Intelligent temperature control circuit

Abstract

The utility model discloses an intelligent temperature control circuit, which comprises a power supply input interface, a main control circuit, a cold and hot switching control circuit, a protection diode and a semiconductor chilling plate, and is characterized in that the power supply input interface is connected to the main control circuit and is connected to the cold and hot switching control circuit through the protection diode, and the semiconductor chilling plate is connected to the cold and hot switching control circuit through the protection diode. The positive electrode of the protection diode is connected with the power input interface, and the negative electrode of the protection diode is connected with the cold-hot switching control circuit; a first output end of the cold and hot switching control circuit is connected with one end of the semiconductor chilling plate, and a second output end of the cold and hot switching control circuit is connected with the other end of the semiconductor chilling plate; the control end of the main control circuit is connected with the controlled end of the cold and hot switching control circuit. According to the utility model, the protection diode is arranged between the power supply input interface and the cold-hot switching control circuit, so that reverse backflow generated during switching of the cold end and the hot end of the semiconductor chilling plate can be prevented from triggering a protection mechanism of a decoy IC and an adapter, the decoy IC and the adapter cannot be matched and work abnormally, and thus the circuit has no output voltage, and the service life of the circuit is prolonged. Therefore, the whole circuit cannot work.

Description

Technical Field

[0001] The utility model relates to the technical field of circuits, in particular to an intelligent temperature control circuit. Background Art

[0002] With the development of technology and the continuous improvement of people's living standards, it is often necessary to cool or heat an item in some scenarios. For example, in daily life or in a car, a water cup needs to be cooled or heated to meet the drinking water needs of different users or in different weather.

[0003] At present, this temperature control circuit that can achieve cooling and heating switching is generally realized by a semiconductor refrigeration chip. Since the semiconductor refrigeration chip has a cold end and a hot end, it can be cooled through its cold end and heated through its hot end. When in use, the user can switch between cooling and heating by changing the direction of the current passing through the semiconductor refrigeration chip, which is very convenient to operate.

[0004] However, since the resistance of the cooling plate will change accordingly at different temperatures, when the power is turned on or the hot and cold switches are switched after working for a period of time, the resistance may be less than the designed rated value, and there will be a sudden large current that exceeds the rated current of the adapter, causing the adapter to have overcurrent protection and enter hiccup mode, and it cannot work normally. Utility Model Content

[0005] In view of this, an object of the embodiments of the present invention is to provide an intelligent temperature control circuit to improve the above-mentioned problem.

[0006] 10. The embodiment of the utility model provides an intelligent temperature control circuit, which includes: a power input interface, a PD protocol control circuit, a main control circuit, a hot and cold switching control circuit, a protection diode and a semiconductor refrigeration sheet, wherein the power input interface is connected to the PD protocol control circuit, the PD protocol control circuit is connected to the main control circuit, and is connected to the hot and cold switching control circuit through the protection diode, and the positive electrode of the protection diode is connected to the power input interface, and the negative electrode is connected to the hot and cold switching control circuit;

[0007] The first output end of the hot-cold switching control circuit is connected to one end of the semiconductor refrigeration chip, and the second output end is connected to the other end of the semiconductor refrigeration chip;

[0008] The control end of the main control circuit is connected to the controlled end of the hot / cold switching control circuit.

[0009] Preferably, the power input interface is a Type-C interface.

[0010] Preferably, it further comprises a voltage stabilizing circuit, and the voltage stabilizing circuit is arranged between the PD protocol control circuit and the main control circuit.

[0011] Preferably, the main control circuit is an MCU, model PAL28.

[0012] Preferably, a fan is also included, and the fan is electrically connected to the power input interface and the main control circuit. The main control circuit is used to output a control signal to the fan, and the air outlet of the fan is oriented toward the hot end of the semiconductor refrigeration plate.

[0013] Preferably, it further comprises at least one indicator light, which is arranged between the voltage stabilizing circuit and the main control circuit, and the main control circuit is used to output a control signal to the indicator light.

[0014] Preferably, it also includes a gear adjustment circuit, and the gear adjustment circuit is connected to the main control circuit.

[0015] Preferably, it also includes a voltage detection circuit; the voltage detection circuit is arranged between the PD protocol control circuit and the main control circuit.

[0016] Preferably, at startup, power is supplied to the semiconductor refrigeration chip according to a preset duty cycle to prevent current overshoot during cooling or heating or switching between hot and cold. The refrigeration chip is powered at a preset duty cycle of 1 minute, and the refrigeration chip enters full power operation after 1 minute.

[0017] In summary, this embodiment sets a protection diode between the power input interface and the hot and cold switching control circuit to prevent the instantaneous reverse backflow generated when the hot and cold ends of the semiconductor refrigeration plate are switched, which causes the adapter to form a power-off protection, thereby improving the overall working stability and reliability of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the implementation mode will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A circuit diagram of an intelligent temperature control circuit provided in an embodiment of the utility model.

[0020] Figure 2 for Figure 1 Circuit diagram of the power input interface.

