Heat dissipation structure of integrated intelligent miniature data processor

Abstract

The utility model discloses an integrated intelligent miniature data processor heat dissipation structure which comprises a processor shell and a heat dissipation assembly, a fixing plate is fixedly installed on the outer wall of the bottom of the processor shell, and the heat dissipation assembly used for cooling an intelligent miniature data processor mainboard is installed on the top of the processor shell. The heat dissipation assembly comprises heat dissipation fins, a mounting groove, fixing screws, a metal support, a vent groove and a turbofan, the mounting groove is formed in the top of the heat dissipation fins, the four corners of the mounting groove are in threaded connection with the original fixing screws, the metal support is mounted in the mounting groove through the fixing screws, the vent groove is formed in the bottom of the metal support, and the turbofan is arranged in the vent groove. A turbofan is installed in the middle of the metal support. The heat dissipation structure of the integrated intelligent miniature data processor not only can dissipate heat of the intelligent miniature data processor, but also can reduce gaps between a heat source of the processor and the heat dissipation fins, and improves heat conduction.

Description

Technical Field

[0001] The utility model relates to the technical field of micro data processors, in particular to an integrated intelligent micro data processor heat dissipation structure. Background Art

[0002] A microprocessor is a central processing unit composed of one or a few large-scale integrated circuits. These circuits perform the functions of control components and arithmetic logic components. The microprocessor can complete operations such as fetching instructions, executing instructions, and exchanging information with external memory and logic components. It is the operation control part of the microcomputer. It can form a microcomputer with memory and peripheral circuit chips.

[0003] The existing micro data processors are highly concentrated, so the heat generated during operation is also concentrated. The heat generated cannot be dissipated in time, which affects the normal working time of the micro data processor and may even cause the device using the processor to crash in severe cases.

[0004] Therefore, in view of this, the shortcomings of the existing structure are studied and improved, and an integrated intelligent micro data processor heat dissipation structure is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated intelligent micro data processor heat dissipation structure to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated intelligent micro data processor heat dissipation structure, including a processor housing and a heat dissipation component, the bottom outer wall of the processor housing is fixedly installed with a fixing plate, the heat dissipation component used to cool the intelligent micro data processor mainboard is installed on the top of the processor housing, the heat dissipation component includes heat dissipation fins, mounting grooves, fixing screws, a metal bracket, a ventilation groove and a turbo fan, the top of the heat dissipation fin is provided with a mounting groove, and the four corners of the mounting groove are threadedly connected to the original fixing screws, the mounting groove is installed with a metal bracket through the fixing screws, and the bottom of the metal bracket is provided with a ventilation groove, and a turbo fan is installed in the middle of the metal bracket.

[0007] Preferably, a bottom plate is provided at the bottom of the processor housing, and the outer diameter of the bottom plate is consistent with the outer diameter of the fixing plate.

[0008] Preferably, a limiting frame is fixedly installed on the top of the bottom plate, and the limiting frame is arranged in an overall "U"-shaped structure.

[0009] Preferably, a silicone grease filling groove is provided on the top of the limiting frame, and an anti-dropping block is provided on the limiting frame below the silicone grease filling groove.

[0010] Preferably, a circuit board placement groove is provided between the silicone grease filling groove and the anti-dropping block, and a clamping plate is clamped at the left end of the circuit board placement groove.

[0011] Preferably, a spring sheet is fixedly mounted on the left side of the clamping plate, and the spring sheet is arranged in a "V"-shaped structure as a whole.

[0012] Preferably, a top plate is fixedly mounted on the right end of the spring sheet, and the top plate is elastically connected to the clamping plate through the spring sheet.

[0013] Compared with the prior art, the beneficial effect of the utility model is that the integrated intelligent micro data processor heat dissipation structure can not only dissipate the heat of the intelligent micro data processor, but also reduce the gap between the processor heat source and the heat dissipation fins, thereby improving heat conduction.

