Electrolytic device for plating solution

Abstract

The plating solution electrolysis device is used for treating electroplating solution, the plating solution electrolysis device comprises a mother solution barrel, a filtering driving assembly and an electrolysis assembly, a storage space used for storing the electroplating solution is formed in the mother solution barrel, the mother solution barrel comprises a heating device used for heating the electroplating solution, and the heating device is located in the storage space; the filtering driving assembly is located outside the mother liquor barrel, communicates with the mother liquor barrel and is used for filtering the electroplating liquid and driving the electroplating liquid to flow; and the electrolysis assembly is located outside the mother liquor barrel, communicates with the filtering driving assembly and the mother liquor barrel and is used for electrolyzing the electroplating liquid. Through the arrangement, the electrolysis assembly is arranged outside the mother liquor barrel, so that step-by-step treatment on the electroplating liquid is realized, interference among the heating device, the filtering driving assembly and the electrolysis assembly is avoided, the treatment speed of the electroplating liquid is favorably improved, and the working efficiency of the electroplating liquid electrolysis device is further favorably improved.

Description

Technical Field

[0001] The present application relates to the field of battery processing technology, and in particular to a plating solution electrolysis device. Background Art

[0002] At present, electroplating liquid can be applied to diamond wire production lines. Since the electroplating liquid needs to be electrolyzed after a certain production cycle, the electrolysis device can effectively remove impurity metal ions such as iron, copper, zinc, chromium, and lead in the electroplating liquid. At the same time, particulate impurities in the electroplating liquid are removed by filtration to reduce the stress value of the electroplating liquid, so that the electroplating liquid can meet the production and use requirements again, thereby realizing the repeated recycling of the electroplating liquid.

[0003] In the prior art, the plating solution electrolysis device is integrated into the diamond wire production line. Due to the limited layout space of the diamond wire production line, the electrolytic component of the plating solution electrolysis device is built into the mother liquid barrel, wherein a heating device is provided in the mother liquid barrel. The heating device can make the local temperature of the anode and cathode of the electrolytic component too high, resulting in reduced electrolysis efficiency of the plating solution, thereby reducing the working efficiency of the plating solution electrolysis device. Utility Model Content

[0004] In order to solve the deficiencies of the prior art, the purpose of the present application is to provide a plating solution electrolysis device with higher working efficiency.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A plating liquid electrolysis device is used to process the plating liquid. The plating liquid electrolysis device comprises a mother liquid barrel, a filter drive assembly and an electrolysis assembly. The mother liquid barrel is formed with a storage space for storing the plating liquid. The mother liquid barrel comprises a heating device for heating the plating liquid, and the heating device is located in the storage space; the filter drive assembly is located outside the mother liquid barrel, the filter drive assembly is connected to the mother liquid barrel, and the filter drive assembly is used to filter the plating liquid and drive the flow of the plating liquid; the electrolysis assembly is located outside the mother liquid barrel, the electrolysis assembly is connected to the filter drive assembly and the mother liquid barrel, and the electrolysis assembly is used to electrolyze the plating liquid.

[0007] Furthermore, the plating solution electrolysis device also includes a water channel component, and the mother liquid barrel, the filter drive component and the electrolysis component are interconnected through the water channel component.

[0008] Furthermore, the filter drive assembly includes a drive device and a filter device, the drive device is located below the filter device and is connected to the filter device, the drive device is connected to the water channel assembly, and the drive device drives the electroplating liquid to flow into the filter device.

[0009] Furthermore, along the height direction of the plating solution electrolysis device, the filter drive assembly and the mother liquid barrel are both located below the electrolysis assembly, and the drive device drives the plating solution to flow through the mother liquid barrel, the filter device and the electrolysis assembly in sequence.

[0010] Furthermore, the mother liquid barrel includes a stirring motor and a stirring member transmission-connected to the stirring motor, the stirring member is at least partially located in the storage space, the stirring motor is located at the upper end of the stirring member, the stirring motor drives the stirring member to rotate in the storage space, and when observed along the height direction of the plating liquid electrolysis device, the heating device is arranged around the stirring member.

[0011] Furthermore, the plating solution electrolysis device also includes a frame and an electric control cabinet for controlling electrical appliances. The electrolysis component and the electric control cabinet are both located above the frame, and the electric control cabinet is electrically connected to the electrolysis component, the filter drive component and the mother liquid barrel.

[0012] Furthermore, the plating solution electrolysis device also includes a rectifier for converting current, the rectifier is located above the frame, the electric control cabinet is located above the rectifier, and the electric control cabinet is electrically connected to the electrolysis component through the rectifier.

