Display mainboard and vehicle-mounted display screen

Abstract

The utility model discloses a display mainboard and a vehicle-mounted display screen, the display mainboard comprises a circuit board and a metal heat dissipation assembly, a copper exposing area is arranged on a top signal layer of the circuit board, and copper materials in the copper exposing area are connected to a grounding layer in the circuit board. According to the invention, a three-dimensional shielding effect is formed between the metal heat dissipation assembly and the grounding layer of the inner layer of the circuit board in a manner of overlapping the metal heat dissipation assembly and the copper material of the copper exposing area, and electromagnetic radiation generated by the circuit board can be effectively inhibited by taking the metal heat dissipation assembly as a local electromagnetic radiation shielding piece. In addition, the signal lines of the bottom signal layer of the circuit board are embedded into the circuit board, and the bottom grounding layer is arranged on one side, contacted with the outside, of the bottom signal layer of the circuit board, so that circuit radiation generated by the bottom signal layer is shielded, electromagnetic radiation generated by the bottom of the circuit board is effectively inhibited, and the service life of the circuit board is prolonged. And the electromagnetic radiation generated by the circuit board is further reduced.

Description

Technical Field

[0001] The utility model relates to the field of display screen design, and in particular to a display mainboard and a vehicle-mounted display screen. Background Art

[0002] At present, with the rapid development of the new energy vehicle industry, display screens have become standard equipment for many new energy vehicles. In the rear cabin of the car, some display screens are set up for entertainment of rear seat users. However, since the display screen is a strong radiation source, it will cause radiation interference to automobile / electric vehicle parts during use, thus affecting the normal operation of other equipment in the car.

[0003] In summary, the display screen in the car in the prior art has the technical problem of large radiation interference. Utility Model Content

[0004] The utility model provides a display mainboard and a vehicle-mounted display screen, which are used to solve the technical problem of large radiation interference of the display screen in the vehicle in the prior art.

[0005] In a first aspect, an embodiment of the utility model provides a display motherboard, including a circuit board and a metal heat dissipation component, wherein a top signal layer of the circuit board is provided with a copper-exposed area, the copper-exposed area exposes the copper material of the top signal layer, the copper material is connected to a ground layer inside the circuit board, and the metal heat dissipation component is overlapped with the copper material;

[0006] The signal line of the bottom signal layer of the circuit board is embedded in the circuit board, and a bottom ground layer is also provided on the side of the bottom signal layer of the circuit board that contacts the outside.

[0007] In this embodiment, by setting a copper exposed area on the top signal layer of the circuit board, connecting the copper material of the copper exposed area to the grounding layer inside the circuit board, and overlapping the metal heat dissipation component with the copper material of the copper exposed area, a three-dimensional shielding effect is formed between the metal heat dissipation component and the grounding layer of the inner layer of the circuit board, and the metal heat dissipation component is used as a local electromagnetic radiation shielding component to effectively suppress the electromagnetic radiation generated by the circuit board. In addition, the embodiment of the utility model also embeds the signal line of the bottom signal layer of the circuit board into the inside of the circuit board, and sets a bottom grounding layer on the side of the bottom signal layer of the circuit board that contacts the outside, thereby shielding the circuit radiation generated by the bottom signal layer, effectively suppressing the electromagnetic radiation generated by the bottom of the circuit board, further reducing the electromagnetic radiation generated by the circuit board, and solving the technical problem of large radiation interference of the display screen in the car in the prior art.

[0008] Preferably, a copper exposed area is arranged around the top signal layer, and the copper material in the copper exposed area is punched at a first preset distance to connect to the ground layer inside the circuit board.

[0009] This embodiment can confine the electric field on both sides of the circuit board to the ground plane by connecting the copper material in the copper exposed area to the ground layer inside the circuit board, thereby effectively shielding the electromagnetic radiation generated on both sides of the circuit board.

[0010] Preferably, the value range of the first preset distance is less than or equal to 3 mm.

[0011] Preferably, the copper material in the copper exposed area is provided with a tinning area at intervals of a second preset distance, and the copper material in the tinning area is coated with tin material.

[0012] As described above, this embodiment increases the oxidation resistance of the circuit board by setting a tin area on the copper material in the copper exposed area, while enabling the metal heat dissipation component to be stably connected to the copper material in the copper exposed area and well grounded to the grounding layer inside the circuit board to form a good local shielding field.

[0013] Preferably, the value range of the second preset distance is less than or equal to 1.5 cm.

