Memory bank cooling device

Abstract

The utility model belongs to the technical field of memory bank cooling, and discloses a memory bank cooling device which comprises a plurality of heat dissipation modules and a cooling module, the plurality of heat dissipation modules comprise heat dissipation clamping plates and clamping pieces, the heat dissipation clamping plates are arranged on the end faces of the two sides of a memory bank, and the clamping pieces are used for clamping the memory bank and the heat dissipation clamping plates located on the end faces of the two sides of the memory bank. The cooling module comprises coolers, refrigerants flow in the coolers, and the coolers are arranged at the two ends, in the length direction, of the multiple heat dissipation modules and connected with the multiple heat dissipation modules in an inserted mode. The heat dissipation clamping plates are clamped on the end faces of the two sides of the memory bank through the clamping pieces, so that a plurality of independent heat dissipation modules are formed, and the coolers are arranged at the two ends of the heat dissipation modules and connected with the heat dissipation modules in an inserted mode, so that when any heat dissipation module or cooler breaks down, only the corresponding heat dissipation module or cooler needs to be replaced, and the heat dissipation efficiency is improved. The whole cooling system does not need to be replaced, disassembly and assembly are easy and convenient, maintenance is easy, and the replacement cost is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of memory bar cooling, in particular to a memory bar cooling device. Background Art

[0002] The memory stick is a key electronic component responsible for storing and accessing data. It is used to temporarily store the calculation data in the CPU and the data exchanged with external storage devices such as hard disks. All programs are run in the memory stick, so the performance of the memory stick directly affects the overall performance of the computer. The temperature management of the memory stick is particularly important. Improper temperature control of the memory will not only lead to a decrease in the running speed, but also may affect the running stability of the memory stick, causing errors or freezes in the memory operation. In extreme cases, excessively high temperatures may even damage the memory stick and cause hardware failures.

[0003] Therefore, a liquid cooling system is usually used to cool down the memory stick. Traditional memory stick cooling usually installs the memory stick, the entire liquid cooling system and the thermal interface material as a whole in the chassis to cool the memory stick. Not only does this make the gaps between the memory sticks very narrow, making it very inconvenient to disassemble and install the memory stick, but when a cooling branch in the liquid cooling system leaks, the entire liquid cooling system needs to be replaced as a whole, making the replacement work very cumbersome, difficult to maintain and costly. Utility Model Content

[0004] The utility model aims to provide a memory bar cooling device, which is easy to replace and maintain and has low replacement cost.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A memory bar cooling device is provided, the memory bar cooling device comprising:

[0007] A plurality of heat dissipation modules, wherein the plurality of heat dissipation modules include heat dissipation clamps and clamping members, wherein the heat dissipation clamps are arranged on the end surfaces of both sides of the memory bar, and the clamping members are used to clamp the memory bar and the heat dissipation clamps located on the end surfaces of both sides of the memory bar;

[0008] The cooling module comprises a cooler in which refrigerant flows. The cooler is arranged at both ends of the plurality of heat dissipation modules along the length direction and is plugged with the plurality of heat dissipation modules.

[0009] Optionally, the cooler is provided with a mounting groove and a plurality of plug-in protrusions spaced apart in the mounting groove, and the plug-in protrusions are inserted between two heat dissipation clamping plates located on both side end surfaces of the memory bar.

[0010] Optionally, the cooling module further includes a cover plate, which is detachably connected to a side of the cooler where the mounting groove is opened.

[0011] Optionally, the cross-section of the cooler is rectangular, and the cover plate includes a sealing portion and a fixing portion vertically connected to the sealing portion, the sealing portion is connected to a side of the cooler where the mounting groove is opened, and the fixing portion is connected to an end face of the cooler that is vertical to the side where the mounting groove is opened.

[0012] Optionally, the cooling module further includes a fastener, the sealing portion and the fixing portion are both provided with a connecting through hole, the cooler is provided with a connecting threaded hole corresponding to the connecting through hole, and the fastener passes through the connecting through hole and is threadedly connected to the connecting threaded hole.

[0013] Optionally, the heat dissipation clip includes a heat dissipation portion and a plug-in portion, the heat dissipation portion is used to cover the memory bar, and the plug-in portion has an area smaller than the heat dissipation portion and is used to be plugged with the cooler.

[0014] Optionally, a thermal interface material is provided between the memory bar and the heat dissipation clip.

[0015] Optionally, a thermal interface material is filled between the heat dissipation clamping plate and the cooler.

[0016] Optionally, the cooling module further includes a liquid inlet pipe and a liquid outlet pipe, a medium chamber in which the refrigerant flows is provided inside the cooler, the liquid inlet pipe and the liquid outlet pipe are respectively connected to both sides of the cooler along the length direction, and are both communicated with the medium chamber.

