Multi-layer packaging type integrated circuit board

Abstract

The utility model provides a multilayer packaging type integrated circuit board, which comprises a protective shell, a cover plate and a circuit board, a plurality of cooling fans are arranged in a fan groove, butt joint shells are respectively arranged at a plurality of corners of the inner bottom surface of the protective shell, a compression spring is arranged in the middle of the inner bottom surface of the protective shell, a plurality of first heat conduction columns are arranged above a first heat conduction plate, and a plurality of second heat conduction columns are arranged above the first heat conduction plate. The lower ends of a plurality of second heat conduction columns are respectively provided with a second heat dissipation silicone grease sheet, and a filter screen is installed in a square groove, and the design solves the problems that the connection process of a heat dissipation plate and a mainboard of an original device is complicated, multi-step operation needs to be carried out, the heat dissipation mode of the mainboard is single, and the heat dissipation efficiency is high. According to the utility model, the structure is reasonable, the practicability is good, the heat dissipation mode of the circuit board is increased, the heat dissipation effect is further improved, the mainboard is convenient to install and has good stability, and the heat dissipation is more convenient by adopting the multi-layer packaging type design.

Description

Technical Field

[0001] The utility model relates to a multi-layer packaged integrated circuit board, belonging to the technical field of integrated circuit boards. Background Art

[0002] Integrated circuit boards are mainly composed of silicone, so they are generally green. Integrated circuit boards are made using semiconductor manufacturing technology. Many transistors, resistors, capacitors and other components are made on a smaller single-crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. The composite multi-layer circuit board has high assembly density, small size and light weight. Due to the high assembly density, the connections between components including components are reduced, thereby improving reliability; the number of wiring layers can be increased, thereby increasing design flexibility; a circuit with a certain impedance can be formed; a high-speed transmission circuit can be formed; a circuit and magnetic circuit shielding layer can be set, and a metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation. It is simple to install and has high reliability.

[0003] Chinese patent number: CN218975438U, mentions a multi-layer packaged integrated circuit board, which is used in conjunction with a main board, a heat sink and a back plate. The main board is connected to the back plate, and the heat sink is completely attached to the outside of the main board, with a large contact area. The heat sink then conducts heat, and multiple heat sinks quickly dissipate the heat, which improves the heat dissipation effect and the operation stability of the integrated circuit board. At the same time, the back plate protects the main board to prevent the main board from being scratched and collided, greatly improving the service life. However, the process of connecting the heat sink and the main board of this device is relatively complicated and requires multiple steps. In addition, the heat dissipation method of the main board is single, and the heat dissipation effect needs to be further improved. Now there is an urgent need for a multi-layer packaged integrated circuit board to solve the above-mentioned problems. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a multi-layer packaged integrated circuit board to solve the problems raised in the above-mentioned background technology. The utility model has a reasonable structure and good practicality. It increases the heat dissipation method for the circuit board and further improves the heat dissipation effect. The mainboard is easy to install and has good stability. The multi-layer package design is more convenient for heat dissipation.

[0005] In order to achieve the above-mentioned purpose, the utility model is realized through the following technical scheme: a multi-layer packaged integrated circuit board, comprising a protective shell, a cover plate and a circuit board, a fan slot is opened on the left side of the protective shell, a plurality of cooling fans are installed inside the fan slot, docking shells are respectively installed at multiple corners of the inner bottom surface of the protective shell, a compression spring is installed in the middle of the inner bottom surface of the protective shell, a first heat conducting plate is installed on the upper end of the compression spring, a plurality of first heat conducting columns are installed above the first heat conducting plate, docking parts are respectively provided at multiple corners below the circuit board, a screw is screwed on the top of the cover plate, a second heat conducting plate is rotatably installed below the screw, a plurality of second heat conducting columns are installed below the second heat conducting plate, and second heat dissipation silicone grease sheets are respectively installed on the lower ends of the plurality of second heat conducting columns, a square slot is opened through the right side of the protective shell, and a filter is installed in the square slot.

[0006] Furthermore, mounting holes are respectively opened at multiple corners above the protective shell, and the cover plate is connected to the protective shell by inserting multiple bolts into the multiple mounting holes.

