Nozzle mechanism of crest welder

Abstract

The utility model provides a crest welder nozzle mechanism which comprises a nozzle and a flow guide groove, the flow guide groove is arranged outside one side of the nozzle, and the flow guide groove is used for conducting flow guide on tin liquid flowing out of the nozzle. A front flow guide plate, a middle adjusting plate and a rear adjusting plate are arranged at the upper end of the nozzle, and the front flow guide plate and the middle adjusting plate are used for adjusting the shape of a wave crest; and the rear adjusting plate is used for controlling the separation angle between the PCB and the tin liquid, and the rear adjusting plate can also adjust the flow velocity of the tin liquid. According to the nozzle mechanism, oxide generated on the surface of tin liquid can be washed to the tin outlet at the beginning of operation of the welding equipment, large-area tin connection of a PCB (printed circuit board) caused by the oxide in the welding process is prevented, subsequent product production cannot be affected, the welding quality is improved, the purity of soldering tin is improved, and the welding quality is guaranteed. Soldering tin waste caused by tin slag pollution is reduced, and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of wave soldering tin furnace devices, in particular to a nozzle mechanism of a wave soldering machine. Background Art

[0002] Wave soldering is the most commonly used soldering technology. The speed of wave soldering is better than manual soldering. Wave soldering realizes the automation of PCB board assembly. This process is particularly suitable for soldering through-hole components with good spacing. Wave soldering is to dissolve the tin bar into liquid through the tin bath and use the motor to stir to form a wave. Wave soldering requires spraying flux first, and then going through preheating, soldering, and cooling zones.

[0003] When the PCB enters the front end of the wave crest, the substrate and the pins are heated, and before leaving the wave crest, the entire PCB is immersed in solder, that is, bridged by solder, but at the moment of leaving the tail end of the wave crest, a small amount of solder adheres to the pad due to the wetting force, and due to surface tension, it shrinks to the minimum state with the lead as the center. At this time, the wetting force between the solder and the pad is greater than the cohesive force of the solder between the two pads. Therefore, a full and round solder joint will be formed, and the excess solder leaving the tail of the wave crest will fall back into the tin pot due to gravity.

[0004] The traditional design of the tin outlet is a right angle. When the equipment is shut down, oxides will continue to form on the surface of the liquid tin. When the equipment is restarted, the oxides on the surface of the liquid tin will rise with the liquid level and eventually stick to the lower surface of the right angle of the tin outlet. During the operation of the equipment, the oxides are constantly washed away and rushed to the tin outlet little by little, affecting the welding quality.

[0005] Oxides are generally in the form of films or sheets. When the oxides are flushed out of the tin outlet, if the PCB happens to pass through the tin outlet, the oxides will hang on the component pins extending from the lower surface of the PCB, causing large-area bridging. Utility Model Content

[0006] The utility model aims to provide a nozzle mechanism for a wave soldering machine, which can flush oxides generated on the surface of molten tin to the tin outlet at the beginning of the operation of the soldering equipment, so as to prevent large-area bridging caused by oxides during the soldering process, thereby not affecting subsequent product production.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A nozzle mechanism of a wave soldering machine, which is used for soldering a PCB board, comprises a nozzle and a guide groove, wherein the guide groove is arranged outside one side of the nozzle, and is used to guide the tin liquid flowing out of the nozzle; a front guide plate, an intermediate adjustment plate and a rear adjustment plate are arranged at the upper end of the nozzle, and the front guide plate and the intermediate adjustment plate are used to adjust the shape of the wave crest; the rear adjustment plate is used to control the separation angle between the PCB board and the tin liquid, and the rear adjustment plate can also adjust the flow rate of the tin liquid.

[0009] Furthermore, in the above-mentioned wave soldering machine nozzle mechanism, the nozzle includes a first side plate, a second side plate and two end plates, the first side plate, the second side plate and the end plates are all vertically arranged, the first side plate, one end plate, the second side plate and the other end plate are connected in sequence, the first side plate, the second side plate and the two end plates together form the nozzle; the guide groove is connected to the upper part of the outer surface of the second side plate.

[0010] Furthermore, in the above-mentioned wave soldering machine nozzle mechanism, a filter is arranged in the nozzle, and the filter is connected to the first side plate, the second side plate and the two end plates; the filter is provided with two layers, upper and lower, and the distance between the two layers of the filter is 20mm to 40mm.

[0011] Furthermore, in the above-mentioned wave soldering machine nozzle mechanism, the front guide plate is arranged above the first side plate, and the two ends of the front guide plate are respectively connected to the two end plates.

