Semiconductor processing grinding device

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a semiconductor processing grinding device which comprises a first belt conveyor, a second belt conveyor and a vertical plate, the first belt conveyor and the second belt conveyor are arranged in parallel, and one end, close to the second belt conveyor, of the vertical plate is fixedly connected with a fixing plate. According to the wafer polishing device, the wafer is conveyed into the polishing opening through the first belt conveyor and the second belt conveyor and placed on the supporting plate under the polishing disc, and then one face of the wafer can be polished in cooperation with the polishing disc; the unpolished surface of the wafer is placed on the upper portion through cooperation of the overturning roller and the inserting groove, the wafer is conveyed into another polishing opening through the first belt conveyor and the second belt conveyor to be polished on the other surface of the wafer, the wafer can be continuously polished, and the two surfaces can be polished without manual overturning of a worker; and the wafer polishing efficiency is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing grinding device. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. From a technological perspective, the importance of semiconductors is enormous. Semiconductor processing requires multiple processes such as crystal ingot growth, crystal ingot cutting and testing, grinding, slicing, and rounding.

[0003] The existing patent (publication number: CN202020684621.7) is a semiconductor processing and grinding equipment, including a workbench, and also includes: support legs, four of which are fixedly connected to the four corners of the bottom of the workbench; a rotating mechanism, which is detachably arranged at the top center of the workbench; a support plate, two of which are detachably arranged on the left and right sides of the top of the workbench; a material plate, which is detachably arranged on the left side wall of the support plate located on the right, and limiting holes are provided on the top of the material plate from left to right; a top plate, which is detachably arranged on the top of the support plate; a grinding mechanism, which is detachably arranged at the top left end of the top plate.

[0004] In the process of realizing the utility model, the inventors found that there are at least the following problems in the prior art that have not been solved: the utility model can realize the simultaneous grinding of multiple wafers and improve the grinding efficiency, but the existing semiconductor processing grinding equipment can only grind one side of the semiconductor. When the back side needs to be ground, the back side needs to be ground again. The process is time-consuming and labor-intensive, affecting the work efficiency. Therefore, we propose a semiconductor processing grinding device. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor processing grinding device to solve the problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor processing and grinding device, comprising a first belt conveyor, a second belt conveyor and a vertical plate, the first belt conveyor and the second belt conveyor are arranged in parallel, the vertical plate is fixedly connected to a fixed plate at one end close to the second belt conveyor, and the vertical plates on both sides above the fixed plate are fixedly connected to support plates, the first drive motor is fixedly connected to both sides of the surface of the fixed plate, the motor shafts of the two first drive motors are fixedly connected to drive disks, the outer sides of the two drive disks are equidistantly provided with four identical grinding openings, a frame is fixedly connected to the fixed plate between the two first drive motors, the inner side of the frame is rotatably connected to a turning roller, and the outer side of the turning roller is equidistantly provided with a plurality of identical slots; push rod motors are fixedly installed on both sides of the top of the inner cavity of the vertical plate, the output ends of the two push rod motors are fixedly connected to the second drive motor, and the motor shafts of the two second drive motors are fixedly connected to grinding disks.

[0007] As an optional solution of the technical solution of the present application, adsorption grooves are provided on the two support plates, and negative pressure pumps are fixedly connected to the bottoms of the two support plates. The suction ends of the two negative pressure pumps are respectively connected to the two adsorption grooves through conduits.

[0008] As an optional solution of the technical solution of the present application, a third driving motor is fixedly installed on the inner wall of the frame, a driving gear is fixedly connected to the motor shaft of the third driving motor, and a driven gear is fixedly connected to the outer side of the connecting shaft of the flip roller.

[0009] As an optional solution of the technical solution of the present application, the belt surfaces of the first belt conveyor and the second belt conveyor are both fixedly connected with anti-skid pads, and the anti-skid pads are made of rubber.

[0010] As an optional solution of the technical solution of the present application, the center of the grinding disc and the center of the adsorption groove are on the same vertical horizontal line.

[0011] As an optional solution of the technical solution of the present application, the two conduits are both connected to exhaust pipes, and electromagnetic valves are fixedly installed in the two exhaust pipes.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] The technical solution of the present application is provided by the first belt conveyor, the second belt conveyor, the first drive motor, the second drive motor, the grinding disc, the third drive motor, the flip roller, the slot, the support plate, the drive disc and the grinding port. The wafer is conveyed to the grinding port by the first belt conveyor and the second belt conveyor and placed on the support plate directly below the grinding disc, and then one side of the wafer can be polished in conjunction with the grinding disc. When one side is polished, the unpolished side of the wafer is placed on top by the flip roller and the slot, and the wafer is conveyed to another grinding port by the first belt conveyor and the second belt conveyor to polish the other side of the wafer. Not only can the wafer be polished continuously, but also there is no need for manual flipping to polish both sides, thereby improving the efficiency of wafer polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0015] Figure 1 This is a front view of a semiconductor processing and grinding device according to the utility model;

[0016] Figure 2 It is a top view of the connection between the first belt conveyor and the second belt conveyor and the driving disk of a semiconductor processing and grinding device of the utility model;

[0017] Figure 3 This is an enlarged view of point A of a semiconductor processing and grinding device of the utility model;

[0018] Figure 4 This is a front view of the connection between a support plate and a negative pressure pump of a semiconductor processing and grinding device of the utility model.

