Printed circuit board (PCB) with covered edge
By setting up edge layers on the periphery edges of the substrate layer and insulating film layer of the PCB board, the problem of burr and debris contamination after punching is solved, and the performance and user experience of the product are improved.
Patent Information
- Application Number
- CN202421084621.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-17
AI Technical Summary
During the PCB production process, the periphery edges of the base material layer and the insulating film layer after being cut are rough, which easily forms burrs and debris, resulting in internal pollution of the product and affects performance.
A PCB board with edges is designed, and by providing edge layers on the four peripheral edges of the substrate layer and the insulating film layer, the glass fibers are prevented from falling off after punching, and bonding to the substrate layer and the insulating film layer.
It effectively avoids the glass fibers falling off after the substrate layer and insulating film layer, reduces internal pollution of the product and improves the product's performance experience.
Smart Images
Figure CN222441935U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of PCB circuit boards, in particular to a PCB board with an edge wrapping. Background Art
[0002] The main materials of PCB are resin and glass fiber, on which there are circuits to achieve certain functions. However, in the PCB production process, large pieces of PCB need to be punched and cut, and the edges around the PCB are rough, so burrs will be formed. When the module is assembled or transported, these burrs will form debris and fall off, causing internal contamination of the product, affecting the product's sound amplification, heat dissipation and other performance. Utility Model Content
[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a PCB board with a hemmed edge.
[0004] The purpose of this utility model is achieved through the following technical solutions:
[0005] A PCB board with hemming, characterized in that it comprises: a substrate layer, two insulating film layers and a plurality of solder pads;
[0006] The two insulating film layers are respectively arranged on opposite surfaces of the substrate layer, copper foil is attached to the inside of the substrate layer, a number of solder pads are arranged one by one through the insulating film layer, the copper foil and the substrate layer, a number of solder pads are arranged on the same surface of the insulating film layer, and a edging layer is arranged around the edges of the substrate layer and the two insulating film layers.
[0007] In one embodiment, the thickness of the edge layer is 0.1 mm to 0.5 mm.
[0008] In one of the embodiments, the PCB board with hemming further includes a copper block, wherein the copper block is disposed on the insulating film layer, and the copper block is electrically connected to the copper foil.
[0009] In one embodiment, at least one positioning hole is respectively formed in corresponding positions of the substrate layer and the two insulating film layers.
[0010] In one embodiment, the substrate layer and the insulating film layer are aligned.
[0011] In one of the embodiments, the PCB board with hemming further includes adhesive, and the insulating film layer and the substrate layer are bonded to each other by the adhesive.
[0012] In one of the embodiments, a steel plate for reinforcement is provided on a side of the insulating film layer away from the welding spot plate.
[0013] In one embodiment, a plurality of electronic components are soldered on the solder pad.
[0014] In one embodiment, the insulating film layer is an ink layer.
[0015] In one embodiment, the material of the substrate layer is resin and glass fiber.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] The PCB board with hemming of the utility model is provided with a substrate layer, two insulating film layers, a plurality of solder pads and an hemming layer, wherein the solder pads are provided through the substrate layer, the copper foil and the two insulating film layers. The hemming layer is bonded to the substrate layer and the two insulating film layers to prevent the glass fibers on the punched surfaces of the substrate layer and the insulating film layer from falling off after punching, thereby contaminating the interior of the product and the internal components and reducing the performance experience of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 It is a schematic cross-sectional structure diagram of a PCB board with hemming in one embodiment of the utility model;
[0020] Figure 2 The figure is a schematic diagram of the three-dimensional structure of a PCB board with hemming in one embodiment of the utility model.
[0021] Reference numerals:
[0022] A PCB board 100 with an edge binding, a base material layer 10, an insulating film layer 11, an edge binding layer 12, positioning holes 13, electronic components 14, and adhesive 15. DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0024] This application proposes a PCB board 100 with a hemmed edge. Figure 1 and Figure 2, including: a substrate layer 10, two insulating film layers 11, a plurality of solder pads and an edge layer 12. The insulating film layer 11 protects and insulates the substrate layer 10 and the copper foil. Among them, the materials of the substrate layer 10 are mainly resin and glass fiber, but the glass fiber is easy to fall off. The two insulating film layers 11 are respectively arranged on the opposite surfaces of the substrate layer 10. Copper foil is attached to the inside of the substrate layer 10, and a plurality of solder pads are arranged one by one on the insulating film layer 11, the copper foil and the substrate layer 10. A plurality of solder pads are arranged on the same surface of the insulating film layer 11. The edge layer 12 is bonded to the edges of the substrate layer 10 and the two insulating film layers 11, and the substrate layer 10 and the two insulating film layers 11 are edged to prevent the glass fibers on the punched surfaces of the substrate layer 10 and the insulating film layer 11 from falling off after punching, polluting the inside of the product and the internal devices, and reducing the performance experience of the product.
