Edge-emitting laser device and optoelectronic equipment

Abstract

The utility model relates to an edge emitting laser device and optoelectronic equipment. The edge emitting laser device comprises a mounting bracket, a first welding piece, a second welding piece, a laser emitting chip and a packaging colloid, the laser emitting chip is arranged in a mounting cavity of the mounting bracket and is connected with a first connecting part of the first welding piece and a second connecting part of the second welding piece, and the packaging colloid is filled into the mounting cavity from a packaging opening and is connected with the first connecting part of the first welding piece and the second connecting part of the second welding piece; the packaging colloid wraps the laser emission chip, and the laser emission chip is packaged in the installation support. By adopting the mounting bracket and cooperating with the packaging colloid for packaging, batch production can be realized, the overall size of the edge-emitting laser device can be reduced, and the production efficiency can be improved. And meanwhile, as the first pin part of the first welding piece and the second pin part of the second welding piece are arranged on the outer wall of the mounting bracket, welding connection can be directly carried out during assembly, pin bending operation and the like are not needed, and the assembly efficiency in the use process is improved.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to edge-emitting laser devices and optoelectronic equipment. Background Art

[0002] At present, the packaging form of edge-emitting laser chips (EEL) is TO packaging. The TO packaging process requires the edge-emitting laser chip to be mounted in the TO tube holder, and the pins are connected with gold wires, and finally the tube cap is encapsulated to complete the product manufacturing. The TO pins bring a lot of inconvenience to production, testing and assembly, and the efficiency of mass production and customer assembly is low. On the other hand, the edge-emitting laser device (i.e., edge-emitting laser chip package) of TO packaging is large in size, which is not conducive to the miniaturization and integration design of circuits. Summary of the invention

[0003] Based on this, it is necessary to provide an edge-emitting laser device and optoelectronic device that can be easily assembled and installed and is conducive to miniaturized design to address the above problems.

[0004] An edge-emitting laser device, the edge-emitting laser device comprises a mounting bracket, a first welding part, a second welding part, a laser emitting chip and a packaging colloid, wherein a mounting cavity is formed in the mounting bracket, a side opening of the mounting bracket is formed as a packaging opening, and the packaging opening is communicated with the mounting cavity; the first welding part comprises a first connecting part and a first pin part connected to the first connecting part, the first connecting part is located in the mounting cavity, and the first pin part extends to the outer wall of the mounting bracket; the second welding part comprises a second connecting part and a second pin part connected to the second connecting part, the second connecting part is located in the mounting cavity and is insulated from the first connecting part, and the second pin part extends to the outer wall of the mounting bracket; the laser emitting chip is an edge-emitting laser chip, the laser emitting chip is arranged in the mounting cavity, the first connecting part and the second connecting part are electrically connected to the laser emitting chip respectively; the packaging colloid is filled into the mounting cavity from the packaging opening, the packaging colloid covers the laser emitting chip, a light exit hole is opened on the outer wall of the mounting bracket, and the laser emitting chip is used to emit light toward the light exit hole.

[0005] In one embodiment, a connection portion between the first connection portion and the first pin portion is embedded in a body of the mounting bracket, and a connection portion between the second connection portion and the second pin portion is embedded in a body of the mounting bracket.

[0006] In one embodiment, the edge-emitting laser device also includes a substrate, the mounting bracket is arranged on the substrate, the mounting bracket is open toward one side of the substrate, the first welding part and the second welding part are both arranged on the substrate, the first connecting portion and the second connecting portion are respectively located on a side of the substrate facing the mounting bracket, and the first pin portion and the second pin portion respectively extend through the substrate.

[0007] In one embodiment, the first pin portion is bent to form a first welding pin and a first covering portion, and the first welding pin and the first covering portion are respectively attached to two outer walls adjacent to the mounting bracket; the second pin portion is bent to form a second welding pin and a second covering portion, and the second welding pin and the second covering portion are respectively attached to two outer walls adjacent to the mounting bracket, and the second welding pin and the first welding pin are located on the same outer wall of the mounting bracket, and the second covering portion and the first covering portion are respectively located on two outer walls opposite to each other of the mounting bracket.

