Wafer stage device

Abstract

The utility model discloses a wafer carrying table device. The wafer carrying table device comprises a magnetofluid structure, the magnetofluid structure comprises a magnetofluid fixed shaft and a magnetofluid rotating shaft, the magnetofluid rotating shaft is rotationally arranged in a center hole of the magnetofluid fixed shaft, and the magnetofluid fixed shaft divides the internal structure of the wafer carrying table device into a vacuum environment side and an atmospheric environment side; the heater is connected with the end, located on the vacuum environment side, of the magnetofluid rotating shaft, a containing groove used for containing the wafer is formed in the heater, and the heater can be connected with an external power source. According to the wafer carrying table device provided by the utility model, the heater is adopted as the wafer carrying table, and the heater can be conducted with the external power supply, so that the wafer can be heated through the heater, and high-temperature heating can be realized only by setting the temperature of the heater if a high-temperature process is needed; high temperature control precision is achieved by adjusting the temperature of the heater.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer carriers, in particular to a wafer carrier device. Background Art

[0002] Ion beam etching (IBE) and ion beam deposition (IBD) technologies play a powerful role in the fields of optical fiber, computer, communication, nanotechnology, new materials and integrated optics. The ideal film should have the characteristics of stable optical properties, no scattering and absorption, strong mechanical properties and stable chemical properties. Ion beam etching (IBE) and ion beam deposition (IBD) provide a technical platform that can meet these requirements. At present, the application field of ion beam etching and deposition technology is constantly being broadened, especially with the improvement of chip integration, the reduction of key dimensions, high selectivity and precise pattern transfer. The process requirements have increased, which further highlights the advantages of ion beam etching and ion beam deposition.

[0003] Ion beam sputtering deposition is a method in which an inert gas (usually argon) generates high-energy ions in an ion source to bombard a target material and deposit the target material onto a substrate. For the production of thin films, the temperature of the substrate is an important parameter. The effect of temperature on film growth is considered from three main application aspects: film structure, stress and adhesion. If a thicker film layer is deposited, a higher substrate temperature is generally required to reduce stress within the film and reduce the chance of film oxidation. However, in actual operation, the temperature control range must also be considered in combination with the method and equipment used to deposit the thin film, as well as the structural characteristics and requirements of the substrate itself.

[0004] Existing wafer carriers usually use cooling water to control the temperature of the sample stage. This temperature control method can generally only control the temperature below 100°C, cannot achieve high-temperature heating function, and the temperature control accuracy is low.

[0005] Therefore, how to provide a wafer carrier that can be heated at high temperature and has high temperature control accuracy is a technical problem that technical personnel in this field currently need to solve. Utility Model Content

[0006] In view of this, an object of the present invention is to provide a wafer stage device to achieve high-temperature heating and high-precision temperature control effects.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A wafer stage device, comprising:

[0009] The magnetic fluid structure comprises a magnetic fluid fixed axis and a magnetic fluid rotating axis, wherein the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and the magnetic fluid fixed axis separates the internal structure of the wafer stage device into a vacuum environment side and an atmospheric environment side;

[0010] The heater is connected to one end of the magnetic fluid rotating shaft located at the vacuum environment side, and the heater is provided with a placement groove for placing the wafer, and the heater can be connected to an external power supply.

[0011] Optionally, in the above-mentioned wafer stage device, an adapter fixing seat is provided at one end of the magnetic fluid rotating shaft close to the heater, the heater is provided on the adapter fixing seat, and a heat insulation plate is provided between the adapter fixing seat and the heater.

[0012] Optionally, in the above-mentioned wafer carrier device, the heater includes a heater body fixed on the adapter fixing seat and a heating harness electrically connected to the heater body, an insulating sleeve is coaxially fixed to the bottom of the heater body, and the heating harness passes through the insulating sleeve and is electrically connected to an external power supply.

[0013] Optionally, in the above wafer stage device, an electric slip ring is provided at one end of the magnetic fluid rotating shaft close to the atmospheric environment side;

[0014] The electric slip ring comprises a stator and a rotor, wherein the stator is fixedly arranged on the magnetic fluid fixed shaft, the rotor is rotatably arranged in the center hole of the stator, and the heating harness is electrically connected to the slip ring harness on the rotor.