[0007] Furthermore, a knob is fixedly connected above the screw rod.

[0008] Further, the size of the plurality of docking parts is smaller than the size of the plurality of docking shells.

[0009] Furthermore, a plurality of anti-slip pads are provided on the annular side surface of the knob.

[0010] Furthermore, first heat dissipation silicone grease sheets are respectively installed on the upper ends of the plurality of first heat-conducting columns.

[0011] The beneficial effects of the utility model: the utility model is a multi-layer packaged integrated circuit board. Because the utility model adds a cooling fan, a first cooling silicone grease sheet, a second cooling silicone grease sheet, a first cooling column, a second cooling column, a docking shell and a screw, our design improvement and actual use show that the device has a reasonable structure and good practicality, increases the heat dissipation method for the circuit board, further improves the heat dissipation effect, and the mainboard is easy to install and has good stability. The multi-layer package design is more convenient for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0013] Figure 1 It is a three-dimensional schematic diagram of the overall structure of a multi-layer packaged integrated circuit board of the utility model;

[0014] Figure 2 This is a three-dimensional schematic diagram of the internal structure of a protective housing of a multi-layer packaged integrated circuit board of the utility model;

[0015] Figure 3 It is a three-dimensional schematic diagram of the spring installation position structure of a multi-layer packaged integrated circuit board of the utility model;

[0016] Figure 4 It is a three-dimensional schematic diagram of a cover plate structure of a multi-layer packaged integrated circuit board of the utility model;

[0017] In the figure: 1-protective shell, 2-cover plate, 3-screw, 4-knob, 5-filter, 6-circuit board, 7-fan slot, 8-cooling fan, 9-docking shell, 10-docking part, 11-compression spring, 12-first heat conduction plate, 13-first heat conduction column, 14-first heat dissipation silicone grease sheet, 15-second heat conduction plate, 16-second heat conduction column, 17-second heat dissipation silicone grease sheet, 18-bolt, 19-square slot, 20-mounting hole. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0019] See also Figure 1-Figure 4 The utility model provides a technical solution: a multi-layer packaged integrated circuit board, including a protective shell 1, a cover plate 2 and a circuit board 6, a fan slot 7 is opened on the left side of the protective shell 1, and a plurality of cooling fans 8 are installed inside the fan slot 7, a docking shell 9 is installed at multiple corners of the bottom surface of the protective shell 1, a compression spring 11 is installed in the middle of the bottom surface of the protective shell 1, a first heat conducting plate 12 is installed on the upper end of the compression spring 11, and a plurality of first heat conducting columns 13 are installed above the first heat conducting plate 12, and a plurality of corners below the circuit board 6 are respectively provided with docking shells 9. The connecting part 10 has a screw 3 screwed on the top of the cover plate 2, a second heat conducting plate 15 is rotatably installed under the screw 3, a plurality of second heat conducting columns 16 are installed under the second heat conducting plate 15, and a second heat dissipating silicone grease sheet 17 is installed at the lower ends of the plurality of second heat conducting columns 16, a square groove 19 is penetrated through the right side of the protective shell 1, and a filter screen 5 is installed in the square groove 19. This design solves the problem that the process of connecting the heat sink and the mainboard of the original device is relatively complicated and requires multiple steps of operation, and the heat dissipation method of the mainboard is single and the heat dissipation effect needs to be further improved.

[0020] As the first embodiment of the utility model: mounting holes 20 are respectively opened at multiple corners above the protective shell 1, and the cover plate 2 is connected to the protective shell 1 by inserting multiple bolts 18 into the multiple mounting holes 20. The cooperation between the multiple bolts 18 and the multiple mounting holes 20 facilitates the disassembly and assembly of the cover plate 2.

