Heat uniformizing structure of camera module

Abstract

The utility model discloses a heat uniformizing structure of a camera module, which comprises a PCB (Printed Circuit Board) and a lens carried on the PCB, one side of the PCB far away from the lens is provided with an electronic component, one side of the PCB is provided with backlight, the electronic component is in contact with the backlight, and the electronic component is in contact with the backlight. A first heat uniformizing film used for uniformizing heat is arranged between the electronic component and the backlight. The heat uniformizing structure has the effects of uniformizing and isolating heat generated by the electronic component, and preventing the backlight performance from being influenced by direct contact of high temperature and backlight.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a heat-uniform structure of a camera module. Background Art

[0002] The camera module is composed of capacitors, chips, components, connectors, flexible circuit boards, lens + holder integrated materials and other main parts. Some camera modules need to use voltage chips or signal conversion chips because of the need for interface conversion or voltage conversion. These chips are often prone to heat up when working due to the large conversion voltage difference. They can reach a high temperature of 70°C after working for one or two minutes. These chips are generally designed on FPC or PCB and exposed. However, when the camera module is assembled, especially for smaller consumer products such as mobile phones and other handheld devices, these chips will directly contact the back of the display screen, and the back of the display screen is generally a backlight or other thin plastic frame. If it is exposed to high temperature for a long time, it will cause yellow spots to appear at the backlight contact position, or the plastic frame will deform, affecting the display effect or function of the whole machine. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a uniform heat structure for a camera module.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A uniform heat distribution structure of a camera module comprises: a PCB board and a lens mounted on the PCB board, electronic components are arranged on a side of the PCB board away from the lens, a backlight is arranged on one side of the PCB, the electronic components are in contact with the backlight, and a first uniform heat distribution film for uniform heat distribution is arranged between the electronic components and the backlight.

[0006] In one embodiment, one side of the first heat-distributing film is attached to the electronic component, and the size of the first heat-distributing film is about 10 times the size of the electronic component.

[0007] In one embodiment, the thickness of the first heat-dissipating film is 0.1 mm-0.5 mm.

[0008] In one embodiment, the first heat-leveling film is composed of a contact portion and a heat-leveling portion, the contact portion is in contact with the electronic component, and the first heat-leveling film except for the area in contact with the electronic component is the heat-leveling portion.

[0009] In one embodiment, the thickness of the contact portion is 0.1 mm.

[0010] In one embodiment, the thickness of the uniform heating portion is 0.5 mm.

[0011] In one embodiment, a second heat-distributing film is attached to a side of the backlight away from the electronic components, and the second heat-distributing film is used to further reduce the temperature of the backlight.

[0012] In one embodiment, the size of the second heat-distributing film is adapted to the size of the backlight.

[0013] In one embodiment, the thickness of the second heat-dissipating film is 0.1 mm-0.5 mm.

[0014] In one embodiment, the first heat-leveling film and the second heat-leveling film both include black PET paper, a heat-leveling material, and a heat-conductive double-sided adhesive that are sequentially arranged.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] 1. The heat distribution structure of a camera module of the utility model is provided with a first heat distribution film between the electronic components and the backlight. The first heat distribution film distributes and isolates the heat generated by the electronic components, so as to minimize the heat conducted from the electronic components to the backlight, thereby ensuring the performance of the backlight;

[0017] 2. The heat uniformity structure of a camera module of the present invention is provided with a second heat uniformity film attached to the backlight, and the second heat uniformity film is used to further uniformly heat the heat conducted to the backlight, so that the temperature at the backlight position is within a normal range. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 A schematic diagram of the side structure of a uniform heat structure of a camera module provided by the utility model;

[0020] Figure 2 A schematic diagram of the structure in which electronic components are in contact with a first uniform heat film in a uniform heat structure of a camera module provided by the utility model;

[0021] Figure 3 A schematic diagram of the stacking structure of a first uniform heating film and a second uniform heating film in a uniform heating structure of a camera module provided by the utility model.

[0022] Description of the drawings: 10, PCB board; 20, lens; 30, electronic components; 40, backlight; 50, first heat-distributing film; 51, contact part; 52, heat-distributing part; 60, second heat-distributing film; 70, black PET paper; 80, heat-distributing material; 90, thermally conductive double-sided adhesive. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0024] A uniform heat structure of a camera module, referring to Figure 1 , including a PCB board 10 and a lens 20 mounted on the PCB board 10, an electronic component 30 is arranged on the PCB board 10, and the electronic component 30 is located on a side of the PCB board 10 away from the lens 20. The electronic component 30 is an electronic component 30 that is easy to generate heat, such as a buck-boost chip, and such electronic component 30 will generate heat when the camera module is working.

[0025] Reference Figure 1 , a backlight 40 is provided on the side of the PCB board 10 away from the lens 20, and the electronic components 30 on the PCB board 10 are in contact with the backlight 40. Since the electronic components 30 on the PCB board 10 are heat-prone electronic components 30, they will emit a large amount of heat during operation, and the electronic components 30 are in direct contact with the backlight 40, which will affect the performance of the backlight 40. Therefore, a first heat-distributing film 50 for heat distribution is provided between the electronic components 30 and the backlight 40. The first heat-distributing film 50 is attached to the electronic components 30 to isolate the electronic components 30 and the backlight 40 to a certain extent, and the first heat-distributing film 50 can distribute the heat evenly, and the heat emitted by the electronic components 30 is dispersed on the entire first heat-distributing film 50 to reduce the temperature.