[0014] 1. The utility model sets a heat dissipation component. The heat dissipation fins are made of semiconductor materials. When current passes through two different heat dissipation fins, heat absorption or heat release will occur at the junction. The semiconductor radiator uses this effect, with a cold end that absorbs heat at one end and a hot end that releases heat at the other end. The cold end of the heat dissipation fin is fitted with the intelligent micro data processor for cooling, and the hot end of the heat dissipation fin is cooled by the turbo fan set on the top to improve the air circulation in front and behind, and cool the hot end on the top of the heat dissipation fin, so that it can be continuously cooled and cooled, so as to achieve the purpose of continuously cooling the intelligent micro data processor and improve the use time of the intelligent micro data processor.

[0015] 2. The utility model uses the setting of a limit frame and a card board to insert the circuit board fixed by the intelligent micro data processor into the circuit board placement slot installation slot, and uses the card board and a spring sheet to block the right end of the circuit board placement slot to prevent it from falling off, and then fills the silicone grease filling slot with silicone grease, thereby increasing the contact area between the installed intelligent micro data processor and the heat sink fins and improving the stability of heat conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of an integrated intelligent micro data processor heat dissipation structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the heat dissipation fin structure of an integrated intelligent micro data processor heat dissipation structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the overall development of an integrated intelligent micro data processor heat dissipation structure of the utility model;

[0019] Figure 4 The utility model is a three-dimensional structural schematic diagram of a limit frame of an integrated intelligent micro data processor heat dissipation structure.

[0020] In the figure: 1. Processor housing; 2. Fixing plate; 3. Heat dissipation assembly; 301. Heat dissipation fins; 302. Mounting slot; 303. Fixing screws; 304. Metal bracket; 305. Ventilation slot; 306. Turbofan; 4. Bottom plate; 5. Limiting frame; 6. Silicone grease filling slot; 7. Anti-slip block; 8. Circuit board placement slot; 9. Card board; 10. Spring sheet; 11. Top plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-Figure 3 As shown, an integrated intelligent micro data processor heat dissipation structure includes a processor housing 1 and a heat dissipation component 3. A fixing plate 2 is fixedly installed on the bottom outer wall of the processor housing 1. The heat dissipation component 3 for cooling the intelligent micro data processor mainboard is installed on the top of the processor housing 1. The heat dissipation component 3 includes a heat dissipation fin 301, a mounting groove 302, a fixing screw 303, a metal bracket 304, a ventilation groove 305 and a turbo fan 306. A mounting groove 302 is opened on the top of the heat dissipation fin 301, and the four corners of the mounting groove 302 are threadedly connected to the original fixing screws 303. The mounting groove 302 is installed with a metal bracket 304 through the fixing screws 303, and a ventilation groove 305 is opened at the bottom of the metal bracket 304. A turbo fan 306 is installed in the middle of the metal bracket 304.

[0023] The heat sink fins 301 are made of semiconductor materials. When current passes through two different heat sink fins 301, heat absorption or heat release will occur at the junction. The semiconductor radiator uses this effect, with a cold end that absorbs heat at one end and a hot end that releases heat at the other end. The cold end of the heat sink fins 301 is fitted with the intelligent micro data processor for cooling, and the hot end of the heat sink fins 301 is cooled by the turbo fan 306 set on the top to improve the air circulation in front and behind, and cool the hot end on the top of the heat sink fins 301, so that it can be continuously cooled and cooled, so as to achieve the purpose of continuously cooling the intelligent micro data processor and increase the use time of the intelligent micro data processor.

[0024] like Figure 4 As shown, a bottom plate 4 is disposed at the bottom of the processor housing 1 , and the outer diameter of the bottom plate 4 is consistent with the outer diameter of the fixing plate 2 .

[0025] The bottom plate 4 and the limiting frame 5 fixed therein can be well fixed to the inside of the processor housing 1 .

[0026] Furthermore, a limiting frame 5 is fixedly installed on the top of the bottom plate 4, and the limiting frame 5 is arranged in a "U"-shaped structure as a whole.

[0027] Furthermore, a silicone grease filling groove 6 is provided on the top of the limiting frame 5 , and an anti-dropping block 7 is provided on the limiting frame 5 below the silicone grease filling groove 6 .

[0028] The silicone grease filling groove 6 is convenient for silicone grease to be fully filled to reduce overflow.

[0029] Furthermore, a circuit board placement groove 8 is provided between the silicone grease filling groove 6 and the anti-dropping block 7 , and a clamping plate 9 is clamped at the left end of the circuit board placement groove 8 .

