Circuit board beneficial to heat dissipation

Abstract

The utility model discloses a circuit board beneficial to heat dissipation, and aims to provide a circuit board beneficial to heat dissipation, which is good in heat dissipation effect. Comprising a circuit board body, heat dissipation boxes are connected to the two ends of the circuit board body, exhaust holes are formed in the tops and the bottoms of the inner side walls of the heat dissipation boxes, a plurality of heat dissipation fans are arranged in the heat dissipation boxes, the circuit board body is provided with a power supply module, the power supply module is electrically connected with the heat dissipation fans, and a turbulent flow block is arranged at the top of the circuit board body. The beneficial effects of the utility model are that the heat dissipation boxes connected with the two ends of the circuit board body can blow out gas to accelerate gas flow, thereby improving the heat dissipation effect; the turbulent flow blocks arranged on the circuit board body can disturb the blown gas, so that the gas faces the components on the circuit board body, and the heat dissipation effect is further improved; the heat dissipation plate connected to the circuit board body improves the heat dissipation effect, and the X-shaped diversion trenches can improve the heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board which is conducive to heat dissipation. Background Art

[0002] Usually, the conductive pattern made of printed circuits, printed components or a combination of the two on the insulating material according to a predetermined design is called a printed circuit. The conductive pattern that provides electrical connection between components on the insulating substrate is called a printed circuit. In this way, the finished board of the printed circuit or printed circuit is called a printed circuit board, also known as a printed board or printed circuit board. Circuit boards can be divided into the following categories according to their functions: single-sided circuit boards, double-sided circuit boards, multi-layer circuit boards, aluminum-based circuit boards, impedance circuit boards, FPC flexible circuit boards, etc.

[0003] In the prior art, the heat dissipation of the circuit board is generally performed through the heat dissipation components on the equipment. The dedicated heat dissipation components for the circuit board have a poor heat dissipation effect on the circuit board and cannot improve the heat dissipation effect of the circuit board, resulting in the high temperature generated by the circuit board cannot be quickly dissipated, affecting the normal operation of the circuit board. Utility Model Content

[0004] The utility model aims to overcome the disadvantage of poor heat dissipation effect of circuit boards in the prior art and provides a circuit board with good heat dissipation effect and conducive to heat dissipation.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a circuit board that is conducive to heat dissipation, including a circuit board body, a heat dissipation box is connected to both ends of the circuit board body, the top and bottom of the inner wall of the heat dissipation box are provided with exhaust holes, a plurality of heat dissipation fans are arranged in the heat dissipation box, the circuit board body is provided with a power supply module, the power supply module is electrically connected to the heat dissipation fan, and a spoiler block is arranged on the top of the circuit board body.

[0006] Preferably, the heat dissipation box is a cavity structure, and an inner side wall of the heat dissipation box is provided with a mounting slot, and the mounting slot is engaged with a side wall of the circuit board body.

[0007] Preferably, a connecting contact piece is connected to the top surface of the installation groove, the connecting contact piece is electrically connected to the heat dissipation fan, a connecting socket is provided at the end of the circuit board body, the connecting socket is electrically connected to the power supply module, and the connecting contact piece is connected to the connecting socket.

[0008] Preferably, a mounting block is provided inside the heat dissipation box, the heat dissipation fan is mounted on the mounting block, and the heat dissipation fan corresponds to the exhaust hole.

[0009] Preferably, the spoiler block is provided with a plurality of conical blocks, and the tips of the conical blocks face the inner side of the circuit board body.

[0010] Preferably, a heat sink is provided at the bottom of the circuit board body, and the heat sink is provided with guide grooves, and the guide grooves are arranged in an "X" shape.

[0011] Preferably, the circuit board body is provided with a plurality of heat dissipation holes, and the heat dissipation holes are close to components on the circuit board body.

