LED packaging structure, LED display module and LED display screen

Abstract

The utility model provides an LED packaging structure. The LED packaging structure comprises a support, the support comprises a connecting part and at least two bowl cups, at least one LED chip is installed in each bowl cup, the at least two bowl cups are connected through the connecting part, a plurality of pins are arranged below each bowl cup, and the pins are connected with the connecting part. Therefore, equivalently, at least two single-lamp LED packaging structures are connected together through the bracket to form a multi-lamp LED packaging structure, and the pins for fixing the LED packaging structure are multiplied, so that the welding force of the single LED packaging structure is favorably improved, and the anti-collision capability of the LED packaging structure after welding is improved. The utility model further provides an LED display module comprising the LED packaging structure and an LED display screen comprising the LED display module.

Description

Technical Field

[0001] The utility model relates to the technical field of LED display, and in particular to an LED packaging structure, an LED display module and an LED display screen. Background Art

[0002] LED (light emitting diode) has the advantages of energy saving and environmental protection in lighting applications. LED has been widely used in display screens, LCD backlights, traffic lights, outdoor lighting and other fields, and has begun to penetrate into indoor lighting, automotive lighting, stage lighting, special lighting and other fields.

[0003] Figure 1 A top view of an LED packaging structure. Figure 2 A cross-sectional view of an LED packaging structure. Figure 3 This is a bottom view of an LED packaging structure. Figures 1 to 3 As shown, in the existing LED packaging structure, three LED chips 10 are installed in a bowl cup 11, the electrodes of the three LED chips 10 are led out through four pins 12 under the bowl cup 11, and the LED packaging structure is welded on the substrate through the four pins 12.

[0004] Usually, LED display modules are formed by welding multiple LED packaging structures on a substrate, and large-sized LED display screens are formed by splicing multiple LED display modules. In the process of splicing LED display modules of large-sized LED display screens, collisions between LED display modules are inevitable. The LED packaging structure on the LED display module is prone to welding detachment and light loss during the collision process. This problem is more prominent in rental screens that need to be frequently moved and assembled. Utility Model Content

[0005] The utility model provides an LED packaging structure, an LED display module and an LED display screen, which can improve the welding force of a single LED packaging structure, increase the anti-collision ability of the LED packaging structure after welding, solve the problem of LED display screens falling off due to collision and poor soldering, and improve the reliability of the LED display screen.

[0006] In order to achieve the above-mentioned purpose, the present embodiment provides an LED packaging structure on one hand. The LED packaging structure includes a bracket, the bracket includes a connecting portion and at least two cups, at least one LED chip is installed in each cup, at least two cups are connected by the connecting portion, and each cup has a plurality of pins below.

[0007] Optionally, the pins are welded on a substrate, and a mask is also provided on the substrate, wherein the mask has a window, and the window exposes the LED packaging structure welded on the substrate.

[0008] Optionally, the top surface of the connecting portion and the top surface of the mask are both surfaces away from the substrate, and the top surface of the connecting portion is flush with the top surface of the mask.

[0009] Optionally, the top surface of the connecting portion and the top surface of the mask both have a first pattern.

[0010] Optionally, the surface of the bowl or cup has a second texture, and the roughness of the second texture is greater than the roughness of the first texture.

[0011] Optionally, a portion of the pin is inside the bracket, and another portion is exposed from the bracket.

[0012] Optionally, the bowl and the connecting portion are an integral structure.

[0013] Optionally, the bracket includes two bowls and a connecting portion, and the two bowls are located at two ends of the connecting portion.

[0014] Optionally, the at least one LED chip installed in each of the bowl cups includes at least one of a red LED chip, a green LED chip and a blue LED chip.

[0015] Optionally, a red LED chip, a green LED chip and a blue LED chip are installed in each bowl cup; each bowl cup has four pins under it, one electrode of the red LED chip, one electrode of the green LED chip and one electrode of the blue LED chip are electrically connected to the same pin, and another electrode of the red LED chip, another electrode of the green LED chip and another electrode of the blue LED chip are electrically connected to the remaining three pins one by one respectively.

[0016] Optionally, the LED packaging structure further includes a packaging adhesive layer, and the packaging adhesive layer is filled in the bowl and covers the LED chip.

[0017] Another aspect of the present invention provides an LED display module, which includes a substrate and the above-mentioned LED packaging structure, wherein the pins of the LED packaging structure are welded on the substrate.

