Laminating structure of multi-layer board
By setting a serrated structure on the edge of the non-functional area of the core plate of the multi-layer board and wrapping the homogenous layer on the outside of the stacking layer, the problem of uneven heat conduction during the pressing process is solved and the pressing quality is improved.
Patent Information
- Application Number
- CN202421155792.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-25
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-25
AI Technical Summary
During the pressing process of multi-layer boards, due to uneven heat conduction, the semi-cured sheet cannot be synchronized during melting and curing, which affects the quality of the pressing.
A uniform conduction and stable transfer of heat is achieved by setting a zigzag structure on the edge of the non-functional area of the core plate and wrapping a homogeneous layer (such as kraft paper) on the outside of the stack.
Thermal stability and temperature uniformity during the pressing process are improved, thereby improving the pressing quality.
Smart Images
Figure CN222464920U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of multi-layer board pressing structures, in particular to a multi-layer board pressing structure. Background Art
[0002] During the lamination process of the multilayer board, the core board and the prepreg are stacked at intervals and then pressed by a laminating machine. During the lamination process, lamination can be performed by single-sided heating or double-sided heating. Double-sided heating means that the top and bottom of the laminating machine heat and press the stacked structure at the same time, and single-sided heating means that only the top or bottom of the laminating machine heats and presses the stacked structure. Regardless of double-sided heating or single-sided heating, during the lamination process, the lamination temperature is transferred to the center through the top and / or bottom of the stacked layer. When the structure of the stacked layer is thicker, the lamination temperature may be unevenly transferred, resulting in the semi-cured sheet in the middle and the semi-cured sheets on both sides unable to keep melting and curing synchronously, resulting in the lamination quality being affected.
[0003] Therefore, how to improve the uniformity of heating of the pressed structure becomes a key factor in improving the pressing quality. Utility Model Content
[0004] In view of this, the present application aims to solve the problems in the related technology to at least a certain extent. One of the purposes of the present application is to provide a lamination structure of a multilayer board, which realizes uniform heat conduction to the entire stacking structure through the serrated structure at the edge of the non-functional area and the homogeneous layer located on the outside of the stacking layer, thereby improving the thermal stability during the lamination process and improving the lamination quality.
[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical solution: a laminated structure of a multilayer board, comprising a stacked layer of M core boards and M-1 prepregs stacked at intervals, wherein the outer side of the stacked layer is wrapped with a homogeneous layer;
[0006] The core board includes a graphic layer in the middle and a non-functional area at the edge. A heat conduction component is arranged on the same side of the M-layer core board. The heat conduction component includes a serrated structure arranged at the edge of the non-functional area in the core board.
[0007] Furthermore, the homogeneous layer is kraft paper.
[0008] Furthermore, the core board is a rectangular structure, and the kraft paper wraps the top, bottom and four sides of the stacked layers at the same time.
[0009] Furthermore, the core plate is a rectangular structure, and one of the long side edges of the core plate is provided with a serrated structure.
[0010] Furthermore, the core plate is a rectangular structure, and two opposite long side edges of the core plate are provided with serrated structures.
[0011] Furthermore, the serrated structure at the edge of the non-functional area of the M-layer core board overlaps in parallel to the pressing direction.
[0012] Furthermore, positioning through holes are provided in the sawtooth structure of the core plate, and the positioning through holes of the M layers of core plates overlap in parallel to the pressing direction.
[0013] Furthermore, there are two positioning through holes, and the two positioning through holes are respectively located at two ends of the same long side of the core plate.
[0014] Furthermore, there are four positioning through holes, and the four positioning through holes are respectively located at two ends of two opposite long sides of the core plate.