[0019] In the figure: 1. first belt conveyor; 2. second belt conveyor; 3. vertical plate; 4. push rod motor; 5. second drive motor; 501. grinding disc; 6. fixed plate; 7. first drive motor; 8. drive disc; 801. grinding port; 9. flip roller; 901. slot; 10. frame; 11. support plate; 1101. adsorption tank; 12. negative pressure pump; 1201. catheter; 13. third drive motor; 1301. driving gear; 14. driven gear; 15. exhaust pipe; 1501. electromagnetic valve. DETAILED DESCRIPTION

[0020] See also Figure 1-4The utility model provides a technical solution: a semiconductor processing and grinding device, comprising a first belt conveyor 1, a second belt conveyor 2 and a vertical plate 3, the first belt conveyor 1 and the second belt conveyor 2 are arranged in parallel, the vertical plate 3 is fixedly connected to a fixed plate 6 at one end close to the second belt conveyor 2, the vertical plates 3 on both sides above the fixed plate 6 are fixedly connected to support plates 11, the first drive motor 7 is fixedly connected to both sides of the surface of the fixed plate 6, the motor shafts of the two first drive motors 7 are fixedly connected to drive disks 8, the outer sides of the two drive disks 8 are equidistantly provided with four identical grinding openings 801, the fixed plate 6 between the two first drive motors 7 A frame 10 is fixedly connected to the upper part, and a turning roller 9 is rotatably connected to the inner side of the frame 10. A plurality of identical slots 901 are equidistantly provided on the outer side of the turning roller 9. A third driving motor 13 is fixedly installed on the inner wall of the frame 10, and a driving gear 1301 is fixedly connected to the motor shaft of the third driving motor 13. A driven gear 14 is fixedly connected to the outer side of the connecting shaft of the turning roller 9, and the driving gear 1301 is meshed with the driven gear 14. Push rod motors 4 are fixedly installed on both sides of the top of the inner cavity of the vertical plate 3, and the output ends of the two push rod motors 4 are fixedly connected to the second driving motors 5, and the motor shafts of the two second driving motors 5 are fixedly connected to grinding discs 501.

[0021] In this technical solution, through the arrangement of the first belt conveyor 1, the second belt conveyor 2, the first drive motor 7, the second drive motor 5, the grinding disc 501, the third drive motor 13, the flip roller 9, the slot 901, the support plate 11, the drive disc 8 and the grinding port 801, the wafer is conveyed to the grinding port 801 by the first belt conveyor 1 and the second belt conveyor 2 and placed on the support plate 11 directly below the grinding disc 501, and then one side of the wafer can be polished in cooperation with the grinding disc 501. When one side is polished, the unpolished side of the wafer is placed on top through the flip roller 9 and the slot 901, and the wafer is conveyed to another grinding port 801 by the first belt conveyor 1 and the second belt conveyor 2 to polish the other side of the wafer. Not only can the wafer be polished continuously, but also there is no need for manual flipping to polish both sides, thereby improving the efficiency of wafer polishing.

[0022] In some technical solutions, adsorption grooves 1101 are provided on the two support plates 11, and negative pressure pumps 12 are fixedly connected to the bottoms of the two support plates 11. The suction ends of the two negative pressure pumps 12 are respectively connected to the two adsorption grooves 1101 through conduits 1201, and the two conduits 1201 are connected to exhaust pipes 15, and electromagnetic valves 1501 are fixedly installed in the two exhaust pipes 15.

[0023] In this technical solution, through the arrangement of the adsorption tank 1101, the negative pressure pump 12, the conduit 1201, the exhaust pipe 15 and the electromagnetic valve 1501, when the wafer to be polished is rotated on the support plate 11 for polishing, the negative pressure pump 12 is started to generate negative pressure in the adsorption tank 1101, thereby improving the stability of the wafer to be polished during polishing, thereby avoiding the rotation of the wafer during polishing to affect the polishing effect, and when the polishing is completed, the electromagnetic valve 1501 is opened to make the pressure difference inside and outside the adsorption tank 1101 quickly the same, thereby not affecting the movement of the wafer for subsequent processing.

