Thermocompression bonding device for preventing metal frame from being oxidized

Abstract

The utility model discloses a thermocompression bonding device for preventing oxidation of a metal frame, which is applied to the field of industrial preparation and comprises a pressing plate and a heating cushion block. A protruding cushion table is formed in the heating cushion block corresponding to the bonding processing area, and gas storage grooves are formed in the two sides of the protruding cushion table in the extending direction of the protruding cushion table. Protective gas inlet holes are formed in the gas storage groove and the surface of the convex cushion table; the pressing plate is provided with at least two sets of backflow holes, the backflow holes comprise at least one set of first backflow holes corresponding to the protective gas inlet holes in the gas storage groove and at least one set of second backflow holes far away from the protective gas inlet holes in the gas storage groove, and the first backflow holes are at least communicated with the corresponding second backflow holes. According to the utility model, the gas storage groove is formed in the heating cushion block, and the backflow hole is correspondingly formed in the pressing plate, so that the protective gas forms circulation between the backflow hole and the gas storage groove, the protective gas stays in the gas storage groove for a longer time, and the metal frame is prevented from being oxidized.

Description

Technical Field

[0001] The utility model relates to the field of industrial preparation, in particular to a hot pressing bonding device for preventing oxidation of a metal frame. Background Art

[0002] Taking the device for bonding bare copper frames as an example, when processing bare copper frames, it is necessary to place the bare copper frames between the heating pads and the pressing plate, use the heating pads set on the lower side of the bare copper frames to heat and bear the load, and use the pressing plate to act on the bare copper frames for processing. In order to prevent the bare copper frames from oxidizing at high temperatures, the existing hot pressing bonding devices need to set protective gas inlet holes in the processing areas corresponding to the heating pads and the pressing plates to pass protective gas to prevent the bare copper frames from oxidizing. However, the gas flow channel formed by the protective gas passed between the existing heating pads and the pressing plates flows directly out of the exhaust port, resulting in the oxidation of the frame due to the unstable introduction of the protective gas when the welding time of the frame is long, and when the introduction of the protective gas is interrupted, the frame will immediately oxidize. Utility Model Content

[0003] In view of this, the purpose of the utility model is to provide a hot pressing bonding device for preventing oxidation of a metal frame, thereby solving the problem in the prior art that oxidation of the metal frame occurs due to a brief interruption of the protective gas.

[0004] In order to solve the above technical problems, the utility model provides a hot pressing bonding device for preventing oxidation of a metal frame, comprising a pressing plate and a heating pad;

[0005] A raised pad is formed in the heating pad block corresponding to the bonding processing area, and gas storage grooves are formed on both sides of the raised pad along the extension direction of the raised pad;

[0006] The gas storage groove and the surface of the raised pad are both provided with protective gas inlet holes;

[0007] The pressure plate is provided with at least two groups of reflow holes, including at least one group of first reflow holes corresponding to the protective gas inlet holes in the gas storage groove, and at least one group of second reflow holes away from the protective gas inlet holes in the gas storage groove, and the first reflow holes are at least connected to the corresponding second reflow holes.

[0008] Optionally, the first reflow hole and the second reflow hole are both connected via a conducting area, and a baffle for changing the gas flow direction is provided on a side of the conducting area facing away from the reflow hole.

[0009] Optionally, the conductive area is conductively connected to the bonding wire window.

[0010] Optionally, the gas storage groove includes a plurality of independent gas storage sub-grooves arranged along the extension direction of the raised pad.

[0011] Optionally, a gas filling groove is provided on the surface of the heating pad;

[0012] The gas filling groove is respectively connected to the first protective gas inlet hole set on the surface of the raised pad and the second protective gas inlet hole set in the gas storage groove, so that the protective gas introduced through the first protective gas inlet hole fills the gas filling groove and flows into the gas storage groove.

[0013] Optionally, a plurality of groups of the second return holes are arranged in a direction away from the first return holes.

[0014] Optionally, a third protective gas inlet hole is provided in the surface of the pressing plate close to the heating pad, corresponding to the outer side away from the gas storage groove, so as to utilize the protective gas to isolate the air on the outer side away from the gas storage groove.