[0014] Preferably, the tinning area is a square with a preset area.

[0015] As mentioned above, this embodiment ensures that there is enough tin in each corner of the upper tin area by setting the upper tin area to a square, so that the metal heat dissipation component is easier to attach to the circuit board during welding, and the connection between the metal heat dissipation component and the circuit board is tighter and more stable, thereby improving reliability and stability.

[0016] Preferably, the metal heat dissipation component is an aluminum alloy heat dissipation component.

[0017] As mentioned above, the metal heat dissipation component of this embodiment adopts an aluminum alloy heat dissipation component, which can provide good thermal conductivity on the one hand, and good magnetic permeability, electrical conductivity and good shielding performance on the other hand. The aluminum alloy heat dissipation component can not only dissipate heat but also play an electromagnetic shielding role, which is a two-in-one product and reduces costs to a certain extent.

[0018] Preferably, it also includes a plastic shell, and the circuit board and the metal heat dissipation component are arranged in the plastic shell.

[0019] As described above, this embodiment uses a plastic shell as the shell of the display mainboard, which can improve the reliability and durability of the display mainboard. In addition, the plastic shell is light in weight and is suitable for vehicle-mounted scenarios.

[0020] Preferably, the circuit board includes, from top to bottom, a top signal layer, a first ground layer, an internal signal layer, a power layer, a second ground layer, a bottom signal layer and a bottom ground layer;

[0021] The copper material in the exposed copper area is connected to the first ground layer and the second ground layer by drilling, and the signal line of the bottom signal layer is switched to the power layer by drilling.

[0022] In a second aspect, an embodiment of the utility model further provides a vehicle-mounted display screen, comprising a display screen and a display mainboard of the first aspect, wherein the display screen is connected to the display mainboard.

[0023] As mentioned above, the embodiment of the utility model provides a display motherboard and a vehicle-mounted display screen, the display motherboard includes a circuit board and a metal heat dissipation component. In this embodiment, by setting a copper-exposed area on the top signal layer of the circuit board, connecting the copper material of the copper-exposed area to the grounding layer inside the circuit board, and overlapping the copper material of the metal heat dissipation component with the copper material of the copper-exposed area, a three-dimensional shielding effect is formed between the metal heat dissipation component and the grounding layer of the inner layer of the circuit board, and the metal heat dissipation component is used as a local electromagnetic radiation shielding component, which can effectively suppress the electromagnetic radiation generated by the circuit board. In addition, the embodiment of the utility model also embeds the signal line of the bottom signal layer of the circuit board into the inside of the circuit board, and sets a bottom grounding layer on the side of the bottom signal layer of the circuit board that contacts the outside, so as to shield the circuit radiation generated by the bottom signal layer, effectively suppress the electromagnetic radiation generated by the bottom of the circuit board, further reduce the electromagnetic radiation generated by the circuit board, and solve the technical problem of large radiation interference in the display screen in the car in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic cross-sectional view of a display mainboard provided by the utility model.

[0025] Figure 2 A top view of a circuit board provided in an embodiment of the utility model.

[0026] Figure 3 A top view of another circuit board provided in an embodiment of the utility model.

[0027] Figure 4 A top view of another circuit board provided in an embodiment of the utility model.

[0028] Figure 5 A cross-sectional schematic diagram of another display mainboard provided by the utility model.

[0029] Figure 6 The utility model provides a top view of a metal heat dissipation component.

[0030] Figure 7 This is a bottom view of a metal heat dissipation component provided by the utility model.

[0031] Figure 8 A schematic cross-sectional view of a circuit board provided by the utility model.

[0032] Fig. 9A top view of a circuit board provided in an embodiment of the utility model.

[0033] Fig.10 A bottom view of a circuit board provided in an embodiment of the utility model.

[0034] In the figure: circuit board 1, metal heat dissipation component 2, exposed copper area 11, tinned area 12, plastic shell 3, overlapping area 21, top signal layer 101, first ground layer 102, internal signal layer 103, power layer 104, second ground layer 105, bottom signal layer 106, bottom ground layer 107. DETAILED DESCRIPTION

[0035] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model are further described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0036] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0038] At present, with the rapid development of the new energy vehicle industry, some ceiling-mounted display screens are being installed in the rear cabin of the car for entertainment of rear-seat users. However, since the display screen is a strong radiation source, it will cause radiation interference to automobile / electric vehicle parts during use, thereby affecting the normal operation of other equipment in the car. Therefore, there have always been two challenges for this type of electronic components. On the one hand, there are the strict EMC (ElectroMagneticCompatibility) test standards for automotive electronic components, and on the other hand, there are weight requirements for ceiling-mounted products.

