Multi-wafer horizontally placed wafer

Abstract

The utility model provides a plurality of horizontally placed wafers, which relates to the technical field of wafers, and comprises a supporting sheet, a plurality of mutually overlapped wafer protection groups are placed at the top end of the supporting sheet, buckling films are placed at the top ends of the wafer protection groups, and buckling top covers are arranged at the top ends of the buckling films. And connecting buckle plates are fixedly mounted at the two ends of the buckling top cover. Compared with the prior art, the wafer storage structure has the advantages that the elastic annular structure is arranged in the wafer storage structure to tighten and fix the wafer, the elastic annular structure is utilized to fix the wafer, transverse movement of the wafer is reduced, meanwhile, it is ensured that the edge of the wafer cannot be pressed in the wafer storage process, and the wafer storage efficiency is improved. And meanwhile, the storage structures of the wafers are connected through the lock catch structures, the impact resistance of the storage structures is improved through the lock catch structures and the elastic annular structures, the wafers in the transportation process can be effectively protected, and the stability and safety of wafer transportation are effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a plurality of wafers placed horizontally. Background Art

[0002] Wafers are the highest-end products and also the most fragile products. The research and development and production of wafers often involve the transportation of wafers. Wafers need to be protected during transportation to avoid damage or contamination.

[0003] However, the existing wafers are prone to lateral movement during transportation and placement, and are more susceptible to impact, which is not conducive to protecting the wafers, and the transportation safety of the wafers is low. Utility Model Content

[0004] Therefore, the purpose of the present invention is to provide a plurality of horizontally placed wafers to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0005] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the utility model provides a plurality of horizontally placed wafers, including a wafer placement box, the interior of the wafer placement box is fixedly connected to a support frame, the top of the support frame is fixedly connected to a support sheet, a plurality of mutually overlapping wafer protection groups are placed on the top of the support sheet, a snap-fitting film is placed on the top of the wafer protection group, a snap-fitting top cover is arranged on the top of the snap-fitting film, connecting buckle plates are fixedly installed at both ends of the snap-fitting top cover, and a snap-fitting groove is opened inside the connecting buckle plates.

[0006] Preferably, any of the above schemes is that a support cavity is provided inside the wafer placement box, a support platform fixedly connected to the wafer placement box is provided inside the support cavity, and the support platform is located below the support sheet.

[0007] By adopting the above technical solution, the support platform is accommodated and fixed by the support cavity, so that the support platform supports the support sheet to a certain extent, thereby enhancing the support strength of the support sheet.

[0008] Preferably, any of the above schemes is that the support frame is located inside the support cavity and distributed around the circumference of the support platform, the support sheet is located inside the support cavity, and the diameter of the support sheet is greater than the diameter of the support platform.

[0009] The above technical solution is adopted: the support plate is fixed by using the support pole, so that the support plate has sufficient bearing capacity to support the wafer.

[0010] Preferably, any of the above schemes comprises a protective rubber ring and a wafer body, the wafer body is fixedly mounted inside the protective rubber ring, and a plurality of the protective rubber rings are overlapped with each other.

[0011] The above technical solution is adopted: several protective rubber rings are stacked and placed on a support table, the wafer body is placed inside the protective rubber rings, and the protective rubber rings are used to protect the wafer body to reduce the lateral movement of the wafer and ensure that the edge of the wafer will not be pressed.

[0012] Preferably, any of the above schemes is that the buckling film is arranged as an arc structure, and the bottom of the buckling film is in contact with the topmost protective rubber ring.

[0013] The above technical solution is adopted: the wafer placed at the top is sealed and protected by fastening the film, thereby improving the safety and stability of wafer placement.

[0014] Preferably, any of the above schemes is that an upper cavity is opened inside the snap-fit ​​top cover, the snap-fit ​​film is located inside the upper cavity, the connecting buckle plate is made of elastic material, and the bottom of the connecting buckle plate is set to be rounded.

[0015] The above technical solution is adopted: the upper cavity inside the buckled top cover is used to accommodate and limit the placed wafers, so that the protective rubber ring will not move under the covering of the upper cavity, and the buckled top cover and the wafer placement box are fixed by connecting buckle plates to ensure the sealing and protection of the wafers.

[0016] Preferably, any of the above schemes has a locking boss inside the locking groove, the locking boss is fixedly installed inside the wafer placement box, and one side of the locking boss is provided with a connecting groove that is compatible with the connecting buckle plate.