[0021] A knob 4 is fixedly connected to the top of the screw rod 3, and the knob 4 is provided to facilitate the rotation of the screw rod 3. The size of the multiple docking parts 10 is smaller than the size of the multiple docking shells 9. The annular side of the knob 4 is provided with multiple anti-skid pads, and by setting the size of the multiple docking parts 10 smaller than the size of the multiple docking shells 9, it is convenient to insert the docking parts 10 into the docking shells 9. The upper ends of the multiple first heat-conducting columns 13 are respectively installed with first heat-dissipating silicone grease sheets 14, and the first heat-dissipating silicone grease sheets 14 are provided to facilitate the heat dissipation of the circuit board 6.

[0022] As a second embodiment of the utility model: when in use, first dock the multiple docking parts 10 with the multiple docking shells 9, and then make the circuit board 6 contact the multiple first heat dissipation silicone grease sheets 14. At this time, the compression spring 11 is compressed by pressure, and then the protective shell 1 and the cover plate 2 are installed together. Then, the knob 4 is turned to rotate the screw 3, driving the second heat conduction plate 15 to move downward, so that the multiple second heat dissipation silicone grease sheets 17 contact the circuit board 6. Under the cooperation of the screw 3 and the multiple second heat dissipation silicone grease sheets 17, the circuit board 6 is also fixed to a certain extent. When the temperature of the circuit board 6 is high, the multiple second heat dissipation silicone grease sheets 17 and the multiple first heat dissipation silicone grease sheets 14 will conduct heat. Bidirectional conduction makes the heat dissipation more efficient. The heat is conducted to the multiple first heat-conducting columns 13 and the multiple second heat-conducting columns 16, and then to the first heat-conducting plate 12 and the second heat-conducting plate 15. Then, the multiple heat-dissipating fans 8 are turned on. The multiple heat-dissipating fans 8 can dissipate the heat of the first heat-conducting plate 12 and the second heat-conducting plate 15, and dissipate it to the outside through the filter 5. The above-mentioned control of the multiple heat-dissipating fans 8 can be equipped with an external temperature sensor. When the temperature exceeds the specified threshold of the external temperature sensor, the multiple heat-dissipating fans 8 can be started to achieve more intelligent heat dissipation. The device as a whole presents a multi-layer structure. After the circuit board 6 is packaged, a certain gap will still be left, which is more conducive to heat dissipation.

[0023] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0024] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A multi-layer packaged integrated circuit board, comprising a protective housing (1), a cover plate (2) and a circuit board (6), characterized in that: A fan slot (7) is provided on the left side of the protective shell (1), and a plurality of cooling fans (8) are installed inside the fan slot (7). A docking shell (9) is installed at a plurality of corners of the inner bottom surface of the protective shell (1). A compression spring (11) is installed in the middle of the inner bottom surface of the protective shell (1). A first heat conducting plate (12) is installed at the upper end of the compression spring (11), and a plurality of first heat conducting columns (13) are installed above the first heat conducting plate (12); A docking portion (10) is provided at multiple corners below the circuit board (6), a screw rod (3) is screwed on the top of the cover plate (2), a second heat conducting plate (15) is rotatably installed below the screw rod (3), a plurality of second heat conducting columns (16) are installed below the second heat conducting plate (15), and a second heat dissipating silicone grease sheet (17) is installed at the lower end of each of the plurality of second heat conducting columns (16), a square groove (19) is provided through the right side of the protective shell (1), and a filter screen (5) is installed in the square groove (19).

2. The multi-layer packaged integrated circuit board according to claim 1, characterized in that: Mounting holes (20) are respectively provided at multiple corners above the protective shell (1), and the cover plate (2) is connected to the protective shell (1) by inserting multiple bolts (18) into the multiple mounting holes (20).

3. The multi-layer packaged integrated circuit board according to claim 1, characterized in that: A knob (4) is fixedly connected to the top of the screw rod (3).

4. The multi-layer packaged integrated circuit board according to claim 1, characterized in that: The size of the plurality of docking parts (10) is smaller than the size of the plurality of docking shells (9).

5. The multi-layer packaged integrated circuit board according to claim 3, characterized in that: The annular side surface of the knob (4) is provided with a plurality of anti-slip pads.

6. The multi-layer packaged integrated circuit board according to claim 1, characterized in that: A first heat dissipation silicone grease sheet (14) is respectively installed on the upper ends of the plurality of first heat-conducting columns (13).

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