[0017] Beneficial effects of the utility model:

[0018] The utility model provides a memory bar cooling device, which uses clamping parts to clamp the heat dissipation clamping plates on the end surfaces on both sides of the memory bar, thereby forming a plurality of independent heat dissipation modules, and coolers with refrigerant flowing inside are arranged at both ends of the plurality of heat dissipation modules and plugged therein, so that when any heat dissipation module or cooler fails, only the corresponding heat dissipation module or cooler needs to be replaced, and there is no need to replace the entire cooling system. Not only is it easy to disassemble and assemble, and easy to maintain and service, but the cost of replacement is also greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an assembly diagram of the memory bar cooling device provided by the utility model;

[0020] Figure 2 This is an exploded view of the structure of the memory bar cooling device provided by the utility model;

[0021] Figure 3It is a structural schematic diagram of a heat dissipation clamp in a memory bar cooling device provided by the utility model;

[0022] Figure 4 It is a structural schematic diagram of a cooler in a memory bar cooling device provided by the utility model;

[0023] Figure 5 The utility model is a schematic diagram of the structure of a cover plate in a memory bar cooling device.

[0024] In the figure:

[0025] 1. heat dissipation module; 11. heat dissipation clamp; 111. heat dissipation part; 112. plug-in part; 12. clamping part;

[0026] 2. Cooling module; 21. Cooler; 211. Insertion protrusion; 212. Insertion slope; 22. Cover plate; 221. Blocking part; 222. Fixing part; 23. Liquid inlet pipe; 24. Liquid outlet pipe;

[0027] 3. Thermal interface material. DETAILED DESCRIPTION

[0028] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0029] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0032] The memory stick is a key electronic component responsible for storing and accessing data. It is used to temporarily store the calculation data in the CPU and the data exchanged with external storage devices such as hard disks. All programs are run in the memory stick, so the performance of the memory stick directly affects the overall performance of the computer. The temperature management of the memory stick is particularly important. Improper temperature control of the memory will not only lead to a decrease in the running speed, but also may affect the running stability of the memory stick, causing errors or freezes in the memory operation. In extreme cases, excessively high temperatures may even damage the memory stick and cause hardware failures.

[0033] Therefore, a liquid cooling system is usually used to cool down the memory stick. Traditional memory stick cooling usually installs the memory stick, the entire liquid cooling system and the thermal interface material as a whole in the chassis to cool the memory stick. Not only does this make the gaps between the memory sticks very narrow, making it very inconvenient to disassemble and install the memory stick, but when a cooling branch in the liquid cooling system leaks, the entire liquid cooling system needs to be replaced as a whole, making the replacement work very cumbersome, difficult to maintain and costly.

[0034] Therefore, in order to achieve quick disassembly and assembly, reduce the difficulty of maintenance, and reduce replacement costs, this embodiment provides a memory bar cooling device.

[0035] like Figures 1 to 5 As shown, the memory bar cooling device includes multiple heat dissipation modules 1 and cooling modules 2. The multiple heat dissipation modules 1 include heat dissipation clamps 11 and clamps 12. The heat dissipation clamps 11 are arranged on the end surfaces of both sides of the memory bar. The clamps 12 are used to clamp the memory bar and the heat dissipation clamps 11 located on the end surfaces of both sides of the memory bar. The cooling module 2 includes a cooler 21. A refrigerant flows in the cooler 21. The cooler 21 is arranged at both ends of the multiple heat dissipation modules 1 along the length direction and is plugged into the multiple heat dissipation modules 1.

[0036] By using the clamping piece 12 to clamp the heat dissipation clamping plate 11 on the end surfaces on both sides of the memory bar (not shown in the figure), a plurality of independent heat dissipation modules 1 are formed, and the coolers 21 with refrigerant flowing inside are arranged at both ends of the plurality of heat dissipation modules 1 and plugged therein, so that when any heat dissipation module 1 or cooler 21 fails, only the corresponding heat dissipation module 1 or cooler 21 needs to be replaced, and there is no need to replace the entire cooling system. Not only is it easy to disassemble and assemble, and easy to maintain and service, but it also greatly reduces the cost of replacement.

[0037] In this embodiment, the heat dissipation module 1 is plugged into the cooler 21 through the heat dissipation clamp 11, wherein the cooler 21 is a water collector, and the heat transfer is achieved through the heat dissipation clamp 11 by passing liquid refrigerant into the cooler 21, thereby cooling the memory bar, wherein the heat dissipation clamp 11 can be any material or structure that has improved heat dissipation capability, wherein specifically, the heat dissipation clamp 11 can be a heat spreader with a vacuum cavity having a microstructure on the inner wall to improve the heat dissipation capability, or an aluminum sheet, a copper sheet or a stainless steel sheet can be used as the heat dissipation clamp 11 for clamping the memory bar to reduce the manufacturing cost. In addition, the clamp 12 for clamping the memory bar and the heat dissipation clamp 11 is a steel clamp formed by bending a steel plate.