[0015] Optionally, the pressure plate includes a first protective gas inlet and a second protective gas inlet;

[0016] The first protective gas inlet is communicated with a third protective gas inlet hole located on one side of the raised pad, and the second protective gas inlet is communicated with a third protective gas inlet hole located on the other side of the raised pad.

[0017] Optionally, the heating pad includes a third protective gas inlet, a fourth protective gas inlet and a fifth protective gas inlet;

[0018] The third protective gas inlet is connected to the protective gas inlet hole located on one side of the raised pad, the fourth protective gas inlet is connected to the protective gas inlet hole located on the other side of the raised pad, and the fifth protective gas inlet is connected to the protective gas inlet hole located on the surface of the raised pad.

[0019] Optionally, the protective gas inlet holes are arranged along the extension direction of the raised pad.

[0020] It can be seen that the hot pressing bonding device for preventing the oxidation of the metal frame provided by the utility model includes a pressing plate and a heating pad; a raised pad is formed in the heating pad corresponding to the bonding processing area, and a gas storage groove is formed on both sides of the raised pad along the extension direction of the raised pad; protective gas inlet holes are provided in the gas storage groove and on the surface of the raised pad; the pressing plate is provided with at least two groups of reflow holes, including at least one group of first reflow holes corresponding to the protective gas inlet holes in the gas storage groove, and at least one group of second reflow holes away from the protective gas inlet holes in the gas storage groove, and the first reflow hole is at least connected to the corresponding second reflow hole. The utility model sets a gas storage groove in the heating pad and sets a corresponding reflow hole in the pressing plate, so that the protective gas forms a circulation between the reflow hole and the gas storage groove, thereby enabling the protective gas to stay in the gas storage groove for a longer time, forming protection in the area where the metal frame is processed, and avoiding oxidation of the metal frame due to a short interruption of the protective gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of a thermal compression bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model;

[0023] Figure 2 A schematic diagram of the structure of another heating pad in a thermal compression bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model;

[0024] Figure 3 A schematic structural diagram of another pressing plate in a hot pressing bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model;

[0025] Figure 4 A schematic structural diagram of another pressing plate in a hot-pressing bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model;

[0026] Figure 5 A schematic diagram of a side cross-sectional structure of a pressing plate in a hot pressing bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model;

[0027] Figure 6 A schematic diagram of a side cross-sectional structure of another pressing plate in a hot pressing bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model;

[0028] Figure 7 A schematic diagram of the structure of another heating pad in the thermal compression bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model;

[0029] Figures 1 to 7 In the figure, the reference numerals are described as follows:

[0030] 10-pressing plate, 101-conducting area, 102-baffle, 11-first reflow hole, 12-second reflow hole, 13-third protective gas inlet hole, 14-welding wire window;

[0031] 20 - heating pad, 21 - raised pad, 22 - gas storage groove, 221 - independent gas storage sub-groove, 23 - protective gas inlet hole, 24 - gas filling tank. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] Embodiment 1:

[0034] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of a hot pressing bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model. The device may include a pressing plate 10 and a heating pad 20;

[0035] A raised pad 21 is formed in the heating pad block 20 corresponding to the bonding processing area, and a gas storage groove 22 is formed on both sides of the raised pad 21 along the extension direction of the raised pad 21;

[0036] Protective gas inlet holes 23 are provided in the gas storage groove 22 and on the surface of the raised pad 21;

[0037] The pressing plate 10 is provided with at least two groups of reflow holes, including at least one group of first reflow holes 11 corresponding to the protective gas inlet holes 23 in the gas storage groove 22, and at least one group of second reflow holes 12 away from the protective gas inlet holes 23 in the gas storage groove 22. The first reflow holes 11 are at least connected to the corresponding second reflow holes 12.