[0025] It should be noted that the edge layer 12 can be made by brushing glue on the punched surfaces of the substrate layer 10 and the insulating film layer 11, and the curing method can be self-curing or thermosetting. The thickness of the edge layer 12 is 0.1 mm to 0.5 mm, and preferably, the thickness of the edge layer 12 is 0.25 mm. If the thickness is too thick, the PCB will not be easy to assemble in the product, and the original product structure needs to be changed to adapt to the PCB. If the thickness is too thin, the edge layer 12 is easy to fall off.
[0026] In one embodiment, the PCB board 100 with hemming further includes a copper block, which is disposed on the insulating film layer 11 to improve the heat dissipation performance of the PCB board. The copper block is electrically connected to the copper foil to facilitate connection control with an external motherboard, components, etc. Further, the substrate layer 10 and the insulating film layer 11 are aligned so that the insulating film layer 11 can fully protect the substrate layer 10. Preferably, please refer to Figure 2 At least one positioning hole 13 is respectively formed at the corresponding position of the substrate layer 10 and the two insulating film layers 11. Each positioning hole 13 penetrates the substrate layer 10 and the insulating film layer 11 to facilitate the alignment of the PCB board 100 with hemming, so that the PCB board can be quickly assembled in the product and the shaking of the PCB board can be prevented.
[0027] In another embodiment, see Figure 1 The PCB board 100 with hemming further includes an adhesive 15 , and the insulating film layer 11 and the substrate layer 10 are bonded to each other through the adhesive 15 , so that the insulating film layer 11 and the substrate layer 10 are integrated.
[0028] For further information, see Figure 2 A number of electronic components 14 are soldered on the soldering pads. The electronic components 14 are connected in a certain relationship so that a circuit with specific functions is formed between the electronic components 14 to realize the function of the PCB board.
[0029] Furthermore, a steel plate for reinforcement is provided on the side of the insulating film layer 11 away from the solder joint disk. Since the texture of the PCB board 100 with the edge is relatively hard and some electronic components 14 are relatively heavy, the PCB board 100 with the edge may be broken or bent, causing the PCB board to be scrapped and need to be replaced and repaired, thereby reducing the user experience of the product.
[0030] In addition, the insulating film layer 11 is an ink layer, and the color of the ink layer is black, which can have a light-shielding effect and shield the substrate layer 10 and the copper foil.
[0031] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A PCB board with hemming, characterized in that: include: A substrate layer, two insulating film layers and a plurality of solder pads; The two insulating film layers are respectively arranged on opposite surfaces of the substrate layer, copper foil is attached to the inside of the substrate layer, a number of solder pads are arranged one by one through the insulating film layer, the copper foil and the substrate layer, a number of solder pads are arranged on the same surface of the insulating film layer, and a edging layer is arranged around the edges of the substrate layer and the two insulating film layers.
2. The PCB board with hemming according to claim 1, characterized in that: The thickness of the edge layer is 0.1 mm to 0.5 mm.
3. The PCB board with hemming according to claim 1, characterized in that: It also includes a copper block, which is arranged on the insulating film layer and is electrically connected to the copper foil.
4. The PCB board with hemming according to claim 1, characterized in that: The substrate layer and the two insulating film layers are respectively provided with at least one positioning hole at corresponding positions.
5. The PCB board with hemming according to claim 1, characterized in that: The substrate layer is aligned with the insulating film layer.
6. The PCB board with hemming according to claim 1, characterized in that: It also includes adhesive, and the insulating film layer and the substrate layer are bonded together by the adhesive.
7. The PCB board with hemming according to claim 1, characterized in that: A steel plate for reinforcement is arranged on a side of the insulating film layer away from the welding spot plate.
8. The PCB board with hemming according to claim 1, characterized in that: A plurality of electronic components are welded on the welding point plate.
9. The PCB board with hemming according to claim 1, characterized in that: The insulating film layer is an ink layer.
10. The PCB board with hemming according to claim 1, characterized in that: The materials of the substrate layer are resin and glass fiber.