[0012] Furthermore, in the above-mentioned wave soldering machine nozzle mechanism, the rear adjustment plate is connected to the second side plate, and the two ends of the rear adjustment plate are respectively connected to the two end plates; the rear adjustment plate includes a first vertical plate and a first horizontal plate, the upper end of the first vertical plate is flush with the upper end of the second side plate, the outer wall of the first vertical plate is connected to the inner surface of the second side plate, the lower end of the first vertical plate is connected to one end of the first horizontal plate, and the other end of the first horizontal plate extends toward the inside of the nozzle and upward; the angle between the first horizontal plate and the horizontal plane is 15°-45°; the first vertical plate and the first horizontal plate are integrally formed.

[0013] Furthermore, in the above-mentioned wave soldering machine nozzle mechanism, the two ends of the middle adjustment plate are respectively connected to the two end plates; the middle adjustment plate includes a second vertical plate and a second horizontal plate, the second vertical plate is located between the front guide plate and the rear adjustment plate, the lower end of the second vertical plate is connected to the second horizontal plate, and the lower surface of the second horizontal plate overlaps the upper surface of the first horizontal plate; the second vertical plate and the second horizontal plate are integrally formed.

[0014] Furthermore, in the above-mentioned nozzle mechanism of the wave soldering machine, the vertical distance between the second vertical plate and the front guide plate is 30 mm to 50 mm.

[0015] Furthermore, in the above-mentioned nozzle mechanism of the wave soldering machine, the vertical distance between the second vertical plate and the first vertical plate is 50 mm to 70 mm.

[0016] Furthermore, in the above-mentioned nozzle mechanism of the wave soldering machine, the width of the guide groove is 25 mm to 45 mm.

[0017] Furthermore, in the above-mentioned wave soldering machine nozzle mechanism, the heights of the front guide plate, the middle adjustment plate and the rear adjustment plate can all be adjusted.

[0018] It can be seen from the analysis that the utility model discloses a nozzle mechanism for a wave soldering machine, which can flush the oxides generated on the surface of the tin liquid to the tin outlet at the beginning of the operation of the soldering equipment, so as to prevent the oxides from causing large-area tinning of the PCB board during the soldering process, thereby not affecting the subsequent product production, improving the soldering quality, improving the purity of the solder, and ensuring the soldering quality. It can reduce the waste of solder caused by tin slag pollution and reduce production costs. It can also reduce rework and maintenance caused by soldering quality problems and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. Among them:

[0020] Figure 1 It is a three-dimensional structural schematic diagram of an embodiment of the utility model.

[0021] Figure 2 It is a right side structural schematic diagram of an embodiment of the utility model.

[0022] Explanation of the reference numerals: 1 guide groove; 2 first side plate; 3 second side plate; 4 end plate; 5 filter screen; 6 front guide plate; 7 middle adjustment plate; 8 rear adjustment plate; 9 first vertical plate; 10 first horizontal plate; 11 second vertical plate; 12 second horizontal plate. DETAILED DESCRIPTION

[0023] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments. Each example is provided by way of explanation of the present invention and does not limit the present invention. In fact, it will be clear to those skilled in the art that modifications and variations may be made in the present invention without departing from the scope or spirit of the present invention. For example, a feature shown or described as a part of one embodiment may be used in another embodiment to produce yet another embodiment. Therefore, it is desired that the present invention includes such modifications and variations within the scope of the appended claims and their equivalents.

[0024] In the description of the present invention, the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention. The terms "connected", "connected" and "set" used in the present invention should be understood in a broad sense. For example, they can be fixed connections or detachable connections; they can be directly connected or indirectly connected through intermediate components; they can be wired electrical connections, radio connections, or wireless communication signal connections. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0025] One or more examples of the utility model are shown in the attached drawings. The detailed description uses numbers and letters to refer to the features in the drawings. Similar or similar marks in the drawings and descriptions have been used to refer to similar or similar parts of the utility model. As used herein, the terms "first", "second", and "third" etc. are used interchangeably to distinguish one component from another, and are not intended to indicate the position or importance of individual components.

[0026] like Figure 1 to Figure 2 As shown, according to an embodiment of the utility model, a wave soldering machine nozzle mechanism is provided, and the nozzle mechanism is used for soldering PCB boards, such as Figure 1 As shown, the nozzle mechanism includes a nozzle and a guide groove 1, the guide groove 1 is arranged outside one side of the nozzle, and the guide groove 1 is used to guide the tin liquid flowing out of the nozzle; the upper end of the nozzle is provided with a front guide plate 6, a middle adjustment plate 7 and a rear adjustment plate 8, the front guide plate 6 and the middle adjustment plate 7 are used to adjust the shape of the wave peak; the rear adjustment plate 8 is used to control the separation angle between the PCB board and the tin liquid, and the rear adjustment plate 8 can also adjust the flow rate of the tin liquid.