[0038] In this embodiment, when processing the metal frame, it is necessary to attach Figure 1The middle pressure plate 10 and the heating pad 20 are buckled together. Compared with the existing structure, the hot pressing key and device in this embodiment have gas storage grooves 22 formed on both sides of the raised pad 21 along the extension direction of the raised pad 21. The pressure plate 10 is provided with at least two groups of reflow holes in the area corresponding to the gas storage groove 22, so that the protective gas in the gas storage groove 22 enters the above-mentioned first reflow hole 11 and flows out through the second reflow hole 12, so as to form a protective gas circulation in the gas storage groove 22 through the above-mentioned reflow holes, thereby increasing the residence time of the protective gas in the gas storage groove 22, thereby ensuring that oxidation is not easy to occur when processing the metal frame. It should be noted that in this embodiment, gas storage grooves 22 are formed on both sides of the raised pad 21 to prevent oxidation in the metal frame processing area, and only setting the gas storage groove 22 on one side of the raised pad 21 can also reduce the risk of oxidation of the metal frame relative to the existing structure, but the effect is poor. Therefore, the scheme actually included in this embodiment is that a raised pad 21 is formed in the heating pad 20 corresponding to the bonding processing area, and a gas storage groove 22 is formed on at least one side of the raised pad 21 along the extension direction of the raised pad 21. In addition, in this embodiment, protective gas inlet holes 23 are provided on the surfaces of the gas storage groove 22 and the raised pad 21 to respectively introduce protective gas into the gas storage groove 22 and the surface of the raised pad 21. In this embodiment, the specific flow direction of the protective gas introduced through the protective gas inlet hole 23 is not limited, as long as a protective gas flow field can be formed in the metal frame processing area, the metal frame surface is isolated from oxygen by the protective gas during the hot pressing bonding process, and the metal frame is prevented from oxidation. For example, the protective gas introduced into the gas storage groove 22 can enter the surface of the raised pad 21 and be discharged through the welding line window 14 in the pressing plate 10 corresponding to the metal frame processing area, so as to form a stable protective gas flow field on the surface of the metal frame, or at least part of the protective gas introduced into the surface of the raised pad 21 can enter the gas storage groove 22 and be discharged through the welding line window 14 in the pressing plate 10 through the protective gas outflow channel. In addition, it should be noted that the specific manner in which the protective gas in the gas storage groove 22 flows into the first reflow hole 11 and flows back into the gas storage groove 22 through the second reflow hole 12 is not limited in this embodiment, as long as the flow direction of the protective gas entering the first reflow hole 11 can be reversed and flows back to the gas storage groove 22 through the second reflow hole 12.

[0039] In this embodiment, the first reflow hole 11 is arranged corresponding to the protective gas inlet hole 23 in the gas storage groove 22 , and the second reflow hole 12 can be arranged corresponding to the side of the first reflow hole 11 away from the raised pad 21 .

[0040] Furthermore, in order to ensure that the gas storage grooves 22 in different areas do not affect each other, it is possible to refer to Figure 2 , Figure 2A schematic diagram of another heating pad structure in a heat-compression bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model. The gas storage groove 22 may include a plurality of independent gas storage sub-grooves 221 arranged along the extension direction of the raised pad 21 .

[0041] It should be noted that in the present embodiment, the air storage groove 22 is configured to include a plurality of air storage sub-grooves, so that the air storage grooves 22 in different areas can be independent of each other. When the air storage sub-groove located on one side of the raised pad 21 is damaged, it will not affect the overall air storage groove 22. The present embodiment does not limit the specific number of air storage sub-grooves that are set. For example, two air storage sub-grooves may be set on a single side of the raised pad 21, or three air storage sub-grooves may be set on a single side of the raised pad 21. Furthermore, in the present embodiment, the number of air storage sub-grooves may be set according to the extended length of the raised pad 21. For example, the longer the extended length of the raised pad 21, the more air storage sub-grooves may be set.

[0042] Further, in order to ensure the uniformity of the protective gas flowing back into the gas storage groove 22 through the second reflow hole 12, it can be referred to Figure 3 , Figure 3 A schematic diagram of another type of pressure plate in a hot-press bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model. A plurality of groups of second return holes 12 may be arranged in a direction away from the first return holes 11 .