[0015] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art: a lamination structure of a multi-layer board provided in the present application comprises a stacking layer of M core boards and M-1 semi-cured sheets stacked at intervals, and a homogeneous layer is wrapped on the outside of the stacking layer; the homogeneous layer can ensure that the heat of the laminating machine is evenly transferred at various positions of the stacking layer; the core board comprises a graphic layer located in the middle and a non-functional area located at the edge, and a heat conduction component is arranged on the same side of the M core boards, and the heat conduction component comprises a serrated structure arranged at the edge of the non-functional area in the core board; in the present application, the heat conduction component is located at the edge of the non-functional area and will not affect the normal operation of the core board. After the lamination is completed, the heat conduction component can be removed by cutting and other processes; in the present application, the heat conduction component is a serrated structure, and the serrated structure can provide a gap for heat conduction, ensuring that the temperature of the top and bottom during the lamination process is evenly transferred to the center of the core board through the homogeneous layer and the serrated structure, thereby improving the temperature uniformity during the lamination process and thereby improving the lamination quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0018] Figure 1 This is a schematic diagram of the structure of one of the core panels;
[0019] Figure 2 It is a side schematic diagram of the pressed structure in Example 2.
[0020] Reference numerals:
[0021] 11. Core board; 12. Serrated structure; 13. Positioning through hole; 14. Prepreg; 15. Kraft paper. DETAILED DESCRIPTION
[0022] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific implementation methods of the present application are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the mechanism or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present application.
[0023] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0024] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application. Example 1
[0025] like Figure 1-Figure 2As shown, a laminated structure of a multilayer board proposed in the present application comprises a stacked layer of M-layer core boards 11 and M-1-layer semi-cured sheets 14 stacked at intervals, wherein a homogeneous layer is wrapped on the outside of the stacked layer; the core board 11 comprises a graphic layer in the middle and a non-functional area at the edge, and a heat conduction component is arranged on the same side of the M-layer core board 11, wherein the heat conduction component comprises a serrated structure 12 arranged at the edge of the non-functional area in the core board 11.
[0026] The homogeneous layer can ensure that the heat of the laminating machine is evenly transferred at each position of the stacked layer. The homogeneous layer can be made of a material that can ensure even temperature transfer, such as kraft paper 15. When the kraft paper 15 is wrapped on the stacked layer, even if the temperature in the laminating machine dissipates from one of the surfaces, the presence of the kraft paper 15 can ensure that the temperature is quickly transferred to each surface of the stacked layer along the kraft paper 15, thereby achieving even temperature transfer in the stacked layer.
[0027] In the present application, the heat conduction component is located at the edge of the non-functional area, which will not affect the normal operation of the core plate 11. After the pressing is completed, the heat conduction component can be removed by cutting and other processes. At the same time, the heat conduction component can also be provided with positioning holes 13, positioning parts and other structures to assist in the forming of the pressing structure.
[0028] In the present application, the heat conduction component is a serrated structure 12, which can provide gaps for heat conduction, ensuring that the temperatures at the top and bottom are evenly transferred to the center of the core plate 11 through the homogeneous layer and the serrated structure 12 during the pressing process, thereby improving the temperature uniformity during the pressing process and further improving the pressing quality.
[0029] Specifically, the uniform layer wrapped around the outside of the stacked layer can be completely fitted with the edge of the stacked layer. When the pressing temperature is transferred along the homogeneous layer to the side of the stacked layer, the serrated structure 12 can increase the surface area of the side of the stacked layer, so that the temperature can be evenly penetrated to the center position of each stacked layer through the serrated structure 12, ensuring that the temperature at each position in the stacked layer is as uniform as possible, thereby improving the uniform transmission of the pressing temperature and further improving the pressing quality of the pressed structure. Example 2
[0030] like Figure 1-Figure 2 As shown, a laminated structure of a multilayer board proposed in the present application comprises a stacked layer of M-layer core boards 11 and M-1-layer semi-cured sheets 14 stacked at intervals, wherein a homogeneous layer is wrapped on the outside of the stacked layer; the core board 11 comprises a graphic layer in the middle and a non-functional area at the edge, and a heat conduction component is arranged on the same side of the M-layer core board 11, wherein the heat conduction component comprises a serrated structure 12 arranged at the edge of the non-functional area in the core board 11.