[0015] Optionally, in the above-mentioned wafer stage device, a lifting bottom tray is provided on a side of the transfer fixing seat away from the heater, and an ejector pin is fixed on the lifting bottom tray, and the ejector pin penetrates the transfer fixing seat and the heater and contacts the back side of the wafer;

[0016] Wherein, the wafer stage device also includes a lifting drive component, and the lifting drive component is used to drive the lifting bottom tray to perform lifting movement.

[0017] Optionally, in the above-mentioned wafer stage device, the lifting drive assembly includes two cylinders symmetrically arranged on both sides of the magnetic fluid structure, and a top ring arranged on the top of the two cylinders, and the top ring is located below the lifting bottom tray.

[0018] Optionally, in the above-mentioned wafer stage device, the cylinder includes a cylinder body and a sealing bellows matched with the cylinder body, and a bottom air inlet and a top air inlet are respectively provided at the bottom and the top of the cylinder body.

[0019] Optionally, in the above wafer stage device, the cylinder further comprises a telescopic rod connected to the telescopic end of the sealing bellows, a magnet is arranged at the bottom of the telescopic rod, and a magnetic induction switch cooperating with the magnet is arranged on the atmospheric environment side;

[0020] And / or, a signal sensor and a signal transmitter are arranged on the vacuum environment side, the signal sensor and the signal transmitter cooperate with each other inductively, and the signal transmitter is arranged on the side of the lifting bottom tray.

[0021] Optionally, in the above-mentioned wafer stage device, a clamping guide rod is also provided on the lifting base tray, and a clamping member for clamping the wafer is provided on the heater, and the clamping guide rod passes through the adapter fixing seat, the heat insulation plate and the heater and is connected to the clamping member.

[0022] Optionally, in the above-mentioned wafer stage device, an elastic element and an elastic guide rod for guiding the elastic element are arranged between the lifting bottom tray and the transfer fixing seat.

[0023] Optionally, in the above-mentioned wafer carrier device, the magnetic fluid structure also includes a magnetic fluid flange arranged on the magnetic fluid fixed axis, and end face water channels and axial end water channels are respectively arranged on the magnetic fluid flange and the magnetic fluid fixed axis, and the end face water channels and the axial end water channels are connected in series.

[0024] Optionally, in the above-mentioned wafer stage device, the wafer stage device further includes a rotation driving member, a first transmission disk, a second transmission disk and a conveyor belt;

[0025] Wherein, the first transmission disc is connected to the output shaft of the rotating drive member, the second transmission disc is arranged on the magnetic fluid rotating shaft, and the conveyor belt connects the first transmission disc and the second transmission disc.

[0026] Optionally, in the above-mentioned wafer stage device, the wafer stage device further includes a stage support member and a flip driving member;

[0027] Wherein, the magnetic fluid structure and the heater are both arranged on the stage support, and the flip driving member is used to drive the stage support to flip around a flip axis, and the flip axis is perpendicular to the rotation axis of the magnetic fluid shaft.

[0028] Optionally, in the above wafer stage device, it further includes an encoder arranged on the magnetic fluid rotating shaft;

[0029] And / or, it also includes a baffle arranged above the heater.

[0030] When using the wafer carrier device provided by the utility model, the wafer is placed in the placement groove of the heater. Since the heater is connected to one end of the magnetic fluid shaft located on the vacuum environment side, the magnetic fluid shaft will drive the heater to rotate during the rotation process, ensuring that the number of deposited atoms on the wafer surface and the number of bombarded atoms reach a certain ratio, thereby ensuring the performance and quality of the film layer; since the wafer carrier device provided by the utility model uses a heater as a wafer carrier, the heater can be connected to an external power supply, and therefore the wafer can be heated by the heater. If a high-temperature process is required, high-temperature heating can be achieved by simply setting the temperature of the heater, and a higher temperature control accuracy can be achieved by adjusting the temperature of the heater. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 A schematic diagram of the internal structure of a wafer stage device provided by an embodiment of the utility model;

[0033] Figure 2 A schematic diagram of the internal structure of another wafer stage device provided in an embodiment of the utility model.

