Wafer vacuum buffer device

Abstract

The utility model relates to the field of wafer processing, in particular to a wafer vacuum buffer device. The utility model provides a wafer vacuum buffer device which can keep negative pressure in an equipment hose when a vacuum pump is damaged, can clamp and fix the hose, and avoids loss caused by the fact that a wafer flies out and is crashed. A wafer vacuum buffer device comprises connecting plates, connecting pipes, a negative pressure pipe and the like, the left portion and the right portion of the negative pressure pipe are both connected with the connecting pipes, and the sides, away from each other, of the connecting pipes are both connected with the connecting plates. The negative pressure in the negative pressure pipe disappears, so that the spring rebounds to drive the position pressing pipe to reset, the position pressing pipe and the negative pressure pipe are not communicated any more, and then the clamping plates get close to each other and make contact with the hose, so that the negative pressure in the equipment hose can be still kept when the vacuum pump is damaged, and the hose can be clamped and fixed; and the wafer is prevented from flying out and being broken to cause loss.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a wafer vacuum buffer device. Background Art

[0002] As we all know, during the process of coating and developing wafers in fully automatic semiconductor equipment, the wafers are mostly in the process of high-speed rotation. The way to fix the wafers to ensure stable and high-speed rotation is mostly achieved through vacuum adsorption.

[0003] As mentioned above, during the high-speed rotation of the wafer, if there is a sudden vacuum leak in the equipment or a problem with the vacuum system supply, it is very likely that the wafer will fly out. Although general equipment has a relatively closed protection chamber to prevent the wafer from flying out and injuring people, most of the wafers have been broken. This will also cause certain losses.

[0004] Therefore, a wafer vacuum buffer device has been developed which can maintain negative pressure in the equipment hose when the vacuum pump is damaged, and can clamp the hose to prevent the wafer from flying out and breaking and causing losses. Utility Model Content

[0005] In order to overcome the disadvantage that during the high-speed rotation of the wafer, if there is a sudden vacuum leakage in the equipment or a problem with the vacuum system supply, the wafer is very likely to fly out, the utility model provides a wafer vacuum buffer device which can maintain negative pressure in the equipment hose when the vacuum pump is damaged and can clamp and fix the hose to avoid the wafer flying out and breaking and causing loss.

[0006] A wafer vacuum buffer device comprises a connecting plate, a connecting pipe, a negative pressure pipe, a spring, a pressure pipe and a clamping mechanism, wherein the left and right parts of the negative pressure pipe are connected with connecting pipes, the connecting pipes are connected with connecting plates on the sides away from each other, the negative pressure pipe is slidably connected with the pressure pipe, a spring is connected between the pressure pipe and the negative pressure pipe, the pressure pipe is located inside the left connecting pipe, and a clamping mechanism capable of clamping the hose is provided between the connecting plates. When the vacuum pump is damaged and cannot operate, the negative pressure in the negative pressure pipe disappears, causing the spring to rebound, driving the pressure pipe to reset, so that the pressure pipe and the negative pressure pipe are no longer connected.

[0007] Optionally, the clamping mechanism includes a connecting cover, a clamping plate, a first gear, a second gear and a rotating shaft. The connecting covers are connected to the connecting plates, and multiple clamping plates are slidably connected on the side of the connecting covers that are away from each other. The first gear is slidably connected between adjacent clamping plates. The rotating shaft is rotatably connected between the upper parts of the connecting covers, and the second gears are connected on the left and right sides of the rotating shaft. The second gears are meshed with adjacent first gears. The first gear is rotated to make the clamping plates slide away from each other on the connecting covers, and then the hose is passed into the connecting plate. Thereafter, the rotating shaft is rotated to make the clamping plates approach each other and contact the hose.

[0008] Optionally, gaskets are provided on the splints.

[0009] Optionally, each of the first gears has a through hole.

[0010] Optionally, a handle is provided on the rotating shaft.

[0011] Optionally, a locking mechanism is also included, which includes a locking plate and a latch. The locking plate is slidably connected to the middle of the rotating shaft, and the latch is clamped between the locking plate and the left connecting tube. When the rotating shaft no longer rotates, the sliding locking plate is close to the left connecting tube, and then the latch is clamped and matched with the locking plate and the left connecting tube.