[0008] In one embodiment, two spaced-apart mounting through holes are provided on the surface of the substrate facing the mounting bracket, and both of the two mounting through holes extend through the surface of the substrate facing away from the mounting bracket, and the first connecting portion and the second connecting portion respectively cover the two mounting through holes; the first pin portion is provided through one of the mounting through holes and extends from the surface of the substrate facing away from the mounting bracket, and the second pin portion is provided through the other mounting through hole and extends from the surface of the substrate facing away from the mounting bracket.

[0009] In one embodiment, the top opening of the mounting bracket forms the packaging opening, and the side opening of the mounting bracket forms the light exit hole.

[0010] In one of the embodiments, the edge-emitting laser device further includes a fluorescent sheet, which is disposed on the mounting bracket and blocks the light-emitting hole.

[0011] In one of the embodiments, the thickness of the edge-emitting laser device in the axial direction of the light-emitting hole is less than or equal to 2 mm.

[0012] In one of the embodiments, the fluorescent sheet is arranged on the outer side of the mounting bracket.

[0013] An optoelectronic device comprises the edge-emitting laser device as described above.

[0014] In the above-mentioned edge-emitting laser device and optoelectronic equipment, the laser emitting chip is arranged in the mounting cavity of the mounting bracket, and is connected to the first connecting portion of the first welding part and the second connecting portion of the second welding part. The packaging colloid is used to fill the mounting cavity from the packaging opening, and the laser emitting chip is coated with the packaging colloid to encapsulate the laser emitting chip in the mounting bracket. The mounting bracket and the packaging colloid packaging method can be used for batch production, which can not only effectively reduce the overall volume of the edge-emitting laser device, which is conducive to miniaturization, but also can effectively improve production efficiency. At the same time, since the first pin portion of the first welding part and the second pin portion of the second welding part are both arranged on the outer wall of the mounting bracket, they can be directly welded and connected during assembly and use, without the need for pin bending operations, etc., thereby improving assembly efficiency during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application.

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various elements are drawn only as examples in the drawings and are not necessarily drawn according to the true scale.

[0018] Figure 1 FIG. 1 is a top view of an edge-emitting laser device in one embodiment.

[0019] Figure 2 for Figure 1 A side view of an edge-emitting laser device is shown.

[0020] Figure 3 FIG. 4 is a schematic structural diagram of an edge-emitting laser device in another embodiment.

[0021] Figure 4 for Figure 3 A side view of an edge-emitting laser device is shown.

[0022] Description of reference numerals:

[0023] Edge-emitting laser device 10; mounting bracket 100; mounting cavity 110; packaging opening 120; light output hole 130; first welding member 200; first connecting portion 210; first pin portion 220; first welding pin 221; first covering portion 222; second welding member 300; second connecting portion 310; second pin portion 320; second welding pin 321; second covering portion 322; laser emitting chip 400; packaging colloid 500; substrate 600; mounting through hole 610; fluorescent sheet 700. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0025] See also Figures 1 to 3The edge-emitting laser device 10 in one embodiment of the present application can at least be easily assembled and installed, and is conducive to miniaturization. Specifically, the edge-emitting laser device 10 includes a mounting bracket 100, a first welding member 200, a second welding member 300, a laser emitting chip 400 and a packaging colloid 500. A mounting cavity 110 is formed in the mounting bracket 100. The mounting bracket 100 can also be called a shell. One side opening of the mounting bracket 100 is formed as a packaging opening 120, and the packaging opening 120 is connected to the mounting cavity 110; the first welding member 200 includes a first connecting portion 210 and a first pin portion 220 connected to the first connecting portion, the first connecting portion 210 is located in the mounting cavity 110, and the first pin portion 220 extends to the outer wall of the mounting bracket 100; the second welding member 300 includes a second connecting portion 310 and a second pin portion 320 connected to the second connecting portion 310, the second connecting portion 310 is located in the mounting cavity 110 and is insulated from the first connecting portion 210, and the second pin portion 320 extends to the outer wall of the mounting bracket 100; the laser emitting chip 400 is an edge-emitting laser chip, the laser emitting chip 400 is arranged in the mounting cavity 110, the first connecting portion 210 is arranged in the mounting cavity 110, and the first connecting portion 210 is arranged in the mounting cavity 110. 0 and the second connecting portion 310 are electrically connected to the laser emitting chip 400 respectively; the packaging colloid 500 is filled into the installation cavity 110 from the packaging opening 120, and the packaging colloid 500 covers the laser emitting chip 400.