[0034] Among them, 11 is a magnetic fluid fixed axis, 12 is a magnetic fluid rotating axis, 13 is a magnetic fluid flange, 14 is an end water channel, 15 is an axis end water channel, 16 is an encoder, 20 is a heater, 21 is a heating harness, 22 is an insulating sleeve, 30 is an adapter fixing seat, 31 is a heat insulation board, 40 is an electric slip ring, 41 is a rotor, 42 is a stator, 43 is a slip ring harness, 44 is a slip ring stator fixing bracket, 50 is a lifting bottom tray, 51 is a ejector pin, 52 is a clamping guide rod, 53 is a clamping member, 54 is an elastic element, 61 is a sealing bellows, 62 is a top ring, 63 is a magnet, 71 is a signal sensor, 81 is a rotating drive member, 82 is a first transmission disk, 83 is a second transmission disk, 84 is a conveyor belt, 90 is a baffle, 91 is a baffle cylinder, 92 is a cylinder magnetic fluid, and 100 is a carrier support. DETAILED DESCRIPTION

[0035] In view of this, the core of the present invention is to provide a wafer carrier device to achieve high-temperature heating and high-precision temperature control effects.

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] like Figure 1 to Figure 2 As shown, an embodiment of the utility model discloses a wafer stage device, including a magnetic fluid structure and a heater 20.

[0038] Among them, the magnetic fluid structure includes a magnetic fluid fixed axis 11 and a magnetic fluid rotating axis 12, the magnetic fluid rotating axis 12 is rotatably set in the center hole of the magnetic fluid fixed axis 11, and the magnetic fluid fixed axis 11 divides the internal structure of the wafer carrier device into a vacuum environment side and an atmospheric environment side; the heater 20 is connected to one end of the magnetic fluid rotating axis 12 on the vacuum environment side, and a placement groove for placing the wafer is provided on the heater 20, and the heater 20 can be connected to an external power supply.

[0039] When using the wafer carrier device provided by the utility model, the wafer is placed in the placement groove of the heater 20. Since the heater 20 is connected to the end of the magnetic fluid shaft 12 located on the vacuum environment side, the magnetic fluid shaft 12 will drive the heater 20 to rotate during the rotation process, ensuring that the number of deposited atoms on the wafer surface and the number of bombarded atoms reach a certain ratio, thereby ensuring the performance and quality of the film layer; since the wafer carrier device provided by the utility model uses the heater 20 as the wafer carrier, the heater 20 can be connected to an external power supply. Therefore, the wafer can be heated by the heater 20. If a high-temperature process is required, high-temperature heating can be achieved by simply setting the temperature of the heater 20. By adjusting the temperature of the heater 20, a higher temperature control accuracy can be achieved.

[0040] like Figure 1 As shown, an adapter fixing seat 30 is provided at one end of the magnetic fluid shaft 12 close to the heater 20 so that the heater 20 can be set on the adapter fixing seat 30, and a heat insulation plate 31 is provided between the adapter fixing seat 30 and the heater 20 so as to isolate the heat source through the heat insulation plate 31, reduce the impact of high temperature on the electrical components on the atmospheric environment side, and extend the service life of the electrical components on the atmospheric environment side.

[0041] It should be understood that the above-mentioned insulation board 31 can be a vacuum insulation board, a foam board or an extruded board, etc. As long as the insulation board type can meet the insulation requirements, it belongs to the protection scope of the present utility model; in addition, the center of the above-mentioned adapter fixing seat 30 and the insulation board 31 is provided with a through hole for the heating harness 21 described below to pass through.

[0042] Specifically, the above-mentioned heater 20 includes a heater body fixed on the adapter fixing seat 30 and a heating harness 21 electrically connected to the heater body. An insulating sleeve 22 is coaxially fixed to the bottom of the heater body. The heating harness 21 passes through the insulating sleeve 22 and is electrically connected to an external power supply to perform insulation through the insulating sleeve 22.

[0043] Furthermore, based on the fact that the heater body and the heating harness 21 will rotate with the magnetic fluid shaft 12, in order to provide a conductive function to the rotating parts, the utility model sets an electric slip ring 40 at one end of the magnetic fluid shaft 12 close to the atmospheric environment. The electric slip ring 40 includes a stator 42 and a rotor 41. The stator 42 is fixed on the magnetic fluid fixed shaft 11 through a slip ring stator fixing bracket 44. The rotor 41 is rotatably set in the center hole of the stator 42. The stator 42 and the rotor 41 adopt a sliding conductive design. The heating harness 21 is electrically connected to the slip ring harness 43 on the rotor 41, thereby realizing the electrical connection between the heater 20 and an external power supply.