[0026] Reference Figure 1 The size of the first heat-distributing film 50 is determined according to the temperature sensitivity of the backlight 40. The size of the first heat-distributing film 50 is about 10 times the size of the electronic component 30. The larger the first heat-distributing film 50 is, the lower the temperature of the electronic component 30 dispersed on the first heat-distributing film 50 is, so as to quickly cool down and avoid the temperature perceived by the backlight 40 being too high and affecting the performance.

[0027] Reference Figure 1 and Figure 2 The thickness of the first heat-uniform film 50 is 0.1 mm-0.5 mm. The thickness of the first heat-uniform film 50 can be determined according to the internal space of the whole machine. The greater the thickness of the first heat-uniform film 50, the better the heat-uniform effect.

[0028] Reference Figure 1 and Figure 2 The first heat-leveling film 50 is composed of a contact portion 51 and a heat-leveling portion 52. The contact portion 51 is used to contact the electronic component 30. The first heat-leveling film 50 except the area in contact with the electronic component 30 is the heat-leveling portion 52. The contact portion 51 contacts the electronic component 30 to conduct heat to the electronic component 30. The heat-leveling portion 52 is used to evenly distribute the conducted heat to the entire area of ​​the heat-leveling portion 52 to reduce the temperature.

[0029] Reference Figure 1 and Figure 2 Since the contact portion 51 is the contact position between the electronic component 30 and the backlight 40, in order to reduce the contact space, the thickness of the contact portion 51 is 0.1 mm, and the uniform heating portion 52 only contacts one side of the backlight 40, the thickness of the uniform heating portion 52 can be increased accordingly, and the thickness of the uniform heating portion 52 is 0.5 mm.

[0030] Reference Figure 1 and Figure 2 In addition to attaching the first heat-leveling film 50 to the heat source, i.e., the electronic component 30, a second heat-leveling film 60 is attached to the backlight 40 in contact with the electronic component 30. The second heat-leveling film 60 is attached to the back side of the backlight 40, i.e., the side of the backlight 40 away from the electronic component 30. The size of the second heat-leveling film 60 is adapted to the size of the backlight 40, and the second heat-leveling film 60 is used to further reduce the temperature of the backlight 40 to ensure the performance of the backlight 40.

[0031] Reference Figure 1 and Figure 2 The thickness of the second uniform heat film 60 is 0.1 mm-0.5 mm.

[0032] Reference Figure 3 The first heat-leveling film 50 and the second heat-leveling film 60 are both multi-layer composite material structures. The first heat-leveling film 50 and the second heat-leveling film 60 both include black PET paper 70, heat-leveling material 80 and heat-conducting double-sided adhesive 90 arranged in sequence. Among them, the heat-conducting double-sided adhesive 90 of the first heat-leveling film 50 is attached to the electronic component 30, and the heat-conducting double-sided adhesive 90 is used to conduct heat from the contacted object. The heat is evenly heated by the heat-leveling material 80, and then the heat is isolated by the black PET paper 70 to minimize the heat conducted from the electronic component 30 to the backlight 40. The heat-conducting double-sided adhesive 90 of the second heat-leveling film 60 is attached to the backlight 40, and the second heat-leveling film 60 is used to further evenly heat the heat conducted to the backlight 40, thereby ensuring the performance of the backlight 40.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A uniform heat structure for a camera module, characterized in that: include: A PCB board (10) and a lens (20) mounted on the PCB board (10); an electronic component (30) is arranged on a side of the PCB board (10) away from the lens (20); a backlight (40) is arranged on one side of the PCB; the electronic component (30) is in contact with the backlight (40); and a first heat-distributing film (50) for distributing heat is arranged between the electronic component (30) and the backlight (40).

2. The uniform heat structure of a camera module according to claim 1, characterized in that: One side of the first heat-distributing film (50) is attached to the electronic component (30), and the size of the first heat-distributing film (50) is approximately 10 times the size of the electronic component (30).

3. The uniform heat structure of a camera module according to claim 2, characterized in that: The thickness of the first heat-dissipating film (50) is 0.1 mm-0.5 mm.

4. The uniform heat structure of a camera module according to claim 3, characterized in that: The first heat-leveling film (50) consists of a contact portion (51) and a heat-leveling portion (52); the contact portion (51) is in contact with the electronic component (30); and the first heat-leveling film (50) except for the area in contact with the electronic component (30) is the heat-leveling portion (52).

5. The uniform heat structure of a camera module according to claim 4, characterized in that: The thickness of the contact portion (51) is 0.1 mm.

6. The uniform heat structure of a camera module according to claim 5, characterized in that: The thickness of the uniform heating portion (52) is 0.5 mm.

7. The uniform heat structure of a camera module according to claim 6, characterized in that: A second heat-dissipating film (60) is attached to a side of the backlight (40) away from the electronic component (30), and the second heat-dissipating film (60) is used to further reduce the temperature of the backlight (40).

8. The uniform heat structure of a camera module according to claim 7, characterized in that: The size of the second heat-dissipating film (60) is adapted to the size of the backlight (40).

9. The uniform heat structure of a camera module according to claim 8, characterized in that: The thickness of the second heat-dissipating film (60) is 0.1 mm-0.5 mm.

10. The uniform heat structure of a camera module according to claim 9, characterized in that: The first heat-leveling film (50) and the second heat-leveling film (60) both comprise black PET paper (70), a heat-leveling material (80) and a heat-conductive double-sided adhesive (90) which are arranged in sequence.

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