[0013] Furthermore, the electrolytic assembly forms an electrolytic space for storing the electroplating solution, and the electrolytic assembly includes an anode member and a cathode member, the anode member and the cathode member are at least partially located in the electrolytic space and in contact with the electroplating solution, and the rectifier is electrically connected to the cathode member and the anode member respectively.

[0014] Furthermore, the mother liquid barrel is also provided with a liquid level tube extending along the height direction of the plating solution electrolysis device, the liquid level tube is located outside the mother liquid barrel, and both ends of the liquid level tube pass through the outside of the mother liquid barrel and are connected to the storage space.

[0015] Furthermore, the liquid level tube is configured as a transparent structure, and at least two filtering structures are installed on the liquid level tube, the two filtering structures are respectively located at the lower end and the upper end of the liquid level tube, and the electroplating solution passes through the two filtering structures and enters the liquid level tube.

[0016] The above-mentioned plating solution electrolysis device can set the electrolysis component outside the mother liquid barrel to realize step-by-step processing of the plating solution, thereby avoiding interference between the heating device, the filter drive component and the electrolysis component, which is beneficial to improve the processing speed of the plating solution, and further beneficial to improve the working efficiency of the plating solution electrolysis device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of the plating solution electrolysis device provided in an embodiment of the present application.

[0018] Figure 2 A partial schematic diagram of the mother liquid barrel provided in an embodiment of the present application.

[0019] Figure 3A schematic diagram of the connection between the electrolytic component and the water circuit component provided in an embodiment of the present application.

[0020] Figure 4 A partial schematic diagram of an electrolytic assembly provided in an embodiment of the present application.

[0021] Figure 5 A schematic diagram of the connection between the mother liquid barrel and the water channel assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0023] like Figure 1 A plating solution electrolysis device 100 is shown. The plating solution electrolysis device 100 is used to process the plating solution. The plating solution is used in the diamond wire production line. Since the plating solution needs to be electrolyzed after a certain production cycle, the impurity metal ions such as iron, copper, zinc, chromium, and lead in the plating solution can be effectively removed by electrolysis. At the same time, particulate impurities in the plating solution are removed by filtering to reduce the stress value of the plating solution, so that the plating solution can meet the production and use requirements again, thereby realizing the repeated recycling of the plating solution. The present application uses the plating solution electrolysis device 100 to achieve rapid electrolysis and filtration of the plating solution, which is beneficial to shorten the processing time of the plating solution, and further beneficial to improve the working efficiency of the plating solution electrolysis device 100. In order to clearly illustrate the technical solution of the application, it is also defined as follows: Figure 1 In the present application, the length direction of the electrolytic device 100 refers to the front-to-back direction, the width direction of the electrolytic device 100 refers to the left-right direction, and the height direction of the electrolytic device 100 refers to the up-down direction.

[0024] like Figure 1 and Figure 2As shown, as an implementation, the plating solution electrolysis device 100 includes a mother liquid barrel 11, a filter drive assembly 12 and an electrolysis assembly 13. The mother liquid barrel 11 is formed with a storage space 101 for storing the plating solution. The mother liquid barrel 11 includes a heating device 111 for heating the plating solution. The heating device 111 is located in the storage space 101. The heating device 111 can heat the plating solution so as to facilitate the treatment of the plating solution. The filter drive assembly 12 is located outside the mother liquid barrel 11, and the filter drive assembly 12 is connected to the mother liquid barrel 11. The filter drive assembly 12 is used to filter the plating solution and drive the flow of the plating solution. The electrolysis assembly 13 is located outside the mother liquid barrel 11. The electrolysis assembly 13 is also located outside the filter drive assembly 12. The electrolysis assembly 13 is connected to the filter drive assembly 12 and the mother liquid barrel 11, and the electrolysis assembly 13 is used to electrolyze the plating solution. Specifically, the plating liquid electrolysis device 100 also includes a water circuit component 14, which is composed of a plurality of different pipes. The electrolysis component 13 is connected to the filter drive component 12 and the mother liquid barrel 11 through different pipes, respectively, so that the mother liquid barrel 11, the filter drive component 12 and the electrolysis component 13 are interconnected through the water circuit component 14, thereby realizing the circulation of the plating liquid in the mother liquid barrel 11, the filter drive component 12 and the electrolysis component 13.