[0027] Furthermore, the nozzle includes a first side plate 2, a second side plate 3 and two end plates 4, the first side plate 2, the second side plate 3 and the end plates 4 are all arranged vertically, the first side plate 2, one end plate 4, the second side plate 3 and another end plate 4 are connected in sequence, and the first side plate 2, the second side plate 3 and the two end plates 4 together form the nozzle; the guide groove 1 is connected to the upper part of the outer surface of the second side plate 3. The motor is arranged on the outer side wall of one end plate 4, and the tin liquid in the nozzle flows into the guide groove 1 from the top of the second side plate 3, and under the guidance in the guide groove 1, the tin liquid flows in the direction away from the motor.

[0028] Furthermore, a filter screen 5 is provided in the nozzle, the filter screen 5 is arranged horizontally, and the filter screen 5 is connected to the first side plate 2, the second side plate 3 and the two end plates 4; the filter screen 5 is provided with two layers, the distance L3 between the two layers of the filter screen 5 is 20mm to 40mm. In this arrangement, the filtering of the filter screen 5 can effectively filter the large oxides in the tin liquid, thereby ensuring the welding quality.

[0029] Furthermore, the front deflector 6 is disposed above the first side plate 2 , and two ends of the front deflector 6 are connected to the two end plates 4 respectively.

[0030] Further, the rear adjustment plate 8 is connected to the second side plate 3, and the two ends of the rear adjustment plate 8 are respectively connected to the two end plates 4; the rear adjustment plate 8 includes a first vertical plate 9 and a first horizontal plate 10, the first vertical plate 9 and the first horizontal plate 10 are integrally formed, the upper end of the first vertical plate 9 is flush with the upper end of the second side plate 3, the outer wall of the first vertical plate 9 is connected to the inner surface of the second side plate 3, the lower end of the first vertical plate 9 is connected to one end of the first horizontal plate 10, and the other end of the first horizontal plate 10 extends toward the inside of the nozzle and upward; Figure 2 As shown, the angle α between the first transverse plate 10 and the horizontal plane is 15°-45°. Preferably, the angle α between the first transverse plate 10 and the horizontal plane is 20°-45°.

[0031] Furthermore, both ends of the middle adjustment plate 7 are connected to the two end plates 4 respectively; the middle adjustment plate 7 includes a second vertical plate 11 and a second horizontal plate 12, the second vertical plate 11 is located between the front guide plate 6 and the rear adjustment plate 8, the lower end of the second vertical plate 11 is connected to one end of the second horizontal plate 12, the lower surface of the second horizontal plate 12 overlaps the upper surface of the first horizontal plate 10, and the inclination angle of the second horizontal plate 12 is consistent with the inclination angle of the first horizontal plate 10; the second vertical plate 11 and the second horizontal plate 12 are integrally formed. Figure 2As shown, the vertical distance L1 between the second vertical plate 11 and the front guide plate 6 is 30mm to 50mm. The vertical distance L2 between the second vertical plate 11 and the first vertical plate 9 is 50mm to 70mm. The width W of the guide groove 1 is 25mm to 45mm. The space between the second vertical plate 11 and the front guide plate 6 is the tin outlet of the nozzle mechanism. After the welding equipment is turned on, the liquid level of the tin liquid in the nozzle rises to the tin outlet, and the PCB board is located above the tin outlet. The tin liquid contacts the PCB board to achieve welding of the PCB board. The tin liquid flows into the guide groove 1 through the rear adjustment plate 8. Under the guidance in the guide groove 1, the tin liquid flows in the direction away from the motor.

[0032] When the welding equipment stops running, the liquid level of the tin liquid will drop to the bottom of the first horizontal plate 10. Since the liquid level of the tin liquid contacts the air, oxides will be generated on the surface of the tin liquid. After the welding equipment is turned on, the tin liquid enters the nozzle from the bottom under the action of the motor, and the liquid level of the tin liquid in the nozzle begins to rise. The oxides generated on the surface of the tin liquid touch the lower surface of the first horizontal plate 10 during the rising process. The oxides generated on the surface of the tin liquid are washed along the lower surface of the first horizontal plate 10 to the tin outlet and flow into the guide groove 1. The first horizontal plate 10 and the second horizontal plate 12 are inclined, so that the oxides generated on the surface of the tin liquid can be washed out of the tin outlet along the lower surface of the first horizontal plate 10 at the beginning of the operation of the welding equipment, so as to prevent the oxides from causing large-area tinning of the PCB board during the welding process, thereby not affecting the subsequent product production. Reduce the waste of solder caused by tin slag pollution and reduce production costs. Reduce rework and repairs caused by welding quality problems and improve production efficiency.