[0021] Figure 3 for Figure 1Circuit diagram of the main control circuit.

[0022] Figure 4 for Figure 1 Circuit diagram of the hot and cold switching control circuit.

[0023] Figure 5 for Figure 1 Circuit diagram of the voltage regulator circuit.

[0024] Figure 6 This is a circuit diagram of the gear adjustment circuit.

[0025] Figure 7 for Figure 1 Circuit diagram of the fan.

[0026] Figure 8 for Figure 1 Circuit diagram of the indicator light. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] See also Figure 1 The embodiment of the utility model provides an intelligent temperature control circuit, which includes: a power input interface 10, a PD protocol control circuit 11, a main control circuit 20, a hot and cold switching control circuit 30, a protection diode 40 and a semiconductor refrigeration sheet 50, wherein the power input interface 10 is connected to the PD protocol control circuit 11, the PD protocol control circuit is connected to the main control circuit 20, and is connected to the hot and cold switching control circuit 30 through the protection diode 40, and the positive electrode of the protection diode 40 is connected to the power input interface 10, and the negative electrode is connected to the hot and cold switching control circuit 30;

[0029] The first output end of the hot-cold switching control circuit 30 is connected to one end of the semiconductor refrigeration chip 50, and the second output end is connected to the other end of the semiconductor refrigeration chip 50;

[0030] The control end of the main control circuit 20 is connected to the controlled end of the hot / cold switching control circuit 30 .

[0031] In this embodiment, the power input interface 10 can be connected to an adapter, and the adapter supplies power to the entire circuit through the power input interface 10, thereby providing the electrical energy required for the circuit to work.

[0032] Among them, Figure 2 As shown, the power input interface 10 may be a Type-C interface. Of course, it may also be other interfaces, such as a common USB interface, a serial interface, etc., which is not specifically limited in the present utility model.

[0033] In this embodiment, the PD protocol control circuit 11 can generate a voltage of 9-12V according to different PD protocol adapters.

[0034] In this embodiment, the main control circuit 20 may be an MCU, and its model may be PAL28. For a specific circuit diagram, refer to Figure 3 Of course, other types of MCUs can also be selected according to actual needs, and the present utility model does not make specific limitations.

[0035] In this embodiment, the specific circuit diagram of the hot and cold switching control circuit 30 is shown in FIG. Figure 4 As shown in the figure, the first end HC1 of the hot and cold switching control circuit 30 is connected to one end of the semiconductor refrigeration sheet 50 , and the second output end HC2 is connected to the other end of the semiconductor refrigeration sheet 50 .

[0036] also, Figure 4 In the embodiment, the hot and cold switching control circuit 30 includes two PWM 1 ports and two PWM 2 ports, and the PWM 1 port is connected to the PWM 1 pin (i.e. Figure 3 Pin 9 of the main control circuit 10), PWM 2 port is connected to PWM 2 pin of the main control circuit 10 (i.e. Figure 3 The main control circuit 20 can send control signals, such as a hot and cold switching signal, a duty cycle signal, and a temperature control signal, to the hot and cold switching control circuit 30 through the PWM pin.

[0037] In particular, due to the characteristics of the semiconductor cooling sheet 50, the current will generate a transient surge at the moment of powering on, and the maximum current of the adapter equipped with the type-c is generally 3A. This transient current may cause the product to form a protective power-off. For this reason, this embodiment starts the output voltage with a power-on duty cycle when the machine is turned on, so that the current will not generate a current overshoot during the power-on process. For example, in the process of turning on the machine for cooling and heating or switching between hot and cold, in order to prevent current overshoot, a duty cycle of 1 minute can be preset to power the cooling sheet, and the cooling sheet can be allowed to enter full power operation after 1 minute. Among them, the generation of the duty cycle signal can be controlled by software or hardware, and these schemes are all within the protection scope of the present utility model.

[0038] In this embodiment, the protection diode 40 is Figure 4The diode D4 has its positive electrode connected to the PD protocol control circuit 11 and its negative electrode connected to the hot and cold switching control circuit 30. Thus, when the semiconductor refrigeration plate 50 switches between the hot and cold ends, the reverse backflow generated will be cut off by the diode D4 to avoid impacting the adapter and causing the adapter to be powered off.

[0039] In this embodiment, in particular, a voltage stabilizing circuit 60 is further included, and the voltage stabilizing circuit 60 is arranged between the PD protocol control circuit 11 and the main control circuit 20 .

[0040] The specific circuit of the voltage stabilizing circuit 60 is shown in FIG. Figure 5 The voltage stabilizing circuit 60 is used to provide a stable voltage to the main control circuit 20.

[0041] In this embodiment, in particular, a gear adjustment circuit 90 is also included, and the gear adjustment circuit is connected to the main control circuit.

[0042] Among them, Figure 6 As shown, the gear adjustment circuit 90 is provided with a plurality of gears, such as 3 gears, and resistors with different resistance values ​​are connected in series at different gears, so that the voltage delivered to the semiconductor refrigeration plate 50 can be adjusted by selecting different gears to connect, thereby adjusting the cooling speed or heating speed of the semiconductor refrigeration plate 50.