[0038] Alternatively, if Figure 2 , Figure 4 As shown, the cooler 21 is provided with a mounting groove and a plurality of plug-in protrusions 211 spaced apart in the mounting groove, and the plug-in protrusions 211 are inserted between the two heat dissipation clamping plates 11 located on the two side end surfaces of the memory stick. By providing a plurality of plug-in protrusions 211 in the mounting groove of the cooler 21, it is convenient to insert the plug-in protrusions 211 between the two heat dissipation clamping plates 11 located on the two side end surfaces of the memory stick, thereby achieving the plug-in connection between the cooler 21 and the heat dissipation module 1.

[0039] In this embodiment, the end of the plugging protrusion 211 is also provided with a plugging slope 212, so as to make the plugging process easier. In addition, the number of the plugging protrusions 211 can be freely set according to the number of memory sticks, so as to meet the use environment under different conditions.

[0040] Alternatively, if Figure 2 As shown, the cooling module 2 further includes a cover plate 22, which is detachably connected to one side of the cooler 21 where the mounting groove is provided. By providing the cover plate 22 on one side of the cooler 21 where the mounting groove is provided, the mounting groove is closed, thereby preventing the heat dissipation module 1 from being separated from the cooler 21 when vibration occurs, thereby improving reliability during vibration.

[0041] Furthermore, if Figure 2 , Figure 5As shown, the cross section of the cooler 21 is rectangular, and the cover plate 22 includes a blocking portion 221 and a fixing portion 222 vertically connected to the blocking portion 221, the blocking portion 221 is connected to the side of the cooler 21 where the mounting groove is provided, and the fixing portion 222 is connected to the end surface of the cooler 21 vertically to the side where the mounting groove is provided. By providing the blocking portion 221 and the fixing portion 222 vertically connected to the blocking portion 221, and making the blocking portion 221 connected to the side of the cooler 21 where the mounting groove is provided, and the fixing portion 222 connected to the end surface of the cooler 21 vertically to the side where the mounting groove is provided, the cover plate 22 is connected to the cooler 21 in two different directions when connected, thereby improving the firmness and stability of the connection between the cover plate 22 and the cooler 21.

[0042] Furthermore, the cooling module 2 also includes a fastener, and the blocking portion 221 and the fixing portion 222 are both provided with a connecting through hole, and the cooler 21 is provided with a connecting threaded hole corresponding to the connecting through hole, and the fastener penetrates the connecting through hole and is threadedly connected to the connecting threaded hole. By providing a connecting through hole on the blocking portion 221 and the fixing portion 222, and a connecting threaded hole corresponding to the connecting through hole on the cooler 21, and a fastener (not shown in the figure) penetrates the connecting through hole and is threadedly connected to the connecting threaded hole, thereby realizing a detachable connection between the cover plate 22 and the cooler 21. When a certain heat dissipation module 1 fails, only the fastener needs to be screwed to separate the cover plate 22 from the cooler 21, thereby facilitating the removal of the failed heat dissipation module 1 and replacing it, making the replacement and disassembly work more convenient and easy to maintain and maintain. In this embodiment, the fastener is a bolt.

[0043] Alternatively, if Figure 2 , Figure 3 As shown, the heat dissipation clamp 11 includes a heat dissipation portion 111 and a plug-in portion 112. The heat dissipation portion 111 is used to cover the memory module, and the plug-in portion 112 has an area smaller than the heat dissipation portion 111 and is used to plug with the cooler 21. Since the area of ​​the heat dissipation clamp 11 is much larger than the area of ​​the memory module, by providing the plug-in portion 112 with an area smaller than the heat dissipation portion 111, not only materials are saved, but also the plug-in between the heat dissipation clamp 11 and the cooler 21 is facilitated. In this embodiment, the plug-in portion 112 is provided at both ends of the heat dissipation portion 111 to form a T-shaped structure.

[0044] Alternatively, if Figure 2 As shown, a thermal interface material 3 is provided between the memory bar and the heat dissipation clamping plate 11. By providing the thermal interface material 3 between the memory bar and the heat dissipation clamping plate 11, the contact thermal resistance between the memory bar and the heat dissipation clamping plate 11 is reduced, and the heat dissipation effect is improved.