[0018] The utility model also provides an LED display screen, which comprises a plurality of the above-mentioned LED display modules.

[0019] Optionally, the LED display screen further comprises a mask, wherein the mask is disposed on the substrate, and the mask has a window, wherein the window exposes an LED packaging structure welded on the substrate.

[0020] Optionally, the top surface of the connecting portion of the LED packaging structure and the top surface of the mask are both surfaces away from the substrate, and the top surface of the connecting portion is flush with the top surface of the mask.

[0021] In the LED packaging structure, LED display module and LED display screen provided by the utility model, the LED packaging structure includes a bracket, the bracket includes a connecting part and at least two bowl cups, at least one LED chip is installed in each bowl cup, at least two bowl cups are connected by the connecting part, and a plurality of pins are provided under each bowl cup, and the pins are used to realize the electrical connection between the LED chip and the external circuit and fix the LED packaging structure, which is equivalent to connecting at least two single-lamp LED packaging structures together through the bracket to form a multi-lamp structure LED packaging structure, and the pins for fixing the LED packaging structure are doubled, which is conducive to improving the welding force of the single LED packaging structure, increasing the anti-collision ability of the LED packaging structure after welding, solving the problem of the LED display screen colliding and falling off the lamp and the cold welding, and improving the reliability of the LED display screen. In addition, since the LED packaging structure of the present application is a multi-lamp structure, completing the welding of an LED packaging structure of the present application is equivalent to completing the welding of multiple existing single-lamp LED packaging structures, thereby improving the welding efficiency of the LED display module and the LED display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A top view of an LED packaging structure.

[0023] Figure 2 A cross-sectional view of an LED packaging structure.

[0024] Figure 3 A bottom view of an LED packaging structure.

[0025] Figure 4 A three-dimensional diagram of a bracket of an LED packaging structure provided in one embodiment of the utility model.

[0026] Figure 5 A top view of an LED packaging structure provided by an embodiment of the utility model.

[0027] Figure 6 A cross-sectional view of an LED packaging structure provided by an embodiment of the utility model.

[0028] Figure 7 A bottom view of an LED packaging structure provided by an embodiment of the utility model.

[0029] Figure 8 A partial cross-sectional view of an LED display screen provided in one embodiment of the utility model.

[0030] Fig. 9A partial top view of an LED display screen provided in one embodiment of the utility model.

[0031] Description of reference numerals:

[0032] ( Figures 1 to 3 )10-LED chip; 11-bowl; 12-pin;

[0033] ( Figures 4 to 9 )20-bracket; 201-bowl; 202-connecting part; 202a-top surface of the connecting part; 203-injection hole; 21-pin; 30-LED chip; 301-red LED chip; 302-green LED chip; 303-blue LED chip; 40-packaging glue layer; 50-substrate; 60-mask; 601-window. DETAILED DESCRIPTION

[0034] In order to improve the welding force of a single LED packaging structure, increase the anti-collision ability of the LED packaging structure after welding, solve the problems of LED display screens falling off due to collision and cold soldering, and improve the reliability and welding efficiency of LED display screens, the utility model provides an LED packaging structure, an LED display module and an LED display screen.

[0035] The LED packaging structure, LED display module and LED display screen proposed by the present invention are further described in detail below in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0036] The terms "installed", "connected", and "connected" used in this specification should be understood in a broad sense, for example, they can be fixedly connected, detachably connected, or integrated; they can be directly connected or indirectly connected through an intermediate medium. Spatial relationship terms such as "under", "below", "below", "under", "above", "above", etc., can be used here for the convenience of description to describe the relationship between an element or feature shown in the figure and other elements or features. It should be understood that in addition to the orientation shown in the figure, the spatial relationship terms are intended to include different orientations of the device in use and operation. For example, if the device in the figure is turned over, then the elements or features described as "under other elements" or "below" or "below" will be oriented as "on" other elements or features. Therefore, the exemplary terms "above" and "on" can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0037] Figure 4 A three-dimensional diagram of a bracket of an LED packaging structure provided in one embodiment of the utility model. Figure 5 A top view of an LED packaging structure provided by an embodiment of the utility model. Figure 6 A cross-sectional view of an LED packaging structure provided by an embodiment of the utility model. Figure 7 A bottom view of an LED packaging structure provided by an embodiment of the utility model.

