Liquid crystal display screen structure for improving light leakage

Abstract

The utility model discloses a liquid crystal display screen structure for improving light leakage, which comprises a liquid crystal display screen body, an integrated circuit (IC) chip and a heat conduction piece, and a binding area is arranged on the liquid crystal display screen body. The IC chip is bound on the binding area through a conductive adhesive film; the heat conduction part is arranged on the binding area, and the heat conduction part is arranged around the periphery of the IC chip. According to the liquid crystal display screen, the heat conduction piece is arranged on the binding area, and meanwhile, the heat conduction piece is arranged around the binding area, so that when the IC chip is bound, heat can be dissipated in time through the heat conduction piece, the problem that the binding area corresponding to the liquid crystal display screen body is deformed due to binding of the IC chip is solved, and the service life of the liquid crystal display screen is prolonged. Therefore, light leakage caused by binding can be reduced, and the yield of products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display module production and manufacturing, in particular to a liquid crystal display screen structure for improving light leakage. Background Art

[0002] Liquid crystal display module is a commonly used mobile phone display screen. COG (Chip on Glass) process is an indispensable part of its manufacturing process, which refers to the control chip IC of the liquid crystal display module being bound to the liquid crystal display LCD through ACF (Anisotropic Conductive Film). The liquid crystal display is a "liquid crystal box" composed of the upper glass CF and the lower glass TFT bonded together by frame glue.

[0003] In order to completely solidify the ACF and break the gold balls in the ACF to achieve connectivity, a certain temperature and pressure must be applied to the IC during bonding. Due to the effects of temperature and pressure, the temperature at the bottom of the glass is different. After the bonding is completed and the temperature is lowered, the deformation of the IC is large, and the deformation of the glass corresponding to the bonding area is small, resulting in overall warping. The pulling effect after warping causes the local box thickness of the LCD near the two ends of the IC to be different, which in turn causes the transmittance to be different, forming bright and dark mura, that is, light leakage. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a liquid crystal display screen structure for improving light leakage.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A liquid crystal display screen structure for improving light leakage comprises: a liquid crystal display screen body, an IC chip and a heat conductive member, wherein a binding area is arranged on the liquid crystal display screen body; the IC chip is bound to the binding area via a conductive adhesive film; the heat conductive member is arranged on the binding area and is arranged around the four peripheries of the IC chip.

[0007] In one embodiment, the liquid crystal display body includes an upper CF glass and a lower TFT glass, one side of the lower TFT glass extends outward relative to the upper CF glass to form a protrusion, and the binding area is located on one side surface of the protrusion.

[0008] In one embodiment, the conductive adhesive film is an ACF anisotropic conductive adhesive film.

[0009] In one embodiment, the heat conductive member includes a heat conductive tape, which is disposed on the binding area and surrounds four sides of the IC chip.

[0010] In one embodiment, the heat conducting member further includes a first heat dissipation block, and the first heat dissipation block is disposed on one end of the thermal conductive tape.

[0011] In one embodiment, the first heat sink is copper foil.

[0012] In one of the embodiments, the heat conducting member further includes a second heat dissipation block, and the second heat dissipation block is disposed on the other end of the heat conductive tape.

[0013] In one embodiment, the second heat sink is copper foil.

[0014] In one of the embodiments, a tear handle is provided at one end of the thermally conductive tape.

[0015] In one embodiment, the thermally conductive tape is a weakly adhesive thermally conductive tape.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The utility model discloses a liquid crystal display screen structure for improving light leakage by arranging a liquid crystal display screen body, an IC chip and a heat conductive member, and arranging the heat conductive member on a binding area, and at the same time making the heat conductive member arranged around the binding area. Thus, when the IC chip is bound, the heat can be promptly dissipated through the heat conductive member, so as to reduce the deformation problem of the binding area corresponding to the liquid crystal display screen body caused by the binding of the IC chip, thereby reducing the light leakage caused by the binding, and further improving the yield rate of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a schematic diagram of the connection structure of the IC chip, the ACF conductive film and the liquid crystal display structure in one embodiment of the utility model;

[0020] Figure 2 It is a front view structural schematic diagram of a liquid crystal display screen structure for improving light leakage in one embodiment of the utility model;

[0021] Figure 3 for Figure 2 A schematic diagram of a local enlarged structure of a liquid crystal display screen structure for improving light leakage;

[0022] Figure 4 It is a side view structural schematic diagram of a liquid crystal display screen structure for improving light leakage in one embodiment of the utility model;

[0023] Figure 5 for Figure 4 A schematic diagram of an enlarged structure at B of a liquid crystal display screen structure for improving light leakage; DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0025] See also Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, a liquid crystal display structure 10 for improving light leakage includes: a liquid crystal display body 100, an IC chip 200 and a heat conductive member 300, wherein the liquid crystal display body 100 is provided with a binding area; the IC chip 200 is bound to the binding area through a conductive adhesive film 400; the heat conductive member 300 is provided on the binding area, and the heat conductive member 300 is provided around the four peripheries of the IC chip 200.

