Microarray chip structure for assisting heat conduction

Abstract

The utility model discloses an auxiliary heat conduction microarray chip structure, and specifically relates to the microarray chip structure field, the microarray chip structure comprises a chip matrix layer and a heat conduction matrix plate, the surface of the chip matrix layer is provided with micropores, one side of the inner cavity of each micropore far away from the heat conduction matrix plate is provided with gathering holes, the periphery of the chip matrix layer is symmetrically and fixedly connected with fixing plates, and the fixing plates are fixedly connected with the heat conduction matrix plate. A positioning hole is formed in the middle of the fixing plate, and adding blocks are symmetrically and fixedly connected to the two sides of the top of the fixing plate. According to the utility model, heat generated at the bottom of the heat-conducting substrate plate can enter the small holes through the small holes to be directly attached to the bottom wall body of the chip substrate layer, so that the heating efficiency of the chip substrate layer can be improved, and the heat-conducting substrate plate and the plugging block are made of heat-conducting materials such as heat-conducting silicone grease and the like; the heat conduction efficiency can be further improved, the using effect is improved, the sealing strength of the micropores can be improved through the arranged plugging blocks and the micropores, and the using effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of microarray chip structures, and more specifically, to a microarray chip structure with auxiliary heat conduction. Background Art

[0002] A microarray chip is a chip that uses methods such as photoconductive in situ synthesis or micro-spotting to orderly solidify a large number of biological macromolecules such as nucleic acid fragments, polypeptide molecules, and even biological samples such as tissue sections and cells on the surface of a support (such as a glass slide, nylon membrane, etc.) to form a dense two-dimensional molecular arrangement.

[0003] The utility model with Chinese patent application number CN202220716154.0 discloses a single-molecule microarray chip substrate. The utility model disassembles the blind-hole-shaped micropores of the single-molecule microarray chip substrate into two parts, respectively making the micropores and the bottom matrix layer, and then composites them into a whole to form a blind hole, which can simplify the processing and manufacturing method of the micropore blind hole, reduce the process difficulty, and is suitable for large-scale industrial batch production;

[0004] However, in actual use, when the molecules in the middle of the microwells need to be heated, the existing microarray chip structure does not improve the thermal conductivity, which affects the uniformity and efficiency of thermal conductivity. Utility Model Content

[0005] In order to overcome the above defects of the prior art, the utility model provides a microarray chip structure with auxiliary heat conduction to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a microarray chip structure with auxiliary heat conduction, comprising a chip substrate layer and a heat-conducting substrate plate, the surface of the chip substrate layer is provided with micropores, the inner cavity of the micropores is provided with a gathering hole on the side away from the heat-conducting substrate plate, the chip substrate layer is symmetrically fixedly connected with a fixing plate around, a positioning hole is provided in the middle of the fixing plate, and the top of the fixing plate is symmetrically fixedly connected with an increase block on both sides;

[0007] It can be seen that the heat-conducting substrate plate can be used to block the inner side of the micropores, so that the gene molecules can be arranged through the micropores, and the gene molecules can enter the inner part of the micropores through the pores to improve the use effect. The fixed plate and the additional block can be used to facilitate the staff to clamp the chip substrate layer with tweezers, so that it is convenient to move and place it for use, and the positioning holes can facilitate the splicing and combination of the heat-conducting substrate plate and the chip substrate layer into one piece for use;

[0008] A small hole is opened in the middle of the heat-conducting base plate, a plurality of blocking blocks are fixedly connected to the top of the heat-conducting base plate, and positioning blocks are symmetrically opened around the top of the heat-conducting base plate;

[0009] It can be seen that the sealing block can improve the sealing strength of the thermal conductive substrate plate to the micropores, and facilitate the positioning of the connection between the chip substrate layer and the thermal conductive substrate plate. The positioning block and the positioning hole cooperate to facilitate splicing and use. The heat at the bottom can be gathered through the small holes, and the thermal conductive substrate plate and the sealing block can be used to heat the chip substrate layer and the gene molecules in the middle of the micropores to improve the auxiliary thermal conductivity effect.