[0043] It should be noted that, in this embodiment, by setting a plurality of groups of second reflow holes 12 on the side of the first reflow hole 11 away from the raised pad 21, the refluxed protective gas can be discharged into the gas storage groove 22 at multiple positions, thereby improving the uniformity of the protective gas in the gas storage groove 22 and avoiding the protective gas from being concentrated in a certain area of ​​the gas storage groove 22. This embodiment does not limit the specific manner of setting the second reflow holes 12. For example, two groups of second reflow holes 12 may be set, and each group of second reflow holes 12 is arranged in a straight line along the extension direction of the raised pad 21, or three groups of second reflow holes 12 may be set, and each group of second reflow holes 12 is arranged in a straight line along the extension direction of the raised pad 21.

[0044] Furthermore, in order to further improve the airtightness of the metal frame processing area formed by the protective gas and avoid oxidation of the metal frame during processing, you can refer to Figure 4 , Figure 4 A schematic diagram of the structure of another pressing plate in the hot pressing bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model. A third protective gas inlet hole 13 can be provided on the surface of the pressing plate 10 close to the heating pad 20, corresponding to the outer side away from the gas storage groove 22, so as to isolate the air with the protective gas on the outer side away from the gas storage groove 22.

[0045] It should be noted that in this embodiment, the pressing plate 10 is placed against the surface of the heating pad 20, and a third protective gas inlet hole 13 is arranged on the outer side away from the gas storage groove 22, so as to form an additional protective gas isolation flow field on the outer side of the protective gas circulation formed in the gas storage groove 22, thereby further avoiding oxidation of the metal frame during processing and improving product yield.

[0046] Furthermore, in order to ensure uniformity of the protective gas introduced into both sides of the raised pad 21 in the pressing plate 10 and improve the airtightness of the gas flow field formed by the protective gas on both sides, the pressing plate 10 includes a first protective gas inlet and a second protective gas inlet;

[0047] The first protective gas inlet is communicated with the third protective gas inlet hole 13 located on one side of the raised support 21 , and the second protective gas inlet is communicated with the third protective gas inlet hole 13 located on the other side of the raised support 21 .

[0048] In the present embodiment, the protective gas inlet holes 23 located on both sides of the raised pad 21 in the pressing plate 10 are arranged to be connected to different protective gas inlets, that is, the protective gas is introduced through different protective gas inlets, thereby ensuring the uniformity and sufficiency of the protective gas introduced on both sides of the raised pad 21 in the pressing plate 10, and further avoiding the risk of oxidation when the metal frame is heated.

[0049] Furthermore, in order to further ensure the sufficiency and uniformity of the protective gas introduced into the protective gas inlet holes 23 of the raised pad 21 and the gas storage groove 22, and to avoid insufficient introduction of the protective gas into the heating pad 20, the heating pad 20 may include a third protective gas inlet, a fourth protective gas inlet and a fifth protective gas inlet;

[0050] The third protective gas inlet is connected to the protective gas inlet hole 23 located on one side of the raised pad 21, the fourth protective gas inlet is connected to the protective gas inlet hole 23 located on the other side of the raised pad 21, and the fifth protective gas inlet is connected to the protective gas inlet hole 23 located on the surface of the raised pad 21.

[0051] It should be noted that, in this embodiment, the protective gas inlet hole 23 located on the surface of the raised pad 21 in the heating pad, the protective gas inlet hole 23 located on one side of the raised pad 21, and the protective gas inlet hole 23 located on the other side of the raised pad 21 are respectively connected to the corresponding protective gas inlets, which can ensure the uniformity and sufficiency of the protective gas introduced through the protective gas inlet.

[0052] Furthermore, in order to ensure that the protective gas introduced through the protective gas inlet holes 23 can protect the metal frame processing area at the raised pad 21 , the protective gas inlet holes 23 can be arranged along the extension direction of the raised pad 21 .