[0044] The transfer fixing seat 30 provided by the utility model is provided with a lifting bottom tray 50 on the side facing away from the heater 20, and a ejector pin 51 is fixed on the lifting bottom tray 50. The ejector pin 51 penetrates the transfer fixing seat 30 and the heater 20 and contacts the back side of the wafer. The wafer carrier device also includes a lifting drive component, which is used to drive the lifting bottom tray 50 to perform lifting movement, so as to drive the lifting bottom tray 50 to perform lifting movement through the lifting drive component, thereby causing the ejector pin 51 on the lifting bottom tray 50 to perform lifting movement. Based on the contact between the ejector pin 51 and the back side of the wafer, the floating height of the wafer is adjusted.

[0045] The above-mentioned lifting drive component can realize the lifting drive of the lifting bottom tray through a type of drive component such as a cylinder, an electric lifting bracket or a hydraulic cylinder. As long as the type of lifting drive component can meet the lifting requirements, it belongs to the protection scope of the present utility model; optionally, the present utility model provides a specific lifting drive component.

[0046] The lifting drive assembly includes two cylinders symmetrically arranged on both sides of the magnetic fluid structure, and a top ring 62 arranged on the top of the two cylinders. A magnetic fluid flange 13 is arranged on the magnetic fluid fixed axis 11. The top ring 62 is located below the lifting bottom tray 50 and above the magnetic fluid flange 13, so that the lifting bottom tray 50 can be driven by the cylinder to lift and lower. The top ring 62 is rigidly connected to the top of the two cylinders to ensure that the two cylinders are lifted and lowered synchronously, lifting the lifting bottom tray 50 and driving the ejector pin 51 to rise. When the cylinder drives the top ring 62 to fall back to contact the upper surface of the magnetic fluid flange 13, it is the extreme position of the fall.

[0047] Specifically, the above-mentioned cylinder includes a cylinder body and a sealing bellows 61 matched with the cylinder body. The bottom and top of the cylinder body are respectively provided with a bottom air inlet and a top air inlet. When it is necessary to lift the ejector pin 51, compressed air is introduced into the bottom air inlets of the two cylinder bodies at the same time. The bottom air inlet is communicated with the sealing bellows 61. Under the push of the airflow, the top of the sealing bellows 61 is lifted. Under the rigid connection of the top ring 62, the tops of the two sealing bellows 61 are lifted at the same time and lift the lifting bottom tray 50, driving the ejector pin 51 to lift. The bottom of the adapter fixing seat 30 is provided with a lifting guide rod and a sliding limiter slidably arranged on the lifting guide rod. The sliding limiter is arranged on the lifting bottom tray 50. As the lifting bottom tray 50 rises to abut against the adapter fixing seat 30, the ejector pin 51 is located at the highest limit position, which is a certain distance away from the placement slot of the heater 20 to facilitate the wafer robot finger to transfer and place the wafer on the ejector pin 51; when the ejector pin 51 needs to be lowered, compressed air is introduced into the top air inlets of the two cylinders at the same time, and under the push of the airflow, the top of the sealing bellows 61 falls back, and when the top ring 62 falls back and contacts the upper surface of the magnetic fluid flange 13, it is the limit position of the fall. At this time, the top ring 62 and the lifting bottom tray 50 are separated, and there is a certain gap to prevent the lifting bottom tray 50 from interfering or rubbing with the top ring 62 during rotation, thereby affecting the normal use of the wafer carrier device.

[0048] In addition, the above-mentioned cylinder also includes a telescopic rod connected to the telescopic end of the sealing bellows 61, a magnet 63 is arranged at the bottom of the telescopic rod, and a magnetic induction switch cooperating with the magnet 63 is arranged on the atmospheric environment side, so as to judge the lifting and lowering position of the telescopic rod through the cooperation between the magnet 63 and the magnetic induction switch, thereby judging the lifting and lowering position of the sealing bellows 61, so as to detect whether the cylinder is operating normally.

[0049] A signal sensor 71 and a signal transmitter are also provided on the above-mentioned vacuum environment side. The signal sensor 71 and the signal transmitter cooperate with each other in induction. The signal transmitter is arranged on the side of the lifting bottom tray 50. There are two signal sensors 71. The two signal sensors 71 are fixed on the stage support 100 described below, distributed up and down, and close to the lifting bottom tray 50. The lifting and lowering condition of the lifting bottom tray 50 can be judged by the induction cooperation of the signal transmitter and the two signal sensors 71, so as to determine whether the ejector pin 51 has fallen back into place.