[0039] There are two solutions for existing ceiling displays on the market:

[0040] Option 1: Using a metal structure as the product shell can reduce the electromagnetic radiation of the display, but its disadvantage is that it is too heavy, which poses a challenge to the safety of the vehicle body.

[0041] Option 2: Using a plastic shell as the product shell can reduce weight, but the disadvantage is that it is difficult to meet the stringent EMC test standards for automotive electronics.

[0042] Based on this, in order to solve the above technical problems, the embodiment of the utility model provides a display motherboard, which includes a circuit board and a metal heat dissipation component. In this embodiment, a copper-exposed area is set on the top signal layer of the circuit board, and the copper material of the copper-exposed area is connected to the grounding layer inside the circuit board, and the metal heat dissipation component is overlapped with the copper material of the copper-exposed area, so that a three-dimensional shielding effect is formed between the metal heat dissipation component and the grounding layer of the inner layer of the circuit board. The metal heat dissipation component is used as a local electromagnetic radiation shielding component, which can effectively suppress the electromagnetic radiation generated by the circuit board. In addition, the embodiment of the utility model also embeds the signal line of the bottom signal layer of the circuit board into the inside of the circuit board, and sets a bottom grounding layer on the side of the bottom signal layer of the circuit board that contacts the outside, so as to shield the circuit radiation generated by the bottom signal layer, effectively suppress the electromagnetic radiation generated by the bottom of the circuit board, and further reduce the electromagnetic radiation generated by the circuit board.

[0043] like Figure 1 As shown, Figure 1 A cross-sectional schematic diagram of a display mainboard provided in an embodiment of the utility model, the display mainboard provided in the embodiment of the utility model includes a circuit board 1 and a metal heat dissipation component 2, the top signal layer of the circuit board 1 is provided with a copper exposed area 11, the copper exposed area 11 exposes the copper material of the top signal layer, the copper material is connected to the ground layer inside the circuit board 1, and the metal heat dissipation component 2 is overlapped with the copper material.

[0044] In this embodiment, the display mainboard includes a circuit board 1 and a metal heat dissipation component 2, wherein the circuit board 1 includes a top signal layer, and the top signal layer refers to a signal layer arranged on the top of the circuit board 1, which is usually used to arrange components and connect control signals to achieve signal transmission. A copper-exposed area 11 is provided on the top signal layer, and the copper-exposed area 11 refers to an area where the copper material inside the top signal layer is exposed. It can be understood that copper material is an indispensable raw material for making the circuit board 1, and the copper material enables the circuit board 1 to have conductivity and the function of transmitting signals. In one embodiment, the copper-exposed area 11 can be provided by not brushing solder mask (i.e., green oil) on the surface of the circuit board 1. For example, Figure 2 As shown, Figure 2 A top view of a circuit board 1 provided in an embodiment of the utility model can be provided with a copper exposed area 11 around the top signal layer of the circuit board 1. In addition, the copper material of the copper exposed area 11 of the top signal layer in this embodiment is also connected to the ground layer inside the circuit board 1, wherein the ground layer refers to the layer connected to the ground inside the circuit board 1, and the ground layer is used to provide a complete ground plane, thereby providing a return current for high speed. By connecting the copper material of the copper exposed area 11 to the ground layer inside the circuit board 1, the electromagnetic radiation generated by the side of the circuit board 1 can be bound in the ground plane, thereby shielding the electromagnetic noise radiated from the side of the circuit board 1. Secondly, the metal heat dissipation component 2 in this embodiment refers to a heat dissipation shell made of metal, and the heat dissipation shell made of metal has the function of isolating electromagnetic radiation, and the metal heat dissipation component 2 in this embodiment is overlapped with the copper material of the copper exposed area 11 of the top signal layer of the display motherboard, so that a three-dimensional shielding effect is formed between the metal heat dissipation component 2 and the ground layer of the inner layer of the circuit board 1, which can effectively suppress the electromagnetic radiation generated by the circuit board 1.

[0045] The signal lines of the bottom signal layer of the circuit board 1 are embedded in the circuit board 1 , and a bottom ground layer is also provided on the side of the bottom signal layer of the circuit board 1 that contacts the outside.