[0053] It should be noted that in this embodiment, the protective gas inlet holes 23 are arranged along the extension direction of the raised pad 21, which can form complete protection for the metal frame processing area at the raised pad 21, and improve the effective utilization rate of the protective gas introduced through the protective gas inlet holes 23. This embodiment does not limit the specific number of protective gas inlet holes 23 arranged along the extension direction of the raised pad 21, and can be set according to the length of the raised pad 21 along the extension direction. Accordingly, this embodiment does not limit the specific number of protective gas inlet holes 23 arranged along the extension direction of the raised pad 21, as long as the protective gas flow field formed can form isolation protection for the metal frame processing area.

[0054] A hot pressing bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model comprises a pressing plate 10 and a heating pad 20; a raised pad 21 is formed in the heating pad 20 corresponding to the bonding processing area, and a gas storage groove 22 is formed on both sides of the raised pad 21 along the extension direction of the raised pad 21; protective gas inlet holes 23 are provided in the gas storage groove 22 and on the surface of the raised pad 21; the pressing plate 10 is provided with at least two groups of reflow holes, including at least one group of first reflow holes 11 corresponding to the protective gas inlet holes 23 in the gas storage groove 22, and at least one group of second reflow holes 12 away from the protective gas inlet holes 23 in the gas storage groove 22, and the first reflow holes 11 are at least connected to the corresponding second reflow holes 12. The utility model sets a gas storage groove 22 in the heating pad 20 and a corresponding reflux hole in the pressing plate 10, so that the protective gas forms a circulation between the reflux hole and the gas storage groove 22, thereby enabling the protective gas to stay in the gas storage groove 22 for a longer time, thereby forming protection in the area where the metal frame is processed, and avoiding oxidation of the metal frame due to a brief interruption of the protective gas.

[0055] In addition, the embodiment of the utility model can make the gas storage grooves 22 in different areas independent of each other by configuring the gas storage groove 22 to include multiple gas storage sub-grooves. When the gas storage sub-groove on the side of the raised pad 21 is damaged, it will not affect the entire gas storage groove 22. By configuring multiple groups of second reflow holes 12 on the side of the first reflow hole 11 away from the raised pad 21, the refluxed protective gas can be discharged into the gas storage groove 22 at multiple positions, thereby improving the uniformity of the protective gas in the gas storage groove 22 and avoiding the protective gas from being concentrated in a part of the gas storage groove 22. The pressing plate 10 is placed against the surface of the heating pad 20, and a third protective gas inlet hole 13 is arranged on the outer side away from the gas storage groove 22, so as to further avoid oxidation of the metal frame during processing and improve the product yield. The shielding gas inlet holes 23 on both sides of the raised pad 21 are arranged to be connected to different shielding gas inlets, which can ensure the uniformity and sufficiency of the shielding gas introduced into the pressure plate 10 on both sides of the raised pad 21; the shielding gas inlet holes 23 on the surface of the raised pad 21 in the heating pad, the shielding gas inlet holes 23 on one side of the raised pad 21, and the shielding gas inlet holes 23 on the other side of the raised pad 21 are respectively connected to the corresponding shielding gas inlets, which can ensure the uniformity and sufficiency of the shielding gas introduced through the shielding gas inlet; the shielding gas inlet holes 23 are arranged along the extension direction of the raised pad 21, which can form a complete protection for the metal frame processing area at the raised pad 21, and improve the effective utilization rate of the shielding gas introduced through the shielding gas inlet holes 23.

[0056] Embodiment 2:

[0057] Please refer to Figure 5 , Figure 5 A schematic diagram of a side cross-sectional structure of a pressing plate in a hot pressing bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model. The device may include a pressing plate 10 and a heating pad;

[0058] A raised pad is formed in the heating pad block corresponding to the bonding processing area, and gas storage grooves are formed on both sides of the raised pad along the extension direction of the raised pad;

[0059] Protective gas inlet holes are provided in the gas storage groove and on the surface of the raised pad;

[0060] The pressing plate 10 is provided with at least two groups of reflux holes, including at least one group of first reflux holes 11 corresponding to the protective gas inlet holes in the gas storage groove, and at least one group of second reflux holes 12 away from the protective gas inlet holes in the gas storage groove, and the first reflux holes 11 are at least connected to the corresponding second reflux holes 12;

[0061] The first reflow hole 11 and the second reflow hole 12 are both connected through a conducting area 101 , and a baffle 102 for changing the gas flow direction is provided on a side of the conducting area 101 facing away from the reflow hole.