[0010] Preferably, the material of the chip substrate layer is set to one of polyethylene, polypropylene, polycarbonate and the like, the material of the heat-conducting substrate plate is set to one of thermally conductive silicone grease and thermally conductive silica gel graphite material, and the material of the blocking block is the same as that of the heat-conducting substrate plate;

[0011] It can be seen that by making the chip substrate layer of one of the materials such as polyethylene, polypropylene, polycarbonate, etc., the chip substrate layer can have the chemical resistance of the material, and at the same time, the heat from the bottom can be evenly transferred to the middle of the chip substrate layer through the heat-conducting substrate plate and the sealing block, thereby facilitating the heating of the gene molecules in the middle of the chip substrate layer, playing a role in auxiliary heat conduction and improving the use effect.

[0012] Preferably, the bottom wall of the chip substrate layer and the top wall of the heat-conducting substrate plate are in contact with each other, and a chemical adhesive is provided between the chip substrate layer and the heat-conducting substrate plate;

[0013] It can be seen that the chemical adhesive can improve the connection strength between the chip substrate layer and the thermal conductive substrate plate, thereby improving the blocking effect on one side of the middle portion of the microhole.

[0014] Preferably, the diameter of the micropore is the same as the diameter of the blocking block, the micropore and the blocking block correspond one to one, and the blocking block is arranged inside the micropore;

[0015] It can be seen that the sealing strength of the middle part of the micropore can be improved by using the blocking block, thereby improving the use effect.

[0016] Preferably, the inner cavity size of the positioning hole is matched with the size of the positioning block, the positioning block corresponds to the positioning hole, and the positioning block is arranged in the middle of the positioning hole;

[0017] It can be seen that through the cooperation of the positioning hole and the positioning block, it is convenient to improve the alignment effect of the chip substrate layer and the thermal conductive substrate plate when the chip substrate layer and the thermal conductive substrate plate are assembled, play a positioning role, and facilitate the insertion of the blocking block into the interior of the positioning hole, thereby improving the use effect.

[0018] Preferably, the inner diameter of the small hole is the same as the inner diameter of the microhole, the number of the small holes is several and they are distributed in an array, and the small holes and the microholes are staggered with each other;

[0019] It can be seen that the heat at the bottom of the thermally conductive substrate can be gathered through the small holes, thereby improving the thermal conductivity of the chip substrate layer, so that the heat at the bottom of the thermally conductive substrate can directly contact the bottom wall of the chip substrate layer, thereby improving the thermal conductivity without affecting the normal use of the microholes.

[0020] Preferably, the inner cavity shape of the condensing hole is set to be a trumpet shape, the cross-sectional shape of the increasing block is set to be a triangle, and the size of the heat-conducting base plate is larger than the size of the chip base layer;

[0021] It can be seen that the gene molecules can be conveniently placed inside the micropores through the polypores, so that the gene molecules can be displayed and distributed to improve the use effect, and the fixed plate can be clamped conveniently by adding blocks, so as to facilitate the clamping and movement of the chip substrate layer and the thermal conductive substrate plate, thereby improving the use effect.

[0022] Technical effects and advantages of the utility model:

[0023] 1. The utility model firstly allows the heat generated at the bottom of the heat-conducting substrate plate to enter the inside of the small hole and directly fit with the bottom wall of the chip substrate layer through the small hole, thereby improving the heating efficiency of the chip substrate layer, and further improving the heat conduction efficiency and the use effect by setting the heat-conducting substrate plate and the blocking block material to heat-conducting silicone grease and other heat-conducting materials, and improving the sealing strength of the micropores through the blocking blocks and micropores, thereby improving the use effect;

[0024] 2. The utility model can also facilitate the staff to clamp and move the chip substrate layer through the clamp by setting the fixing plate, which is convenient for use. The chip substrate layer and the heat-conducting substrate plate can be conveniently positioned and aligned through the cooperation of the positioning holes and the positioning blocks, thereby improving the splicing and assembly effect. The gene molecules can be conveniently placed inside the micropores through the polypores for display and distribution, thereby improving the use effect.