[0046] The bottom signal layer of the circuit board 1 refers to the signal layer arranged at the bottom of the circuit board 1, and the bottom signal layer is usually used to arrange the bottom components and connect the bottom signals. In this embodiment, the signal line of the bottom signal layer of the circuit board 1 is embedded in the interior of the circuit board 1, wherein the signal line refers to the line used to transmit the signal in the bottom signal layer, that is, the signal line in the bottom signal layer in this embodiment is embedded in the interior of the circuit board 1, for example, the signal line of the bottom signal layer can be set to the inner layer of the circuit board 1 by punching and changing layers. In addition, in this embodiment, a bottom grounding layer is also provided on the side of the bottom signal layer of the circuit board 1 that contacts the outside, and the bottom grounding layer refers to a layer arranged at the bottom of the circuit board 1 and used for grounding. By embedding the signal line of the bottom signal layer into the interior of the circuit board 1 and providing a bottom grounding layer at the bottom of the bottom signal layer, the electromagnetic radiation generated by the bottom signal layer can be shielded, and the electromagnetic radiation generated by the bottom of the circuit board 1 can be effectively suppressed.

[0047] As mentioned above, the embodiment of the utility model provides a display motherboard, which includes a circuit board and a metal heat dissipation component. In this embodiment, a copper-exposed area is set on the top signal layer of the circuit board, and the copper material of the copper-exposed area is connected to the grounding layer inside the circuit board, and the metal heat dissipation component is overlapped with the copper material of the copper-exposed area, so that a three-dimensional shielding effect is formed between the metal heat dissipation component and the grounding layer of the inner layer of the circuit board. The metal heat dissipation component is used as a local electromagnetic radiation shielding component to effectively suppress the electromagnetic radiation generated by the circuit board. In addition, the embodiment of the utility model also embeds the signal line of the bottom signal layer of the circuit board into the inside of the circuit board, and sets a bottom grounding layer on the side of the bottom signal layer of the circuit board that contacts the outside, so as to shield the circuit radiation generated by the bottom signal layer, effectively suppress the electromagnetic radiation generated by the bottom of the circuit board, further reduce the electromagnetic radiation generated by the circuit board, and solve the technical problem of large radiation interference in the display screen in the car in the prior art.

[0048] On the basis of the above embodiment, copper exposed areas 11 are arranged around the top signal layer, and the copper material in the copper exposed area 11 is punched at a first preset distance to connect to the ground layer inside the circuit board 1 .

[0049] In one embodiment, if Figure 3 As shown, a copper exposed area 11 is arranged around the top signal layer of the circuit board 1, and the copper material in the copper exposed area 11 is punched at intervals of a first preset distance, so that the copper material in the copper exposed area 11 is connected to the ground layer inside the circuit board 1, wherein the first preset distance is a preset distance. In one embodiment, the value range of the first preset distance is less than or equal to 3 mm. It can be understood that the smaller the first preset distance is, the more it can block electromagnetic radiation.

[0050] As described above, this embodiment can confine the electric field on both sides of the circuit board to the ground plane by connecting the copper material in the copper exposed area to the ground layer inside the circuit board, thereby effectively shielding the electromagnetic radiation generated on both sides of the circuit board.

[0051] On the basis of the above embodiment, the copper material in the copper exposed area 11 is provided with a tinning area 12 at intervals of a second preset distance, and the copper material in the tinning area 12 is coated with tin material.

[0052] In one embodiment, in the copper material of each copper exposed area 11 of the top signal layer, a tinning area 12 is arranged at a second preset distance, wherein the tinning area 12 refers to an area for tinning, and the copper material of the tinning area 12 is coated with tin material, such as Figure 4 As shown. In this embodiment, by tinning the tinning area 12, while increasing the oxidation resistance of the circuit board, the metal heat dissipation component 2 can be stably connected to the copper material of the copper-exposed area 11, and well grounded to the grounding layer inside the circuit board 1, forming a good local shielding field. In addition, the second preset distance is a pre-set distance. In this embodiment, the value range of the second preset distance is less than or equal to 1.5 cm. In this embodiment, the second preset distance needs to be set according to the wavelength of the signal transmitted in the circuit board 1. The reason is that it is necessary to consider the minimum radiation length ≥ wavelength / 20. For example, assuming that the frequency of the transmitted signal is 1 GHz and the wavelength is 30 cm, the minimum length of the electromagnetic radiation is 1.5 cm, that is, at this time the second preset distance is a maximum of 1.5 cm, and a tinning area 12 is set at a maximum interval of 1.5 cm in the copper material of the copper-exposed area 11. It can be understood that the closer the second preset distance is, the more it can block electromagnetic radiation. In one embodiment, the upper tinning area 12 is a square with a preset area, wherein the preset area is a pre-set area. By setting the upper tinning area 12 to a square, it can be ensured that there is enough tin in each corner of the upper tinning area 12, so that the metal heat dissipation component 2 is more easily attached to the circuit board 1 during welding, and the connection between the metal heat dissipation component 2 and the circuit board 1 is tighter and more stable, thereby improving reliability and stability. In one embodiment, the preset area of ​​the upper tinning area 12 can be set to 25mm 2 , that is, the side length of the square of the upper tin area 12 is 5 mm.