[0038] refer to Figures 4 to 7 As shown, the LED packaging structure provided in this embodiment includes a bracket 20, the bracket 20 includes a connecting portion 202 and at least two bowl cups 201, at least one LED chip is installed in each bowl cup 201, at least two bowl cups 201 are connected by the connecting portion 202, and each bowl cup 201 has a plurality of pins 21 under it, and the pins 21 are used to realize the electrical connection between the LED chip and the external circuit and fix the LED packaging structure.

[0039] The LED packaging structure of this embodiment is described below by taking an example in which the bracket 20 includes two cups 201 and a connecting portion 202 , and the two cups 201 are located at two ends of the connecting portion 202 .

[0040] like Figure 5 As shown, the LED packaging structure of this embodiment can be rectangular, with two cups 201 located at both ends and the connecting portion 202 located in the middle. In other embodiments, the number of cups 201 of an LED packaging structure can be three or four, etc., and the connecting portion 202 can connect these cups 201.

[0041] In this embodiment, the bracket 20 can be made of plastic. The plastic can be PPA, PCT or epoxy resin. In this embodiment, the plastic in the bracket 20 can be formed by one-time injection molding, part of the plastic is used as the bowl 201, and part of the plastic is used as the connecting part 202. The bowl 201 and the connecting part 202 are an integrated structure, which can improve the connection reliability of the connecting part 202 connecting the bowl 201.

[0042] refer to Figure 7 As shown, the injection hole 203 of the bracket 20 can be designed at the center of the back side of the bracket 20 , that is, the injection hole 203 can be located at the center of the connecting portion 202 , so as to ensure the uniformity of the filling during the injection molding of the rubber material, which is beneficial to improve the reliability of the bracket 20 .

[0043] For example, Figure 6 As shown, the top surface 202a of the connecting portion may be lower than the top surface of the bowl cup 201, and the outer side wall of the bowl cup 201 and the top surface 202a of the connecting portion define a groove, but the present invention is not limited thereto.

[0044] A pin 21 is disposed in the bracket 20, and a plurality of pins 21 are disposed under each bowl 201; a portion of the pin 21 may be embedded in the bracket 20, and another portion may be exposed from the bracket 20. The pin 21 may be made of metal, including but not limited to copper (Cu) or iron (Fe).

[0045] refer to Figure 5 and Figure 6 As shown, at least one LED chip 30 installed in each bowl cup 201 may include at least one of a red LED chip 301, a green LED chip 302, and a blue LED chip 303. The LED chips installed in the bowl cup 201 may be any combination of the three chips of red LED chip 301, green LED chip 302, and blue LED chip 303, and the number of LED chips of various light colors may be set as required. Exemplarily, one red LED chip 301, one green LED chip 302, and one blue LED chip 303 may be installed in each bowl cup 201, but the present invention is not limited thereto.

[0046] In this embodiment, the electrodes of the LED chip 30 installed in the bowl cup 201 are electrically connected to the pins 21 below the bowl cup 201 .

[0047] like Figure 5 and Figure 6 As shown, taking a bowl cup 201 in which a red LED chip 301, a green LED chip 302 and a blue LED chip 303 are installed as an example, correspondingly, each bowl cup 201 can have four pins 21, one electrode of the red LED chip 301, one electrode of the green LED chip 302 and one electrode of the blue LED chip 303 are all electrically connected to the same pin 21 (that is, they are all connected to a common pin 21), and another electrode of the red LED chip 301, another electrode of the green LED chip 302 and another electrode of the blue LED chip 303 are electrically connected to the remaining three pins 21 one by one, respectively.

[0048] It should be noted that, in the present embodiment, an LED packaging structure has two bowl cups 201, each bowl cup 201 has four pins 21 underneath, and the connecting portion 202 connects the two bowl cups 201 together, so that an LED packaging structure has 8 pins 21. Compared with an LED packaging structure with 4 pins in the prior art, the welding force and anti-collision ability of the LED packaging structure can be improved, and the problems of LED display screens falling off due to collision and poor soldering can be improved.