[0031] The homogeneous layer is kraft paper 15; the kraft paper 15 can be a whole, wrapping the entire stacking layer along the outer side of the stacking layer, and the kraft paper 15 is completely in contact with the outer side of the stacking layer. During the lamination process, the temperature of the top and / or bottom of the stacking layer is evenly transferred to various positions of the stacking layer along the kraft paper 15. When the temperature is transferred to the side of the stacking layer, the serrated structure 12 increases the contact area of the side of the stacking layer, ensuring that the lamination temperature is evenly transferred to the side of the stacking layer.
[0032] The core board 11 of the present application is a rectangular structure, and the kraft paper 15 simultaneously wraps the top, bottom and four sides of the stacked layer. During the lamination process, when the lamination heating plate at the top and / or bottom abuts against the stacked layer, the higher lamination temperature is transferred to the four sides along the kraft paper 15 box, and the side is provided with a serrated structure 12, which increases the surface area of the side, so that the lamination high temperature penetrates into the inside of the side along the serrated structure 12.
[0033] In the present application, the core board 11 is a rectangular structure, and one of the long sides of the core board 11 is provided with a serrated structure 12. Or two opposite long sides of the core board 11 are provided with a serrated structure 12. In the present application, the serrated structure 12 can be provided in all four sides, or only in the long sides, or only in one of the long sides. The reason for providing the serrated structure 12 in the long sides is to ensure that the pressing temperature penetrates evenly into the stacking layer in the longer direction, and further improve the uniformity of the transfer of the pressing temperature in the stacking layer.
[0034] In the present application, the serrated structures 12 at the edges of the non-functional areas of the M-layer core panels 11 overlap in parallel to the pressing direction. The purpose of the overlap is to facilitate the stacking of the M-layer core panels 11. In actual operation, the same cutting process can be used to cut the edges of the M-layer core panels 11 to ensure that the serrated structures formed are the same, ensuring that during the stacking process, the serrated structures 12 of the M layers can completely overlap. The overlapping serrated structures 12 can also be used as a standard for detecting whether the stacking is offset. In the process of placing the core panels 11 in sequence, if the serrated structures 12 can completely overlap, it indicates that the stacking has not offset.
[0035] Since the serrated structure 12 is located at the edge of the non-functional area, it will not affect the function of the middle graphic layer of the core board 11. After the lamination is completed, the heat conduction component can be removed by cutting and other processes. At the same time, positioning holes 13, positioning parts and other structures can also be set in the heat conduction component to assist in the molding of the lamination structure. The present application can set a positioning hole 13 in the raised structure of the serrated structure 12, and the positioning holes 13 of the M-layer core board 11 overlap in parallel to the lamination direction.
[0036] During the stacking process of the core board 11 and the prepreg 14, the positioning pins and other positioning parts can be passed through the bottom core board 11, and then the prepreg 14 is placed, and then the upper core board 11 is placed. When placing the upper core board 11, it is only necessary to place the positioning through holes 13 in the core board 11 in alignment with the positioning pins. The present application can ensure that the stacking process of the core board 11 is fast and without offset by setting the positioning through holes 13.
[0037] As a specific embodiment, the present application has two positioning holes 13, and the two positioning holes 13 are respectively located at the two ends of the same long side of the core plate 11. The two positioning holes 13 can ensure that the core plate 11 is placed layer by layer smoothly and avoid deviation during the stacking process.
[0038] As another specific embodiment, the present application has four positioning through holes 13, and the four positioning through holes 13 are respectively located at the two ends of the two opposite long sides of the core plate 11. The four positioning through holes 13 are symmetrically located at the two ends of the long side of the core plate 11, and the four positioning through holes 13 can ensure that the core plate 11 is placed layer by layer smoothly to avoid deviation during the stacking process.
[0039] It should be noted that when the core board 11 is stacked layer by layer, if the two positioning through holes 13 or the four positioning through holes 13 of the core board 11 are fitted and installed with the positioning parts, if the core board 11 is folded in the middle, it means that the size of the core board 11 is deviated, and a new core board 11 can be replaced, and the core board 11 can be inspected and calibrated.