[0053] On the basis of the above embodiment, the metal heat dissipation component 2 is an aluminum alloy heat dissipation component.

[0054] In one embodiment, the metal heat dissipation component 2 adopts an aluminum alloy heat dissipation component. The aluminum alloy heat dissipation component refers to a heat dissipation component made of aluminum alloy material. For example, the aluminum alloy can adopt 1060 aluminum material. The use of aluminum alloy can provide good thermal conductivity on the one hand, and on the other hand, it can also provide good magnetic permeability, electrical conductivity and good shielding performance. When the aluminum alloy heat dissipation component overlaps with the copper exposed area 11 of the top signal layer, a three-dimensional shielding effect is formed between the aluminum alloy heat dissipation component and the grounding layer inside the circuit board 1, which can effectively suppress the electromagnetic radiation generated by the circuit board 1. In one embodiment, the top view of the aluminum alloy heat dissipation component is as shown Figure 5 As shown, the bottom view is as Figure 6 As shown, Figure 6 The middle overlap region 21 is the overlap between the aluminum alloy heat sink component and the circuit board 1. The aluminum alloy heat sink component can not only dissipate heat but also play an electromagnetic shielding role, which is a dual purpose and reduces the cost to a certain extent.

[0055] On the basis of the above embodiment, the display mainboard further includes a plastic shell 3 , and the circuit board 1 and the metal heat dissipation component 2 are arranged in the plastic shell 3 .

[0056] In one embodiment, the display mainboard further includes a plastic shell 3, which is a shell made of plastic material. The circuit board 1 and the metal heat dissipation component 2 are arranged in the plastic shell 3. Figure 7 As shown. In one embodiment, the plastic housing 3 is provided with threaded holes and holes are punched on the circuit board 1, and the circuit board 1 is fixed to the inside of the plastic housing 3 by screws. The plastic housing 3 can play a fixing and protective role, thereby protecting the circuit board 1 and the metal heat dissipation component 2 from displacement or damage due to external force impact, improving the reliability and durability of the display motherboard, and the plastic housing 3 is light in weight and suitable for vehicle-mounted scenarios.

[0057] On the basis of the above embodiment, the circuit board 1 includes, from top to bottom, a top signal layer 101, a first ground layer 102, an internal signal layer 103, a power layer 104, a second ground layer 105, a bottom signal layer 106 and a bottom ground layer 107;

[0058] The copper material in the copper exposed area 11 is connected to the first ground layer 102 and the second ground layer 105 through drilling, and the signal line of the bottom signal layer 106 is switched to the power layer 104 through drilling.

[0059] In one embodiment, the circuit board 1 includes, from top to bottom, a top signal layer 101, a first ground layer 102, an internal signal layer 103, a power layer 104, a second ground layer 105, and a bottom signal layer 106. Figure 8As shown. The first grounding layer 102 and the second grounding layer 105 are grounding layers inside the circuit board 1, which are used to provide a ground plane. The first grounding layer 102 and the second grounding layer 105 connect the ground wires of various parts on the circuit board 1 to ensure the circuit and ground connection, while reducing noise and interference. The internal signal layer 103 is used to arrange various signal lines and signal planes for signal transmission and communication. The power supply layer 104 is responsible for power supply and power management. In this embodiment, the copper exposed area 11 can be connected to the first grounding layer 102 and the second grounding layer 105 inside the circuit board 1 by punching holes in the copper material of the copper exposed area 11, and for the signal line of the bottom signal layer 106, the signal line can be embedded in the power supply layer 104 for routing by punching and changing layers. In another embodiment, the top view and the bottom view of the circuit board 1 are respectively as shown in Fig. 9 as well as Fig.10 shown.

