Waste recycling mechanism for semiconductor auxiliary materials

Abstract

The utility model discloses a semiconductor auxiliary material waste recovery mechanism comprising a recovery box used for recovering waste; the waste recycling device further comprises a feeding module which is located at the top of the recycling box and conveys waste into the recycling box. The detection module is connected with the feeding module and used for detecting the quantity of the waste materials conveyed into the recycling box through the feeding module; and the indicating module is connected with the feeding module and used for indicating whether the waste materials can be fed into the feeding module or not. The intelligent feeding system has the advantages that the problem that conventional feeding is not intelligent is solved, waste recycling management can be intelligently carried out, and intelligent and complicated intelligent warehouse management is facilitated; 2, the structure is mainly a mechanical structure, the structure is stable, the cost is low, the operation cost is low, and the reliability is high; and 3, the whole structure adopts a modular design, and has higher universality and expansibility.

Description

Technical Field

[0001] The utility model relates to the technical fields of semiconductor equipment and intelligent storage, and in particular to a waste recycling mechanism for semiconductor auxiliary materials. Background Art

[0002] The application scale of intelligence and automation in the semiconductor industry is getting bigger and bigger, and the demand accounts for an increasing proportion. The management of the life cycle of semiconductor processing consumables and intelligent storage equipment have begun to enter major packaging manufacturers. All kinds of consumables need to be managed reasonably and meticulously. Among them, the most demanded is the intelligent equipment for the management of various auxiliary materials.

[0003] Semiconductor intelligent storage equipment replaces manual work for the loading, storage, delivery, recycling, and life cycle management of production consumables. It can monitor and manage single and multiple logistics, liberate productivity, and improve the quality and efficiency of the entire material management.

[0004] In warehouse management, there is a need for a waste consumables recycling function. During the recycling process, statistical records must be kept and the safety of operators must be guaranteed. Therefore, a waste recycling mechanism for semiconductor auxiliary materials is designed. Summary of the invention

[0005] According to an embodiment of the utility model, a waste recycling mechanism for semiconductor auxiliary materials is provided, comprising: a recycling box for recycling waste materials; and further comprising:

[0006] A feeding module is located on the top of the recycling box to transport the waste into the recycling box;

[0007] A detection module, which is connected to the feeding module and is used to detect the amount of waste materials transported to the recycling box by the feeding module;

[0008] The indicating module is connected to the feeding module and is used to indicate whether waste can be fed into the feeding module.

[0009] Furthermore, the feeding module includes:

[0010] Mounting seat;

[0011] A mounting plate, the mounting plate is arranged on the top of the mounting seat;

[0012] A feeding pipe, the feeding pipe is arranged on the mounting plate with an adjustable angle, and the discharge end of the feeding pipe is located at the top of the recovery box;

[0013] The control component is connected to the mounting seat and is used to adjust the on-off of the feeding pipe and control the feeding state of the feeding pipe.

[0014] Furthermore, the control component comprises:

[0015] Control port, the control port is opened at the top of the feeding pipe;

[0016] A driver is connected to the mounting base and provides a driving force for lifting;

[0017] The control ring is sleeved on the feeding pipe, the bottom of the control ring is connected to the driver, and a protrusion is arranged on the inner wall of the top of the control ring, and the protrusion is arranged opposite to the control port.

[0018] Furthermore, the control assembly also includes: a pair of slideways, the pair of slideways are arranged on both sides of one end of the mounting plate, and both sides of the control ring are slidably connected in the pair of slideways respectively.

[0019] Furthermore, the mounting plate is a U-shaped structure, and a reinforcing rib is connected to the top of the mounting plate.

[0020] Furthermore, the feeding module also includes:

[0021] Two rotation holes, the two rotation holes are opened on opposite sides of the mounting plate;

[0022] Two arc-shaped holes, the two arc-shaped holes are opened on opposite surfaces of the mounting plate;

[0023] The adjustment seat is arranged on the mounting plate through two rotating holes and two arc holes on both sides of the adjustment seat so that the angle can be adjusted;

[0024] The clamp locks the feeding pipe on the adjusting seat.

[0025] Furthermore, the detection module includes:

[0026] A sensor mounting frame, the sensor mounting frame is connected to the feeding module;

[0027] The optical fiber sensor is arranged on the sensor mounting frame and is used to detect the amount of waste materials transported to the recycling box through the feeding module.

[0028] Furthermore, the top of the discharge section of the feeding pipe is a hollow structure and is directly opposite to the detection end of the optical fiber sensor.

[0029] Further, the instruction module comprises:

[0030] A lamp rack, which is connected to the feeding module;

[0031] The indicator light is connected to the light bracket and is used to indicate whether waste can be fed into the feeding module.

[0032] A waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model has the following beneficial effects:

[0033] 1. Solve the problem of conventional unintelligent feeding, and be able to intelligently manage waste recycling, which is conducive to intelligent and complex intelligent warehousing management.

[0034] 2. The structure is mainly mechanical structure, with stable structure, low cost, low operating cost and high reliability.

[0035] 3. The entire structure is modular in design and has high versatility and expandability.

