring layer of the bracket provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0019] This embodiment provides a bracket for an infrared receiving module. Figures 1 to 3 The bracket includes an upper wiring layer, a middle wiring layer and a lower wiring layer. The upper wiring layer and the lower wiring layer are provided with a large-area grid ground wire 1. All functional wiring wires 2 of the bracket are arranged on the middle wiring layer. The shielding layer on the upper wiring layer adopts a copper grid structure, and the ground wire 3 on the upper wiring layer adopts a winding structure.

[0020] Specifically, the grid ground wires 1 on the upper wiring layer are arranged around the periphery of the upper wiring layer; and the grid ground wires 1 on the lower wiring layer are arranged in the middle area of ​​the lower wiring layer.

[0021] The ground wire 3 on the upper wiring layer includes a first direction extension section, a second direction extension section and a wraparound section, the length direction of the first direction extension section is perpendicular to the edge of the chip pad 4 on the upper wiring layer, the length direction of the second direction extension section is parallel to the edge of the chip pad 4, the wraparound section extends from the end of the second direction extension section toward the chip pad 4, and the end of the wraparound section is a distance away from the edge of the chip pad 4. Preferably, the ground wire 3 of this embodiment is L-shaped.

[0022] This embodiment also provides an infrared receiving module, including a bracket, a chip, pins 5 and wires 6. The chip is welded and fixed on a chip pad 4 of an upper wiring layer of the bracket. The chip pad 4 is electrically connected to the electronic circuit on the upper wiring layer through the wires 6. The pins 5 are arranged at the edge of the lower wiring layer of the bracket, and the multiple pins 5 are insulated from each other.

[0023] In this embodiment, the grid ground wires 1 are arranged in a large area on the upper wiring layer and the lower wiring layer of the bracket, and all the functional wirings 2 are arranged on the middle wiring layer, so that the anti-interference performance of the infrared receiving module after packaging can be improved.

[0024] After the chip is fixed and the wires are bonded, the upper wiring layer will be fully covered with epoxy resin during the finished product packaging. The copper grid structure on the upper wiring layer can increase the bonding strength between the epoxy resin and the bracket sheet, which is beneficial to improving the quality of module packaging.

[0025] The ground wire 3 of the upper wiring layer adopts a winding structure, which is equivalent to providing an escape space for the epoxy resin, thereby preventing the epoxy resin in the wafer adhesive from diffusing and contaminating the bonding wire and the bonding pad.

[0026] Furthermore, a bridging pad 7 is provided on the upper wiring layer, the chip pad 4 is electrically connected to the bridging pad 7 through a wire 7, and the electronic circuit on the upper wiring layer is electrically connected to the bridging pad 7 through a wire 5; by arranging the bridging pad 4, the overall wire arc height can be reduced, further compressing the packaging space of the module.

[0027] In summary, the utility model improves the structure of the bracket of the infrared module in a simple and effective way, improves the anti-interference performance of the product, and hardly increases the cost.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A bracket for an infrared receiving module, comprising an upper wiring layer, a middle wiring layer and a lower wiring layer, characterized in that: The upper wiring layer and the lower wiring layer are provided with grid ground wires, and all functional wirings of the bracket are arranged on the middle wiring layer; the shielding layer on the upper wiring layer adopts a copper-plated grid structure, and the ground wire on the upper wiring layer adopts a winding structure.

2. The bracket according to claim 1, characterized in that The grid ground lines on the upper wiring layer are arranged around the periphery of the upper wiring layer.

3. The bracket according to claim 1, characterized in that: The grid ground lines on the lower wiring layer are arranged in the middle area of ​​the lower wiring layer.

4. The bracket according to claim 1, characterized in that: The ground wire on the upper wiring layer includes a first direction extension segment, a second direction extension segment and a wraparound segment. The length direction of the first direction extension segment is perpendicular to the edge of the chip pad on the upper wiring layer, the length direction of the second direction extension segment is parallel to the edge of the chip pad, and the wraparound segment extends from the end of the second direction extension segment toward the chip pad, and the end of the wraparound segment is a distance away from the edge of the chip pad.

5. The bracket according to claim 4, characterized in that The ground line on the upper wiring layer is L-shaped.

6. The bracket according to claim 4, characterized in that: A bridge pad is also provided between the electronic circuit on the upper wiring layer and the chip pad, and the bridge pad is electrically connected to the electronic circuit on the upper wiring layer through a wire.

7. An infrared receiving module, comprising a chip, pins and wires, characterized in that: It also includes a bracket as described in any one of claims 1 to 6, the chip is welded and fixed on the chip pad of the upper wiring layer of the bracket, the chip pad is electrically connected to the electronic circuit on the upper wiring layer through the wire, the pin is arranged at the edge of the lower wiring layer of the bracket, and the multiple pins are insulated from each other.

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