Connecting line for semiconductor equipment
By using a combined structure of expansion filling material layer, nylon cloth layer and insect-proof ant drug in the semiconductor device connection line, the problem of the connection line being bitten by insect-anti during use is solved, and the waterproof and mechanical strength of the connection line are improved. The anti-insect and ant performance extends the service life.
Patent Information
- Application Number
- CN202421153331.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-24
AI Technical Summary
The connecting wire of existing semiconductor equipment is easily bitten by insects and ants during use, affecting the normal operation of the equipment.
Adopt a connecting wire structure including an outer insulation layer, four wire cores, inner insulation layer, fill layer, nylon cloth layer and metal sheet, where the fill layer is an expanded fill material layer, the nylon cloth layer is coated with insect-proof ant drugs, and in nylon Fluffs are installed on the surface of the cloth to improve the anti-worm and ant effect.
By expanding the filling material layer, the waterproof performance and mechanical strength of the connecting wires are improved, the nylon cloth layer increases the use strength, and the insect-proof ant drugs and villi improve the anti-insect and ant effect, extending the service life of the connecting wires and avoiding the phenomenon of being bitten by insects and ants .
Smart Images

Figure CN222462425U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of connecting wires for semiconductor equipment, in particular to a connecting wire for semiconductor equipment. Background Art
[0002] In semiconductor devices, connecting wires usually refer to wires or conductors used to connect semiconductor devices, circuit boards and other components. Connecting wires play the role of transmitting signals, power or data in semiconductor devices and are an indispensable part of electronic devices.
[0003] A Chinese patent with publication number CN212750473U discloses a connecting wire for high-voltage testing equipment, including a sleeve, a connecting wire body and an adapter, a part of the connecting wire body is arranged inside the sleeve and the adapter, and the adapter is threadedly connected to the sleeve, and the connecting wire body includes a copper conductor, a semiconductor wrapping tape 1, an extruded inner insulation layer, an extruded outer insulation layer, a semiconductor wrapping tape 2, a tinned copper wire layer, a non-woven fabric layer and an extruded sheath. The extruded inner insulation layer and the extruded outer insulation layer adopt a double extrusion process to improve the vulcanization degree of the insulation; the semiconductor wrapping tape 1 and the semiconductor wrapping tape 2, the two semiconductor tape wrappings, effectively reduce the local discharge caused by high voltage when the product is in use; the tinned copper wire layer effectively reduces the local discharge caused by high voltage when the product is in use, and shields the interference of external signals, and also avoids the interference of the copper conductor to the outside world.
[0004] The existing related technologies often have the following defects: during the actual use of semiconductor device connection wires, when there are many insects and ants in the use area, the insects and ants may bite through the wire core, which will affect the subsequent use of the semiconductor device.
[0005] Therefore, the utility model provides a connecting wire for semiconductor equipment. Utility Model Content
[0006] The utility model aims to solve the defect in the prior art that the semiconductor device connection wire is bitten off by insects and ants, and proposes a connection wire for semiconductor equipment.
[0007] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a connecting wire for semiconductor equipment, comprising an outer insulating layer and four wire cores, the outer surface of the wire core is glued with an inner insulating layer, the outer surfaces of the four inner insulating layers are provided with filling layers, the outer surface of the filling layer is glued with a nylon cloth layer, and the filling layer is an expanded filling material layer.
[0008] The effects achieved by the above components are: the filling layer made of the expanded filling material layer can expand into a foam state when filling the internal space of the connecting line, filling all gaps, thereby improving the waterproof performance and mechanical strength of the connecting line; the nylon cloth layer has excellent wear resistance, tensile resistance, corrosion resistance and heat resistance, and is used as the material inside the connecting line to improve the use strength of the connecting line; coating the nylon cloth layer with insect and ant repellent drugs can effectively improve the anti-insect and ant effect of the connecting line during use and extend the service life of the connecting line.
[0009] Preferably, a plurality of rows of fluff are evenly and fixedly connected to the surface of the nylon cloth layer.