[0050] In addition, a clamping guide rod 52 is also provided on the above-mentioned lifting bottom tray 50, and a clamping member 53 for clamping the wafer is provided on the heater 20. The clamping guide rod 52 passes through the adapter fixing seat 30, the insulation plate 31 and the heater 20 and is connected with the clamping member 53, so as to drive the clamping guide rod 52 to rise and fall through the lifting bottom tray 50, so that the clamping member 53 can be lifted and lowered to a preset clamping position to clamp the wafer, and can be lifted and lowered to a preset release position to release the wafer.

[0051] Furthermore, an elastic element 54 and an elastic guide rod for guiding the elastic element 54 are arranged between the lifting bottom tray 50 and the transfer fixing seat 30, so that the extension and contraction of the elastic element 54 are guided by the elastic guide rod, and based on the compression deformation force of the elastic element 54, the lifting bottom tray 50 is in a falling state, so that the ejector pins 51 and the clamping members 53 arranged on the lifting bottom tray 50 are in a falling state, so as to prevent the ejector pins 51 from applying a pushing force to the wafer and causing damage to the wafer, and the clamping member 53 applies a clamping force to the edge of the wafer placed on the heater 20, so as to fix the wafer and prevent it from falling off.

[0052] In addition, an end face water channel 14 and an axis end water channel 15 are respectively arranged on the magnetic fluid flange 13 and the magnetic fluid fixed shaft 11, and the end face water channel 14 and the axis end water channel 15 are connected in series to form a cooling water channel to provide cooling for the entire wafer carrier device and further isolate the heat source to protect the electrical components on the atmospheric environment side from high temperature, thereby extending the service life of the electrical components.

[0053] The wafer carrier device provided by the utility model also includes a rotating driving member 81, a first transmission disk 82, a second transmission disk 83 and a conveyor belt 84; wherein the first transmission disk 82 is connected to the output shaft of the rotating driving member 81, the second transmission disk 83 is arranged on the magnetic fluid shaft 12, and the conveyor belt 84 connects the first transmission disk 82 and the second transmission disk 83 to drive the first transmission disk 82 to rotate through the rotating driving member 81. Based on the connection between the second transmission disk 83 and the first transmission disk 82 through the conveyor belt 84, the second transmission disk 83 also rotates accordingly, so that the magnetic fluid shaft 12 rotates, and the heater 20 arranged on the magnetic fluid shaft 12 realizes self-rotation, thereby improving the uniformity of the coating.

[0054] In addition, the wafer carrier device also includes a carrier support 100 and a flipping drive; wherein, the magnetic fluid structure and the heater 20 are both arranged on the carrier support 100, and the flipping drive is used to drive the carrier support 100 to flip, and the flipping axis is perpendicular to the rotation axis of the magnetic fluid shaft 12, so that the wafer carrier device can drive the heater 20 to rotate through the magnetic fluid shaft 12, so that the wafer can rotate, thereby improving the uniformity of the coating. On the other hand, by flipping the carrier support 100 by the flipping drive, the entire wafer carrier device can be flipped at different angles, thereby improving the uniformity of the coating and the deposition rate. The wafer carrier device occupies a small space, has a high degree of integration, rotates smoothly and with high precision, and can be used for etching and ion beam deposition equipment at the same time.

[0055] The wafer carrier device provided by the utility model also includes an encoder 16 arranged on the magnetic fluid shaft 12, so as to determine the rotation position of the magnetic fluid shaft 12 through the encoder 16, thereby accurately determining the rotation position of the heater 20 on which the wafer is placed; the wafer carrier device also includes a baffle 90 arranged above the heater 20, so as to block the ion beam flow at certain moments of the process through the baffle 90, thereby reducing the damage of the ion beam flow to the wafer, preventing the wafer from being bombarded by the ion beam and generating unnecessary particles, thereby enhancing the service life of the wafer carrier.

