High-efficiency semiconductor mounting equipment

Abstract

The utility model discloses high-efficiency semiconductor mounting equipment, which comprises a transportation platform, an XY-axis displacement mechanism, a lifting driving piece and a glue gun, the XY-axis displacement mechanism is arranged on one side of the transportation platform and is in driving connection with the lifting driving piece, and the lifting driving piece is in driving connection with the glue gun; the device further comprises a first translation driving mechanism, and the first translation driving mechanism is in driving connection with the transportation platform. According to the high-efficiency semiconductor mounting equipment, the first translation driving mechanism is additionally arranged to drive the transportation platform to move, so that the movement stroke of the glue gun driven by the XY-axis displacement mechanism is reduced, the glue gun can be quickly aligned with the dispensing position of the die bonding bracket on the transportation platform, and the production efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor mounting, in particular to a high-efficiency semiconductor mounting device. Background Art

[0002] Semiconductor mounting is a processing method that uses colloid to bond the chip to the designated area of ​​the die-bonding bracket to form an electrical path. The usual die-bonding method is that the feeding mechanism transfers the die-bonding bracket to the working position on the fixture, and the glue dispensing mechanism first dispenses glue at the position where the die-bonding bracket needs to be bonded to the chip. Then the wafer is picked up by the wafer pick-up head and placed in the die-bonding position. Existing semiconductor mounting equipment usually uses an XY-axis moving mechanism to drive the glue gun to move to the die-bonding position. With the increasing demand for semiconductor products in the market, existing semiconductor mounting equipment is difficult to meet production efficiency requirements. Therefore, it is necessary to provide a high-efficiency semiconductor mounting equipment. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a high-efficiency semiconductor mounting device.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a high-efficiency semiconductor mounting equipment, including a transport platform, an XY-axis displacement mechanism, a lifting drive component and a glue gun, the XY-axis displacement mechanism is arranged on one side of the transport platform and is driven and connected to the lifting drive component, and the lifting drive component is driven and connected to the glue gun; it also includes a first translation drive mechanism, which is driven and connected to the transport platform.

[0005] Furthermore, the first translation drive mechanism is a linear slide module.

[0006] Furthermore, it also includes a first mounting plate, the first translation drive mechanism is arranged on the first mounting plate, the first mounting plate is provided with a first guide rail, and the transport platform is provided with a first sliding block that cooperates with the first guide rail.

[0007] Furthermore, the first guide rails are respectively provided on both sides of the first translation drive mechanism.

[0008] Furthermore, it also includes a second translation drive mechanism, which is drivingly connected to the first mounting plate.

[0009] Furthermore, the second translation drive mechanism is a linear slide module.

[0010] Furthermore, it also includes a second mounting plate, the second translation drive mechanism is arranged on the second mounting plate, the second mounting plate is provided with a second guide rail, and the first mounting plate is provided with a second sliding block that cooperates with the second guide rail.

[0011] Furthermore, the second guide rails are respectively provided on both sides of the second translation drive mechanism.

[0012] Furthermore, it also includes a lifting drive mechanism, which is used to drive the transport platform to move up and down.

[0013] Furthermore, there are multiple glue guns.

[0014] The beneficial effect of the utility model is that the high-efficiency semiconductor mounting equipment adds a first translation drive mechanism to drive the transport platform to move, thereby reducing the moving stroke of the glue gun driven by the XY-axis displacement mechanism, allowing the glue gun to align with the glue dispensing position of the solid crystal bracket on the transport platform more quickly, effectively improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a high-efficiency semiconductor mounting device according to a first embodiment of the utility model.

[0016] Description of labels:

[0017] 1. Transport platform; 11. First slide block;

[0018] 2. XY axis displacement mechanism;

[0019] 3. Glue gun;

[0020] 4. A first translation driving mechanism;

[0021] 5. first mounting plate; 51. first guide rail; 52. second slider;

[0022] 6. A second translation driving mechanism;

[0023] 7. Second mounting plate; 71. Second guide rail. DETAILED DESCRIPTION

[0024] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0025] Please refer to Figure 1 A high-efficiency semiconductor mounting equipment includes a transport platform 1, an XY-axis displacement mechanism 2, a lifting drive and a glue gun 3, wherein the XY-axis displacement mechanism 2 is arranged on one side of the transport platform 1 and is drivingly connected to the lifting drive, and the lifting drive is drivingly connected to the glue gun 3; it also includes a first translation drive mechanism 4, which is drivingly connected to the transport platform 1.

