Inert protective gas spraying device

Abstract

The utility model discloses an inert protective gas spraying device which comprises a spraying pipe, a gas feeding pipe, a first blocking plate and a second blocking plate, the gas feeding pipe is concentrically arranged in the horizontally-arranged spraying pipe, the first blocking plate is arranged at the tail of the spraying pipe and used for blocking the gas feeding pipe, and the second blocking plate is arranged at the tail of the spraying pipe and used for blocking the gas feeding pipe. The second blocking plate is arranged at the front end of the spraying pipe, the front end of the air feeding pipe penetrates through the second blocking plate and extends to the outer side of the second blocking plate, positioning plates horizontally pointing to the inner wall of the spraying pipe are arranged on the two sides of the air feeding pipe, and air grooves are formed in the sides, making contact with the inner wall of the spraying pipe, of the positioning plates in an inwards-concave mode; air supply holes located in the inner side of the spraying pipe are formed in the top of the air supply pipe at intervals, and spraying holes are formed in the bottom of the spraying pipe at intervals. According to the inert protective gas spraying device disclosed by the utility model, secondary uniformity of air pressure is realized, and the uniformity of the inert protective gas sprayed downwards through the spraying holes is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer production, in particular to an inert protective gas spraying device. Background Art

[0002] During the production of semiconductor wafers, an oxidation furnace can be used to form an oxidation protection layer on the semiconductor wafer to protect multiple semiconductor wafers.

[0003] The temperature of the oxidation furnace is high. In order to improve safety, argon or other inert protective gases can be introduced into the oxidation furnace for protection when the semiconductor wafer is oxidized. The existing practice is to install a spray pipe in the oxidation furnace to spray the inert protective gas in the oxidation furnace. In order to improve the uniformity of the inert gas distribution, the utility model patent with application number 2017209024458 discloses a photovoltaic silicon wafer quartz diffusion furnace with uniform spraying. A plurality of spray holes are opened on the wall of the spray pipe, and the diameter of the spray hole closer to the head of the quartz diffusion furnace is larger than the diameter of the spray hole closer to the tail of the quartz diffusion furnace to solve the problem of uneven spraying of the spray pipe. However, in the process of making the spray pipe, the diameter difference and spacing change of the spray hole are difficult to accurately calculate, the processing is difficult, and improvements are needed. Utility Model Content

[0004] The utility model aims to provide an inert protective gas spraying device to spray the inert protective gas and improve the spraying uniformity.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] An inert protective gas spray device comprises: a spray pipe, an air supply pipe, a first sealing plate and a second sealing plate, the air supply pipe is concentrically arranged in a horizontally placed spray pipe, the first sealing plate is arranged at the tail end of the spray pipe and seals the air supply pipe, the second sealing plate is arranged at the front end of the spray pipe, the front end of the air supply pipe passes through the second sealing plate and extends to the outside of the second sealing plate, positioning plates pointing horizontally to the inner wall of the spray pipe are arranged on both sides of the air supply pipe, an air groove is concavely arranged on one side of the positioning plate in contact with the inner wall of the spray pipe, air supply holes located on the inner side of the spray pipe are arranged at intervals on the top of the air supply pipe, and spray holes are arranged at intervals at the bottom of the spray pipe.

[0007] Wherein, the first blocking plate and the second blocking plate are respectively provided with mounting holes located outside the spray pipe.

[0008] Wherein, a through hole corresponding to the air supply pipe is arranged in the middle of the second blocking plate, and the air supply pipe is fixed to the second blocking plate by welding.

[0009] Wherein, a section of external thread is arranged on the outer circle of the front end of the air supply pipe.

[0010] Wherein, the air grooves are arranged at intervals on the positioning plate.

[0011] Wherein, the air supply hole and the spray hole are misaligned in the axial direction of the spray pipe.

[0012] The beneficial effects of the utility model include: an inert protective gas spraying device, in which the inert protective gas is first blown toward the top of the inner wall of the spray pipe through the air supply pipe, and mixed above the air supply pipe to improve the uniformity of the air pressure distribution above the air supply pipe, and then the inert protective gas is transferred to the bottom of the air supply pipe by the air groove, and the uniformity of the air pressure distribution below the air supply pipe is improved, thereby achieving secondary uniformity of the air pressure, and finally the gas is evenly sprayed downwards through the spray hole, thereby achieving protection for the oxidation process of the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1~Figure 2 It is a structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0014] Combine the following Figure 1~Figure 2 The technical solution of the utility model is further illustrated by specific embodiments.