[0056] The above-mentioned baffle 90 can be opened manually or by a baffle driving mechanism. As long as the baffle can meet the use requirements, it belongs to the protection scope of the present utility model; optionally, the baffle cylinder 91 provided in the embodiment of the present utility model is connected to the rotating cylinder arranged on the atmospheric environment side through the cylinder magnetic fluid 92, so that under the action of the rotating cylinder, the baffle 90 can be driven to rotate within a limited angle, thereby improving the convenience of opening and closing the baffle 90.

[0057] In addition, a protective cover is provided around the heater 20 to prevent the side surface of the wafer from being contaminated by the ion beam.

[0058] The entire workflow of using the wafer stage device is as follows:

[0059] First, the entire wafer stage device rotates along the rotation axis direction of the stage support 100 to a position as shown in FIG. Figure 1 As shown in the horizontal state, the heater 20 rotates with the magnetic fluid shaft 12 to a preset origin position (capable of meeting the wafer transfer position). Under the action of the baffle cylinder, the baffle 90 is opened, and then compressed air is introduced into the air inlets at the bottom of the cylinder body on both sides of the magnetic fluid structure, causing the sealing bellows 61 to rise. The cylinder bodies on both sides take in air at the same time and rise synchronously under the connection of the top ring 62, thereby lifting the lifting bottom tray 50, driving the ejector pin 51 and the clamping piece to rise. Under the action of the lifting guide rod and the sliding limiter, the ejector pin 51 and the clamping piece 53 are lifted to the extreme position. The ejector pin 51 and the clamping piece 53 are at a certain distance from the upper surface of the heater 20 to facilitate the wafer robot finger transfer and place the wafer on the ejector pin 51.

[0060] After the wafer is placed, compressed air is passed through the air inlet holes on the top of the cylinder on both sides of the magnetic fluid structure, causing the sealing bellows 61 to fall back. When the top ring 62 falls back to contact the upper surface of the magnetic fluid flange 13, it is the limit position. At this time, the top ring 62 and the lifting bottom tray 50 are separated with a certain gap; the pressing member presses the wafer to prevent it from falling off under the action of the elastic element 54. A magnet 63 is installed at the bottom of the telescopic rod of the sealing bellows 61, and two magnetic induction switches are set outside to judge the lifting position of the sealing bellows 61, thereby detecting Whether the cylinder is lifted and lowered normally; a position detection device is also provided on the vacuum environment side to prevent the elastic element 54 from malfunctioning and causing the clamping piece 53 to fail to fall back into place. Two signal sensors 71 are fixed on the stage support 100, distributed up and down, and close to the lifting bottom tray 50. The signal transmitter is installed on the side of the lifting bottom tray 50. Because the lifting bottom tray 50 and the clamping piece 53 are rigidly connected by the clamping guide rod 52, the lifting and lowering of the lifting bottom tray 50 can be used to determine whether the clamping piece 53 has fallen back into place.

[0061] After the wafer is fixed, the magnetic fluid shaft 12 rotates under the driving action of the rotating drive member 81, the rotor 41 of the electric slip ring 40 rotates with the magnetic fluid shaft 12, and the stator 42 is fixed by the slip ring stator fixing bracket 44. The stage support 100 can realize the flipping of the entire wafer stage device at different angles under the driving action of the flipping drive member on its shaft end.

[0062] If a high-temperature process is required, temperature control can be achieved by simply setting the temperature of the heater 20. During the high-temperature heating process, the main risk point is the impact on the service life of electrical components such as rotating drive parts and cylinders on the atmospheric environment side. The utility model avoids high-temperature heating problems through a layer-by-layer insulation design, in which the heat insulation plate 31 directly cuts off the heat source, and a cooling water channel is provided inside the magnetic fluid structure, wherein the end face water channel 14 and the shaft end water channel 15 are connected in series to provide cooling for the entire wafer carrier device, further isolating the heat source, thereby protecting the electrical components in the bottom atmospheric space.

[0063] The wafer carrier device described in the utility model can realize wafer rotation and flipping and switching of the wafer carrier device as a whole at different angles while heating the wafer carrier at high temperature, and has small space occupation, high integration, low cost, symmetrical dual-cylinder design, and is easy to debug and maintain.

[0064] The terms "first" and "second" in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.