[0026] From the above description, it can be seen that the beneficial effect of the utility model is that the high-efficiency semiconductor mounting equipment is added with a first translation drive mechanism 4 to drive the transport platform 1 to move, thereby reducing the moving stroke of the glue gun 3 driven by the XY-axis displacement mechanism 2, so that the glue gun 3 can be aligned with the glue dispensing position of the solid crystal bracket on the transport platform 1 more quickly, effectively improving production efficiency.

[0027] Furthermore, the first translation driving mechanism 4 is a linear slide module.

[0028] It can be seen from the above description that the first translation drive mechanism 4 is easy to obtain and use.

[0029] Furthermore, it also includes a first mounting plate 5, the first translation drive mechanism 4 is arranged on the first mounting plate 5, the first mounting plate 5 is provided with a first guide rail 51, and the transport platform 1 is provided with a first slider 11 that cooperates with the first guide rail 51.

[0030] It can be seen from the above description that the first guide rail 51 and the first slider 11 cooperate to guide the transport platform 1, which is beneficial to improving the accuracy of the glue dispensing position.

[0031] Furthermore, the first guide rails 51 are respectively provided on both sides of the first translation driving mechanism 4 .

[0032] It can be seen from the above description that the two first guide rails 51 can further prevent position deviation and improve the position accuracy of the transportation platform 1.

[0033] Furthermore, it also includes a second translation drive mechanism 6 , which is drivingly connected to the first mounting plate 5 .

[0034] It can be seen from the above description that the second translation drive mechanism 6 can increase the moving range of the transport platform 1 and compensate for the moving stroke of the glue gun 3 in another direction, thereby further improving the production efficiency.

[0035] Furthermore, the second translation driving mechanism 6 is a linear slide module.

[0036] It can be seen from the above description that the second translation drive mechanism 6 is easy to obtain and use.

[0037] Furthermore, it includes a second mounting plate 7 , the second translation drive mechanism 6 is arranged on the second mounting plate 7 , the second mounting plate 7 is provided with a second guide rail 71 , and the first mounting plate 5 is provided with a second slider 52 that cooperates with the second guide rail 71 .

[0038] It can be seen from the above description that the cooperation between the second guide rail 71 and the second slider 52 can guide the transport platform 1, which is beneficial to improving the accuracy of the dispensing position.

[0039] Furthermore, the second guide rails 71 are respectively provided on both sides of the second translation driving mechanism 6 .

[0040] It can be seen from the above description that the two second guide rails 71 can further prevent position deviation and improve the position accuracy of the transportation platform 1.

[0041] Furthermore, it also includes a lifting drive mechanism, which is used to drive the transportation platform 1 to move up and down.

[0042] It can be seen from the above description that the lifting drive mechanism can drive the transport platform 1 to compensate for the stroke of the glue gun 3 in the height direction, thereby further improving the production efficiency.

[0043] Furthermore, there are multiple glue guns 3.

[0044] It can be seen from the above description that providing a plurality of glue guns 3 can perform glue dispensing at a plurality of glue dispensing positions at the same time, which is beneficial to improving production efficiency.

[0045] Please refer to Figure 1 , Embodiment 1 of the utility model is: a high-efficiency semiconductor mounting equipment, including a transport platform 1, an XY-axis displacement mechanism 2, a lifting drive and a glue gun 3, wherein the XY-axis displacement mechanism 2 is arranged on one side of the transport platform 1 and is drivingly connected to the lifting drive, and the lifting drive is drivingly connected to the glue gun 3; and further comprising a first translation drive mechanism 4, which is drivingly connected to the transport platform 1. Specifically, the first translation drive mechanism 4 is used to drive the transport platform 1 to move along the direction of the X-axis. In this embodiment, the first translation drive mechanism 4 is a linear slide module; and the lifting drive is preferably a ball screw module.

[0046] The high-efficiency semiconductor mounting equipment further includes a first mounting plate 5, a first translation driving mechanism 4 is disposed on the first mounting plate 5, a first guide rail 51 is disposed on the first mounting plate 5, and a first slider 11 cooperating with the first guide rail 51 is disposed on the transport platform 1. Specifically, a first guide rail 51 is disposed on each side of the first translation driving mechanism 4, and the number of the first sliders 11 corresponds to the number of the first guide rails 51.