[0015] like Figure 1 and Figure 2 The inert protective gas spray device shown includes: a spray pipe 1, an air supply pipe 2, a first sealing plate 5 and a second sealing plate 6. The air supply pipe 2 is concentrically arranged in the horizontally placed spray pipe 1. The first sealing plate 5 is arranged at the tail end of the spray pipe 1 and seals the air supply pipe 2. The first sealing plate 5 is welded and fixed to the tail ends of the spray pipe 1 and the air supply pipe 2, respectively, and has a stable structure and good air tightness.

[0016] The second blocking plate 6 is arranged at the front end of the spray pipe 1, and the first blocking plate 5 and the second blocking plate 6 are respectively provided with mounting holes 7 located outside the spray pipe 1. Figure 2 As shown, the outer diameters of the first sealing plate 5 and the second sealing plate 6 are larger than the outer diameter of the spray pipe, so that the spray device can be easily fixed in the oxidation furnace by screws.

[0017] The front end of the air supply pipe 2 passes through the second blocking plate 6 and extends to the outside of the second blocking plate 6. In this embodiment, a through hole corresponding to the air supply pipe 2 is provided in the middle of the second blocking plate 6, which is convenient for assembly. The air supply pipe 2 is welded and fixed to the second blocking plate 6, and the structure is stable to avoid air leakage. A section of external thread is provided on the outer circle of the front end of the air supply pipe 2, which is convenient for connecting with the air supply pipeline and introducing the inert protective gas (argon) into the air supply pipe 2.

[0018] like Figure 2As shown, positioning plates 9 pointing horizontally toward the inner wall of the spray pipe 1 are arranged on both sides of the air supply pipe 2. The positioning plates 9 extend along the length direction of the spray pipe 1 and are welded and fixed to the air supply pipe 2. The concentricity of the air supply pipe 2 in the spray pipe 1 is ensured by the positioning plates 9.

[0019] Air supply holes 3 located on the inner side of the spray pipe 1 are arranged at intervals on the top of the air supply pipe 2, and air grooves 8 are arranged inwardly on the side of the positioning plate 9 that contacts the inner wall of the spray pipe 1. In the present embodiment, the air grooves 8 are arranged at intervals on the positioning plate 9. When the inert protective gas is delivered into the spray pipe 1 through the air supply pipe 2, the air supply holes 3 are first used to blow the inert protective gas toward the top of the inner wall of the spray pipe 1, and the gas is mixed above the air supply pipe 2 to improve the uniformity of the air pressure distribution above the air supply pipe 2. Then, the air grooves 8 are used to transfer the inert protective gas to the bottom of the air supply pipe 2, so as to improve the uniformity of the air pressure distribution below the air supply pipe 2 in the spray pipe 1, thereby achieving secondary uniformity of the air pressure.

[0020] Spray holes 4 are arranged at intervals at the bottom of the spray pipe 1, and the inert protective gas is finally sprayed downward uniformly through the spray holes 4, thereby protecting the oxidation process of the semiconductor wafer. In this embodiment, the air supply hole 3 and the spray hole 4 are staggered in the axial direction of the spray pipe, which is conducive to the mixing of the airflow above the spray hole 4 and improves the uniformity of the air pressure.

[0021] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. An inert protective gas spraying device, characterized in that: include: A spray pipe, an air supply pipe, a first sealing plate and a second sealing plate, the air supply pipe is concentrically arranged in a horizontally placed spray pipe, the first sealing plate is arranged at the tail end of the spray pipe and seals the air supply pipe, the second sealing plate is arranged at the front end of the spray pipe, the front end of the air supply pipe passes through the second sealing plate and extends to the outside of the second sealing plate, positioning plates pointing horizontally to the inner wall of the spray pipe are arranged on both sides of the air supply pipe, an air groove is concavely arranged on one side of the positioning plate in contact with the inner wall of the spray pipe, air supply holes located on the inner side of the spray pipe are arranged at intervals at the top of the air supply pipe, and spray holes are arranged at intervals at the bottom of the spray pipe.

2. The inert protective gas spraying device according to claim 1, characterized in that: The first blocking plate and the second blocking plate are respectively provided with mounting holes located outside the spray pipe.

3. The inert protective gas spraying device according to claim 1, characterized in that: A through hole corresponding to the air supply pipe is arranged in the middle of the second blocking plate, and the air supply pipe is fixed to the second blocking plate by welding.

4. The inert protective gas spraying device according to claim 1, characterized in that: A section of external thread is arranged on the outer circle of the front end of the air delivery pipe.

5. The inert protective gas spraying device according to claim 1, characterized in that: The air grooves are arranged on the positioning plate at intervals.

6. The inert protective gas spraying device according to claim 1, characterized in that: The air delivery hole and the spray hole are misaligned in the axial direction of the spray pipe.

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