Discharging device of scribing machine

By designing a scribing machine cutting device that automatically discharges, the problem of traditional cutting devices being easily filled and manual cleaning is solved, and automatic discharge is realized and working efficiency is improved.

CN222440557UActive Publication Date: 2025-02-07TANGSHAN HAITAI NEW ENERGY TECH CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202420400545.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-03
Publication Date
2025-02-07
Estimated Expiration
2034-03-03

AI Technical Summary

Technical Problem

During the manufacturing process of photovoltaic modules, the scribing machine is easily filled, resulting in cumbersome manual cleaning and affecting work efficiency.

Method used

A scribing machine unloading device including a frame, a depressor hopper, a baffle and a spring is designed. The bottom surface of the lower hopper is equipped with a lofted inclined surface, and the baffle is hinged at the cutting port, and automatic discharge of materials is achieved through a spring and ball mechanism.

Benefits of technology

The automatic discharge function of the cutting device is realized, reducing the need for manual processing, and improving work efficiency and productivity.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222440557U_ABST
    Figure CN222440557U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of scribing machines, in particular to a blanking device of a scribing machine. Scraps generated in the working process of the scribing machine can enter the discharging hopper, the scraps entering the discharging hopper can fall on the sample placing slope, and then the scraps slide to the surface of the baffle at the position of the discharging opening under the action of gravity. Along with continuous accumulation of the sweeps, when the gravity of the sweeps is larger than the elastic force of the spring, the sweeps can extrude the baffle downwards to enable the spring to be shortened and drive the ball to move along the sliding groove, at the moment, the baffle rotates along the hinged end, and the sweeps can be automatically discharged from a gap between the baffle and the discharging opening. And when the gravity of the scraps is smaller than the elastic force, the baffle blocks the discharging opening again under the action of the spring. By the adoption of the structural design, the automatic discharging function of the discharging device can be achieved, and the problem that in a traditional mode, manual treatment is needed, and then efficiency is low is solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of dicing machines, in particular to a material unloading device for dicing machines. Background Art

[0002] A dicing machine is used in the manufacturing process of photovoltaic modules. The dicing machine uses a high-energy laser beam to irradiate the surface of the battery cell or silicon wafer, causing the irradiated area to melt and vaporize, and then laser cutting is achieved under the drive of a CNC workbench.

[0003] In actual use, the dicing machine needs to be equipped with a material unloading device. When the dicing machine is operating, the material unloading device is needed to collect and hold the waste generated during the laser scribing process. However, in the related art, since the material unloading frequency is too fast when the dicing machine is in high-speed operation, the material unloading device is quickly filled up, and the staff is too repetitive and busy when handling the material unloading device, and cannot solve other tasks at the same time, which seriously affects the work efficiency and dicing output. Summary of the invention

[0004] In view of this, an embodiment of the present application provides a dicing machine unloading device to solve the problem that the unloading device is easily filled up and manual cleaning is troublesome.

[0005] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0006] A dicing machine unloading device, comprising:

[0007] A frame, wherein the frame is provided with a lower hopper, a lower opening is provided on the bottom surface of the lower hopper, a lofting slope is provided between the bottom surface of the lower hopper and the lower opening, and the lofting slope is inclined downward from outside to inside;

[0008] A baffle, the baffle is hingedly arranged at the material discharge port, a sliding groove is arranged on the side of the baffle away from the material discharge port; the end of the baffle away from the hinged end is aligned with the material discharge port in the upper and lower directions;

[0009] A spring, wherein the first end of the spring is fixed to the bottom surface of the frame, and the other end of the spring is provided with a shaft ring, in which a ball is rotatably provided, and the ball is located directly below the discharge port; the spring is located in the sliding groove, and the ball is rollingly connected to the sliding groove.

[0010] To further optimize the technical solution, the frame is provided with universal wheels for easy movement, and the lower hopper is provided with push-pull handrails.

[0011] To further optimize the technical solution, an inclined surface is provided on the side of the baffle plate close to the discharge port, and the inclined surface is inclined downward from the hinged end to the other end.

[0012] To further optimize the technical solution, a material storage trough is provided on the side of the inclined surface away from the hinged end.

[0013] To further optimize the technical solution, the side wall of the lower hopper is an inclined wall, and the inclined wall is inclined toward the direction of the lower feed port.