[0060] As mentioned above, the embodiment of the utility model provides a display motherboard, which includes a circuit board and a metal heat dissipation component. In this embodiment, a copper-exposed area is set on the top signal layer of the circuit board, and the copper material of the copper-exposed area is connected to the grounding layer inside the circuit board, and the metal heat dissipation component is overlapped with the copper material of the copper-exposed area, so that a three-dimensional shielding effect is formed between the metal heat dissipation component and the grounding layer of the inner layer of the circuit board. The metal heat dissipation component is used as a local electromagnetic radiation shielding component, which can effectively suppress the electromagnetic radiation generated by the circuit board. In addition, the embodiment of the utility model also embeds the signal line of the bottom signal layer of the circuit board into the inside of the circuit board, and sets a bottom grounding layer on the side of the bottom signal layer of the circuit board that contacts the outside, so as to shield the circuit radiation generated by the bottom signal layer, effectively suppress the electromagnetic radiation generated by the bottom of the circuit board, and further reduce the electromagnetic radiation generated by the circuit board. In addition, in the embodiment of the utility model, by selecting a plastic shell, the weight of the display motherboard can also be reduced.

[0061] The embodiment of the utility model also provides a vehicle-mounted display screen, including a display screen and a display mainboard as described above, and the display screen is connected to the display mainboard, wherein the connection refers to an electrical connection. After the display mainboard is connected to the display screen, the display mainboard is used to drive the display screen to display images. As described above, the utility model forms a three-dimensional shielding effect between the metal heat dissipation component and the grounding layer of the inner layer of the circuit board by setting a copper-exposed area on the top signal layer of the circuit board, connecting the copper material of the copper-exposed area to the grounding layer inside the circuit board, and overlapping the metal heat dissipation component with the copper-exposed area. The metal heat dissipation component is used as a local electromagnetic radiation shielding component, which can effectively suppress the electromagnetic radiation generated by the circuit board. In addition, the embodiment of the utility model also embeds the signal line of the bottom signal layer of the circuit board into the inside of the circuit board, and sets a bottom grounding layer on the side of the bottom signal layer of the circuit board that contacts the outside, thereby shielding the circuit radiation generated by the bottom signal layer, effectively suppressing the electromagnetic radiation generated by the bottom of the circuit board, and further reducing the electromagnetic radiation generated by the circuit board. The embodiment of the utility model can effectively reduce the radiation generated by the circuit board in the display mainboard, and solves the technical problem that the display screen in the car in the prior art has large radiation interference.

[0062] The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only a specific embodiment of the utility model and is not intended to limit the protection scope of the utility model. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A display motherboard, comprising a circuit board and a metal heat dissipation component, characterized in that: The top signal layer of the circuit board is provided with a copper exposed area, the copper exposed area exposes the copper material of the top signal layer, the copper material is connected to the ground layer inside the circuit board, and the metal heat dissipation component is overlapped with the copper material; The signal line of the bottom signal layer of the circuit board is embedded in the circuit board, and a bottom ground layer is also provided on the side of the bottom signal layer of the circuit board that contacts the outside.

2. A display mainboard according to claim 1, characterized in that: Copper exposed areas are arranged around the top signal layer, and copper material in the copper exposed areas is connected to the ground layer inside the circuit board by punching holes at intervals of a first preset distance.

3. A display mainboard according to claim 2, characterized in that: The value range of the first preset distance is less than or equal to 3 mm.

4. A display mainboard according to claim 2, characterized in that: The copper material in the copper exposed area is provided with a tinning area at intervals of a second preset distance, and the copper material in the tinning area is coated with tin material.

5. A display mainboard according to claim 4, characterized in that: The value range of the second preset distance is less than or equal to 1.5 cm.

6. A display mainboard according to claim 4, characterized in that: The tinning area is a square with a preset area.

7. A display mainboard according to any one of claims 1 to 6, characterized in that: The metal heat dissipation component is an aluminum alloy heat dissipation component.

8. A display mainboard according to any one of claims 1 to 6, characterized in that: It also includes a plastic shell, in which the circuit board and the metal heat dissipation component are arranged.

9. A display mainboard according to any one of claims 1 to 6, characterized in that: The circuit board includes, from top to bottom, the top signal layer, the first ground layer, the internal signal layer, the power layer, the second ground layer, the bottom signal layer and the bottom ground layer; The copper material in the copper exposed area is connected to the first ground layer and the second ground layer through punching, and the signal line of the bottom signal layer is switched to the power layer through punching.

10. A vehicle-mounted display screen, characterized in that: It comprises a display screen and a display mainboard as claimed in any one of claims 1 to 9, wherein the display screen is connected to the display mainboard.

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