[0036] 4. The on-off control of the feeding pipe is designed to greatly improve the installation of the equipment feeding and effectively protect the safety of on-site workers.

[0037] 5. Clear reminder logic improves the convenience of waste recycling.

[0038] 6. The position of the feeding pipe can be fine-tuned, which effectively reduces the assembly difficulties caused by processing stress and the shorter life caused by incomplete stress release.

[0039] 7. Modular split design, low maintenance cost in the later stage.

[0040] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a three-dimensional structural schematic diagram of a waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model.

[0042] Figure 2 The figure is a schematic diagram of the explosion structure of a waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model.

[0043] Figure 3 The present invention is a schematic structural diagram of a feeding module of a waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the present invention.

[0044] Figure 4 The figure is a schematic diagram of the explosion structure of a feeding module of a waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model. DETAILED DESCRIPTION

[0045] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings to further illustrate the present invention.

[0046] First, combine Figures 1 to 4 A waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model is described, which is used for recycling waste materials and is suitable for the recycling management of auxiliary materials such as splitters, tungsten steel needles, die heads, silver glue, etc., and has a wide range of application scenarios.

[0047] like Figures 1 to 4As shown, a waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model comprises a recycling box 1 for recycling waste materials, a feeding module, a detection module and an indication module.

[0048] Specifically, if Figures 1 to 4 As shown, the feeding module is located at the top of the recycling box 1, and the waste is transported into the recycling box 1. The feeding module includes: a mounting seat 21, a mounting plate 22, a feeding pipe 23 and a control component. The mounting plate 22 is arranged on the top of the mounting seat 21; the feeding pipe 23 is arranged on the mounting plate 22 with an adjustable angle, and the discharge end of the feeding pipe 23 is located at the top of the recycling box 1, and the waste is put into the feeding end of the feeding pipe 23 and discharged from the discharge end; the control component is connected to the mounting seat 21, and is used to adjust the on-off of the feeding pipe 23 and control the feeding state of the feeding pipe 23 (that is, the feeding state or the non-feeding state). In this embodiment, the inner wall of the feeding pipe 23 is smooth, and it plays a role in assisting the waste to fall during the sliding process of the waste.

[0049] Further, if Figures 1 to 4 As shown, the control assembly includes: a control port 241, a driver 242 and a control ring 243. The control port 241 is opened at the top of the feeding pipe 23; the driver 242 is connected to the mounting seat 21 to provide a driving force for lifting and lowering, and the driver 242 can be a cylinder; the control ring 243 is sleeved on the feeding pipe 23, the bottom of the control ring 243 is connected to the driver 242, and a protrusion 2431 is provided on the inner wall of the top of the control ring 243, and the protrusion 2431 is arranged opposite to the control port 241. The driver 242 drives the control ring 243 to rise and fall, so that the protrusion 2431 is inserted or pulled out of the control port 241 to control the on and off of the feeding pipe 23.

[0050] Further, if Figures 1 to 4 As shown, the control component also includes: a pair of slideways 244, which are arranged on both sides of one end of the mounting plate 22, and the two sides of the control ring 243 are respectively slidably connected in the pair of slideways 244 to guide the lifting movement of the control ring 243 to ensure stable operation.

[0051] Further, if Figures 1 to 4 As shown, the mounting plate 22 is a U-shaped structure, and a reinforcing rib 245 is connected to the top of the mounting plate 22 to control the gap between a pair of slideways 244 to ensure the guiding effect.

[0052] Further, if Figures 1 to 4As shown, the feeding module also includes: two rotating holes 25, two arc holes 26, an adjustment seat 27 and a hoop 28. The two rotating holes 25 are provided on opposite sides of the mounting plate 22; the two arc holes 26 are provided on opposite sides of the mounting plate 22; the two sides of the adjustment seat 27 are arranged on the mounting plate 22 with adjustable angles through the two rotating holes 25 and the two arc holes 26; the hoop 28 locks the feeding pipe 23 on the adjustment seat 27. The feeding pipe 23 is adjustable in angle, which can absorb installation errors.

[0053] Specifically, Figure 1~2 As shown, the detection module is connected to the feeding module, and is used to detect the amount of waste materials transported to the recycling box 1 by the feeding module. The detection module includes: a sensor mounting frame 31 and an optical fiber sensor 32. The sensor mounting frame 31 is connected to the feeding module; the optical fiber sensor 32 is arranged on the sensor mounting frame 31, and is used to detect the amount of waste materials transported to the recycling box 1 by the feeding module, so as to realize the statistics of the amount of waste materials, without the need for manual statistics, and avoid errors.

[0054] Furthermore, the top of the discharge section of the feeding pipe 23 is a hollow structure and is directly opposite to the detection end of the optical fiber sensor 32 , so that the optical fiber sensor 32 can detect the waste material recovered and transported by the feeding pipe 23 .

[0055] Specifically, Figure 1~2 As shown, the indication module is connected to the feeding module and is used to indicate whether waste can be fed into the feeding module. The indication module includes: a lamp holder 41 and an indicator light 42. The lamp holder 41 is connected to the feeding module; the indicator light 42 is connected to the lamp holder 41 and is used to indicate whether waste can be fed into the feeding module.