[0040] The uniform layer wrapped around the outside of the stacked layer in the present application can be completely fitted with the edge of the stacked layer. When the pressing temperature is transferred along the homogeneous layer to the side of the stacked layer, the serrated structure 12 can increase the surface area of the side of the stacked layer, so that the temperature can be evenly penetrated to the center position of each stacked layer through the serrated structure 12, ensuring that the temperature at each position in the stacked layer is as uniform as possible, improving the uniform transmission of the pressing temperature, and thereby improving the pressing quality of the pressing structure.
[0041] The homogeneous layer can ensure that the heat of the laminating machine is evenly transferred at each position of the stacked layer. The homogeneous layer can be made of a material that can ensure even temperature transfer, such as kraft paper 15. When the kraft paper 15 is wrapped on the stacked layer, even if the temperature in the laminating machine dissipates from one of the surfaces, the presence of the kraft paper 15 can ensure that the temperature is quickly transferred to each surface of the stacked layer along the kraft paper 15, thereby achieving even temperature transfer in the stacked layer.
[0042] In the present application, the heat conduction component is located at the edge of the non-functional area, which will not affect the normal operation of the core plate 11. After the pressing is completed, the heat conduction component can be removed by cutting and other processes. At the same time, the heat conduction component can also be provided with positioning holes 13, positioning parts and other structures to assist in the forming of the pressing structure.
[0043] In the present application, the heat conduction component is a serrated structure 12, which can provide gaps for heat conduction, ensuring that the temperatures at the top and bottom are evenly transferred to the center of the core plate 11 through the homogeneous layer and the serrated structure 12 during the pressing process, thereby improving the temperature uniformity during the pressing process and further improving the pressing quality.
[0044] It can be understood that the above embodiments only express the preferred implementation methods of the present application, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present application; it should be pointed out that for ordinary technicians in this field, without departing from the concept of the present application, the above-mentioned technical features can be freely combined, and several deformations and improvements can be made, which all belong to the protection scope of the present application; therefore, all equivalent changes and modifications made to the scope of the claims of the present application should belong to the scope covered by the claims of the present application.
Claims
1. A laminated structure of a multilayer board, characterized in that: A stacking layer comprising M layers of core boards and M-1 layers of prepreg sheets stacked at intervals, wherein the outer side of the stacking layer is wrapped with a homogeneous layer; The core board includes a graphic layer in the middle and a non-functional area at the edge. A heat conduction component is arranged on the same side of the M-layer core board. The heat conduction component includes a serrated structure arranged at the edge of the non-functional area in the core board.
2. A laminated structure of a multilayer board according to claim 1, characterized in that: The homogeneous layer is kraft paper.
3. A laminated structure of a multilayer board according to claim 2, characterized in that: The core board is a rectangular structure, and the kraft paper wraps the top, bottom and four sides of the stacked layers simultaneously.
4. The laminated structure of a multilayer board according to claim 1, characterized in that: The core plate is a rectangular structure, and one of the long sides of the core plate is provided with a serrated structure.
5. The laminated structure of a multilayer board according to claim 1, characterized in that: The core plate is a rectangular structure, and two opposite long side edges of the core plate are provided with serrated structures.
6. The laminated structure of a multilayer board according to claim 1, characterized in that: The serrated structures at the edges of the non-functional areas of the M-layer core panels overlap in parallel to the pressing direction.
7. The laminated structure of a multilayer board according to claim 1, characterized in that: Positioning through holes are arranged in the sawtooth structure of the core plate, and the positioning through holes of the M layers of core plates overlap in parallel with the pressing direction.
8. The laminated structure of a multilayer board according to claim 7, characterized in that: There are two positioning through holes, and the two positioning through holes are respectively located at two ends of the same long side of the core plate.
9. The laminated structure of a multilayer board according to claim 7, characterized in that: There are four positioning through holes, and the four positioning through holes are respectively located at two ends of two opposite long sides of the core plate.