[0049] In this embodiment, the two bowls 201 of the LED packaging structure are both equipped with LED chips 30, so that the LED packaging structure of this embodiment is a dual-lamp structure, or a two-in-one structure. The width of the connecting portion 202 or the distance between the two bowls 201 can be set as needed, where "width" is Figure 5 and Figure 6 For example, the width of the connecting portion 202 may be equal to the spacing between two adjacent single-lamp LED packaging structures welded on the substrate in the prior art, so that the spacing between the light-emitting points remains unchanged, so that the display effect of the LED display module formed by assembling the dual-lamp LED packaging structure of this embodiment is consistent with that of the LED display module formed by assembling the single-lamp LED packaging structure.

[0050] refer to Figure 6 As shown, the bowl 201 is filled with a packaging glue layer 40, and the packaging glue layer 40 can cover the LED chip 30 in the bowl 201. Exemplarily, the material of the packaging glue layer 40 can be one of epoxy resin, silica gel, and silicone resin. The surface of the packaging glue layer 40 can be a convex curved surface, a plane, or a concave curved surface, and the surface can be higher, equal to, or lower than the top surface of the bowl 201. The packaging glue layer 40 can be used as a lens, which helps to improve the light efficiency and consistency of the LED packaging structure. The packaging glue layer 40 also serves as a sealing layer and a lens, which can improve the service life of the LED packaging structure.

[0051] refer to Figure 5 As shown, the surface of the bowl 201 can be made with a second texture, and the second texture on the surface of the bowl 201 can prevent the packaging glue layer 40 from expanding to the surface of the bowl 201 when it is in liquid state (i.e. before curing) to form a mirror reflection, resulting in poor consistency of the surface appearance of the LED packaging structure. Exemplarily, the roughness Ra of the second texture can be greater than or equal to 0.7μm; the second texture can be a granular texture, but is not limited thereto.

[0052] Figure 8 A partial cross-sectional view of an LED display screen provided in one embodiment of the utility model. Fig. 9 A partial top view of an LED display screen provided in one embodiment of the utility model.

[0053] refer to Figure 6 , Figure 8 and Fig. 9As shown, the pins 21 of the LED packaging structure of this embodiment are welded on the substrate 50, and a mask 60 is also provided on the substrate 50. The mask 60 has a window 601, and the window 601 exposes the LED packaging structure welded on the substrate 50. Among them, the mask 60 can protect the LED packaging structure and shield the welding position of the LED packaging structure, and the mask 60 can avoid side reflection to optimize the appearance of the display screen. The mask 60 can be spliced ​​on the top surface of the substrate 50 by pasting or bayoneting. The material of the mask 60 includes but is not limited to resin.

[0054] In this embodiment, the top surface of the connecting portion 202 and the top surface of the mask 60 are both surfaces away from the substrate 50. Fig. 9 As shown, the top surface of the connecting portion 202 is exposed from the window 601 of the mask 60, wherein the top surface of the connecting portion 202 is flush with the top surface of the mask 60, which can improve the consistency of the display screen (i.e., the consistency of the display screen when it is black).

[0055] Exemplarily, the top surface of the connecting portion 202 and the top surface of the mask 60 can both be made with a first texture, so that the roughness of the top surface of the connecting portion 202 is the same or similar to the roughness of the top surface of the mask 60, which can further improve the consistency of the display screen. The roughness of the first texture is less than the roughness of the second texture. Exemplarily, the roughness Ra of the first texture is less than or equal to 0.4 μm, and the first texture can be a planar texture, but is not limited thereto.

[0056] The manufacturing process of the LED packaging structure of this embodiment may include: designing and manufacturing a bracket 20; cleaning the bracket 20; installing the red LED chip 301, the green LED chip 302 and the blue LED chip 303 in the bowl 201 of the bracket 20; welding bonding wires to electrically connect the top surface electrodes of the red LED chip 301, the green LED chip 302 and the blue LED chip 303 to the pins 21 (this step is omitted if the LED chip is a flip chip); applying packaging glue and curing it to form a packaging glue layer 40.

[0057] This embodiment also provides an LED display module. Figures 4 to 9 As shown, the LED display module includes a substrate 50 and the above-mentioned LED packaging structure, and the pins 21 of the LED packaging structure are welded on the substrate 50.

[0058] This embodiment also provides an LED display screen, which may include a plurality of LED display modules spliced ​​together, and the LED display module includes a substrate 50 and an LED packaging structure welded to the substrate 50. Figures 4 to 9As shown, the LED packaging structure includes a bracket 20, the bracket 20 includes a connecting portion 202 and at least two bowl cups 201, at least one LED chip 30 is installed in each bowl cup 201, at least two bowl cups 201 are connected by the connecting portion 202, and each bowl cup 201 has a plurality of pins 21 at the bottom.