[0062] It should be noted that in this embodiment, the first reflow hole 11 and the second reflow hole 12 are both arranged to be connected through the conduction area 101, and a baffle 102 is arranged on the side of the conduction area 101 facing away from the first reflow hole 11 and the second reflow hole 12, and the baffle 102 is used to limit and change the flow direction of the protective gas so that the protective gas can flow back to the gas storage groove through the second reflow hole 12. This embodiment does not limit the specific shape of the baffle 102, as long as the protective gas that enters the conduction area 101 through the first reflow hole 11 can flow back to the gas storage groove through the second reflow hole 12. For example, the baffle 102 can be set to an arc surface to guide the protective gas to flow to the second reflow hole 12, or the baffle 102 can be set to other shapes.

[0063] Further, in order to improve the isolation and anti-oxidation protection effect of the protective gas on the metal frame processing area, you can refer to Figure 6 , Figure 6 The conductive area 101 can be arranged to be conductive with the wire bonding window 14 .

[0064] It should be noted that, in the present embodiment, the conductive area 101 is configured to be conductive with the welding wire window 14, so that part of the protective gas entering the conductive area 101 through the first reflow hole 11 can enter the welding wire window 14 and be conductive by the welding wire window 14. On the one hand, oxygen is prevented from entering through the welding wire window 14. On the other hand, the protective gas entering the welding wire window 14 through the conductive area 101 forms a protective gas flow field on the surface of the metal frame processing area, which has an isolation effect on oxygen, and further reduces the risk of oxidation of the metal frame during processing.

[0065] A hot pressing bonding device for preventing oxidation of a metal frame provided by an embodiment of the utility model comprises a pressing plate 10 and a heating pad; a raised pad is formed in the heating pad corresponding to the bonding processing area, and a gas storage groove is formed on both sides of the raised pad along the extension direction of the raised pad; protective gas inlet holes are provided in the gas storage groove and on the surface of the raised pad; the pressing plate 10 is provided with at least two groups of reflow holes, including at least one group of first reflow holes 11 corresponding to the protective gas inlet holes in the gas storage groove, and at least one group of second reflow holes 12 away from the protective gas inlet holes in the gas storage groove, the first reflow hole 11 is at least connected to the corresponding second reflow hole 12, the first reflow hole 11 and the second reflow hole 12 are both connected through a conducting area 101, and a baffle 102 for changing the gas flow direction is provided on the side of the conducting area 101 facing away from the reflow hole. The utility model sets a gas storage groove in the heating pad block and sets a corresponding reflow hole in the pressing plate 10, so that the protective gas forms a circulation between the reflow hole and the gas storage groove, so that the protective gas can stay in the gas storage groove for a longer time, and form protection in the area where the metal frame is processed, so as to avoid oxidation of the metal frame due to a brief interruption of the protective gas. The first reflow hole 11 and the second reflow hole 12 are both set to be connected through the conduction area 101, and a baffle 102 is set on the side of the conduction area 101 facing away from the first reflow hole 11 and the second reflow hole 12. The baffle 102 limits and changes the flow direction of the protective gas so that the protective gas can flow back to the gas storage groove through the second reflow hole 12, thereby improving the simplicity of the device.

[0066] Embodiment 3:

[0067] Please refer to Figure 7 , Figure 7 A schematic diagram of the structure of another heating pad in the thermal compression bonding device for preventing oxidation of a metal frame provided in an embodiment of the utility model. The device may include a pressing plate and a heating pad 20;

[0068] A raised pad 21 is formed in the heating pad block 20 corresponding to the bonding processing area, and a gas storage groove 22 is formed on both sides of the raised pad 21 along the extension direction of the raised pad 21;

[0069] Protective gas inlet holes 23 are provided in the gas storage groove 22 and on the surface of the raised pad 21;

[0070] The pressing plate is provided with at least two groups of reflux holes, including at least one group of first reflux holes corresponding to the protective gas inlet holes 23 in the gas storage groove 22, and at least one group of second reflux holes away from the protective gas inlet holes 23 in the gas storage groove 22, and the first reflux holes are at least connected to the corresponding second reflux holes;

[0071] A gas filling groove 24 is provided on the surface of the heating pad block 20; the gas filling groove 24 is respectively connected with the first protective gas inlet hole 23 provided on the surface of the raised pad 21 and the second protective gas inlet hole 23 provided in the gas storage groove 22, so that the protective gas introduced through the first protective gas inlet hole 23 can fill the gas filling groove 24 and flow into the gas storage groove 22.