[0024] In some technical solutions, the belt surfaces of the first belt conveyor 1 and the second belt conveyor 2 are fixedly connected with anti-skid pads, and the anti-skid pads are made of rubber.

[0025] In this technical solution, by setting the anti-slip pad, the friction between the semiconductor wafer to be polished and the belts of the first belt conveyor 1 and the second belt conveyor 2 can be increased, thereby preventing the semiconductor wafer to be polished and the belts of the first belt conveyor 1 and the second belt conveyor 2 from slipping against each other, thereby preventing the transportation and polishing of the semiconductor wafer to be polished.

[0026] In some technical solutions, the center of the grinding disc 501 and the center of the adsorption groove 1101 are on the same vertical horizontal line.

[0027] In this technical solution, the grinding disc 501 corresponds to the adsorption disc, thereby ensuring that the grinding disc 501 can contact the stably adsorbed semiconductor wafer for grinding.

[0028] When in use, first, the wafer is conveyed to the grinding port 801 of the left driving disk 8 by the first belt conveyor 1 and the second belt conveyor 2, and then the driving disk 8 is driven to rotate by the first driving motor 7 to place the wafer to be ground on the support plate 11 directly below the grinding disk 501. At the same time, the negative pressure pump 12 is started to generate negative pressure in the adsorption groove 1101, thereby improving the stability of the wafer to be ground on the support plate 11, and then the push rod motor 4 and the second driving motor 4 are started, and then the grinding disk 501 is rotated to grind one side of the wafer. When one side is polished, the first The driving motor 7 drives the driving disk 8 to rotate and transports the wafer with one side polished to one side of the flip roller 9. When the wafer is inserted into the slot 901, the third driving motor 13 is started to cooperate with the active gear 1301 and the driven gear 14 to engage, thereby driving the flip roller 9 to rotate and cooperate with the slot 901 to place the unpolished side of the wafer on the top and transport the wafer to another polishing port 801 through the first belt conveyor 1 and the second belt conveyor 2 to polish the other side of the wafer. Not only can the wafer be polished continuously, but also there is no need for manual flipping to polish both sides, thereby improving the efficiency of wafer polishing.

Claims

1. A semiconductor processing and grinding device, comprising a first belt conveyor (1), a second belt conveyor (2) and a vertical plate (3), characterized in that: The first belt conveyor (1) and the second belt conveyor (2) are arranged in parallel, and a fixed plate (6) is fixedly connected to one end of the vertical plate (3) close to the second belt conveyor (2), and support plates (11) are fixedly connected to the vertical plates (3) on both sides above the fixed plate (6), and first drive motors (7) are fixedly connected to both sides of the surface of the fixed plate (6), and drive disks (8) are fixedly connected to the motor shafts of the two first drive motors (7), and four identical grinding openings (801) are equidistantly provided on the outer sides of the two drive disks (8), and a frame (10) is fixedly connected to the fixed plate (6) between the two first drive motors (7), and a turning roller (9) is rotatably connected to the inner side of the frame (10), and a plurality of identical slots (901) are equidistantly provided on the outer side of the turning roller (9); Push rod motors (4) are fixedly installed on both sides of the top of the inner cavity of the vertical plate (3), the output ends of the two push rod motors (4) are fixedly connected to the second drive motors (5), and the motor shafts of the two second drive motors (5) are fixedly connected to the grinding discs (501).

2. A semiconductor processing and polishing device according to claim 1, characterized in that: The two support plates (11) are each provided with an adsorption groove (1101), the bottoms of the two support plates (11) are each fixedly connected to a negative pressure pump (12), and the suction ends of the two negative pressure pumps (12) are respectively connected to the two adsorption grooves (1101) through conduits (1201).

3. A semiconductor processing and polishing device according to claim 1, characterized in that: A third drive motor (13) is fixedly mounted on the inner wall of the frame (10); a driving gear (1301) is fixedly connected to the motor shaft of the third drive motor (13); and a driven gear (14) is fixedly connected to the outer side of the connecting shaft of the turning roller (9).

4. A semiconductor processing and polishing device according to claim 1, characterized in that: The belt surfaces of the first belt conveyor (1) and the second belt conveyor (2) are both fixedly connected with anti-skid pads, and the anti-skid pads are made of rubber.

5. A semiconductor processing and polishing device according to claim 1, characterized in that: The center of the grinding disc (501) and the center of the adsorption groove (1101) are on the same vertical horizontal line.

6. A semiconductor processing and polishing device according to claim 2, characterized in that: The two conduits (1201) are both connected to an exhaust pipe (15), and an electromagnetic valve (1501) is fixedly installed in the two exhaust pipes (15).

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