[0017] The above technical solution is adopted: the locking connection between the locking groove and the locking boss and the mutual locking connection between the connecting buckle plate and the connecting groove are used to ensure the stability of the locking top cover installation and the safety of wafer transportation.

[0018] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0019] 1. An elastic ring structure is set inside the storage structure where the wafers are placed to tighten and fix the wafers. The elastic ring structure is used to fix the wafers to reduce the lateral movement of the wafers. At the same time, it is ensured that the edges of the wafers will not be pressed during the storage process. At the same time, the storage structure of the wafers is connected with a locking structure. The locking structure and the elastic ring structure improve the impact resistance of the storage structure, which can effectively protect the wafers during transportation and effectively improve the stability and safety of wafer transportation.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 It is a structural schematic diagram according to an embodiment of the utility model;

[0023] Figure 2 It is a schematic diagram of an explosion structure according to an embodiment of the utility model;

[0024] Figure 3 It is a structural schematic diagram of a wafer protection group according to an embodiment of the utility model;

[0025] Figure 4 It is a schematic diagram of the structure of the buckled top cover according to an embodiment of the utility model;

[0026] Among them: 1-wafer placement box, 2-support frame, 3-support sheet, 4-wafer protection group, 41-protection rubber ring, 42-wafer body, 5-snap-on rubber sheet, 6-snap-on top cover, 7-connecting buckle plate, 8-clamping groove, 9-support cavity, 10-support platform, 11-upper cavity, 12-clamping boss, 13-connecting slot. DETAILED DESCRIPTION

[0027] The present invention is further described below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0028] like Figure 1-4 As shown, a plurality of horizontally placed wafers according to an embodiment of the utility model comprises a wafer placement box 1, a support frame 2 is fixedly connected to the inside of the wafer placement box 1, a support sheet 3 is fixedly connected to the top of the support frame 2, a plurality of wafer protection groups 4 overlapping each other are placed on the top of the support sheet 3, a snap-fitting film 5 is placed on the top of the wafer protection group 4, a snap-fitting top cover 6 is arranged on the top of the snap-fitting film 5, connecting buckle plates 7 are fixedly installed at both ends of the snap-fitting top cover 6, and a snap-fitting groove 8 is opened inside the connecting buckle plate 7.

[0029] Preferably, any of the above schemes is that a support cavity 9 is opened inside the wafer placement box 1 , and a support platform 10 fixedly connected to the wafer placement box 1 is arranged inside the support cavity 9 , and the support platform 10 is located below the support sheet 3 .

[0030] The above technical solution is adopted: the support platform 10 is accommodated and fixed by the support cavity 9, so that the support platform 10 supports the support sheet 3 to a certain extent, thereby enhancing the support strength of the support sheet 3.

[0031] Preferably, from any of the above schemes, the support frame 2 is located inside the support cavity 9 and distributed around the circumference of the support platform 10 , the support sheet 3 is located inside the support cavity 9 , and the diameter of the support sheet 3 is greater than the diameter of the support platform 10 .

[0032] The above technical solution is adopted: the support plate 10 is fixed by the support pole 2, so that the support plate 10 has sufficient bearing capacity to support the wafer.

[0033] Preferably, from any of the above schemes, the wafer protection group 4 includes a protective rubber ring 41 and a wafer body 42 , the wafer body 42 is fixedly mounted inside the protective rubber ring 41 , and a plurality of protective rubber rings 41 overlap each other.

[0034] The above technical solution is adopted: a plurality of protective rubber rings 41 are stacked and placed on the support table 10, and a wafer body 42 is placed inside the protective rubber ring 41. The protective rubber ring 41 is used to protect the wafer body 42 to reduce the lateral movement of the wafer and ensure that the edge of the wafer is not pressed.

[0035] Preferably, any of the above solutions is that the buckling film 5 is arranged as an arc structure, and the bottom of the buckling film 5 fits with the topmost protective rubber ring 41 .

[0036] By adopting the above technical solution, the wafer placed at the top is sealed and protected by the buckled film 5, thereby improving the safety and stability of wafer placement.

[0037] Preferably, any of the above schemes has an upper cavity 11 opened inside the buckled top cover 6, the buckled film 5 is located inside the upper cavity 11, the connecting buckle plate 7 is made of elastic material, and the bottom of the connecting buckle plate 7 is set to be rounded.