[0056] Working principle:

[0057] The waste recycling mechanism is fixed to the external equipment. When waste needs to be collected, the driver 242 drives the control ring 243 to move upward, so that the protrusion 2431 on the control ring 243 is separated from the control port 241. The driver 242 sends a message, and the indicator light 42 lights up to indicate that the material can be fed, reminding the operator to feed the waste. The waste is affected by gravity and enters the feeding end of the feeding pipe 23 and is discharged into the recycling box 1 from the discharging end. The optical fiber sensor 32 monitors in real time and counts the amount of waste. When the waste counted by the optical fiber sensor 32 reaches a certain amount, the indicator light 42 at the feeding place turns red to remind the operator to clean the waste recycling box 1.

[0058] Above, refer to Figures 1 to 4 A waste recycling mechanism for semiconductor auxiliary materials according to an embodiment of the utility model is described, which has the following beneficial effects:

[0059] 1. Solve the problem of conventional unintelligent feeding, and be able to intelligently manage waste recycling, which is conducive to intelligent and complex intelligent warehousing management.

[0060] 2. The structure is mainly mechanical structure, with stable structure, low cost, low operating cost and high reliability.

[0061] 3. The entire structure is modular in design and has high versatility and expandability.

[0062] 4. The on-off control of the feeding pipe 23 is designed to greatly improve the installation of the equipment feeding and effectively protect the safety of on-site workers.

[0063] 5. Clear reminder logic improves the convenience of waste recycling.

[0064] 6. The position of the feeding pipe 23 can be fine-tuned, which effectively reduces the assembly difficulties caused by processing stress and the shorter service life caused by incomplete stress release.

[0065] 7. Modular split design, low maintenance cost in the later stage.

[0066] It should be noted that, in this specification, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0067] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A waste recycling mechanism for semiconductor auxiliary materials, comprising: a recycling box for recycling waste materials; characterized in that: Also includes: A feeding module, which is located on the top of the recycling box and transports waste materials into the recycling box; A detection module, the detection module is connected to the feeding module and is used to detect the amount of waste materials transported to the recovery box by the feeding module; An indication module, which is connected to the feeding module and is used to indicate whether waste can be fed into the feeding module.

2. The semiconductor auxiliary material waste recycling mechanism according to claim 1, characterized in that: The feeding module comprises: Mounting seat; A mounting plate, the mounting plate being arranged on the top of the mounting seat; A feeding pipe, wherein the feeding pipe is arranged on the mounting plate in an angle-adjustable manner, and the discharge end of the feeding pipe is located at the top of the recovery box; A control component is connected to the mounting seat and is used to adjust the on-off of the feeding pipe and control the feeding state of the feeding pipe.

3. The semiconductor auxiliary material waste recycling mechanism as claimed in claim 2, characterized in that: The control component comprises: A control port, the control port being opened at the top of the feeding pipe; A driver, the driver is connected to the mounting seat and provides a driving force for lifting; A control ring is sleeved on the feeding pipe, the bottom of the control ring is connected to the driver, a protrusion is provided on the top inner wall of the control ring, and the protrusion is arranged opposite to the control port.

4. The semiconductor auxiliary material waste recycling mechanism as claimed in claim 3, characterized in that: The control assembly further comprises: a pair of slideways, wherein the pair of slideways are arranged on both sides of one end of the mounting plate, and both sides of the control ring are respectively slidably connected in the pair of slideways.

5. The semiconductor auxiliary material waste recycling mechanism as claimed in claim 4, characterized in that: The mounting plate is a U-shaped structure, and a reinforcing rib is connected to the top of the mounting plate.

6. The semiconductor auxiliary material waste recycling mechanism as claimed in claim 2, characterized in that: The feeding module also includes: Two rotation holes, the two rotation holes are opened on opposite surfaces of the mounting plate; Two arc-shaped holes, the two arc-shaped holes are opened on opposite surfaces of the mounting plate; An adjustment seat, two sides of which are arranged on the mounting plate so as to be angle-adjustable through the two rotating holes and the two arc-shaped holes; A clamp is used to lock the feeding pipe on the adjusting seat.

7. The semiconductor auxiliary material waste recycling mechanism as claimed in claim 2, characterized in that: The detection module comprises: A sensor mounting frame, the sensor mounting frame is connected to the feeding module; An optical fiber sensor is arranged on the sensor mounting frame and is used to detect the amount of waste material transported into the recovery box through the feeding module.

8. The semiconductor auxiliary material waste recycling mechanism according to claim 7, characterized in that: The top of the discharge section of the feeding pipe is a hollow structure and is directly opposite to the detection end of the optical fiber sensor.

9. The semiconductor auxiliary material waste recycling mechanism according to claim 1, characterized in that: The indication module comprises: A lamp rack, the lamp rack being connected to the feeding module; An indicator light, the indicator light is connected to the light bracket and is used to indicate whether waste can be fed into the feeding module.

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