[0012] The beneficial effects of the utility model are as follows: 1. The utility model causes the negative pressure in the negative pressure tube to disappear, causing the spring to rebound, driving the pressure tube to reset, so that the pressure tube and the negative pressure tube are no longer connected, and then the clamping plates are brought close to each other and in contact with the hose, so that when the vacuum pump is damaged, the negative pressure in the equipment hose can still be maintained, and the hose can be clamped and fixed to avoid the loss caused by the wafer flying out and being smashed.

[0013] 2. The utility model achieves the effect of being able to fix the shaft in place and prevent the hose from loosening due to the rotation of the shaft by sliding the clamping plate close to the left connecting pipe when the shaft stops rotating and then engaging the latch with the clamping plate and the left connecting pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0015] Figure 2 It is a partial three-dimensional structural cross-sectional schematic diagram of the utility model.

[0016] Figure 3 It is a schematic cross-sectional view of the three-dimensional structure of the clamping mechanism of the utility model.

[0017] Figure 4 It is a schematic cross-sectional view of the three-dimensional structure of the clamping mechanism of the utility model.

[0018] Figure 5 It is a three-dimensional structural schematic diagram of the locking mechanism of the utility model.

[0019] Markings in the accompanying drawings: 1: connecting plate, 2: connecting pipe, 3: negative pressure pipe, 4: spring, 5: pressure pipe, 6: clamping mechanism, 61: connecting cover, 62: clamping plate, 63: first gear, 64: second gear, 65: rotating shaft, 7: locking mechanism, 71: clamping plate, 72: latch. DETAILED DESCRIPTION

[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0021] A wafer vacuum buffer device, such as Figure 1 and Figure 2 As shown, it includes a connecting plate 1, a connecting tube 2, a negative pressure tube 3, a spring 4, a pressure tube 5 and a clamping mechanism 6. The left and right parts of the negative pressure tube 3 are connected to the connecting tube 2, and the connecting plates 1 are connected to the sides of the connecting tubes 2 that are away from each other. The negative pressure tube 3 is slidably connected to the pressure tube 5, and a spring 4 is connected between the pressure tube 5 and the negative pressure tube 3. The pressure tube 5 is located inside the left connecting tube 2, and a clamping mechanism 6 is provided between the connecting plates 1.

[0022] like Figure 1 , Figure 3 and Figure 4 As shown, the clamping mechanism 6 includes a connecting cover 61, a clamping plate 62, a first gear 63, a second gear 64 and a rotating shaft 65. The connecting covers 61 are connected to the connecting plates 1. A plurality of clamping plates 62 are slidably connected to the side of the connecting cover 61 that is away from each other. Gaskets are provided on the clamping plates 62 to avoid wear on the hose. First gears 63 are slidably connected between adjacent clamping plates 62. Through holes are provided on the first gears 63 to facilitate the entry of the hose. A rotating shaft 65 is rotatably connected between the upper parts of the connecting covers 61. A handle is provided on the rotating shaft 65 to facilitate grasping and rotation. Second gears 64 are connected to the left and right sides of the rotating shaft 65, and the second gears 64 are meshed with the adjacent first gears 63.

[0023] When using the utility model, firstly, the vacuum pump hose and the equipment hose are connected to the negative pressure pipe 3 and the pressure pipe 5 respectively through the connecting plate 1 and the connecting pipe 2. When it is necessary to adsorb the wafer, the vacuum pump is started to generate negative pressure in the negative pressure pipe 3, so that the pressure pipe 5 moves to the right, and the spring 4 is squeezed and contracted, so that the pressure pipe 5 is connected to the negative pressure pipe 3, so that negative pressure is generated in the equipment hose to adsorb the wafer. When the vacuum pump is damaged and cannot operate, the negative pressure in the negative pressure pipe 3 disappears, so that the spring 4 rebounds, driving the pressure pipe 5 to reset, so that the pressure pipe 5 is connected to the negative pressure pipe 3. 3 is no longer connected. When the hose is passed into the connecting plate 1, the rotating shaft 65 is first rotated to drive the second gear 64 to rotate, so that the second gear 64 and the first gear 63 are meshed and moved, so that the first gear 63 is rotated, so that the clamping plates 62 slide on the connecting cover 61 and move away from each other, and then the hose is passed into the connecting plate 1. After that, the rotating shaft 65 is rotated to make the clamping plates 62 approach each other and contact the hose, so that the negative pressure in the equipment hose can be maintained when the vacuum pump is damaged, and the hose can be clamped and fixed to avoid the loss caused by the wafer flying out and being smashed.