[0030] The card plate 9 is used to block the right end of the circuit board placement slot 8 .

[0031] Furthermore, a spring sheet 10 is fixedly mounted on the left side of the clamping plate 9, and the spring sheet 10 is arranged in a "V"-shaped structure as a whole.

[0032] The spring sheet 10 provides a certain supporting elastic force for the circuit board installed inside the circuit board placement slot 8 .

[0033] Furthermore, a top plate 11 is fixedly mounted on the right end of the spring sheet 10 , and the top plate 11 is elastically connected to the clamping plate 9 through the spring sheet 10 .

[0034] Working principle: When using the integrated intelligent micro data processor heat dissipation structure, first insert the circuit board fixed by the intelligent micro data processor into the circuit board placement slot 8, and use the card plate 9 to cooperate with the spring sheet 10 to block the right end of the circuit board placement slot 8 to prevent it from falling off, and then fill the silicone grease filling slot 6 with silicone grease to increase the contact area between the installed intelligent micro data processor and the heat dissipation fin 301 and improve the stability of heat conduction. When the current passes through two different heat dissipation fins 301, heat absorption or heat release will occur at the contact point. The semiconductor radiator uses this effect, with a cold end that absorbs heat at one end and a hot end that releases heat at the other end. The cold end of the heat dissipation fin 301 is fitted with the intelligent micro data processor for cooling, and the hot end of the heat dissipation fin 301 is improved by the turbo fan 306 set on the top to improve the air circulation before and after the hot end of the heat dissipation fin 301, and cool the hot end on the top of the heat dissipation fin 301, so that it can continue to cool and cool, so as to achieve the purpose of continuously cooling the intelligent micro data processor and improve the use time of the intelligent micro data processor. This is the working principle of the integrated intelligent micro data processor heat dissipation structure.

Claims

1. An integrated intelligent micro data processor heat dissipation structure, comprising a processor housing (1) and a heat dissipation component (3), characterized in that: A fixing plate (2) is fixedly mounted on the bottom outer wall of the processor housing (1); a heat dissipation component (3) for cooling the mainboard of the intelligent micro data processor is mounted on the top of the processor housing (1); the heat dissipation component (3) comprises a heat dissipation fin (301), a mounting groove (302), a fixing screw (303), a metal bracket (304), a ventilation groove (305) and a turbo fan (306); a mounting groove (302) is provided on the top of the heat dissipation fin (301); the four corners of the mounting groove (302) are threadedly connected to the original fixing screws (303); a metal bracket (304) is mounted on the mounting groove (302) via the fixing screws (303); a ventilation groove (305) is provided on the bottom of the metal bracket (304); and a turbo fan (306) is mounted in the middle of the metal bracket (304).

2. The integrated intelligent micro data processor heat dissipation structure according to claim 1, characterized in that: A bottom plate (4) is provided at the bottom of the processor housing (1), and the outer diameter of the bottom plate (4) is consistent with the outer diameter of the fixing plate (2).

3. The integrated intelligent micro data processor heat dissipation structure according to claim 2, characterized in that: A limiting frame (5) is fixedly mounted on the top of the bottom plate (4), and the limiting frame (5) is arranged in a "U"-shaped structure as a whole.

4. The integrated intelligent micro data processor heat dissipation structure according to claim 3, characterized in that: A silicone grease filling groove (6) is provided on the top of the limiting frame (5), and an anti-dropping block (7) is provided on the limiting frame (5) below the silicone grease filling groove (6).

5. The integrated intelligent micro data processor heat dissipation structure according to claim 4, characterized in that: A circuit board placement groove (8) is provided between the silicone grease filling groove (6) and the anti-slip block (7), and a clamping plate (9) is clamped at the left end of the circuit board placement groove (8).

6. The integrated intelligent micro data processor heat dissipation structure according to claim 5, characterized in that: A spring sheet (10) is fixedly mounted on the left side of the clamping plate (9), and the spring sheet (10) is arranged in a V-shaped structure as a whole.

7. The integrated intelligent micro data processor heat dissipation structure according to claim 6, characterized in that: A top plate (11) is fixedly mounted on the right end of the spring sheet (10), and the top plate (11) is elastically connected to the clamping plate (9) through the spring sheet (10).

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