[0012] The beneficial effects of the utility model are as follows: the heat dissipation boxes connected at both ends of the circuit board body can blow out gas to accelerate the gas flow, thereby improving the heat dissipation effect; the spoiler blocks arranged on the circuit board body can spoil the blown gas, so that the gas is directed toward the components on the circuit board body, thereby improving the heat dissipation effect; the heat dissipation plate connected to the circuit board body improves the heat dissipation effect, and the X-shaped guide grooves arranged at the same time can improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 The utility model is a stereoscopic Figure 1 ;

[0014] Figure 2 This is a cross-sectional view of the heat dissipation box of the utility model;

[0015] Figure 3 The utility model is a stereoscopic Figure 2 .

[0016] In the accompanying drawings,

[0017] 1. Circuit board body, 2. Heat dissipation box, 3. Power supply module, 4. Spoiler block, 10. Connection jack, 11. Heat dissipation plate, 12. Guide groove, 13. Heat dissipation hole, 20. Exhaust hole, 21. Cooling fan, 22. Installation slot, 23. Connection contact piece, 24. Installation block, 40. Conical block. DETAILED DESCRIPTION

[0018] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0019] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0020] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0021] Embodiment 1, as Figure 1-3 As shown, a circuit board that is conducive to heat dissipation includes a circuit board body 1, and heat dissipation boxes 2 are connected to both ends of the circuit board body 1. The top and bottom of the inner wall of the heat dissipation box 2 are provided with exhaust holes 20, and a plurality of heat dissipation fans 21 are arranged in the heat dissipation box 2. The circuit board body 1 is provided with a power supply module 3, and the power supply module 3 is electrically connected to the heat dissipation fan 21. A spoiler block 4 is arranged on the top of the circuit board body 1.

[0022] The heat dissipation box 2 is a cavity structure, and the inner wall of the heat dissipation box 2 is provided with a mounting slot 22 , and the mounting slot 22 is engaged with the side wall of the circuit board body 1 .

[0023] A connecting contact piece 23 is connected to the top surface of the mounting slot 22 , and the connecting contact piece 23 is electrically connected to the heat dissipation fan 21 . A connecting socket 10 is provided at the end of the circuit board body 1 , and the connecting socket 10 is electrically connected to the power supply module 3 . The connecting contact piece 23 is connected to the connecting socket 10 .

[0024] A mounting block 24 is disposed inside the heat dissipation box 2 , and the heat dissipation fan 21 is mounted on the mounting block 24 . The heat dissipation fan 21 corresponds to the exhaust hole 20 .

[0025] The spoiler block 4 is provided with a plurality of conical blocks 40 , and the tips of the conical blocks 40 face the inner side of the circuit board body 1 .

[0026] A heat sink 11 is disposed at the bottom of the circuit board body 1 , and the heat sink 11 is provided with guide grooves 12 , and the guide grooves 12 are arranged in an “X” shape.

[0027] The circuit board body 1 is provided with a plurality of heat dissipation holes 13 , and the heat dissipation holes 13 are close to components on the circuit board body 1 .

[0028] The working principle of the utility model is as follows: Figure 1-3As shown, a number of components are welded on the circuit board body 1, wherein the components include a power supply module 3. Among them, heat dissipation boxes 2 are respectively arranged at both ends of the circuit board body 1, and a mounting slot 22 is arranged on the heat dissipation box 2, and the mounting slot 22 is clamped with the circuit board body 1. At the same time, a connecting contact 23 is arranged on the top of the circuit board body 1, and the connecting contact 23 is electrically connected to the power supply module 3. A connecting jack 10 is arranged on the circuit board body 1, and the connecting jack 10 is electrically connected to the power supply module 3. When the mounting slot 22 is clamped with the circuit board body 1, the connecting contact 23 is connected to the connecting jack 10 to achieve circuit connection. At the same time, the heat dissipation box 2 is a cavity structure, and a mounting block 24 is installed inside the heat dissipation box 2, and the heat dissipation fan 21 is installed on the mounting block 24. A number of exhaust holes 20 are arranged on the heat dissipation box 2, and the exhaust holes 20 are placed on the same side as the mounting slot 22, and the exhaust holes 20 face the inner side of the circuit board body 1. The installation position of the heat dissipation fan 21 is aligned with the position of the exhaust hole 20, so that the wind blown by the heat dissipation fan 21 can be directly discharged from the exhaust hole 20, thereby dissipating heat for the circuit board body 1, thereby improving the heat dissipation effect of the circuit board.