[0026] In the edge-emitting laser device 10, the laser emitting chip 400 is arranged in the mounting cavity 110 of the mounting bracket 100, and is connected to the first connection portion 210 of the first welding member 200 and the second connection portion 310 of the second welding member 300. The packaging colloid 500 is used to fill the mounting cavity 110 from the packaging opening 120, and the laser emitting chip 400 is covered by the packaging colloid 500 to package the laser emitting chip 400 in the mounting bracket 100. The mounting bracket 100 and the packaging colloid 500 are used to package, so that a plurality of edge-emitting laser devices 10 can be produced simultaneously in batches, which can not only effectively reduce the overall volume of the edge-emitting laser device 10, but also be conducive to miniaturization, and can effectively improve production efficiency. At the same time, since the first pin portion 220 of the first welding member 200 and the second pin portion 320 of the second welding member are both arranged on the outer wall of the mounting bracket 100, when assembled and used, they can be directly welded and connected without the need for pin bending operations, thereby improving assembly efficiency during use.

[0027] See also Figure 1 and Figure 2In one embodiment, the connection portion between the first connection portion 210 and the first pin portion 220 is embedded in the entity of the mounting bracket 100, and the connection portion between the second connection portion 310 and the second pin portion 320 is embedded in the entity of the mounting bracket 100. During processing, the first welding member 200 and the second welding member 300 are firstly stamped and formed according to their respective shapes, and the mounting bracket 100 is directly injection-molded on the first welding member 200 and the second welding member 300, so that the first welding member 200 and the second welding member 300 are effectively embedded in the mounting bracket 100, and the first welding member 200 and the second welding member 300 are reliably connected on the mounting bracket 100.

[0028] Specifically, the first pin portion 220 is bent to form a first welding pin 221 and a first covering portion 222, and the first welding pin 221 and the first covering portion 222 are respectively attached to two adjacent outer walls of the mounting bracket 100; the second pin portion 320 is bent to form a second welding pin 321 and a second covering portion 322, and the second welding pin 321 and the second covering portion 322 are respectively attached to two adjacent outer walls of the mounting bracket 100, and the second welding pin 321 and the first welding pin 221 are located on the same outer wall of the mounting bracket 100, and the second covering portion 322 and the first covering portion 222 are respectively located on two opposite outer walls of the mounting bracket 100. By providing the first covering portion 222 formed by bending the first pin portion 220 and covering the outer wall of the mounting bracket 100, the reliability of the first pin portion 220 being arranged on the mounting bracket 100 can be improved, and the first welding pin 221 is used for welding connection during assembly. Similarly, by providing the second covering portion 322 formed by bending the second pin portion 320 and covering the outer wall of the mounting bracket 100, the reliability of the second pin portion 320 being arranged on the mounting bracket 100 can be improved, and the second welding pin 321 is used for welding connection during assembly.

[0029] See also Figure 3 and Figure 4In another embodiment, the edge-emitting laser device 10 further includes a substrate 600, the mounting bracket 100 is disposed on the substrate 600, the mounting bracket 100 is open toward one side of the substrate 600, the first welding member 200 and the second welding member 300 are both disposed on the substrate 600, the first connecting portion 210 and the second connecting portion 310 are respectively located on one side of the substrate 600 facing the mounting bracket 100, and the first pin portion 220 and the second pin portion 320 extend through the substrate 600. By installing the first welding member 200 and the second welding member 300 and then installing the mounting bracket 100 on the substrate 600, the convenience of installation and connection can be improved.