[0014] The dicing machine unloading device provided in the embodiment of the present application has at least the following beneficial effects:

[0015] In the dicing machine unloading device provided in the embodiment of the present application, the waste chips generated by the dicing machine during operation will enter the unloading hopper, and the waste chips entering the unloading hopper will fall on the lofting slope, and then the waste chips will slide to the surface of the baffle at the unloading port under the action of gravity. As the waste chips continue to accumulate, when the gravity of the waste chips is greater than the elastic force of the spring, the waste chips will squeeze the baffle downward to shorten the spring and drive the ball to move along the sliding groove. At this time, the baffle rotates along the hinged end, and the waste chips can be automatically discharged from the gap between the baffle and the unloading port. When the gravity of the waste chips is less than the elastic force, the baffle will re-block the unloading port under the action of the spring. The above-mentioned structural design can realize the automatic unloading function of the unloading device, which solves the problem of low efficiency caused by manual processing in the traditional mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of a dicing machine unloading device according to an embodiment of the present application;

[0018] Figure 2 This is a schematic diagram of the top view of the unloading device of the dicing machine according to an embodiment of the present application;

[0019] Figure 3 This is a bottom view structural diagram of a dicing machine unloading device according to an embodiment of the present application;

[0020] Figure 4 This is a schematic diagram of the side sectional structure of the dicing machine unloading device according to an embodiment of the present application.

[0021] In the figure:

[0022] 100, frame; 200, discharge hopper; 210, discharge port; 220, lofting slope; 230, inclined wall; 300, baffle; 310, sliding groove; 320, inclined surface; 330, storage trough; 400, spring; 410, shaft ring; 420, ball bearing; 500, universal wheel; 600, push-pull handrail. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.

[0024] A dicing machine unloading device, comprising:

[0025] A frame 100, wherein the frame 100 is provided with a lower hopper 200, a lower opening 210 is provided on the bottom surface of the lower hopper 200, a lofting slope 220 is provided between the bottom surface of the lower hopper 200 and the lower opening 210, and the lofting slope 220 is inclined downward from outside to inside;

[0026] The baffle 300 is hingedly disposed at the material discharge port 210, and a sliding groove 310 is disposed on the side of the baffle 300 away from the material discharge port 210; the end of the baffle 300 away from the hinged end is aligned with the material discharge port 210 in the upper and lower directions;

[0027] A spring 400, wherein the first end of the spring 400 is fixed to the bottom surface of the frame 100, and the other end of the spring 400 is provided with a shaft ring 410, and a ball 420 is rotatably provided in the shaft ring 410, and the ball 420 is located directly below the discharge port 210; the spring 400 is located in the sliding groove 310, and the ball 420 is rollingly connected to the sliding groove 310.

[0028] To further optimize the technical solution, the frame 100 is provided with universal wheels 500 for easy movement, and the lower hopper 200 is provided with a push-pull handrail 600.

[0029] To further optimize the technical solution, the side of the baffle 300 close to the discharge port 210 is provided with an inclined surface 320, and the inclined direction of the inclined surface 320 is downwardly inclined from the hinged end to the other end.

[0030] To further optimize the technical solution, a material storage trough 330 is provided on the side of the inclined surface 320 away from the hinged end.

[0031] To further optimize the technical solution, the side wall of the lower hopper 200 is an inclined wall 230 , and the inclined wall 230 is inclined toward the direction of the lower material port 210 .

[0032] like Figure 1-Figure 4 As shown, the dicing machine unloading device provided in the embodiment of the present application includes a frame 100, a unloading hopper 200, a baffle 300 and a spring 400, wherein the frame 100 is a bearing mechanism of the unloading device, and the unloading hopper 200, the baffle 300 and the spring 400 are all mounted on the frame 100. The unloading hopper 200 is mounted on the frame 100, and the unloading hopper 200 is used to hold the waste generated during the operation of the dicing machine. A unloading port 210 is provided on the bottom surface of the unloading hopper 200, and a lofting slope 220 is provided between the bottom surface of the unloading hopper 200 and the opening of the unloading port 210.

[0033] In this embodiment, the lofting slope 220 is a surface with a certain slope, and the lofting slope 220 gradually slopes downward from the inside to the outside, that is, the bottom surface of the lower hopper 200 slopes downward from the outside to the lower material port 210. In this way, the waste chips entering the lower hopper 200 can slide along the lofting slope 220 toward the lower material port 210.

[0034] The baffle 300 is hingedly arranged at the discharge port 210, and one end of the baffle 300 is a rotation axis. When the baffle 300 is parallel to the bottom surface of the discharge hopper 200, the discharge port 210 can be blocked; when the baffle 300 rotates, a certain gap will be generated between the baffle 300 and the discharge port 210. Among them, the end of the baffle 300 away from the hinged end is located directly below the discharge port 210, so that the waste chips entering the discharge hopper 200 can directly fall onto the end surface of the baffle 300 away from the hinged end through the discharge port 210. In this embodiment, a sliding groove 310 is also provided on the bottom surface of the baffle 300 away from the discharge port 210, and the sliding groove 310 is provided along the length direction of the baffle 300.