[0029] A spoiler block 4 is provided at the side end of the circuit board body 1, and the spoiler block 4 is composed of a plurality of conical blocks 40. The tip of the spoiler block 4 faces the circuit board body 1, so that the gas blown out from the exhaust hole 20 can change the gas flow direction when passing through the inclined spoiler of the spoiler block 4, so that the gas flows toward the circuit board body 1, thereby improving the air flow above the circuit board body 1, thereby improving the heat dissipation effect of the circuit board.

[0030] A heat sink 11 is provided at the bottom of the circuit board body 1, and a guide groove 12 is provided on the heat sink 11. The guide groove 12 is arranged in an X shape, wherein the open end of the guide groove 12 faces the exhaust hole 20, so that the air discharged from the exhaust hole 20 can pass through the guide groove 12, so that the heat dissipation effect of the heat sink 11 can be improved, thereby making the heat dissipation effect of the circuit board better.

[0031] At the same time, a plurality of heat dissipation holes 13 are arranged on the circuit board body 1. The heat dissipation holes 13 are arranged at the component accessories on the circuit board body 1. The arrangement of the heat dissipation holes 13 can improve the heat dissipation effect of the entire heat dissipation plate 11 and realize the overall heat dissipation performance of the circuit board.

[0032] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board that is conducive to heat dissipation, characterized in that: The invention comprises a circuit board body (1), wherein two ends of the circuit board body (1) are connected to a heat dissipation box (2), the top and bottom of the inner wall of the heat dissipation box (2) are provided with exhaust holes (20), a plurality of heat dissipation fans (21) are provided in the heat dissipation box (2), the circuit board body (1) is provided with a power supply module (3), the power supply module (3) is electrically connected to the heat dissipation fan (21), and a spoiler block (4) is provided on the top of the circuit board body (1).

2. A circuit board that is conducive to heat dissipation according to claim 1, characterized in that: The heat dissipation box (2) is a cavity structure, and an inner side wall of the heat dissipation box (2) is provided with a mounting slot (22), and the mounting slot (22) is engaged with a side wall of the circuit board body (1).

3. A circuit board that is conducive to heat dissipation according to claim 2, characterized in that: A connecting contact piece (23) is connected to the top surface of the mounting slot (22), the connecting contact piece (23) is electrically connected to the heat dissipation fan (21), a connecting jack (10) is provided at the end of the circuit board body (1), the connecting jack (10) is electrically connected to the power supply module (3), and the connecting contact piece (23) is connected to the connecting jack (10).

4. A circuit board that is conducive to heat dissipation according to claim 1, characterized in that: A mounting block (24) is provided inside the heat dissipation box (2), the heat dissipation fan (21) is mounted on the mounting block (24), and the heat dissipation fan (21) corresponds to the exhaust hole (20).

5. The circuit board according to claim 1, characterized in that: The spoiler block (4) is provided with a plurality of conical blocks (40), and the tips of the conical blocks (40) face the inside of the circuit board body (1).

6. A circuit board that is conducive to heat dissipation according to claim 1, characterized in that: A heat sink (11) is provided at the bottom of the circuit board body (1), and the heat sink (11) is provided with guide grooves (12), and the guide grooves (12) are arranged in an "X" shape.

7. The circuit board according to claim 1, characterized in that: The circuit board body (1) is provided with a plurality of heat dissipation holes (13), and the heat dissipation holes (13) are close to components on the circuit board body (1).

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