[0030] Specifically, two spaced mounting through holes 610 are provided on the surface of the substrate 600 facing the mounting bracket 100. Both mounting through holes 610 penetrate the surface of the substrate 600 facing away from the mounting bracket 100. The first connection portion 210 and the second connection portion 310 cover the two mounting through holes 610 respectively. The first pin portion 220 penetrates one of the mounting through holes 610 and extends from the surface of the substrate 600 facing away from the mounting bracket 100. The second pin portion 320 penetrates the other mounting through hole 610 and extends from the surface of the substrate 600 facing away from the mounting bracket 100. The laser emission chip 400 is mounted on the substrate 600 and connected to the first connection portion 210 and the second connection portion 310. The first pin portion 220 and the second pin portion 320 penetrate the substrate 600 to facilitate assembly and welding.

[0031] In one embodiment, a light exit hole 130 is provided on the outer wall of the mounting bracket 100, and the laser emitting chip 400 is used to emit light toward the light exit hole 130. The light exit hole 130 is provided to facilitate the light emission of the laser emitting chip 400, and the opening position of the light exit hole 130 can be set according to the light emission requirements.

[0032] For example, the top opening of the mounting bracket 100 forms the package opening 120, and the side opening of the mounting bracket 100 forms the light exit hole 130. During installation, the laser emitting chip 400 can be installed in the mounting cavity 110 through the package opening 120, and the light exit side of the laser emitting chip 400 faces the light exit hole 130. In other embodiments, the light exit hole 130 can be omitted, and the laser emitting chip 400 directly emits light from the direction of the package opening 120.

[0033] like Figure 1As shown, in one embodiment, the edge-emitting laser device 10 further includes a fluorescent sheet 700, which is disposed on the mounting bracket 100 and blocks the light-emitting hole 130. The fluorescent sheet 700 can be used to absorb the light of a characteristic wavelength emitted by the laser emitting chip 400, thereby stabilizing the wavelength of the light. Specifically, the fluorescent sheet 700 is disposed on the outer side of the mounting bracket 100. In other embodiments, the fluorescent sheet 700 can also be omitted.

[0034] In one embodiment, the thickness dimension of the edge emitting laser device 10 in the axial direction of the light exit hole 130 is less than or equal to 2 mm. Specifically, the thickness dimension of the edge emitting laser device 10 in the axial direction of the light exit hole 130 is 1 mm. Since the edge emitting laser device 10 is packaged by using the mounting bracket 100 and the packaging colloid 500, it is convenient to reduce the size of the edge emitting laser device 10, so that the thickness dimension of the edge emitting laser device 10 reaches 1 mm, which is conducive to integration on a circuit board and is conducive to the miniaturized design of the product.

[0035] In one embodiment, the laser emission chip 400 is an EEL laser chip. The EEL laser chip is a solid-state laser chip with high speed, high efficiency, low energy consumption and miniaturization. The principle of the EEL laser chip is to use electron injection to achieve discharge reversal. When the electron flow enters the laser material, they collide with the atoms in the material and convert the excited state atoms into ground state atoms. In this process, the excited state atoms release energy and generate photons. When these photons pass through the reflector, they will be amplified and produce a focusing effect, and finally form a laser with a certain wavelength and coherence.

[0036] See also Figure 1 and Figure 3 In one embodiment, the present application further discloses an optoelectronic device, wherein the optoelectronic device includes the edge-emitting laser device 10 in any one of the embodiments described above. The optoelectronic device can be applied in the fields of medicine, lighting, communication, radar, etc. For example, in the medical field, the optoelectronic device can be used for cutting and welding biological tissues; in the lighting field, the optoelectronic device can be used for high-brightness laser lighting; in the communication field, the optoelectronic device can be used for optical fiber communication and circuit integration; in the radar field, it can be used for imaging radar.