[0065] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer stage device, characterized in that: include: The magnetic fluid structure comprises a magnetic fluid fixed axis and a magnetic fluid rotating axis, wherein the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and the magnetic fluid fixed axis separates the internal structure of the wafer stage device into a vacuum environment side and an atmospheric environment side; The heater is connected to one end of the magnetic fluid rotating shaft located at the vacuum environment side, and the heater is provided with a placement groove for placing the wafer, and the heater can be connected to an external power supply.

2. The wafer stage device according to claim 1, characterized in that: An adapter fixing seat is arranged at one end of the magnetic fluid rotating shaft close to the heater, the heater is arranged on the adapter fixing seat, and a heat insulation plate is arranged between the adapter fixing seat and the heater.

3. The wafer stage device according to claim 2, characterized in that: The heater comprises a heater body fixed on the adapter fixing seat and a heating harness electrically connected to the heater body. An insulating sleeve is coaxially fixed to the bottom of the heater body. The heating harness passes through the insulating sleeve and is electrically connected to an external power source.

4. The wafer stage device according to claim 3, characterized in that: An electric slip ring is arranged at one end of the magnetic fluid rotating shaft close to the atmospheric environment; The electric slip ring comprises a stator and a rotor, wherein the stator is fixedly arranged on the magnetic fluid fixed shaft, the rotor is rotatably arranged in the center hole of the stator, and the heating harness is electrically connected to the slip ring harness on the rotor.

5. The wafer stage device according to claim 2, characterized in that: A lifting bottom tray is arranged on the side of the transfer fixing seat away from the heater, and an ejector pin is fixed on the lifting bottom tray. The ejector pin penetrates the transfer fixing seat and the heater and contacts the back side of the wafer; Wherein, the wafer stage device also includes a lifting drive component, and the lifting drive component is used to drive the lifting bottom tray to perform lifting movement.

6. The wafer stage device according to claim 5, characterized in that: The lifting drive assembly includes two cylinders symmetrically arranged on both sides of the magnetic fluid structure, and a top ring arranged on the top of the two cylinders, and the top ring is located below the lifting bottom tray.

7. The wafer stage device according to claim 6, characterized in that: The cylinder comprises a cylinder body and a sealing bellows matched with the cylinder body. A bottom air inlet and a top air inlet are respectively arranged at the bottom and the top of the cylinder body.

8. The wafer stage device according to claim 7, characterized in that: The cylinder further comprises a telescopic rod connected to the telescopic end of the sealing bellows, a magnet is arranged at the bottom of the telescopic rod, and a magnetic induction switch cooperating with the magnet is arranged on the atmospheric environment side; And / or, a signal sensor and a signal transmitter are arranged on the vacuum environment side, the signal sensor and the signal transmitter cooperate with each other inductively, and the signal transmitter is arranged on the side of the lifting bottom tray.

9. The wafer stage device according to claim 5, characterized in that: The lifting bottom tray is also provided with a clamping guide rod, and the heater is provided with a clamping piece for clamping the wafer. The clamping guide rod passes through the transfer fixing seat, the heat insulation plate and the heater and is connected with the clamping piece.

10. The wafer stage device according to claim 9, characterized in that: An elastic element and an elastic guide rod for guiding the elastic element are arranged between the lifting bottom tray and the transfer fixing seat.

11. The wafer stage device according to claim 1, characterized in that: The magnetic fluid structure also includes a magnetic fluid flange arranged on the magnetic fluid fixed axis, and an end surface water channel and an axial end water channel are respectively arranged on the magnetic fluid flange and the magnetic fluid fixed axis, and the end surface water channel and the axial end water channel are connected in series.

12. The wafer stage device according to claim 1, characterized in that: The wafer stage device also includes a rotating drive member, a first transmission disk, a second transmission disk and a conveyor belt; Wherein, the first transmission disc is connected to the output shaft of the rotating drive member, the second transmission disc is arranged on the magnetic fluid rotating shaft, and the conveyor belt connects the first transmission disc and the second transmission disc.

13. The wafer stage device according to claim 1, characterized in that: The wafer stage device also includes a stage support component and a flip driving component; Wherein, the magnetic fluid structure and the heater are both arranged on the stage support, and the flip driving member is used to drive the stage support to flip around a flip axis, and the flip axis is perpendicular to the rotation axis of the magnetic fluid shaft.

14. The wafer stage device according to claim 1, characterized in that: It also includes an encoder arranged on the magnetic fluid rotating shaft; And / or, it also includes a baffle arranged above the heater.

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