[0033] Furthermore, the heights of the front guide plate 6, the middle adjustment plate 7 and the rear adjustment plate 8 can be adjusted. The front guide plate 6, the middle adjustment plate 7 and the rear adjustment plate 8 are connected to the nozzles by screws respectively. The heights of the front guide plate 6, the middle adjustment plate 7 and the rear adjustment plate 8 can be adjusted as needed by loosening the screws, and the heights of the front guide plate 6, the middle adjustment plate 7 and the rear adjustment plate 8 can be fixed by tightening the screws. By adjusting the heights of the front guide plate 6 and the middle adjustment plate 7, the shape of the wave crest can be adjusted; by adjusting the height of the rear adjustment plate 8, the separation angle between the PCB board and the tin liquid can be controlled, and the flow rate of the tin liquid can be adjusted.

[0034] From the above description, it can be seen that the above embodiments of the utility model achieve the following technical effects:

[0035] A wave soldering machine nozzle mechanism can flush the oxides generated on the surface of the tin liquid to the tin outlet at the beginning of the operation of the soldering equipment, so as to prevent the oxides from causing large-area tinning of the PCB board during the soldering process, thereby not affecting the subsequent product production, improving the soldering quality, improving the purity of the solder, and ensuring the soldering quality. It can reduce the waste of solder caused by tin slag pollution and reduce production costs. It can also reduce rework and maintenance caused by soldering quality problems and improve production efficiency.

[0036] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wave soldering machine nozzle mechanism, the nozzle mechanism is used for soldering PCB boards, characterized in that: Including nozzles and guide grooves, The guide groove is arranged outside one side of the nozzle, and the guide groove is used to guide the tin liquid flowing out of the nozzle; The upper end of the nozzle is provided with a front guide plate, a middle adjustment plate and a rear adjustment plate, wherein the front guide plate and the middle adjustment plate are used to adjust the shape of the wave crest; The rear adjustment plate is used to control the separation angle between the PCB board and the tin liquid, and the rear adjustment plate can also adjust the flow rate of the tin liquid.

2. The wave soldering machine nozzle mechanism according to claim 1, characterized in that: The nozzle comprises a first side plate, a second side plate and two end plates, the first side plate, the second side plate and the end plates are all arranged vertically, the first side plate, one end plate, the second side plate and another end plate are connected in sequence, and the first side plate, the second side plate and the two end plates together surround the nozzle; The guide groove is connected to the upper portion of the outer surface of the second side plate.

3. The wave soldering machine nozzle mechanism according to claim 2, characterized in that: A filter screen is arranged in the nozzle, and the filter screen is connected to the first side plate, the second side plate and the two end plates; The filter screen is provided with two layers, an upper layer and a lower layer, and the distance between the two layers of the filter screen is 20 mm to 40 mm.

4. The wave soldering machine nozzle mechanism according to claim 2, characterized in that: The front deflector is arranged above the first side plate, and two ends of the front deflector are respectively connected to the two end plates.

5. The wave soldering machine nozzle mechanism according to claim 2, characterized in that: The rear adjustment plate is connected to the second side plate, and both ends of the rear adjustment plate are respectively connected to the two end plates; The rear adjustment plate includes a first vertical plate and a first horizontal plate, the upper end of the first vertical plate is flush with the upper end of the second side plate, the outer wall of the first vertical plate is connected to the inner surface of the second side plate, the lower end of the first vertical plate is connected to one end of the first horizontal plate, and the other end of the first horizontal plate extends toward the inside of the nozzle and upward; The angle between the first horizontal plate and the horizontal plane is 15°-45°; The first vertical plate and the first horizontal plate are integrally formed.

6. The wave soldering machine nozzle mechanism according to claim 5, characterized in that: Both ends of the middle adjustment plate are connected to the two end plates respectively; The middle adjustment plate includes a second vertical plate and a second horizontal plate, the second vertical plate is located between the front guide plate and the rear adjustment plate, the lower end of the second vertical plate is connected to the second horizontal plate, and the lower surface of the second horizontal plate overlaps the upper surface of the first horizontal plate; The second vertical plate and the second horizontal plate are integrally formed.

7. The wave soldering machine nozzle mechanism according to claim 6, characterized in that: The vertical distance between the second vertical plate and the front guide plate is 30 mm to 50 mm.

8. The wave soldering machine nozzle mechanism according to claim 6, characterized in that: The vertical distance between the second vertical plate and the first vertical plate is 50 mm to 70 mm.

9. The wave soldering machine nozzle mechanism according to claim 1, characterized in that: The width of the guide groove is 25 mm to 45 mm.

10. The nozzle mechanism of the wave soldering machine according to claim 1, characterized in that: The heights of the front deflector plate, the middle adjustment plate and the rear adjustment plate are all adjustable.

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