[0024] like Figure 1 and Figure 5 As shown, a locking mechanism 7 is also included. The locking mechanism 7 includes a locking plate 71 and a latch 72. The middle of the rotating shaft 65 is slidably connected with the locking plate 71, and the latch 72 is locked between the locking plate 71 and the left connecting pipe 2.

[0025] By using the locking mechanism 7 of the device, the rotating shaft 65 can be fixed. When the rotating shaft 65 no longer rotates, the sliding locking plate 71 is close to the left connecting pipe 2, and then the latch 72 is engaged with the locking plate 71 and the left connecting pipe 2, thereby playing the role of locking and fixing the rotating shaft 65 to prevent the rotating shaft 65 from rotating and causing the hose to loosen.

[0026] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer vacuum buffer device, characterized in that: The invention comprises a connecting plate (1), a connecting pipe (2), a negative pressure pipe (3), a spring (4), a pressure pipe (5) and a clamping mechanism (6); the left and right parts of the negative pressure pipe (3) are both connected to the connecting pipe (2); the connecting plate (1) is connected to the side of the connecting pipe (2) that is away from each other; the negative pressure pipe (3) is slidably connected to the pressure pipe (5); a spring (4) is connected between the pressure pipe (5) and the negative pressure pipe (3); the pressure pipe (5) is located inside the left connecting pipe (2); a clamping mechanism (6) capable of clamping the hose is provided between the connecting plates (1); when the vacuum pump is damaged and cannot operate, the negative pressure in the negative pressure pipe (3) disappears, so that the spring (4) rebounds, driving the pressure pipe (5) to reset, so that the pressure pipe (5) and the negative pressure pipe (3) are no longer connected.

2. The wafer vacuum buffer device according to claim 1, characterized in that: The clamping mechanism (6) comprises a connecting cover (61), a clamping plate (62), a first gear (63), a second gear (64) and a rotating shaft (65). The connecting plates (1) are all connected with the connecting covers (61). A plurality of clamping plates (62) are slidably connected on the side of the connecting covers (61) away from each other. The first gear (63) is slidably connected between adjacent clamping plates (62). The upper part of the connecting cover (61) is rotatably connected with the rotating shaft (65). The left and right sides of the rotating shaft (65) are all connected with the second gear (64). The second gear (64) is meshed with the adjacent first gear (63), so that the first gear (63) rotates, so that the clamping plates (62) slide away from each other on the connecting cover (61), and then the hose is passed into the connecting plate (1). Thereafter, the rotating shaft (65) is rotated so that the clamping plates (62) approach each other and contact the hose.

3. A wafer vacuum buffer device according to claim 2, characterized in that: Gaskets are arranged on the clamping plates (62).

4. The wafer vacuum buffer device according to claim 2, characterized in that: The first gear (63) is provided with a through hole.

5. The wafer vacuum buffer device according to claim 2, characterized in that: A handle is provided on the rotating shaft (65).

6. The wafer vacuum buffer device according to claim 2, characterized in that: The invention also comprises a locking mechanism (7), which comprises a locking plate (71) and a latch (72). The middle part of the rotating shaft (65) is slidably connected with the locking plate (71), and the latch (72) is locked between the locking plate (71) and the left connecting pipe (2). When the rotating shaft (65) stops rotating, the sliding locking plate (71) is close to the left connecting pipe (2), and then the latch (72) is locked with the locking plate (71) and the left connecting pipe (2).

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