[0037] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0038] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0042] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An edge-emitting laser device, characterized in that: The edge emitting laser device comprises: A mounting bracket, wherein a mounting cavity is formed in the mounting bracket, and an opening on one side of the mounting bracket is formed as a packaging opening, and the packaging opening is communicated with the mounting cavity; a first welding member, the first welding member comprising a first connecting portion and a first pin portion connected to the first connecting portion, the first connecting portion being located in the mounting cavity, and the first pin portion extending outwardly from an outer wall of the mounting bracket; a second welding member, the second welding member comprising a second connecting portion and a second pin portion connected to the second connecting portion, the second connecting portion being located in the mounting cavity and insulated from the first connecting member, the second pin portion extending outwardly from an outer wall of the mounting bracket; A laser emitting chip, wherein the laser emitting chip is an edge emitting laser chip, the laser emitting chip is disposed in the mounting cavity, and the first connecting portion and the second connecting portion are electrically connected to the laser emitting chip respectively; and The encapsulation colloid is filled into the mounting cavity from the encapsulation opening, the encapsulation colloid covers the laser emitting chip, a light emitting hole is opened on the outer wall of the mounting bracket, and the laser emitting chip is used to emit light toward the light emitting hole.

2. The edge-emitting laser device according to claim 1, characterized in that: The connection portion between the first connection portion and the first pin portion is embedded in the entity of the mounting bracket, and the connection portion between the second connection portion and the second pin portion is embedded in the entity of the mounting bracket.

3. The edge-emitting laser device according to claim 2, characterized in that: The first pin portion is bent to form a first welding pin and a first covering portion, and the first welding pin and the first covering portion are respectively attached to two outer walls adjacent to the mounting bracket; the second pin portion is bent to form a second welding pin and a second covering portion, and the second welding pin and the second covering portion are respectively attached to two outer walls adjacent to the mounting bracket, and the second welding pin and the first welding pin are located on the same outer wall of the mounting bracket, and the second covering portion and the first covering portion are respectively located on two outer walls opposite to each other of the mounting bracket.

4. The edge-emitting laser device according to claim 1, characterized in that: The edge-emitting laser device also includes a substrate, the mounting bracket is arranged on the substrate, the mounting bracket is open toward one side of the substrate, the first welding part and the second welding part are both arranged on the substrate, the first connecting portion and the second connecting portion are respectively located on a side of the substrate facing the mounting bracket, and the first pin portion and the second pin portion respectively extend through the substrate.

5. The edge-emitting laser device according to claim 4, characterized in that: The surface of the substrate facing the mounting bracket is provided with two spaced-apart mounting through holes, both of which penetrate to the surface of the substrate facing away from the mounting bracket, and the first connecting portion and the second connecting portion respectively cover the two mounting through holes; the first pin portion is penetrated through one of the mounting through holes and extends from the surface of the substrate facing away from the mounting bracket, and the second pin portion is penetrated through the other mounting through hole and extends from the surface of the substrate facing away from the mounting bracket.

6. The edge-emitting laser device according to any one of claims 1 to 5, characterized in that: The top opening of the mounting bracket forms the packaging opening, and the side opening of the mounting bracket forms the light exit hole.

7. The edge-emitting laser device according to claim 6, characterized in that: The edge-emitting laser device further includes a fluorescent sheet, which is disposed on the mounting bracket and blocks the light-emitting hole.

8. The edge-emitting laser device according to claim 7, characterized in that: The fluorescent sheet is arranged on the outer side of the mounting bracket.

9. The edge-emitting laser device according to claim 6, characterized in that: The thickness of the edge-emitting laser device in the axial direction of the light-emitting hole is less than or equal to 2 mm.

10. An optoelectronic device, characterized in that: The optoelectronic device comprises an edge-emitting laser device as claimed in any one of claims 1 to 9.

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