[0035] A mounting plate is provided on the bottom surface of the lower hopper 200, and the mounting plate is perpendicular to the bottom surface of the lower hopper 200. A spring 400 is provided on the mounting plate, and the spring 400 is located in the sliding groove 310, and one end of the spring 400 is connected to a ball 420 through a shaft ring 410, and the ball 420 can rotate at a fixed point in the shaft ring 410, and the ball 420 is also connected to the bottom surface of the sliding groove 310 by rolling. Therefore, when a certain amount of waste chips accumulates on the end surface of the baffle 300 away from the hinge end, the waste chips will squeeze the baffle 300 to make it rotate, thereby squeezing the spring 400 to stretch and drive the ball 420 to slide along the sliding groove 310, and a gap will be generated between the baffle 300 and the lower material port 210, and the waste chips can be discharged outward from the gap, thereby realizing the function of automatic discharging.

[0036] In the dicing machine feeding device provided in the embodiment of the present application, the waste generated by the dicing machine during operation will enter the feeding hopper 200, and the waste entering the feeding hopper 200 will fall on the lofting slope 220, and then the waste will slide to the surface of the baffle 300 at the feeding port 210 under the action of gravity. As the waste continues to accumulate, when the gravity of the waste is greater than the elastic force of the spring 400, the waste will squeeze the baffle 300 downward to shorten the spring 400 and drive the ball 420 to move along the sliding groove 310. At this time, the baffle 300 rotates along the hinged end, and the waste can be automatically discharged from the gap between the baffle 300 and the feeding port 210. When the gravity of the waste is less than the elastic force, the baffle 300 will re-block the feeding port 210 under the action of the spring 400. The above-mentioned structural design can realize the automatic discharge function of the feeding device, which solves the problem of relying on manual processing in the traditional mode, thereby resulting in low efficiency.

[0037] In some embodiments, the top surface of the baffle 300 near the discharge port 210 is provided with an inclined surface 320, and the inclined direction of the inclined surface 320 is gradually inclined downward from the hinged end to the other end, so that the waste can be gathered to the greatest extent toward the end surface of the baffle 300 away from the hinged end, so as to facilitate timely discharge. In addition, a storage trough 330 can also be provided at the end surface of the baffle 300 away from the hinged end, and the storage trough 330 can further improve the discharge efficiency of the discharge device.

[0038] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0039] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0040] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0041] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0042] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0043] The term "substrate" as used herein refers to the material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned, or may remain unpatterned. In addition, the substrate may include a wide range of materials, such as silicon, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material (e.g., glass, plastic, or sapphire wafer, etc.).

[0044] The term "layer" used in the text may refer to a material portion including an area with a certain thickness. A layer may extend over the entire underlying structure or overlying structure, or may have a range smaller than the range of the underlying or overlying structure. In addition, a layer may be an area of ​​a homogeneous or inhomogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer may be located between the top surface and the bottom surface of the continuous structure or between any paired lateral planes at the top surface and the bottom surface. A layer may extend laterally, vertically and / or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and / or may have one or more layers located thereon, above it and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductors and a contact layer (forming contacts, interconnects and / or vias therein) and one or more dielectric layers.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A dicing machine unloading device, characterized in that: include: A frame, wherein the frame is provided with a lower hopper, a lower opening is provided on the bottom surface of the lower hopper, a lofting slope is provided between the bottom surface of the lower hopper and the lower opening, and the lofting slope is inclined downward from outside to inside; A baffle, the baffle is hingedly arranged at the material discharge port, a sliding groove is arranged on the side of the baffle away from the material discharge port; the end of the baffle away from the hinged end is aligned with the material discharge port in the upper and lower directions; A spring, wherein the first end of the spring is fixed to the bottom surface of the frame, and the other end of the spring is provided with a shaft ring, in which a ball is rotatably provided, and the ball is located directly below the discharge port; the spring is located in the sliding groove, and the ball is rollingly connected to the sliding groove.

2. The dicing machine unloading device according to claim 1, characterized in that: The frame is provided with universal wheels for easy movement, and the lower hopper is provided with push-pull handrails.

3. The dicing machine unloading device according to claim 1, characterized in that: The side surface of the baffle plate close to the discharge port is provided with an inclined surface, and the inclined direction of the inclined surface is downwardly inclined from the hinged end to the other end.

4. The dicing machine unloading device according to claim 3, characterized in that: A material storage trough is arranged on one side of the inclined surface away from the hinged end.

5. The dicing machine unloading device according to claim 1, characterized in that: The side wall of the lower hopper is an inclined wall, and the inclined wall is inclined toward the direction of the lower material port.

Citation Information

Cited By

  • A raceway polishing device for deep groove ball bearing processing and its use method

    CN119772712A