[0010] The effects achieved by the above components are as follows: the setting of the fluff improves the adhesion effect of the anti-insect and ant medicine, and further improves the anti-insect and ant effect of the connecting line during use.
[0011] Preferably, a plurality of support strips are glued between the outer insulating layer and the nylon cloth layer.
[0012] The effects achieved by the above components are: the setting of the support strip facilitates the support work between the nylon cloth layer and the outer insulating layer, increases the sodium storage capacity of the drug stored between the two, and further improves the insect and ant prevention effect of the connecting line during use.
[0013] Preferably, the outer surface of the outer insulating layer is covered with a metal sheet.
[0014] The effect achieved by the above components is: the metal sheet is formed into a circular ring structure, thereby improving the stability of the connection line in use.
[0015] Preferably, a groove is provided at one end of the metal sheet, and a protrusion is provided at the other end of the metal sheet, and the size of the protrusion matches the size of the groove.
[0016] The effect achieved by the above-mentioned components is that the protrusion is sleeved on the inner side of the groove, thereby improving the stability of the splicing of the metal sheets of the circular ring structure.
[0017] Preferably, a plurality of cone rods are evenly and fixedly connected to the inner side of the metal sheet.
[0018] The effects achieved by the above components are as follows: the cone rod passes through the outer insulating layer, the nylon cloth layer and the filling layer in sequence, thereby improving the stability of the use of the connecting wire.
[0019] In summary:
[0020] In the utility model, by providing the above-mentioned structure, the insect and ant resistance of the semiconductor device connecting wire during use is improved, and the phenomenon that the semiconductor device connecting wire is bitten off by insects and ants during use is avoided. The safety of the use of the semiconductor device connecting wire is improved to a certain extent, and the stability of the operation of the semiconductor device is further improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0022] Figure 2 It is a partial structural schematic diagram of the utility model;
[0023] Figure 3 It is a cross-sectional view of the utility model;
[0024] Figure 4 It is a structural schematic diagram of the metal sheet in the utility model.
[0025] Legend: 1. Outer insulation layer; 2. Wire core; 3. Inner insulation layer; 4. Filling layer; 5. Metal sheet; 6. Nylon cloth layer; 7. Support bar; 8. Fluff; 9. Protrusion; 10. Groove; 11. Conical rod. DETAILED DESCRIPTION
[0026] Reference Figure 1 As shown, the utility model provides a technical solution: a connecting wire for semiconductor equipment, comprising an outer insulating layer 1 and four wire cores 2, the outer surface of the wire core 2 is glued with an inner insulating layer 3, and the outer surfaces of the four inner insulating layers 3 are provided with a filling layer 4.
[0027] The following is a detailed description of its overall specific settings and functions.
[0028] In this embodiment: the outer surface of the filling layer 4 is glued with a nylon cloth layer 6, and the filling layer 4 is an expanded filling material layer. The filling layer 4 made of the expanded filling material layer can expand into a foam when filling the internal space of the connecting line, fill all the gaps, and improve the waterproof performance and mechanical strength of the connecting line. The nylon cloth layer 6 has excellent wear resistance, tensile resistance, corrosion resistance and heat resistance. It is used as the material inside the connecting line to improve the use strength of the connecting line. The nylon cloth layer 6 is coated with insect-proof drugs, which can effectively improve the anti-insect and ant effect of the connecting line during use and extend the service life of the connecting line. The surface of the nylon cloth layer 6 is evenly and fixedly connected with a plurality of rows of fluff 8. The setting of the fluff 8 improves the adhesion effect of the insect-proof drugs and further improves the insect-proof effect of the connecting line during use. A plurality of support strips 7 are glued between the outer insulating layer 1 and the nylon cloth layer 6. The provision of the support strip 7 facilitates the support work between the nylon cloth layer 6 and the outer insulating layer 1, increases the sodium storage capacity of the drug stored between the two, and further improves the insect and ant prevention effect of the connecting line during use.