[0038] The above technical solution is adopted: the upper cavity 11 inside the buckled top cover 6 is used to accommodate and limit the placed wafers, so that the protective rubber ring 41 will not move under the covering of the upper cavity 11, and the buckled top cover 6 and the wafer placement box 1 are fixed by connecting the buckle plate 7 to ensure the sealing and protection of the wafers.

[0039] Preferably, any of the above schemes has a snap-fitting boss 12 inside the snap-fitting groove 8 , the snap-fitting boss 12 is fixedly mounted inside the wafer placement box 1 , and a connecting snap-fitting groove 13 matched with the connecting buckle plate 7 is provided on one side of the snap-fitting boss 12 .

[0040] The above technical solution is adopted: the locking connection between the locking groove 8 and the locking boss 12 and the mutual locking connection between the connecting buckle plate 7 and the connecting locking groove 13 are used to ensure the stability of the installation of the buckled top cover 6 and ensure the safety of wafer transportation.

[0041] The utility model is a plurality of wafers placed horizontally, and the working principle is as follows:

[0042] Place the protective rubber ring 41 on top of the support sheet 3, insert the wafer body 42 into the inside of the protective rubber ring 41, overlap the protective rubber rings 41 in sequence, and after placing the wafer body 42, use the snap-fitting film 5 to fix the wafer body 42, and use the snap-fitting top cover 6 and the wafer placement box 1 to lock them to enhance the stability of wafer protection.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] 1. An elastic ring structure is set inside the storage structure where the wafers are placed to tighten and fix the wafers. The elastic ring structure is used to fix the wafers to reduce the lateral movement of the wafers. At the same time, it is ensured that the edges of the wafers will not be pressed during the storage process. At the same time, the storage structure of the wafers is connected with a locking structure. The locking structure and the elastic ring structure improve the impact resistance of the storage structure, which can effectively protect the wafers during transportation and effectively improve the stability and safety of wafer transportation.

Claims

1. A plurality of wafers placed horizontally, characterized in that: The invention comprises a wafer placement box (1), wherein a support frame (2) is fixedly connected to the inside of the wafer placement box (1), a support sheet (3) is fixedly connected to the top of the support frame (2), a plurality of wafer protection groups (4) overlapping each other are placed on the top of the support sheet (3), a snap-fitting film (5) is placed on the top of the wafer protection group (4), a snap-fitting top cover (6) is arranged on the top of the snap-fitting film (5), connecting buckle plates (7) are fixedly installed at both ends of the snap-fitting top cover (6), and a snap-fitting groove (8) is arranged inside the connecting buckle plate (7).

2. The multiple horizontally placed wafers according to claim 1, characterized in that: A support cavity (9) is provided inside the wafer placement box (1), and a support platform (10) fixedly connected to the wafer placement box (1) is provided inside the support cavity (9), and the support platform (10) is located below the support sheet (3).

3. The multiple horizontally placed wafers according to claim 2, characterized in that: The support frame (2) is located inside the support cavity (9) and is distributed around the circumference of the support platform (10); the support sheet (3) is located inside the support cavity (9); and the diameter of the support sheet (3) is greater than the diameter of the support platform (10).

4. The multiple horizontally placed wafers according to claim 3, characterized in that: The wafer protection group (4) comprises a protective rubber ring (41) and a wafer body (42); the wafer body (42) is fixedly mounted inside the protective rubber ring (41); and a plurality of the protective rubber rings (41) are overlapped with each other.

5. The multiple horizontally placed wafers according to claim 4, characterized in that: The buckling film (5) is arranged as an arc structure, and the bottom of the buckling film (5) is in contact with the topmost protective rubber ring (41).

6. The multiple horizontally placed wafers according to claim 5, characterized in that: An upper cavity (11) is provided inside the buckled top cover (6), the buckled film (5) is located inside the upper cavity (11), the connecting buckle plate (7) is made of elastic material, and the bottom of the connecting buckle plate (7) is arranged to be rounded.

7. The multiple horizontally placed wafers according to claim 6, characterized in that: The inside of the locking groove (8) is locked with a locking boss (12), and the locking boss (12) is fixedly installed inside the wafer placement box (1), and one side of the locking boss (12) is provided with a connecting slot (13) that is compatible with the connecting buckle plate (7).

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