[0025] In summary, through the mutual influence of the above-mentioned multiple effects, the heat conduction and heating effect can be improved, and at the same time, the chip substrate layer and the heat conductive substrate plate can be conveniently positioned and spliced ​​to improve the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0027] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model.

[0028] Figure 3 It is a schematic diagram of the cross-sectional structure of the chip substrate layer of the utility model.

[0029] Figure 4It is a schematic diagram of the cross-sectional structure of the heat-conducting base plate of the utility model.

[0030] The accompanying drawings are marked as follows: 1. chip substrate layer; 2. heat-conducting substrate plate; 3. micropores; 4. polypores; 5. fixing plate; 6. positioning holes; 7. adding block; 8. small holes; 9. blocking block; 10. positioning block. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] As attached Figure 1-4 The microarray chip structure with auxiliary heat conduction shown in the figure comprises a chip substrate layer 1 and a heat-conducting substrate plate 2, micropores 3 are provided on the surface of the chip substrate layer 1, and a gathering hole 4 is provided on the inner cavity of the micropore 3 away from the heat-conducting substrate plate 2, a fixing plate 5 is symmetrically fixedly connected to the four sides of the chip substrate layer 1, a positioning hole 6 is provided in the middle of the fixing plate 5, and an increase block 7 is symmetrically fixedly connected to the top of the fixing plate 5 on both sides;

[0033] A small hole 8 is provided in the middle of the heat-conducting base plate 2 , a plurality of blocking blocks 9 are fixedly connected to the top of the heat-conducting base plate 2 , and positioning blocks 10 are symmetrically provided around the top of the heat-conducting base plate 2 .

[0034] As attached Figure 1-4As shown, the material of the chip substrate layer 1 is set to one of polyethylene, polypropylene, polycarbonate and other materials, the material of the heat-conducting substrate plate 2 is set to one of thermally conductive silicone grease and thermally conductive silicone graphite materials, the material of the blocking block 9 is the same as the material of the heat-conducting substrate plate 2, the bottom wall of the chip substrate layer 1 and the top wall of the heat-conducting substrate plate 2 are in contact, a chemical adhesive is arranged between the chip substrate layer 1 and the heat-conducting substrate plate 2, the diameter of the micropore 3 is the same as the diameter of the blocking block 9, the micropore 3 corresponds to the blocking block 9 one by one, the blocking block 9 is arranged inside the micropore 3, the inner cavity size of the positioning hole 6 is adapted to the size of the positioning block 10, the positioning block 10 corresponds to the positioning hole 6, the positioning block 10 is arranged in the middle of the positioning hole 6, and the inner cavity diameter of the small hole 8 is the same as the inner cavity diameter of the micropore 3 The same, the number of small holes 8 is several, and they are distributed in an array, the small holes 8 and the micropores 3 are offset from each other, the inner cavity shape of the polypore 4 is set to be trumpet-shaped, the cross-sectional shape of the increase block 7 is set to be triangular, the size of the heat-conducting substrate plate 2 is larger than the size of the chip substrate layer 1, and the heat-conducting substrate plate 2 can be used to block the inner side of the micropore 3, so that the gene molecules can be arranged through the micropore 3, and the gene molecules can be easily entered into the micropore 3 through the polypore 4, which is convenient for addition, and the fixed plate 5 and the increase block 7 can be used to facilitate the staff to clamp the chip substrate layer 1 with tweezers, which is convenient for moving and placing. The chemical adhesive can improve the connection strength between the chip substrate layer 1 and the heat-conducting substrate plate 2, thereby improving the blocking effect on the middle side of the micropore 3.

[0035] The sealing block 9 can improve the sealing strength of the heat-conducting substrate plate 2 on the micro-hole 3, and facilitate the positioning of the connection between the chip substrate layer 1 and the heat-conducting substrate plate 2. The positioning block 10 cooperates with the positioning hole 6 to facilitate splicing and achieve the positioning function. The heat at the bottom can be gathered through the small hole 8, thereby improving the thermal conductivity of the chip substrate layer 1, so that the heat at the bottom of the heat-conducting substrate plate 2 can directly contact the bottom wall of the chip substrate layer 1, thereby improving the thermal conductivity, and does not affect the normal use of the micro-hole 3.