[0025] In this embodiment, the plating liquid in the mother liquid barrel 11 first flows into the filter drive assembly 12, the filter drive assembly 12 filters the plating liquid and delivers the filtered plating liquid to the electrolysis assembly 13, the electrolysis assembly 13 ionizes the plating liquid and delivers the ionized plating liquid back to the mother liquid barrel 11. Through the above arrangement, the plating liquid is processed step by step, thereby avoiding interference between the heating device 111, the filter drive assembly 12 and the electrolysis assembly 13, which is conducive to improving the processing speed of the plating liquid, and further conducive to improving the working efficiency of the plating liquid electrolysis device 100.

[0026] As an implementation, the filter drive assembly 12 includes a drive device 121 and a filter device 122. Along the height direction of the filter drive assembly 12, the drive device 121 is located below the filter device 122 and communicates with the filter device 122. The drive device 121 is also communicated with the water channel assembly 14. The drive device 121 drives the electroplating solution to flow into the filter device 122. Specifically, the electroplating solution in the mother liquid barrel 11 first flows into the drive device 121 through the water channel assembly 14, and the drive device 121 transports the electroplating solution to the filter device 122, so that the electroplating solution is filtered in the filter device 122, which is conducive to improving the cleanliness of the electroplating solution. At the same time, the drive device 121 can increase the flow speed of the electroplating solution to speed up the fluidity of the electroplating solution in the filter device 122, thereby improving the working efficiency of the plating solution electrolysis device 100. In addition, the drive device 121 can be fixedly connected to the filter device 122, that is, the drive device 121 and the filter device 122 are integrated, which is conducive to improving the structural stability of the filter drive assembly 12.

[0027] It should be noted that multiple driving devices 121 can be provided, and the driving device 121 can be integrated in the mother liquid barrel 11, and the driving device 121 can be integrated in the electrolytic component 13, which is beneficial to increase the flow rate of the plating solution and further improve the working efficiency of the plating solution electrolysis device 100.

[0028] Exemplarily, the driving device 121 can be installed on the water path component 14 between the mother liquid barrel 11 and the electrolysis component 13 , and the driving device 121 can be installed on the water path component 14 between the mother liquid barrel 11 and the electrolysis component 13 .

[0029] like Figure 1 , Figure 3 and Figure 4As shown, in this implementation, the plating solution electrolysis device 100 further includes a frame 15, and the electrolysis assembly 13 is located above the frame 15. Along the height direction of the plating solution electrolysis device 100, the filter drive assembly 12 and the mother liquid barrel 11 are both located below the electrolysis assembly 13, and the drive device 121 drives the plating solution to flow through the mother liquid barrel 11, the filter device 122 and the electrolysis assembly 13 in sequence. Specifically, the waterway assembly 14 includes an inlet pipe 141 and an outlet pipe 142 arranged on the electrolysis assembly 13, and the electrolysis assembly 13 forms an electrolysis space 102 for storing the plating solution. The inlet pipe 141 and the outlet pipe 142 are respectively connected to the electrolysis space 102, and the end of the inlet pipe 141 away from the electrolysis assembly 13 is connected to the filter drive assembly 12, and the end of the outlet pipe 142 away from the electrolysis assembly 13 is connected to the mother liquid barrel 11. More specifically, the electrolytic assembly 13 includes an anode member 131 and a cathode member 132 located in the electrolysis space 102. The cathode member 132 and the anode member 131 cooperate with each other to achieve electrolysis of the electroplating solution. Since the electrolysis treatment time is generally long, loose sediments will be generated on the cathode member 132 during the long electrolysis process. The falling of the sediments will re-contaminate the electroplating solution. Therefore, after a period of electrolysis, the cathode member 132 should be taken out and brushed to brush away the loose or bad sediments on the cathode member 132 before continuing the electrolysis. Through the above arrangement, the frame 15 can increase the height of the electrolytic assembly 13, so as to facilitate the replacement of the cathode member 132 by the operator, thereby facilitating the replacement efficiency of the electrolytic assembly 13, and further improving the assembly efficiency of the electrolytic solution electrolysis device 100. In addition, it is also beneficial for the electrolytic solution after electrolysis to flow back to the mother liquid barrel 11, thereby facilitating the improvement of the working efficiency of the electrolytic assembly 13 and the mother liquid barrel 11.