[0059] refer to Figure 8 and Fig. 9 As shown, the LED display screen further includes a mask 60 , which is disposed on the substrate 50 . The mask 60 has a window 601 , and the window 601 exposes the LED packaging structure welded on the substrate 50 .

[0060] In this embodiment, the top surface of the connecting portion 202 of the LED packaging structure and the top surface of the mask 60 are both surfaces away from the substrate 50. The top surface 202a of the connecting portion can be flush with the top surface of the mask 60, which can improve the consistency of the display screen.

[0061] In the LED packaging structure, LED display module and LED display screen provided by the utility model, the LED packaging structure includes a bracket 20, the bracket 20 includes a connecting portion 202 and at least two bowl cups 201, at least one LED chip 30 is installed in each bowl cup 201, at least two bowl cups 201 are connected by the connecting portion 202, and a plurality of pins 21 are provided under each bowl cup 201, the pins 21 are used to realize the electrical connection between the LED chip 30 and the external circuit and fix the LED packaging structure, which is equivalent to connecting at least two single-lamp LED packaging structures together through the bracket to form a multi-lamp structure LED packaging structure, and the pins for fixing the LED packaging structure are doubled, which is conducive to improving the welding force of the single LED packaging structure, increasing the anti-collision ability of the LED packaging structure after welding, solving the problem of the LED display screen colliding and falling off the lamp and the cold welding, and improving the reliability of the LED display screen; in addition, since the LED packaging structure of the present application is a multi-lamp structure, completing the welding of an LED packaging structure of the present application is equivalent to completing the welding of multiple existing single-lamp LED packaging structures, thereby improving the welding efficiency of the LED display module and the LED display screen.

[0062] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of rights of the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. An LED packaging structure, characterized in that: The invention comprises a bracket, wherein the bracket comprises a connecting portion and at least two bowl cups, at least one LED chip is installed in each bowl cup, at least two bowl cups are connected by the connecting portion, and a plurality of pins are arranged at the bottom of each bowl cup.

2. The LED packaging structure according to claim 1, characterized in that: The pins are welded on a substrate, and a mask is also arranged on the substrate. The mask has a window, and the window exposes the LED packaging structure welded on the substrate.

3. The LED packaging structure according to claim 2, characterized in that: The top surface of the connecting portion and the top surface of the mask are both surfaces away from the substrate, and the top surface of the connecting portion is flush with the top surface of the mask.

4. The LED packaging structure according to claim 2, characterized in that: The top surface of the connecting portion and the top surface of the mask both have first lines.

5. The LED packaging structure according to claim 4, characterized in that: The surface of the bowl has a second texture, and the roughness of the second texture is greater than the roughness of the first texture.

6. The LED packaging structure according to claim 1, characterized in that: A portion of the pin is inside the bracket, and another portion is exposed from the bracket.

7. The LED packaging structure according to claim 1, characterized in that: The bowl and the connecting portion are an integrated structure.

8. The LED packaging structure according to claim 1, characterized in that: The bracket includes two bowls and a connecting portion, and the two bowls are located at two ends of the connecting portion.

9. The LED packaging structure according to claim 1, characterized in that: The at least one LED chip installed in each bowl cup includes at least one of a red LED chip, a green LED chip and a blue LED chip.

10. The LED packaging structure according to claim 9, characterized in that: A red LED chip, a green LED chip and a blue LED chip are installed in each of the bowl cups; there are four pins under each of the bowl cups, one electrode of the red LED chip, one electrode of the green LED chip and one electrode of the blue LED chip are all electrically connected to the same pin, and another electrode of the red LED chip, another electrode of the green LED chip and another electrode of the blue LED chip are electrically connected to the remaining three pins one by one respectively.

11. The LED packaging structure according to claim 1, characterized in that: The LED packaging structure further includes a packaging adhesive layer, which is filled in the bowl and covers the LED chip.

12. An LED display module, characterized in that: It comprises a substrate and the LED packaging structure according to any one of claims 1 to 11, wherein the pins of the LED packaging structure are welded on the substrate.

13. An LED display screen, characterized in that: It comprises a plurality of LED display modules as claimed in claim 12.

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