[0072] It should be noted that in this embodiment, a gas filling groove 24 is provided on the surface of the raised pad 21, so that the protective gas introduced through the first protective gas inlet hole 23 can fill the gas filling groove 24 and flow into the gas storage groove 22 along the gas filling groove 24, thereby ensuring the unidirectionality and stability of the protective gas flow field on the surface of the metal frame processing area and improving the isolation effect of the protective gas against oxygen.

[0073] The hot pressing bonding device for preventing oxidation of a metal frame provided by the embodiment of the utility model comprises a pressing plate and a heating pad 20; a raised pad 21 is formed in the heating pad 20 corresponding to the bonding processing area, and a gas storage groove 22 is formed on both sides of the raised pad 21 along the extension direction of the raised pad 21; a protective gas inlet hole 23 is provided in the gas storage groove 22 and on the surface of the raised pad 21; the pressing plate is provided with at least two groups of reflux holes, including at least one group of the first group of the second ... A reflow hole, and at least one group of second reflow holes away from the protective gas inlet hole 23 in the gas storage groove 22, the first reflow hole is at least connected to the corresponding second reflow hole, a gas filling groove 24 is arranged on the surface of the heating pad 20, and the gas filling groove 24 is respectively connected to the first protective gas inlet hole 23 arranged on the surface of the raised pad 21 and the second protective gas inlet hole 23 arranged in the gas storage groove 22, so that the protective gas introduced from the first protective gas inlet hole 23 fills the gas filling groove 24 and flows into the gas storage groove 22. The utility model sets a gas storage groove 22 in the heating pad block 20 and correspondingly sets a reflow hole in the pressure plate, so that the protective gas forms a circulation between the reflow hole and the gas storage groove 22, so that the protective gas can stay in the gas storage groove 22 for a longer time, thereby forming protection in the area where the metal frame is processed, and avoiding oxidation of the metal frame due to a brief interruption of the protective gas. By setting a gas filling groove 24 on the surface of the raised pad 21, the protective gas introduced through the first protective gas inlet hole 23 can fill the gas filling groove 24 and flow into the gas storage groove 22 along the gas filling groove 24, thereby ensuring the unidirectionality and stability of the protective gas flow field at the surface of the metal frame processing area and improving the isolation effect of the protective gas on oxygen.

[0074] The thermal compression bonding device for preventing oxidation of a metal frame provided by the utility model may specifically include the following structures:

[0075] A pressing plate and a heating pad, wherein a raised pad is formed in the heating pad corresponding to the bonding processing area, and gas storage grooves are formed on both sides of the raised pad along the extension direction of the raised pad;

[0076] Protective gas inlet holes are provided in the gas storage groove and on the surface of the raised pad; the gas storage groove includes a plurality of independent gas storage sub-grooves arranged along the extension direction of the raised pad;

[0077] The pressing plate is provided with at least two groups of reflow holes, including at least one group of first reflow holes corresponding to the protective gas inlet holes in the gas storage groove, and at least one group of second reflow holes away from the protective gas inlet holes in the gas storage groove, the first reflow holes are at least connected to the corresponding second reflow holes; the first reflow holes and the second reflow holes are both connected through a conducting area, and a baffle for changing the gas flow direction is provided on the side of the conducting area facing away from the reflow holes; the conducting area is connected to the welding wire window; and multiple groups of second reflow holes are provided in a direction away from the first reflow holes;