[0030] like Figure 2 As shown, as an implementation method, the mother liquid barrel 11 includes a stirring motor 112 and a stirring member 113 that is transmission-connected to the stirring motor 112. The stirring member 113 is at least partially located in the storage space 101. The stirring motor 112 is located at the upper end of the stirring member 113. The stirring motor 112 drives the stirring member 113 to rotate in the storage space 101. When viewed along the height direction of the plating solution electrolysis device 100, the heating device 111 is arranged around the stirring member 113. Specifically, the stirring motor 112 is used to drive the stirring member 113 to rotate, and the stirring member 113 is used to stir the plating solution so that the concentration of the plating solution is at the same level, thereby avoiding excessive impurities from being deposited at the bottom of the plating solution, achieving sufficient filtration of the plating solution, and then improving the filtration performance of the plating solution electrolysis device 100. It should be noted that the heating device 111 is arranged around the stirring member 113 so that the plating solution is heated evenly. Through the above arrangement, the heating device 111 can make the temperature of the plating solution at the same concentration the same, which is beneficial to improve the processing efficiency of the plating solution and further improve the working efficiency of the plating solution electrolysis device 100.

[0031] like Figure 1 As shown, as an implementation, the plating solution electrolysis device 100 further includes an electric control cabinet 16 for controlling electrical appliances, the electric control cabinet 16 is located above the frame 15, and the electric control cabinet 16 is electrically connected to the electrolysis assembly 13, the filter drive assembly 12 and the mother liquid barrel 11, that is, the electric control cabinet 16 is electrically connected to the anode 131, the cathode 132, the drive device 121, the heating device 111 and the stirring motor 112. Specifically, the electrical appliances refer to the anode 131, the cathode 132, the drive device 121, the heating device 111 and the stirring motor 112, etc. The electric control cabinet 16 is used to control the work of the anode 131, the cathode 132, the drive device 121, the heating device 111 and the stirring motor 112, so that the mother liquid barrel 11, the filter drive assembly 12 and the electrolysis assembly 13 can work synchronously, which is conducive to improving the working efficiency of the electric control cabinet 16, the mother liquid barrel 11, the filter drive assembly 12 and the electrolysis assembly 13, and then improving the intelligence of the plating solution electrolysis device 100. It should be noted that a plurality of switches are arranged in the electric control cabinet 16, and the mother liquid barrel 11, the filter drive assembly 12 and the electrolytic assembly 13 are driven by different switches respectively. Thus, when any one of the mother liquid barrel 11, the filter drive assembly 12 and the electrolytic assembly 13 fails, the corresponding switch can be turned off to control any one of the mother liquid barrel 11, the filter drive assembly 12 and the electrolytic assembly 13 to stop working, which is beneficial to improve the service life of the mother liquid barrel 11, the filter drive assembly 12 and the electrolytic assembly 13.

[0032] Furthermore, the plating solution electrolysis device 100 further includes a rectifier 17 for converting current, the rectifier 17 is located above the frame 15, the electric control cabinet 16 is located above the rectifier 17, the electric control cabinet 16 is electrically connected to the electrolysis assembly 13 through the rectifier 17, and the rectifier 17 is used to convert alternating current into direct current to meet the working requirements of the electrolysis assembly 13. Specifically, the anode member 131 and the cathode member 132 are at least partially located in the electrolysis space 102 and in contact with the plating solution, and the rectifier 17 is electrically connected to the cathode member 132 and the anode member 131. Through the above arrangement, the rectifier 17 can provide the required electrical energy for the cathode member 132 and the anode member 131, thereby improving the electrolysis efficiency of the cathode member 132 and the anode member 131, and further improving the working efficiency of the electrolysis assembly 13.

[0033] like Figure 5As shown, as an implementation method, the mother liquid barrel 11 is further provided with a liquid level tube 114 extending in the height direction of the plating solution electrolysis device 100, and the liquid level tube 114 is located outside the mother liquid barrel 11, and both ends of the liquid level tube 114 pass through the outside of the mother liquid barrel 11 and communicate with the storage space 101. Specifically, the lower end of the liquid level tube 114 is basically located at the lowest end of the mother liquid barrel 11 and communicates with the storage space 101, and the upper end of the liquid level tube 114 is basically located at the highest end of the mother liquid barrel 11 and communicates with the storage space 101, so that the electroplating solution can flow into the liquid level tube 114 through the lower end of the liquid level tube 114, so as to facilitate the observation of the height of the electroplating solution, and because the liquid level tube 114 is connected to the mother liquid barrel 11, the liquid level height in the liquid level tube 114 is basically equal to the liquid level height in the mother liquid barrel 11. The above arrangement makes it easy to observe the capacity of the plating solution in the mother liquid barrel 11. When the plating solution is insufficient, the plating solution can be replenished in time, so that the plating solution electrolysis device 100 can process more plating solution, which is beneficial to improve the working efficiency of the plating solution electrolysis device 100.