[0045] Alternatively, if Figure 2As shown, the heat dissipation clamping plate 11 and the cooler 21 are filled with a thermal interface material 3. By filling the heat dissipation clamping plate 11 and the cooler 21 with the thermal interface material 3, not only the contact thermal resistance between the heat dissipation clamping plate 11 and the cooler 21 can be reduced, the heat dissipation effect can be improved, and the gap at the plug-in place of the heat dissipation clamping plate 11 and the cooler 21 can be filled to ensure the stability of the heat dissipation clamping plate 11 after plugging.

[0046] Alternatively, if Figure 2 As shown, the cooling module 2 further includes a liquid inlet pipe 23 and a liquid outlet pipe 24. A medium chamber for refrigerant flow is provided inside the cooler 21. The liquid inlet pipe 23 and the liquid outlet pipe 24 are respectively connected to both sides of the cooler 21 along the length direction and are both communicated with the medium chamber. By providing the liquid inlet pipe 23 and the liquid outlet pipe 24 communicated with the internal medium chamber at both ends of the cooler 21, it is convenient for the refrigerant to flow into or out of the cooler 21.

[0047] During the actual assembly, first apply the thermal interface material 3 on both side end surfaces of the memory stick, then attach the heat dissipation clamp 11 to the end surfaces on both sides of the memory stick, then use the clamp 12 to clamp the heat dissipation clamp 11 and the memory stick to form an independent heat dissipation module 1, then assemble them in sequence according to the number of memory sticks, then plug each heat dissipation module 1 into the cooler 21, and finally connect the cover plate 22 to the cooler 21 with fasteners to complete the assembly.

[0048] When replacement is required, one only needs to screw the fasteners to separate the cover 22 from the cooler 21, then take out the heat dissipation module 1 to be replaced, plug the new heat dissipation module 1 into the cooler 21, and finally connect the cover 22 to the cooler 21 with the fasteners to complete the replacement and maintenance work.

[0049] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A memory bar cooling device, characterized in that: The memory bar cooling device comprises: A plurality of heat dissipation modules (1), wherein the plurality of heat dissipation modules (1) comprise heat dissipation clamps (11) and clamping members (12), wherein the heat dissipation clamps (11) are arranged on the end surfaces of both sides of the memory bar, and the clamping members (12) are used to clamp the memory bar and the heat dissipation clamps (11) located on the end surfaces of both sides of the memory bar; A cooling module (2), the cooling module (2) comprising a cooler (21), a refrigerant flowing in the cooler (21), the cooler (21) being arranged at both ends of the plurality of heat dissipation modules (1) along the length direction and being plugged into the plurality of heat dissipation modules (1).

2. The memory bar cooling device according to claim 1, characterized in that: The cooler (21) is provided with a mounting groove and a plurality of plug-in protrusions (211) arranged at intervals in the mounting groove. The plug-in protrusions (211) are inserted between the two heat dissipation clamping plates (11) located on the end surfaces of both sides of the memory bar.

3. The memory bar cooling device according to claim 2, characterized in that: The cooling module (2) further comprises a cover plate (22), wherein the cover plate (22) is detachably connected to a side of the cooler (21) where the mounting groove is provided.

4. The memory bar cooling device according to claim 3, characterized in that: The cross-section of the cooler (21) is rectangular, and the cover plate (22) includes a sealing portion (221) and a fixing portion (222) vertically connected to the sealing portion (221), the sealing portion (221) is connected to a side of the cooler (21) where the mounting groove is provided, and the fixing portion (222) is connected to an end face of the cooler (21) that is vertical to the side where the mounting groove is provided.

5. The memory bar cooling device according to claim 4, characterized in that: The cooling module (2) further comprises a fastener, the blocking portion (221) and the fixing portion (222) are both provided with a connecting through hole, the cooler (21) is provided with a connecting threaded hole corresponding to the connecting through hole, and the fastener passes through the connecting through hole and is threadedly connected to the connecting threaded hole.

6. The memory bar cooling device according to claim 1, characterized in that: The heat dissipation clamp (11) comprises a heat dissipation portion (111) and a plug-in portion (112); the heat dissipation portion (111) is used to cover the memory bar; the plug-in portion (112) has an area smaller than that of the heat dissipation portion (111) and is used to be plugged with the cooler (21).

7. The memory bar cooling device according to claim 1, characterized in that: A thermal interface material (3) is provided between the memory bar and the heat dissipation clamping plate (11).

8. The memory bar cooling device according to claim 1, characterized in that: A thermal interface material (3) is filled between the heat dissipation clamping plate (11) and the cooler (21).

9. The memory bar cooling device according to claim 1, characterized in that: The cooling module (2) further comprises a liquid inlet pipe (23) and a liquid outlet pipe (24); a medium chamber in which the refrigerant flows is provided inside the cooler (21); the liquid inlet pipe (23) and the liquid outlet pipe (24) are respectively connected to two sides of the cooler (21) along the length direction and are both in communication with the medium chamber.

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