[0026] Please note that Figure 1 As shown, in the COG process, the IC chip 100 needs to be bound to the liquid crystal display body 100. Since the conductive adhesive film 400 is used for binding the IC chip, the purpose of connection can be achieved only when the conductive gold ball 410 in the conductive adhesive film 400 is broken. When the IC chip is bound, it is necessary to apply a temperature of about 145° and a pressure of about 300N to it. Under the action of pressure and temperature, the regional temperature of the binding area corresponding to the liquid crystal display body 100 will be different, that is, after the binding is completed and the temperature is slowly cooled down, the deformation of the IC chip is large due to different shrinkage amounts, while the deformation of the glass in the binding area corresponding to the liquid crystal display body 100 is small, which will form an overall warping phenomenon. The pulling effect after the warping causes the local box thickness of the liquid crystal display structure near the two ends of the IC chip to be different, which in turn causes the transmittance to be different, resulting in the problem of bright and dark mura, that is, the problem of light leakage. Therefore, in the present invention, a heat conductive member 300 is arranged around the IC chip 200, that is, before the IC chip 200 binding process is performed, the heat conductive member 300 needs to be arranged on the binding area, and the heat conductive member 300 needs to avoid the binding position of the IC chip. During the IC chip binding process, the heat can be dissipated in time through the heat conductive member 300, thereby reducing the deformation problem caused by the binding of the IC chip, thereby reducing the light leakage caused by the binding, and thus improving the product yield.

[0027] Specifically, the liquid crystal display body 100 includes an upper CF (Color Filter) glass 110 and a lower TFT (Thin Film Transistor) glass 120. One side of the lower TFT glass extends outward relative to the upper CF glass to form a protrusion, and the binding area is located on one side of the protrusion. That is, the protrusion of the lower TFT glass relative to the CF glass is the binding area, which is used to bind the IC chip 200 and the FPC (flexible circuit board).

[0028] Preferably, the conductive film is an ACF anisotropic conductive film, which uses conductive particles to connect the electrodes between the IC chip and the substrate to make them conductive, while avoiding short circuit between two adjacent electrodes, and achieving the purpose of conducting only in the Z-axis direction.

[0029] In one embodiment, the heat conducting member 300 includes a heat conducting tape 310, which is disposed on the binding area and is disposed around the four sides of the IC chip 200. By providing the heat conducting tape 310, the heat can be dissipated in time during the binding process of the IC chip 200, so as to avoid deformation caused by slow cooling, and further avoid the problem of poor light leakage of the product due to binding.

[0030] Furthermore, the heat conducting member 300 further includes a first heat dissipation block 320, which is disposed on one end of the thermally conductive tape 310. The first heat dissipation block 320 is exposed, so that the machine of the binding device can extend a manipulator to contact the first heat dissipation block 320, so that the heat of the glass area corresponding to the binding area can be timely transferred to the machine of the binding device through the thermally conductive tape 310 and the first heat dissipation block 320 and dissipated. Preferably, the first heat dissipation block 310 is copper foil, which is a good thermal conductor, so that the heat dissipation speed can be ensured.

[0031] Furthermore, in order to improve the heat dissipation efficiency, the heat conducting member 300 further includes a second heat dissipation block 330, which is disposed on the other end of the heat conductive tape 310. Similarly, the second heat dissipation block 330 is also exposed, so that the machine platform of the binding device can extend a manipulator to contact the second heat dissipation block 320, thereby transferring heat to the machine platform of the binding device to further improve the heat dissipation efficiency. Preferably, the second heat dissipation block is copper foil.

[0032] Furthermore, a tear handle 311 is provided at one end of the thermal conductive tape 310. That is, the length of the thermal conductive tape 310 needs to be greater than the width of the binding area of ​​the liquid crystal display structure 20, so that one end of the thermal conductive tape 310 can extend away from the binding area to form a tear handle 311. The purpose of providing the tear handle 311 is to facilitate the tearing off of the thermal conductive tape 310 after the IC chip is bound. Therefore, in this embodiment, the thermal conductive tape 310 is a weakly sticky thermal conductive tape, so that the thermal conductive tape can be easily torn off after the IC chip is bound.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A liquid crystal display structure for improving light leakage, characterized in that: include: A liquid crystal display screen body, wherein a binding area is provided on the liquid crystal display screen body; An IC chip, wherein the IC chip is bonded to the bonding area via a conductive adhesive film; and The heat conducting member is arranged on the binding area and is arranged around the four sides of the IC chip.

2. The liquid crystal display structure for improving light leakage according to claim 1, characterized in that: The liquid crystal display screen body comprises an upper CF glass and a lower TFT glass, one side of the lower TFT glass extends outward relative to the upper CF glass to form a protrusion, and the binding area is located on one side surface of the protrusion.

3. The liquid crystal display structure for improving light leakage according to claim 1, characterized in that: The conductive adhesive film is an ACF anisotropic conductive adhesive film.

4. The liquid crystal display structure for improving light leakage according to claim 1, characterized in that: The heat-conducting member comprises a heat-conducting adhesive tape, which is arranged on the binding area and surrounds the four peripheries of the IC chip.

5. The liquid crystal display screen structure for improving light leakage according to claim 4, characterized in that: The heat conducting member further comprises a first heat dissipating block, and the first heat dissipating block is arranged on one end of the heat conducting tape.

6. The liquid crystal display structure for improving light leakage according to claim 5, characterized in that: The first heat dissipation block is copper foil.

7. The liquid crystal display screen structure for improving light leakage according to claim 5, characterized in that: The heat conducting member further comprises a second heat dissipating block, and the second heat dissipating block is arranged on the other end of the heat conducting tape.

8. The liquid crystal display structure for improving light leakage according to claim 7, characterized in that: The second heat dissipation block is copper foil.

9. The liquid crystal display structure for improving light leakage according to any one of claims 4 to 8, characterized in that: A tear handle is provided at one end of the thermal conductive tape.

10. The liquid crystal display structure for improving light leakage according to any one of claims 4 to 8, characterized in that: The thermally conductive tape is a weakly adhesive thermally conductive tape.

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