[0034] Exemplarily, the liquid level tube 114 is set as a transparent structure, and at least two filter structures 115 are installed on the liquid level tube 114. The two filter structures 115 are respectively located at the lower end of the liquid level tube 114 and the upper end of the liquid level tube 114. The electroplating solution passes through the two filter structures 115 and enters the liquid level tube 114. Specifically, the filter structure 115 can prevent the sediment in the electroplating solution from directly flowing into the liquid level tube 114, so as to prevent the sediment in the electroplating solution from being deposited in the liquid level tube 114 and blocking the liquid level tube 114, thereby facilitating the improvement of the fluidity of the electroplating solution, and further improving the ability of the electrolytic device 100 to judge the capacity of the electroplating solution. In addition, the transparent structure of the liquid level tube 114 can be set to a material such as glass or rubber, so as to facilitate the observation of the capacity of the electroplating solution, so that the liquid level tube 114 has multiple functions, which is conducive to improving the functional diversity of the electrolytic device 100.

[0035] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A plating solution electrolysis device for treating a plating solution, characterized in that: The plating solution electrolysis device comprises: A mother liquid barrel, wherein the mother liquid barrel is formed with a storage space for storing the electroplating solution, and the mother liquid barrel comprises a heating device for heating the electroplating solution, and the heating device is located in the storage space; A filter drive assembly, the filter drive assembly is located outside the mother liquid barrel, the filter drive assembly is communicated with the mother liquid barrel, and the filter drive assembly is used to filter the electroplating solution and drive the flow of the electroplating solution; An electrolytic component, the electrolytic component is located outside the mother liquid barrel, the electrolytic component is connected to the filter drive component and the mother liquid barrel, and the electrolytic component is used to electrolyze the electroplating solution.

2. The plating solution electrolysis device according to claim 1, characterized in that: The plating solution electrolysis device also includes a water channel component, and the mother liquid barrel, the filter drive component and the electrolysis component are interconnected through the water channel component.

3. The plating solution electrolysis device according to claim 2, characterized in that: The filter drive assembly includes a drive device and a filter device, the drive device is located below the filter device and is connected to the filter device, the drive device is connected to the water channel assembly, and the drive device drives the electroplating solution to flow into the filter device.

4. The plating solution electrolysis device according to claim 3, characterized in that: Along the height direction of the plating solution electrolysis device, the filter drive assembly and the mother liquid barrel are both located below the electrolysis assembly, and the drive device drives the plating solution to flow through the mother liquid barrel, the filter device and the electrolysis assembly in sequence.

5. The plating solution electrolysis device according to claim 1, characterized in that: The mother liquid barrel includes a stirring motor and a stirring member that is transmission-connected to the stirring motor. The stirring member is at least partially located in the storage space. The stirring motor is located at the upper end of the stirring member. The stirring motor drives the stirring member to rotate in the storage space. When viewed along the height direction of the plating solution electrolysis device, the heating device is arranged around the stirring member.

6. The plating solution electrolysis device according to claim 5, characterized in that: The plating solution electrolysis device also includes a frame and an electric control cabinet for controlling electrical appliances. The electrolysis component and the electric control cabinet are both located above the frame, and the electric control cabinet is electrically connected to the electrolysis component, the filter drive component and the mother liquid barrel.

7. The plating solution electrolysis device according to claim 6, characterized in that: The plating solution electrolysis device also includes a rectifier for converting current, the rectifier is located above the frame, the electric control cabinet is located above the rectifier, and the electric control cabinet is electrically connected to the electrolysis component through the rectifier.

8. The plating solution electrolysis device according to claim 7, characterized in that: The electrolytic component forms an electrolytic space for storing the electroplating solution, and the electrolytic component includes an anode component and a cathode component, wherein the anode component and the cathode component are at least partially located in the electrolytic space and in contact with the electroplating solution, and the rectifier is electrically connected to the cathode component and the anode component respectively.

9. The plating solution electrolysis device according to claim 1, characterized in that: The mother liquid barrel is also provided with a liquid level tube extending along the height direction of the plating solution electrolysis device. The liquid level tube is located outside the mother liquid barrel. Both ends of the liquid level tube pass through the outside of the mother liquid barrel and are connected to the storage space.

10. The plating solution electrolysis device according to claim 9, characterized in that: The liquid level tube is configured as a transparent structure, and at least two filtering structures are installed on the liquid level tube, the two filtering structures are respectively located at the lower end and the upper end of the liquid level tube, and the electroplating solution passes through the two filtering structures and enters the liquid level tube.

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