[0043] Among them, the gear adjustment circuit 90 can adjust the gear by touch, knob or button, and the number of gears can be set according to actual needs, such as 3, 4, 5 gears, etc., which are not specifically limited in the present invention.

[0044] In this embodiment, in particular, Figure 7 As shown, a fan 70 is also included, and the fan 70 is electrically connected to the power input interface 10 and the main control circuit 20. The main control circuit 20 is used to output a control signal to the fan, and the air outlet of the fan 70 faces the hot end of the semiconductor cooling plate 50.

[0045] In this embodiment, in principle, the semiconductor refrigeration 50 pieces are a heat transfer tool. When current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form a hot and cold end (the hot and cold ends can be switched by changing the direction of the current). However, the semiconductor itself has resistance. When current passes through the semiconductor, heat will be generated, which will affect the heat transfer. In addition, the heat between the two plates will also be reversely transferred through the air and the semiconductor material itself. When the hot and cold ends reach a certain temperature difference and the amount of these two heat transfers is equal, a balance point will be reached, and the positive and reverse heat transfers will cancel each other out. At this time, the temperature of the hot and cold ends will not continue to change.

[0046] To this end, in this embodiment, a fan 70 is provided to lower the temperature of the hot end so as to achieve a lower temperature at the cold end.

[0047] Of course, in actual electronic products, a heat sink may also be provided to reduce the temperature of the hot end, which will not be elaborated in detail in the present invention.

[0048] In this embodiment, in particular, Figure 8 As shown, at least one indicator light 80 is further included. The indicator light 80 is arranged between the main control circuit 20 and the voltage stabilizing circuit 60. The main control circuit 20 is used to output a control signal to the indicator light.

[0049] The indicator light 80 can be connected to the LED pin of the main control circuit 20, such as Figure 3 The LED 1 to LED 6 pins in the circuit. The indicator light 80 is used to indicate the working state of the circuit, such as a green light for normal operation, a red light for sleep, no light for shutdown, and a flashing light for fault, depending on the actual needs.

[0050] In this embodiment, in particular, a voltage detection circuit 100 is further included. The voltage detection circuit 100 is arranged between the PD protocol control circuit 11 and the main control circuit 20 .

[0051] Among them, the voltage detection circuit 100 is used to detect the voltage value input by the power input interface 10 to the main control circuit 20. The main control circuit 20 determines whether the voltage value is within the normal range. If it is within the normal range, it will supply power normally. If it is not within the normal range, it will enter the standby state and stop working.

[0052] For example, 7-15v is set as the normal power supply. If the voltage detection circuit 100 detects that the power supply is lower than 7v or higher than 15v, it enters the standby flashing mode and does not work.

[0053] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. An intelligent temperature control circuit, characterized in that: include: A power input interface, a PD protocol control circuit, a main control circuit, a hot and cold switching control circuit, a protection diode and a semiconductor refrigeration sheet, wherein the power input interface is connected to the PD protocol control circuit, the PD protocol control circuit is connected to the main control circuit, and is connected to the hot and cold switching control circuit through the protection diode, and the positive electrode of the protection diode is connected to the power input interface, and the negative electrode is connected to the hot and cold switching control circuit; The first output end of the hot-cold switching control circuit is connected to one end of the semiconductor refrigeration chip, and the second output end is connected to the other end of the semiconductor refrigeration chip; The control end of the main control circuit is connected to the controlled end of the hot / cold switching control circuit.

2. The intelligent temperature control circuit according to claim 1, characterized in that: The power input interface is a Type-C interface.

3. The intelligent temperature control circuit according to claim 1, characterized in that: It also includes a voltage stabilizing circuit, which is arranged between the PD protocol control circuit and the main control circuit.

4. The intelligent temperature control circuit according to claim 1, characterized in that: The main control circuit is MCU, model is PAL28.

5. The intelligent temperature control circuit according to claim 1, characterized in that: It also includes a fan, which is electrically connected to the power input interface and the main control circuit. The main control circuit is used to output a control signal to the fan, and the air outlet of the fan is oriented toward the hot end of the semiconductor refrigeration plate.

6. The intelligent temperature control circuit according to claim 3, characterized in that: It also includes at least one indicator light, which is arranged between the voltage stabilizing circuit and the main control circuit, and the main control circuit is used to output a control signal to the indicator light.

7. The intelligent temperature control circuit according to claim 1, characterized in that: It also includes a gear adjustment circuit, which is connected to the main control circuit.

8. The intelligent temperature control circuit according to claim 1, characterized in that: It also includes a voltage detection circuit, which is arranged between the PD protocol control circuit and the main control circuit.

9. The intelligent temperature control circuit according to claim 1, characterized in that: At startup, the semiconductor refrigeration chip is powered according to a preset duty cycle to prevent current overshoot during cooling or heating or switching between hot and cold. The refrigeration chip is powered at a preset duty cycle of 1 minute, and the refrigeration chip enters full power operation after 1 minute.

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