[0029] Specifically, the outer surface of the outer insulating layer 1 is covered with a metal sheet 5. The metal sheet 5 is formed into a circular ring structure, which improves the stability of the use of the connecting wire. A groove 10 is provided at one end of the metal sheet 5, and a protrusion 9 is provided at the other end of the metal sheet 5. The size of the protrusion 9 is adapted to the size of the groove 10. The protrusion 9 is covered on the inner side of the groove 10, which improves the stability of the splicing of the circular ring structure metal sheet 5. A plurality of cone rods 11 are evenly fixedly connected to the inner side of the metal sheet 5. The cone rods 11 will pass through the outer insulating layer 1, the nylon cloth layer 6 and the filling layer 4 in sequence, which improves the stability of the use of the connecting wire.
[0030] Working principle: the filling layer 4 made of the expansion filling material layer can expand into a foam state when filling the internal space of the connecting line, fill up all the gaps, and improve the waterproof performance and mechanical strength of the connecting line. The nylon cloth layer 6 has excellent wear resistance, tensile resistance, corrosion resistance and heat resistance. It is used as the material inside the connecting line to improve the use strength of the connecting line. The anti-insect and ant drug is coated on the nylon cloth layer 6, which can effectively improve the anti-insect and ant effect of the connecting line during use and extend the service life of the connecting line. In the process of applying and covering the anti-insect and ant drug, the setting of the fluff 8 improves the adhesion effect of the anti-insect and ant drug, and further improves the anti-insect and ant effect of the connecting line during use. The setting of the support bar 7 facilitates the support work between the nylon cloth layer 6 and the outer insulating layer 1, and improves the drug between the two. The amount of sodium stored further improves the insect and ant proof effect of the connecting wire during use, the metal sheet 5 is bent to form a circular ring structure, and the protrusion 9 is placed on the inner side of the groove 10, thereby improving the stability of the splicing of the circular ring structure metal sheet 5. During this process, the cone rod 11 will pass through the outer insulating layer 1, the nylon cloth layer 6 and the filling layer 4 in sequence, thereby improving the stability of the use of the connecting wire and avoiding the phenomenon of sliding or twisting between the inner layers during the use of the connecting wire. By setting the above structure, the insect and ant proof performance of the semiconductor device connecting wire during use is improved, and the phenomenon of the semiconductor device connecting wire being bitten by insects and ants during use is avoided, thereby improving the safety of the use of the semiconductor device connecting wire to a certain extent, and further improving the stability of the operation of the semiconductor device.
[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.
Claims
1. A connecting wire for semiconductor equipment, comprising an outer insulating layer (1) and four wire cores (2), characterized in that: The outer surface of the wire core (2) is glued with an inner insulating layer (3), the outer surfaces of the four inner insulating layers (3) are provided with a filling layer (4), the outer surface of the filling layer (4) is glued with a nylon cloth layer (6), and the filling layer (4) is an expansion filling material layer.
2. A semiconductor device connection wire according to claim 1, characterized in that: A plurality of rows of fluff (8) are evenly and fixedly connected to the surface of the nylon cloth layer (6).
3. A semiconductor device connection wire according to claim 1, characterized in that: A plurality of support strips (7) are glued between the outer insulating layer (1) and the nylon cloth layer (6).
4. The connection wire for semiconductor device according to claim 1, characterized in that: The outer surface of the outer insulating layer (1) is covered with a metal sheet (5).
5. A semiconductor device connection wire according to claim 4, characterized in that: One end of the metal sheet (5) is provided with a groove (10), and the other end of the metal sheet (5) is provided with a protrusion (9), and the size of the protrusion (9) is matched with the size of the groove (10).
6. A connection wire for semiconductor devices according to claim 4, characterized in that: A plurality of cone rods (11) are evenly and fixedly connected to the inner side of the metal sheet (5).
Citation Information
Patent Citations
Connecting line for high-voltage test equipment
CN212750473U