[0047] The high-efficiency semiconductor mounting equipment also includes a second translation drive mechanism 6, which is drivingly connected to the first mounting plate 5, and the second translation drive mechanism 6 is used to drive the transport platform 1 to move along the Y-axis direction. In this embodiment, the second translation drive mechanism 6 is preferably a linear slide module. Specifically, the second translation drive mechanism 6 is arranged on the second mounting plate 7, and the second mounting plate 7 is provided with a second guide rail 71, and the first mounting plate 5 is provided with a second slider 52 that cooperates with the second guide rail 71. A second guide rail 71 is respectively provided on both sides of the second translation drive mechanism 6, and the number of the second sliders 52 is set in a one-to-one correspondence with the number of the second guide rails 71.

[0048] In other embodiments, the high-efficiency semiconductor mounting equipment further includes a lifting drive mechanism, and it is also feasible that the lifting drive mechanism is used to drive the transport platform 1 to move up and down. It is easy to understand that the lifting drive mechanism can drive the transport platform 1 to compensate for the stroke of the glue gun 3 in the height direction, further improving production efficiency.

[0049] In order to improve production efficiency, the number of glue guns 3 is multiple. In this embodiment, the number of glue guns 3 is three. The XY axis displacement mechanism 2 includes an X axis drive mechanism and a Y axis drive mechanism, and the number of the Y axis drive mechanism, the lifting drive member and the glue guns 3 are arranged in a one-to-one correspondence.

[0050] In summary, the high-efficiency semiconductor mounting equipment provided by the utility model adds a first translation drive mechanism to drive the transport platform to move, thereby reducing the moving stroke of the glue gun driven by the XY axis displacement mechanism, allowing the glue gun to align with the glue dispensing position of the solid crystal bracket on the transport platform more quickly, effectively improving production efficiency. The first guide rail and the first slider can cooperate to guide the transport platform, which is beneficial to improving the accuracy of the glue dispensing position. The second translation drive mechanism can increase the moving range of the transport platform and compensate for the moving stroke of the glue gun in another direction, further improving production efficiency. The second guide rail and the second slider can cooperate to guide the transport platform, which is beneficial to improving the accuracy of the glue dispensing position.

[0051] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A high-efficiency semiconductor mounting equipment, comprising a transport platform, an XY-axis displacement mechanism, a lifting drive and a glue gun, wherein the XY-axis displacement mechanism is arranged on one side of the transport platform and is drivingly connected to the lifting drive, and the lifting drive is drivingly connected to the glue gun; characterized in that: It also includes a first translation drive mechanism, which is drivingly connected to the transportation platform.

2. The high-efficiency semiconductor mounting equipment according to claim 1, characterized in that: The first translation driving mechanism is a linear slide module.

3. The high-efficiency semiconductor mounting equipment according to claim 1, characterized in that: It also includes a first mounting plate, the first translation drive mechanism is arranged on the first mounting plate, a first guide rail is arranged on the first mounting plate, and a first sliding block cooperating with the first guide rail is arranged on the transport platform.

4. The high-efficiency semiconductor mounting equipment according to claim 3, characterized in that: The first guide rails are respectively disposed on both sides of the first translation driving mechanism.

5. The high-efficiency semiconductor mounting equipment according to claim 3, characterized in that: It also includes a second translation drive mechanism, which is drivingly connected to the first mounting plate.

6. The high-efficiency semiconductor mounting equipment according to claim 5, characterized in that: The second translation driving mechanism is a linear slide module.

7. The high-efficiency semiconductor mounting equipment according to claim 5, characterized in that: It also includes a second mounting plate, the second translation drive mechanism is arranged on the second mounting plate, the second mounting plate is provided with a second guide rail, and the first mounting plate is provided with a second sliding block that cooperates with the second guide rail.

8. The high-efficiency semiconductor mounting equipment according to claim 7, characterized in that: The second guide rails are respectively provided on both sides of the second translation driving mechanism.

9. The high-efficiency semiconductor mounting equipment according to claim 1, characterized in that: It also includes a lifting drive mechanism, which is used to drive the transport platform to move up and down.

10. The high-efficiency semiconductor mounting equipment according to claim 1, characterized in that: The number of the glue guns is multiple.

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