[0036] By making the chip base layer 1 of one of the materials such as polyethylene, polypropylene, polycarbonate, etc., the chip base layer 1 can have the chemical resistance of the material. At the same time, the heat from the bottom can be easily and evenly transferred to the middle of the chip base layer 1 through the heat-conducting base plate 2 and the blocking block 9, thereby facilitating the heating of the gene molecules in the middle of the chip base layer 1, playing a role in auxiliary heat conduction and improving the use effect.

[0037] Working principle of the utility model: when in use, it is only necessary to apply chemical adhesive on the surface of the heat-conducting substrate plate 2, and place the chip substrate layer 1 on the top of the heat-conducting substrate plate 2, so that the positioning block 10 is inserted into the interior of the positioning hole 6, and the blocking block 9 is inserted into the interior of the micropore 3. At this time, the micropore 3 can be blocked by the blocking block 9, and the chip substrate layer 1 and the heat-conducting substrate plate 2 are aligned by the positioning block 10, so as to facilitate splicing and combining them into one piece for use;

[0038] The gene molecules can be conveniently placed for use through the polypores 4, and the bottom of the heat-conducting substrate 2 can be evenly heated through the cooperation of the small holes 8, the heat-conducting substrate 2 and the blocking block 9, thereby improving the heat-conducting effect.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A microarray chip structure with auxiliary heat conduction, comprising a chip substrate layer (1) and a heat-conducting substrate plate (2), characterized in that: The surface of the chip substrate layer (1) is provided with micropores (3), a side of the inner cavity of the micropores (3) away from the heat-conducting substrate plate (2) is provided with a gathering hole (4), the four sides of the chip substrate layer (1) are symmetrically fixedly connected with a fixing plate (5), the middle of the fixing plate (5) is provided with a positioning hole (6), and the top of the fixing plate (5) is symmetrically fixedly connected with an increase block (7) on both sides; A small hole (8) is provided in the middle of the heat-conducting base plate (2), a plurality of blocking blocks (9) are fixedly connected to the top of the heat-conducting base plate (2), and positioning blocks (10) are symmetrically provided around the top of the heat-conducting base plate (2).

2. The microarray chip structure with auxiliary heat conduction according to claim 1, characterized in that: The material of the chip substrate layer (1) is set to be one of polyethylene, polypropylene, polycarbonate and the like, the material of the heat-conducting substrate plate (2) is set to be one of heat-conducting silicone grease and heat-conducting silica gel graphite material, and the material of the blocking block (9) is the same as that of the heat-conducting substrate plate (2).

3. The microarray chip structure with auxiliary heat conduction according to claim 1, characterized in that: The bottom wall of the chip base layer (1) and the top wall of the heat-conducting base plate (2) are in contact with each other, and a chemical adhesive is provided between the chip base layer (1) and the heat-conducting base plate (2).

4. The microarray chip structure with auxiliary heat conduction according to claim 1, characterized in that: The diameter of the micropore (3) is the same as the diameter of the blocking block (9); the micropore (3) and the blocking block (9) correspond one to one; and the blocking block (9) is arranged inside the micropore (3).

5. The microarray chip structure with auxiliary heat conduction according to claim 1, characterized in that: The inner cavity size of the positioning hole (6) is matched to the size of the positioning block (10), the positioning block (10) corresponds to the positioning hole (6), and the positioning block (10) is arranged in the middle of the positioning hole (6).

6. The microarray chip structure with auxiliary heat conduction according to claim 1, characterized in that: The inner diameter of the small hole (8) is the same as the inner diameter of the microhole (3). The number of the small holes (8) is several and they are distributed in an array. The small holes (8) and the microholes (3) are staggered with each other.

7. The microarray chip structure with auxiliary heat conduction according to claim 1, characterized in that: The inner cavity shape of the gathering hole (4) is set to be a trumpet shape, the cross-sectional shape of the increasing block (7) is set to be a triangle, and the size of the heat-conducting base plate (2) is larger than the size of the chip base layer (1).

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