[0078] A gas filling groove is provided on the surface of the heating pad block, and the gas filling groove is respectively connected with a first protective gas inlet hole provided on the surface of the raised pad and a second protective gas inlet hole provided in the gas storage groove, so that the protective gas introduced into the first protective gas inlet hole fills the gas filling groove and flows into the gas storage groove;

[0079] A third protective gas inlet hole is provided on the surface of the pressing plate close to the heating pad block, corresponding to the outer side away from the gas storage groove, so as to isolate the air by using the protective gas on the outer side away from the gas storage groove; the pressing plate includes a first protective gas inlet and a second protective gas inlet, the first protective gas inlet is connected to the third protective gas inlet hole located on one side of the raised pad, and the second protective gas inlet is connected to the third protective gas inlet hole located on the other side of the raised pad;

[0080] The heating pad block includes a third protective gas inlet, a fourth protective gas inlet and a fifth protective gas inlet, the third protective gas inlet is connected to the protective gas inlet hole located on one side of the raised pad, the fourth protective gas inlet is connected to the protective gas inlet hole located on the other side of the raised pad, and the fifth protective gas inlet is connected to the protective gas inlet hole located on the surface of the raised pad;

[0081] The protective gas inlet holes are arranged along the extension direction of the raised pad.

[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0083] In addition, it should be noted that, in this article, relationships such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variants are intended to cover non-exclusive inclusions.

[0084] The above is a detailed introduction to a hot pressing bonding device for preventing metal frame oxidation provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the structure and core idea of ​​the utility model; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A thermal compression bonding device for preventing oxidation of a metal frame, characterized in that: Includes a press plate and a heating pad; A raised pad is formed in the heating pad block corresponding to the bonding processing area, and gas storage grooves are formed on both sides of the raised pad along the extension direction of the raised pad; The gas storage groove and the surface of the raised pad are both provided with protective gas inlet holes; The pressure plate is provided with at least two groups of reflow holes, including at least one group of first reflow holes corresponding to the protective gas inlet holes in the gas storage groove, and at least one group of second reflow holes away from the protective gas inlet holes in the gas storage groove, and the first reflow holes are at least connected to the corresponding second reflow holes.

2. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 1, characterized in that: The first reflow hole and the second reflow hole are both connected via a conducting area, and a baffle for changing the gas flow direction is arranged on a side of the conducting area facing away from the reflow hole.

3. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 2, characterized in that: The conducting area is in conduction with the wire bonding window.

4. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 1, characterized in that: The gas storage groove includes a plurality of independent gas storage sub-grooves arranged along the extension direction of the raised pad.

5. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 1, characterized in that: The surface of the heating pad block is provided with a gas filling groove; The gas filling groove is respectively connected to the first protective gas inlet hole set on the surface of the raised pad and the second protective gas inlet hole set in the gas storage groove, so that the protective gas introduced through the first protective gas inlet hole fills the gas filling groove and flows into the gas storage groove.

6. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 1, characterized in that: A plurality of groups of the second return holes are arranged in a direction away from the first return holes.

7. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 1, characterized in that: A third protective gas inlet hole is provided on the surface of the pressing plate close to the heating pad, corresponding to the outer side away from the gas storage groove, so as to use the protective gas to isolate the air on the outer side away from the gas storage groove.

8. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 7, characterized in that: The pressure plate includes a first shielding gas inlet and a second shielding gas inlet; The first protective gas inlet is communicated with a third protective gas inlet hole located on one side of the raised pad, and the second protective gas inlet is communicated with a third protective gas inlet hole located on the other side of the raised pad.

9. The thermal compression bonding device for preventing oxidation of a metal frame according to claim 1, characterized in that: The heating pad block comprises a third protective gas inlet, a fourth protective gas inlet and a fifth protective gas inlet; The third protective gas inlet is connected to the protective gas inlet hole located on one side of the raised pad, the fourth protective gas inlet is connected to the protective gas inlet hole located on the other side of the raised pad, and the fifth protective gas inlet is connected to the protective gas inlet hole located on the surface of the raised pad.

10. The thermal compression bonding device for preventing oxidation of a metal frame according to any one of claims 1 to 9, characterized in that: The protective gas inlet holes are arranged along the extension direction of the raised pad.

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